MXCHIP EMC6083 Wi-Fi, BLE IoT Module Instructions

MXCHIP EMC6083 Wi-Fi, BLE IoT Module

Product Information

Specifications

• Input Voltage: 3.0V~3.6V
• Operating Temperature: -40 to +105 degrees Celsius
• Processors: Arm Cortex-M55 and RISC-V
• Memory :
  • 512KB SRAM
  • 64KB ROM
  • 8MB XIP Flash
  • 8MB External Flash
• Wi-Fi:
  • IEEE 802.11 b/g/n/ax 1T1R
  • Transmitting Power: up to +18dBm
  • Receiving Sensitivity: -99dBm
  • Supports WPA/WPA2/WPA3
• Bluetooth :
  • BLE 5.2 Standard
  • Supports Bluetooth Scattering Network
  • Supports SIG Mesh Network Communication Mode
• Rich Peripherals:
  • 21 x GPIO
  • 1 x SPI
  • 3 x UART
• Interface and Size: External antenna with IPEX connector, 18mm x 19.2mm x 3.2mm

Product Usage Instructions

Powering the Module:
Ensure the input voltage is within the specified range of 3.0V to 3.6V.

Connecting to Wi-Fi:
Configure the module to connect to a Wi-Fi network using the provided SDK or AT instructions.

Utilizing Bluetooth Features:
Implement BLE functionality by following the BLE 5.2 Standard and utilizing the available network communication modes.

Frequently Asked Questions (FAQ)

• Q: What is the operating temperature range of the EMC6083 module?
  A: The operating temperature range is from -40 to +105 degrees Celsius.

• Q: How much external flash memory does the module have?
  A: The module comes with 8MB of external flash memory.

• Q: What are the typical applications of the EMC6083 module?
  A: The typical applications include smart appliances, intelligent electrician, and industrial automation.

SPECIFICATION

• Input： 3.0V~3.6V

• Operating temperature ：-40℃ to +105℃

• Dual Processor(Arm Cortex-M55 and RISC-V)

  • 32-bit processor
  • Main frequency up to 240MHz.
  • UART supporting download and debugging.

• Memory

  • 512KB SRAM
  • 64KB ROM
  • 8MB XIP Flash
    8MB external Flash

• Wi-Fi

  • IEEE 802.11 b/g/n/ax 1T1R .
  • Support 20/40MHz Channel bandwidth, 2.4GHz single frequency.
  • Transmitting power up to+18dBm, receiving sensitivity – 99dBm.
  • Support working mode ： STA 、 AP 、 Direct ， Concurrency AP+STA.
  • Support WPA/WPA2/WPA3.
  • Integrated BT/WLAN coexistence（PTA）.

• Bluetooth

  • Support BLE 5.2 Standard.
  • Support Bluetooth scattering network
  • Support SIG Mesh network communication mode that supports flooding and scattering methods.
  • Support AOA and AOD technology
  • Wi-Fi and BLE share the same PA and antenna, time-sharing multiplexing.
    Support Bluetooth slave mode, which can be used for Bluetooth distribution network.

• Rich Peripherals

  • 21 x GPIO
  • 1 x SPI
  • 3 x UART

• Interface and Size

  • External antenna with IPEX connector.
  • 18mm x 19.2mm x 3.2mm, stamp hole

• Rich Supporting Software

  • Support MXOS operating systems.
  • Provide access SDK and AT instructions for major cloud platforms.
  • Provide mass-produced firmware for various typical applications.

• Typical Application

  • Smart appliances
  • Intelligent electrician
  • Industrial automation

• Order code****
  Code| Direction
  ---|---
  EMC6083-EZJ6| External Antenna with IPEX connector-40℃~105℃

Order Code

For a list of all relevant features (such as packaging, minimum order quantity, etc.) and other information, please contact the nearest MXCHIP sales point and agent.

Parts

EMC6083-P module.Used with MXKIT-Base.
FX-6083| EMC6083 production fixture, including accompanying plate: MXKIT-Base, MXKIT-Core-6083.

