VLinK E901 2.4G WiFi 6 plus BLE 5.1 IOT Module Instructions
- July 31, 2024
- VLinK
Table of Contents
E901 2.4G WiFi 6 plus BLE 5.1 IOT Module
Product Information
Specifications
- Product Name: E901 2.4G WiFi 6+BLE 5.1 Module
- Model: ECR6600-TS2L
- Wireless Standards: 802.11b/g/n/ax 1T1R WiFi + BLE
- Frequency: 2.4GHz
- Document Release Version: V1.0
- Date: 2022/02/25
Product Usage Instructions
1. Overview
The E901 WiFi 6 + BLE 5.1 IOT module utilizes ESWIN’s ECR6600
chip line, providing a combination of 2.4GHz WiFi and BLE
technology for low latency, long-distance, and low power
applications.
2. Main Features
-
Wi-Fi: Supports IEEE 802.11b/g/n/ax standards with various
modes and features like AP, STA, Wi-Fi Direct, and more. -
BLE: Features BLE 5.1 technology with power control, encryption
options, and iShare PA&LNA with Wi-Fi GAP. -
MCU: Includes UART, SPI, I2C, PWM, ADC, and other interfaces
for connectivity.
3. Module Size
Size: 1.8mm
Frequently Asked Questions (FAQ)
Q: What certifications does the E901 module comply with?
A: The E901 module complies with FCC/CE/SRRC certifications for
regulatory compliance.
Q: What is the power supply voltage range for the module?
A: The module operates within a voltage range of 3.0V to 3.6V,
with a typical operating voltage of 3.3V.
E901 2.4G WiFi 6+BLE 5.1 Module
E901 2.4G WiFi 6 +BLE 5.1 IOT Module
Product Specification
802.11b/g/n/ax 1T1R WiFi +BLE Module
(ECR6600-TS2L)
Document Release Version V1.0
Version Ver1.0
Date 2022/02/25
History
Modification
Initials
Approved
E901 2.4G WiFi 6+BLE 5.1 Module
1.summarize
The E901WiFi 6 +BLE5.1 IOT module uses ESWIN’s ECR6600, a single-band 2.4GHz Combo (802.11ax +BLE5.1) chip
line. It uses WiFi/BLE coexistence architecture, which can meet the requirements of low latency, long distance and low
power application scenarios at the same time, and provide big data transmission se v e.
e
00 ses l
s o p le
/
o es
pe o
e
l l e s o p ove po e o ve s o e e
el e
po e o p
e e e e o ple e v o e s
e
00 op s 1 1 o
e
e ses
e olo o s ppo
se
s ss o se o 1 1 sp e
e s ss o e
e e se
p o e e ev e
s
l se ess op es 25 .
es es e e
00 ses e
se
e
s o p ov e o
e
o poe o o
s
oe
o le s e
o le p e po ls.
ee s / /S
e
o e 01 s s ple es o eq e e s.
24 1
ve s l
Advant age
Wi-Fi 6 co-exists with BLE 5.1 architecture
Wi-Fi 6 Single band 2.4GHz SoC line, The driver supports RTOS and Linux,
loaded with a Fully Host and Fully MAC respectively. Provides BLE 5.1-based
Wi-Fi P2P networks with transmission bandwidth up to 40MHz and supports long
protection
intervals
Improve PA efficiency through digital predistortion technology; Low vector
error (EVM), high signal
modulation quality Graphical development interface
Provide graphical user development interface, effectively save development
time and cost; Peripheral streamlining reduces design costs
Telnet debug
Supports remote Telnet debugging, saving debugging time and cost and releasing
the serial port
Complies with FCC/CE/SRRC certification
Multiple users access AP at the same time to perfectly solve the delay problem