Version Update

Update the final assembly dimension drawing
2024-04-24| 0.4| Adjust the final assembly dimension drawing
2024-05-23| 0.5| Optimize the annotation data of the final assembly dimension drawing

Copyright Notice
Without permission, it is prohibited to use or copy all or any part of this manual, especially for trademarks, model naming, part numbers and drawings.
Datasheet lower than 1.0 are for reference only and may be modified before mass production.

Introduction

EMC6083 series modules are mainly used for data communication of the Internet of Things. The module realizes data acquisition and device control through rich peripheral interfaces. It can not only communicate directly with mobile devices through low-power Bluetooth, but also connect to the Internet of Things cloud service platform through Wi-Fi network connection to realize the interconnection of everything. This series of modules are applied to a wide range of Internet of Things applications through various external dimensions, interface forms, antenna interfaces and temperature ranges. The EMC6083 module is built-in an ultra-high integration Wi-Fi/BLE Combo SOC chip, providing the necessary computing power and stable Wi-Fi/BLE connectivity of IOT data terminals. The chip integrates:

• Dual processor(Arm Cortex-M55 and RISC-V)
• Main frequency up to 320MHz.
• 512K Byte SRAM.
• 8M Byte XIP Flash.
• 2.4GHz Wi-Fi controller conforming to IEEE 802.11 b/g/n/ax standard.
• Low-power Bluetooth controller conforming to BLE5.2 BQB specification.

EMC6083 module is powered by 3.3V single power supply and supports the stamp hole SMT installation mode, which is applicable to various smart home appliance application scenarios.
MXCHIP provides the MXOS software platform to support the development of the EMC6083 series modules, and provides an efficient development environment, access protocol stacks for major Internet of Things cloud services, rich sample programs and various typical applications.
The EMC6083 module is mainly including:

• Wi-Fi microcontroller
• On-board or external antenna
• Power supply and communication interface
• Peripheral interface units

Pin Definition

Pin Arrangement

Pin Definition

No.| Name| Type| Recommended

Function

| 复用功能
---|---|---|---|---
1| GND| P| Ground| –
2| VDD| P| DC3.3V Power| –
3| CHIP_EN| I/O| No floating

– 1：Enable

– 0：Disable

|

–

4| PB0| I/O|

SWD_DIO：

SWD Debug

| ADC5/TIME8_TRIG/LEDC/SPI1_CLK/SPI1_MISO/SPI1_MOSI/SPI1_CS UARTn_TXD/UARTn_RXD(n=0,1,2,3) / UARTn_CTS/UARTn_RTS(n=0,3) I2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA/PWM0/PWM1/PWM2/PWM3

DMIC_CLK/DMIC_DATA[1]

5| PB1| I/O| SWD_CLK：

SWD Debug

| TOUCH4_ADC4/TIME9_TRIG/LEDC/SPI1_CLK/SPI1_MISO/SPI1_MOSI/SPI1_CSUARTn_TXD/UARTn_RXD(n=0,1,2,3)/UARTn_CTS/UARTn_RTS(n=0,3)I2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA/PWM0/PWM1/PWM2/PWM3DMIC_CLK/DMIC_DATA[1]
6| NC| I/O| –| –
7| NC| I/O| –| –
8| NC| I/O| –| –
9| PB3| I/O| UART0_TXD：

Application uart

| TOUCH2_ADC2/LEDC/SPI1_MOSI/DMIC_CLK/DMIC_DATA[1]UARTn_TXD/UARTn_RXD(n=0,1,2,3) / UARTn_CTS/UARTn_RTS(n=0,3) I2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA/PWM0/PWM1/PWM2/PWM3
---|---|---|---|---
10| PB4| I/O| UART0_RXD：

Application uart

| TOUCH1_ADC1/LEDC/SPI1_MISO/DMIC_CLK/DMIC_DATA[1] UARTn_TXD/UARTn_RXD(n=0,1,2,3)/UARTn_CTS/UARTn_RTS(n=0,3)I2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA/PWM0/PWM1/PWM2/PWM3
11| NC| I/O| –| –
12| NC| I/O| –| –
13| PA28| I/O| SPI0_CLK| TOUCH8/LEDC/SPI0_CLK/DMIC_CLK/DIMC_DATA[1] UARTn_TXD/UARTn_RXD(n=0,1,2,3)/UARTn_CTS/UARTn_RTS(n=0,3)SPI1_CLK/SPI1_MISO/SPI1_MOSI/SPI1_CSI2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA/PWM0/PWM1/PWM2/PWM3
14| PA30| I/O| SPI0_MISO| TOUCH6/LEDC/SPI0_MISO/DMIC_CLK/DIMC_DATA[1]UARTn_TXD/UARTn_RXD(n=0,1,2,3)/UARTn_CTS/UARTn_RTS(n=0,3)SPI1_CLK/SPI1_MISO/SPI1_MOSI/SPI1_CSI2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA/PWM0/PWM1/PWM2/PWM3
15| GND| P| Ground|
16| PA29| I/O| SPI0_MOSI| TOUCH7/LEDC/SPI0_MOSI//DMIC_CLK/DIMC_DATA[1]UARTn_TXD/UARTn_RXD(n=0,1,2,3)/UARTn_CTS/UARTn_RTS(n=0,3)SPI1_CLK/SPI1_MISO/SPI1_MOSI/SPI1_CSI2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA/PWM0/PWM1/PWM2/PWM3
17| NC| I/O| –|
18| NC| I/O| –|
19| NC| I/O| –|
20| NC| I/O| –|
21| NC| I/O| –|

22

|

PA8

|

I/O

|

F_DATA2

| UARTn_TXD/UARTn_RXD(n=0,1,2,3)/UARTn_CTS/UARTn_RTS(n=0,3) SPI1_CLK/SPI1_MISO/SPI1_MOSI/SPI1_CS I2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA PWM0/PWM1/PWM2/PWM3/PWM4/PWM5/PWM6/PWM7

DMIC_CLK/DIMIC_DATA[0]/DMIC_DATA[1]/LEDC

23| PA31| I/O| SPI0_CS| TOUCH5/LEDC/SPI0_CS/DMIC_CLK/DMIC_DATA[1] UARTn_TXD/UARTn_RXD/UARTn_CTS/UARTn_RTS（n=0,1,2,3）PI1_CLK/SPI1_MISO/SPI1_MOSI/SPI1_CSI2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA/PWM0/PWM1/PWM2/PWM3
24| PA11| I/O| F_DATA3| UARTn_TXD/UARTn_RXD(n=0,1,2,3)/UARTn_CTS/UARTn_RTS(n=0,3)SPI1_CLK/SPI1_MISO/SPI1_MOSI/SPI1_CS/LEDCI2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA/PWM0/PWM1/PWM2/PWM3/PWM4/PWM5/PWM6/PWM7
25| NC| I/O| –| –
26| PA1| I/O| UART1_TXD| –
27| PB2| I/O| –| TOUCH3_ADC3/SPI1_CLK/LEDC/DMIC_CLK/DMIC_DATA[1]UARTn_TXD/UARTn_RXD(n=0,1,2,3)/UARTn_CTS/UARTn_RTS(n=0,3)
 |  |  |  | I2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA/PWM0/PWM1/PWM2/PWM3
---|---|---|---|---
28| PA0| I/O| UART1_RXD| –

29

|

PA14

|

I/O

|

–

| UARTn_TXD/UARTn_RXD(n=0,1,2,3)/UARTn_CTS/UARTn_RTS(n=0,3) SPI1_CLK/SPI1_MISO/SPI1_MOSI/SPI1_CS/LEDC I2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA/PWM0/PWM1/PWM2/PWM3/PWM4/PWM5/PWM6/PWM7DMIC_CLK/DIMIC_DATA[0]/DMIC_DATA[1]
30| PA15| I/O| –| SPI0_CLK/UARTn_TXD/UARTn_RXD(n=0,1,2,3)/UARTn_CTS/UARTn_RTS(n=0,3) SPI1_CLK/SPI1_MISO/SPI1_MOSI/SPI1_CS/LEDC I2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA/PWM4/PWM5/PWM6/PWM7DMIC_CLK/DMIC_DATA[0]