Dynamic bandwidth adjustment, which uses bandwidth rationally and efficiently
performs long-distance
transmission, improves home device deployment, and prolongs the distance by
four times The TWT technology significantly reduces power consumption and
prolongs battery life by seven times Long protection intervals can effectively
reduce the multipath effect migrates data and moves the CSMA detection
threshold BLE Rapid network distribution
y
se o
5.1 e olo es e 01
s ss o s e os
ele
ll
oo lo ks
e le ev es
S
ppl es/ o e e
e/
os
e se o
E901 2.4G WiFi 6+BLE 5.1 Module
2. ECR6600 Blocking Diagram
3.Main feature
Wi-Fi
2.4G IEEE 802.11b/g/n/ax Greenfield mode Mixed ModeLegacy mode
APSTAWi-Fi Direct (P2P) RX STBC PALNATRX Switch OFDMADCM All GITWT
Dynamic bandwidth management
Soft-
E901 2.4G WiFi 6+BLE 5.1 Module
BLE
BLE 5.1
iShare PA&LNA with Wi-Fi GAP
AFH S ppo o e o p
ee p e
Power control
AES128/ECC/HASH/TRNG WEPWPA/WPA2/WPA3 personal WPS
MCU
The core frequency to 240MHZ, support floating-point operations, with I cache
and D cache
UART0/1/2 SPI0/1 (80MHZ@max) IR T/R I2S I2C PWM x6 ADC x 4 SDIO2.0(50MHZ@max)
y
RAM ROM SIP Flash External PSRAM External FLASH 1 Kbit eFuse
o e s ppl vol e p
e3.0V3.6V p l v l e3.3V
pe
e pe e-40 +105
E901 2.4G WiFi 6+BLE 5.1 Module
4.Module sizeUnits: mm
1.8mm
E901 2.4G WiFi 6+BLE 5.1 Module
5.Module pin definition
Pin
Function
Type Voltage
Description
1 Reset#
IANA 3.3V
RC NC
2 GPIO20/ADC2/PWM3
I/O
3.3V
GPIO
3 GPIO23/PWM1
I/O
3.3V
GPIO
4 GPIO13/TX2/I2C_SCL
I/O
3.3V
GPIO
5 GPIO25/PWM3/I2C_SDA
I/O
3.3V
GPIO
6 GPIO24/PWM2
I/O
3.3V
GPIO
7 GPIO22/TX0/PWM0
I/O
3.3V
GPIO
8 3.3V
IPMU 3.3V
3.3V
9 GPIO16/PWM2
I/O
3.3V
GPIO
10 GPIO21/RX0/I2C_SDA
I/O
3.3V
GPIO
11 GND
GND GND
GND
12 GPIO2/TX1/PWM2/I2C_SCL/SPI_MOSI I/O
3.3V
GPIO
13 GPIO1/RX1/PWM1/SPI_CS0
I/O
3.3V
GPIO
14 GPIO3/PWM3/I2C_SDA/SPI_MISO I/O
3.3V
GPIO
15 GND
GND GND
GND
16 GPIO4/PWM4/SPI_CS1
I/O
3.3V
GPIO
17 GPIO17/RX2/PWM5
I/O
3.3V
GPIO
18 GPIO0/TX2/PWM0/SPI_CLK
I/O
3.3V
GPIO
19 GPIO15/ADC1/PWM5/BM1
I/O
3.3V
GPIO
20 GPIO14/ADC0/PWM4/BM0
I/O
3.3V
GPIO
21 GPIO5/DBG_RX0/32K_IN
I/O
3.3V
GPIO/
22 GPIO6/DBG_TX0/32K_OUT
I/O
3.3V
GPIO/
6. Order Information
Module
Part number
E901 E901 E901 E901
E901_NI_NS E901_WI_NS E901_NI_WS E901_WI_WS
Description
E901 IOT E901 IOT E901 IOT E901 IOT
E901 2.4G WiFi 6+BLE 5.1 Module
7. Specifications
7.1 Recommended Operating Conditions
Parameter
Min
Typ
Max
Unit
Operation Voltage
3.0
3.3
3.6
V
Operation Temperature
-40
105
7.2 Current consumption
Table 4.2 Current consumption performance specification
Parameter
Test Item
TX Power Current
Unit
11b, CCK,1Mbps
20dBm
353
mA
11b, CCK,11Mbps
20dBm
345
mA
11g, OFDM, 6Mbps
19dBm
265
mA
11g, OFDM, 54Mbps
17dBm
215
mA
11n,HT20, MCS0
19dBm
256
mA
WiFi TX
11n,HT20, MCS7
16dBm
216
mA
11ax,HT20, MCS7
19dBm
260
mA
11ax,HT20, MCS7
16dBm
215
mA
11n,HT40, MCS0
18dBm
240
mA
11n,HT40, MCS7
15dBm
198
mA
–
0dBm
42.4
mA
WiFi RX
–
–
44.8
mA
BLE,1M, Power_Level = 3
12dBm
98
mA
BT TX
BLE,2M, Power_Level = 3
12dBm
75
mA
–
0dBm
42.4
mA
BT RX
–
–
42.7
mA
E901 2.4G WiFi 6+BLE 5.1 Module