31

|

PA16

|

I/O

|

–

| SPI0_MOSI/UARTn_TXD/UARTn_RXD(n=0,1,2,3)/UARTn_CTS/UARTn_RTS(n=0,3)SPI1_CLK/SPI1_MISO/SPI1_MOSI/SPI1_CS/LEDCI2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA/PWM4/PWM5/PWM6/PWM7DMIC_CLK/DMIC_DATA[0]
32| NC| I/O| –|
33| PA17| I/O| –| SPI0_MISO/UARTn_TXD/UARTn_RXD（n=0,1,2,3） SPI1_CLK/SPI1_MISO/SPI1_MOSI/SPI1_CS/LEDC I2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA/PWM4/PWM5/PWM6/PWM7DMIC_CLK/DMIC_DATA[0]
34| PA19| I/O| DBG_RXD：调试串口| UARTn_TXD/UARTn_RXD(n=0,1,2,3)
35| PA20| I/O| DBG_TXD：调试串口| UARTn_TXD/UARTn_RXD(n=0,1,2,3)
36| PA18| I/O| –| SPI0_CS/UARTn_TXD/UARTn_RXD(n=0,1,2,3)/UARTn_CTS/UARTn_RTS(n=0,3) SPI1_CLK/SPI1_MISO/SPI1_MOSI/SPI1_CS/LEDC I2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA/PWM4/PWM5/PWM6/PWM7DMIC_CLK/DMIC_DATA[0]
37| PA21| I/O| –| TIM9_TRIG/UARTn_TXD/UARTn_RXD(n=0,1,2,3)/UARTn_CTS/UARTn_RTS(n=0,3) SPI1_CLK/SPI1_MISO/SPI1_MOSI/SPI1_CS/LEDC I2C0_SCL/I2C0_SDA/I2C1_SCL/I2C1_SDA/PWM4/PWM5/PWM6/PWM7DMIC_CLK/DMIC_DATA[0]

Note:

1. Debugging serial port is used for debugging. It should not be used during design and should be provided in a convenient way to facilitate software development.
2. Pull down PA20 (DBG-TXD) and power it on to enter firmware download mode and write the firmware through debugging serial port.
3. The NC pin is not connected and cannot be used.

Electrical Parameters

Operation Voltage and Current
Table 2 Operation Voltage

Table 3 Operation Current

1. The above parameters were measured in a wireless shielding environment in the laboratory. Please refer to Table 4 for actual application power consumption!
2. The power consumption of Flash is not included in table3 Reference source not found. In the data. When reading code or writing data from Flash. The power consumption of Flash should not exceed 20Ma. The power consumption of Flash in standby mode (CS signal raised) shall not exceed 50 μ A.

General I/O Interface
Table 4 I/O operating parameters

Typical Application Power
The module current test environment is based on VDD=3.3V and is tested in the ordinary office application environment (the values measured in different test environments will be different).
Table 5 Typical Application Power

standby
Keep Wi-Fi connected| 82.4| 97.4| mA| Turn off Wi-Fi and MCU low power consumption
Keep Wi-Fi connected| 35.6| 47.8| mA| Turn on Wi-Fi low power consumption, turn off MCU low power consumption, DTIM = 1
Keep Wi-Fi connected| 20.7| 27.3| mA| Turn on Wi-Fi low power consumption, turn off MCU low power consumption, DTIM = 3
Keep Wi-Fi connected| 10.3| 11.7| mA| Turn on Wi-Fi low power consumption and MCU low power consumption, DTIM = 1
Keep Wi-Fi connected| 6.2| 7.8| mA| Turn on Wi-Fi low power consumption and MCU low power consumption, DTIM = 3
SoftAP mode| 67.9| 244.6| mA| SoftAP networking status
Monitor mode| 86.4| 101.5| mA| Network Distribution process, in RX state
Iperf performance mode| 200| 243.5| mA| Turn off the low power consumption of Wi-Fi and MCU, iperf sends at full speed

Temperature
Table 6 Storage Temperature and operation temperature

Electrostatic discharge
Table 7 Electrostatic discharge

RF Parameter

1. Wi-Fi RF Parameter
   Table 8 RF Basic Parameter Item| Specification
   ---|---
   Operating Frequency| 2.402~2.484GHz
   Antenna Interface| 1T1R, Single stream
   Specification| Wi-Fi Standard| IEEE 802.11b/g/n/ax
   Bluetooth| Bluetooth 5.2
   Modulation Type| Wi-Fi| 11b: DBPSK, DQPSK, CCK for DSSS

11g: BPSK, QPSK, 16QAM, 64QAM for OFDM

11n: BPSK,QPSK,16QAM,64QAM for OFDM

11ax: BPSK,QPSK,16QAM,64QAM,256QAM for OFDMA

BLE| GFSK
Data Rates| Wi-Fi| 802.11b: 1, 2, 5.5 and 11Mbps

802.11g: 6, 9, 12, 18, 24, 36, 48 and 54 Mbps

802.11n: MCS0~7, up to 72.2Mbps

Bluetooth| 1Mbps
Antenna type| One U.F.L connector for external antenna

  *  **Transmitting performance**  

Table 9 Output power TX Characteristics| Min.| Typical| Max.| Unit
---|---|---|---|---
Power@11Mbps, 802.11b| 15| 17| 18| dBm
Power@54Mbps, 802.11g| 14| 16| 17| dBm
Power@HT20, MCS7,802.11n| 14| 16| 17| dBm
Power@HT20, MCS9,802.11ax| 14| 16| 17| dBm

Table 10 Frequency error

Table 11 EVM

  *  **Receiving performance**  

Table 12 Receiving sensitivity. RX Characteristics| Min.| Typical| Max.| Unit
---|---|---|---|---
Minimum Input Level Sensitivity
PER≦8%@11Mbps,802.11b| –| -90| –| dBm
PER≦10%@54Mbps,802.11g| –| -76| –| dBm
PER≦10%@HT20, MCS7, 802.11n| –| -75| –| dBm
PER≦10%@HT20, MCS9,802.11ax| –| -69| –| dBm
2. Bluetooth RF Parameter
Table 13 Bluetooth TX/RX Characteristic Item| DataRate| Min| Typical| Max| Unit
---|---|---|---|---|---
POWER_AVERAGE| LE_1M| 6| 8| 10| dBm
Frequency Drift Error| LE_1M| -50| -5| 50| KHz
Carrier frequency offset and drift at NOC:
∆Fn max| LE_1M| -150| 6.5| 150| KHz
|F0-Fn|| LE_1M|  | 2.2| 50| KHz
|F1-F0|| LE_1M|  | 2.1| 20| KHz
|Fn-Fn5|| LE_1M|  | 0.9| 20| KHz
Modulation characteristics:
∆F1avg| LE_1M| 225| 249| 275| KHz
∆F2avg| LE_1M| 185| 238| 275| KHz
∆F2avg/∆F1avg| LE_1M| 0.8| 0.96|  | KHz
∆F2max| LE1M| 185| 245|  | KHz
In-Band Emissions
OFFSET-2| LE1M|  | -44.3| -20| dBm
OFFSET-3| LE1M|  | -46.6| -30| dBm
OFFSET-4| LE1M|  | -46.5| -30| dBm
OFFSET-5| LE_1M|  | -50.6| -30| dBm
OFFSET_2| LE_1M|  | -46.1| -20| dBm
OFFSET_3| LE_1M|  | -45.7| -30| dBm
OFFSET_4| LE_1M|  | -44.4| -30| dBm
OFFSET_5| LE_1M|  | -50.2| -30| dBm
RX Characteristics
Minimum Sensitivity PER ≤30.8%| LE_1M| –| -98| -97| dBm

Table 14 Bluetooth TX/RX Characteristic

Carrier frequency offset and drift at NOC:
∆Fn max| LE_1M| -150| 15| 150| KHz
|F0-Fn|| LE_1M| 0| 10| 50| KHz
|F1-F0|| LE_1M| 0| 10| 20| KHz
|Fn-Fn5|| LE_1M| 0| 10| 20| KHz
Modulation characteristics:
∆F1avg| LE_1M| 225| 250| 275| KHz
∆F2avg| LE_1M| 185| 235| 275| KHz
∆F2avg/∆F1avg| LE_1M| 0.8| 1| 2| KHz
∆F2max| LE_1M| 185| 225| 275| KHz
RX Characteristics
Minimum Sensitivity PER ≤30.8%| LE_1M| –| -94| –| dBm

Antenna Information

EMC6083 series module adopt external antenna with IPEX connector. Please order according to the order code. Better RF performance can be obtained by connecting external antenna through IPX connector.