7.3 WiFi WLAN Receiver Characteristic
Table 4.3 WLAN receiver performance specification
Parameters
Test Item
CH1 CH7 CH13 Unit
Receive Sensitivity
11b, CCK,1M , <-76dBm@8%PER 11b, CCK,11M ,<-76dBm@8%PER 11g, OFDM,6M , <-82dBm@10%PER 11g, OFDM,54M , <-65dBm@10%PER 11n, HT20 MCS0, <-82dBm@10%PER 11n, HT20 MCS7, <-64dBm@10%PER 11ax, HT20 MCS0, <-82dBm@10%PER 11ax, HT20 MCS7, <-64dBm@10%PER
-94
-94
-94 dBm
-86
-86
-86 dBm
-90
-90
-89 dBm
-74
-74
-73 dBm
-90
-90
-89 dBm
-71
-71
-70 dBm
-90
-90
-89 dBm
-71
-71
-70 dBm
Test Item
CH3 CH7 CH11 Unit
11n, HT40 MCS0,<-79dBm@10%PER
-87
-87
-86 dBm
11n, HT40 MCS7,<-61dBm@10%PER
-68
-68
-67 dBm
7.4 WiFi WLAN Transmitter Characteristics
Table 4.4 WLAN transmitter performance specification
Parameter Test Item
Typical Value
CH1 CH7 CH13 Unit
11b, CCK,1Mbps 11b,1CCK,1Mbps
20±1dBm,EVM<-20dB 20.32 20.38 20.32 dBm 20±1dBm, EVM<-20dB 20.28 20.38 20.33 dBm
11g ,OFDM, 6Mbps 19±1dBm,EVM<-18dB 19.06 19.06 19.08 dBm
11g ,OFDM, 54Mbps 17±1dBm,EVM<-27dB 17.22 17.37 17.37 dBm
Output Power
11n, HT20 MCS0 11n, HT20 MCS7 11ax ,HT20 MSC0 11ax ,HT20 MSC7
19±1dBm,EVM<-18dB 18.56 18.55 18.53 dBm 16±1dBm,EVM<-27dB 16.25 16.21 16.21 dBm 19±1dBm,EVM<-25dB 18.74 18.77 18.82 dBm 16±1dBm,EVM<-30dB 16.14 16.10 16.11 dBm
Test Item
Typical Value
CH3 CH7 CH11 Unit
11n, HT40 MCS0
17±1dB,EVM<-25dB
17.13 17.10 17.19 dBm
11n, HT40 MCS7
15±1dB,EVM<-29dB
14.64 14.69 14.87 dBm
E901 2.4G WiFi 6+BLE 5.1 Module
7.5 BLE BLE RX Performance
Parameter
Sensitivity >30% packaet
Table 4.5 BLE receiver performance specification
Test Item
Typical Value
Channel(dBm)
Unit
CH0
CH19 CH39
1Mbps
<-90
-92
-92
-92
dBm
2Mbps
<-88
-90
-90
-90
dBm
7.6 BLE BLE TX Performance
Parameter Output power
Table 4.6 BLE transmitter performance specification
Test Item Typical Value
Channel(dBm)
CH0
CH19
CH39
1Mbps
10±1
9.86
10.01
9.93
2Mbps
10±1
9.98
10.13 10.06
Unit dBm dBm
8.Lead-free reflow welding process parameter requirements
Lead-free reflow welding process curve is shown in the figure below.
E901 2.4G WiFi 6+BLE 5.1 Module
Lead-free reflow welding process parameters are shown in the following table.
k H
40150
60150s 2.0/s
–
–
150200 60120s 1.0/s
–
–
217
6090s
–
230-260
–
Tmax180
–
–
–
1.0/sSlope4.0/s
s o s
Preheating zone: The temperature is from 40 ° C to 150 ° C, the temperature
rise rate is controlled at about 2 ° C /s, and the temperature zone time is 60
~ 150s.
Average temperature zone: the temperature is 150 ~ 200, steadily and slowly
rising, the temperature rise
rate is less than 1/s, and the time in the region is controlled at 60 ~ 120s (Note: the region must be slowly
heated, otherwise it is easy to lead to bad welding).
Reflux zone: temperature from 217 ~ Tmax ~ 217, the whole interval time is controlled at 60 ~ 90s.
Cooling zone: The temperature is from Tmax to 180, and the maximum temperature
drop rate can not exceed 4/s.
The temperature from room temperature 25 to 250 should not exceed 6 minutes.
The reflow curve is recommended only. The client needs to adjust it according
to the actual production situation.