External antenna parameters and use
Users can select 2.4G antennas with different dimensions and gain no more than 2dBi according to the application environment.
The following is a copper tube antenna with IPEX connector commonly used by MXCHIP.

• Frequency range: 2400-2500 MHz
• Input impedance: 50 Ohm
• SWR: <2.0
• Gain: 2.0dBi
• Polarization: vertical
• Directionality: omnidirectional
• Copper pipe: 4.4 * 23mm
• Wire: 1.13 gray line L-82mm

Dimension Diagram of External Antenna Connector.

General Assembly Size

Production Guidelines

MXCHIP stamp port packaging module must be SMT machine patches, module humidity sensitivity grade MSL3, after unpacking more than a fixed time patches to bake module.

• SMT patches require instruments.
  • Reflow bonding machine.
  • AOI detector
  • 6-8mm suction nozzle
• Baking requires equipment:
  • Cabinet oven
  • Anti-static, high-temperature tray
  • Antistatic and heat-resistant gloves.

The storage conditions of MXCHIP module are as follows:

• Moisture-proof bags must be stored in an environment with temperature < 30 degree C and humidity < 85% RH.
• A humidity indicator card is installed in the sealed package.

After the module is split, if the humidity card shows pink, it needs to be baked. The baking parameters are as follows:

• The baking temperature is 120℃±5℃ and the baking time is 4 hours.
• The alarm temperature is set to 130℃.
• SMT patches can be made after cooling < 36℃ under natural conditions.
• Drying times: 1 time.
• If there is no welding after baking for more than 12 hours, please bake again.

If the disassembly time exceeds 3 months, SMT process is forbidden to weld this batch of modules, because PCB gold deposition process, over 3 months, pad oxidation is serious, SMT patch is likely to lead to virtual welding, leak welding, resulting in various problems, our company does not assume the corresponding responsibility. Before SMT patch, ESD (Electrostatic Discharge, Electrostatic Release) protection should be applied to the module. SMT patches should be made according to the reflow curve. The peak temperature is 250 C. The reflow temperature curve is shown in Chapter 9, Figure 7. In order to ensure the qualified rate of reflow soldering, 10% of the first patches should be taken for visual inspection and AOI testing to ensure the rationality of furnace temperature control, device adsorption mode and placement mode, and 5-10 patches per hour are recommended for visual inspection and AOI testing in subsequent batch production.

Precautions

• Operators of each station must wear static gloves during the entire production process.
• Do not exceed the baking time when baking.
• It is strictly forbidden to add explosive, flammable, or corrosive substances during baking.
• When baking, the module uses a high-temperature tray to be placed in the oven to keep the air circulation between each module while avoiding direct contact between the module and the inner wall of the oven.
• When baking, please close the oven door to ensure that the oven is closed to prevent temperature leakage and affect the baking effect.
• Try not to open the door when the oven is running. If it must be opened, try to shorten the time for opening the door.
• After baking, the module should be naturally cooled to <36°C before wearing the static gloves to avoid burns.
• When operating, strictly guard against water or dirt on the bottom of the module.

The temperature and humidity control level of MXCHIP factory module is Level 3, and the storage and baking conditions are based on IPC/JEDEC J-STD-020.

Storage Condition

Secondary Reflux Temperature Curve
We recommend solder paste model: SAC305, lead-free. No more than 2 reflux times.

Label Information

1. MXCHIP: Company Logo.
2. Shanghai MXCHIP Information Technology Co., Ltd.: Manufacturer company name
3. EMC6083-E: Product Main Type.
4. CMIIT ID: SRRC ID.
5. FCC ID: FCC certification ID
6. : CE certification logo
7. : Environmental protection sign, indicating no littering in the trash can
8. ZL7: Product Sub model.
9. X2401: Production Serial Number.
10. B0F893C125DE: Module MAC Address.
11. 0000.0000.A258: Software version.
12. Input DC 3.3V 300mA: Operation Voltage and Current
13. QR code: MAC Address.

Note: Due to the production batch and version, the above label schematic diagram is for reference only, please refer to the real object.

FCC Warning

Radiation Exposure Statement
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The module is limited to OEM installation only The OEM integrator is responsible for ensuring that the end-user has no manual instructions to remove or install module If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: P53-EMC6083 Or Contains FCC ID: P53-EMC6083
When the module is installed inside another device, the user manual of the host must contain below warning statements.

1. List of applicable FCC rules
   FCC Part 15 Subpart C 15.247 & 15.209

2. Specific operational use conditions
   The module is a 2.4GHz Wi-Fi /BLE Module2.4GHz Wi-Fi /BLE Module| Operation Frequency| Number of Channel| Modulation| Antenna Spec.
   ---|---|---|---|---
   2.4G Wi-Fi| BLE| 2.4G Wi-Fi| BLE| 2.4G Wi-Fi| BLE| 2.4G Wi-Fi| BLE
   EMC6083| 2412- 2462MHz| 2402- 2480MHz| 11| 40| DSSS, OFDM| GFSK| Single PCB antenna, 2dBi Max.

The module can be used for mobile or portable applications with a maximum 2dBi antenna. The host manufacturer installing this module into their product must ensure that the final composite product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation. The host manufacturer has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

3. Limited module procedures Not applicable. The module is a Single module and complies with the requirement of FCC Part 15.212.

4. Trace antenna designs
   Not applicable. The module has its own antenna, and doesn’t need a host’s printed board microtrip trace antenna etc.

5. RF exposure considerations
   The module must be installed in the host equipment such that at least 20cm is maintained between the antenna and users’ body; and if RF exposure statement or module layout is changed, then the host product manufacturer required to take responsibility of the module through a change in FCC ID or new application. The FCC ID of the module cannot be used on the final product. In these circumstances, the host manufacturer will be responsible for re- evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

6. Antennas
   Antenna Specification are as follows:
   Type: Single PCB antenna Gain: 2dBi.
   This device is intended only for host manufacturers under the following conditions: The transmitter module may not be co-located with any other transmitter or antenna; The module shall be only used with the internal antenna(s) that has been originally tested and certified with this module. The antenna must be either permanently attached or employa ‘unique’ antenna coupler. As long as the conditions above are met, further transmitter test will not be required. However, the host manufacturer is still responsible for testing their end product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

7. Label and compliance information
   Host product manufacturers need to provide a physical or e-label stating “Contains FCC ID: P53-EMC6083” with their finished product.

8. Information on test modes and additional testing requirements
   Operation Frequency: 2412-2462MHz / 2402-2480MHz
   Number of Channel: 11 / 40
   Modulation: DSSS, OFDM / GFSK
   Host manufacturer must perform test of radiated & conducted emission and spurious emission, etc according to the actual test modes for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. Only when all the test results of test modes comply with FCC requirements, then the end product can be sold legally.

9. Additional testing, Part 15 Subpart B disclaimer The modular transmitter is only FCC authorized for FCC Part 15 Subpart C 15.247 & 15.209 and the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. You are cautioned that changes or modifications not expressly approved by the party responsible for compliance could void your authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Sales and Technical Support Information
If you need to consult or purchase this product, please call Shanghai MXCHIP Information Technology Co., Ltd. during office hours.
Office hours: Monday to Friday morning: 9:00-12:00, afternoon: 13:00-18:00
Contact Tel: +86-21-52655026
Address: 9th Floor, Building B, 2145 Jinshajiang Road, Putuo District, Shanghai
Zip code: 200333
Email: sales@mxchip.com

Shanghai MXCHIP Information Technology Co., Ltd. All rights reserved.

References

• eCFR :: 47 CFR Part 15 Subpart A -- General
• Federal Register :: Request Access
• eCFR :: 47 CFR Part 15 -- Radio Frequency Devices

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