The target reflux time is 60 to 90s. For some boards with large heat capacity
that cannot meet the time
requirements, the reflux time can be set relax to 120s. Package body
temperature standard refer to IPC/JEDEC J-STD-020D standard, package body
temperature
measurement method refer to JEP 140 standard. IPC/JEDEC J-STD-020D standard, enclosed body temperature
measurement method in accordance with the JEP 140 standard requirements:
The temperature resistance standards of lead-free device packages in IPC/JEDEC 20D are shown in the following
table. Table IPC/JEDEC020D temperature tolerance standards for lead-free device packages
Package Thickness
1.6mm
Volume mm3 350 260
Volume mm3 350~2000
260
Volume mm3 2000 260
1.6mm2.5mm
260
250
245
2.5mm
250
245
245
The device welding ends (welding balls, pins) and external heat sinks are not included in t he volume calculation. Reflow welding process curve measurement wed method:
JEP140 recommendation: For devices with small thickness, the thermocouple is directly attached to the surface of the device when measuring the temperature of the package, and for devices with large thickness, the thermocouple is drilled into the surface of the device for measurement. Due to the requirements of quantifying the thickness of the device, it is recommended to use all the holes in the surface of the package buried in the thermocouple type (especially thin devices, except drilling is not possible).
FCC Statement This device complies with part 15 of the FCC rules. Operation is
subject to the following two conditions: (1) this device may not cause harmful
interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation. Changes or
modifications not expressly approved by the party responsible for compliance
could void the user’ s authority to operate the equipment. NOTE: This
equipment has been tested and found to comply with the limits for a Class B
digital device, pursua nt to part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful inte rference in a
residential installation. This equipment generates uses and can radiate radio
frequency energy a nd, if not installed and used in accordance with the
instructions, may cause harmful interference to radio com munications.
However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turn ing the
equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures: – Reorient or relocate
the receivingantenna. – Increase the separation between the equipment and
receiver. -Connect the equipment into an outlet on a circuit different from
that to which the receiver is connected. -Consult the dealer or an experienced
radio/TV technician for help important announcement Important Note: Radiation
Exposure Statement This equipment complies with FCC radiation exposure limits
set forth for an uncontrolled environment. This equipment should be installed
and operated with minimum distance 20cm between the radiator and your body.
This transmitter must not be co-located or operating in conjunction with any
other antenna or transmitter. Country Code selection feature to be disabled
for products marketed to the US/Canada. This device is intended only for OEM
integrators under the following conditions: 1. The antenna must be installed
such that 20 cm is maintained between the antenna and users, and 2. The
transmitter module may not be co-located with any other transmitter or
antenna, 3. For all products market in US, OEM has to limit the operation
channels in CH1 to CH11 for 2.4G band
by supplied firmware programming tool. OEM shall not supply any tool or info
to the end-user regarding to Regulatory Domain change. (if modular only test
Channel 1-11) As long as the three conditions above are met, further
transmitter testing will not be required. However, the OEM integrator is still
responsible for testing their end-product for any additional compliance
requirements required with this module installed.
Important Note: In the event that these conditions cannot be met (for example
certain laptop configurations or co-location with another transmitter), then
the FCC authorization is no longer considered valid and the FCC ID cannot be
used on the final product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate FCC authorization.
End Product Labeling The final end product must be labeled in a visible area
with the following” Contains FCC ID: 2AXX8-E901-NI-WS”
Manual Information to the End User The OEM integrator has to be aware not to
provide information to the end user regarding how to install or remove this RF
module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning
as show in this manual.
Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01r01 2.2 List of applicable FCC rules
CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the
modular transmitter
2.3 Specific operational use conditions
This module is stand-alone modular. If the end product will involve the
Multiple simultaneously transmitting condition or different operational
conditions for a stand-alone modular transmitter in a host, host manufacturer
have to consult with module manufacturer for the installation method in end
system.
2.4 Limited module procedures
Not applicable
2.5 Trace antenna designs
Not applicable
2.6 RF exposure considerations
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. This equipment should be installed and operated with
minimum distance 20cm between the radiator & your body.
2.7 Antennas This radio transmitter FCC ID:2AXX8-E901-NI-W S has been approved
by Federal Communications
Commission to operate with the antenna types listed below, with the maximum
permissible gain indicated. Antenna types not included in this list that have
a gain greater than the maximum gain indicated for any type listed are
strictly prohibited for use with this device.
Antenna No.
Bluetooth 2.4G Wi-Fi
Model No. of antenna:
/ /
Type of antenna:
PCB Antenna PCB Antenna
Gain of the antenna (Max.) Antenna 1
-0.58 -0.58
Frequency range:
2402-2480MHz 2412-2462MHz
2.8 Label and compliance information
The final end product must be labeled in a visible area with the following”
Contains FCC ID:2AXX8-E901-NI-WS”.
2 .9 Information on test modes and additional testing requirements
Host manufacturer is strongly recommended to confirm compliance with FCC
requirements for the transmitter when
the module is installed in the host.
2.10 Additional testing, Part 15 Subpart B disclaimer
Host manufacturer is responsible for compliance of the host system with module
installed with all other applicable requirements for the system such as Part
15 B.
2.11 Note EMI Considerations
Host manufacture is recommended to use D04 Module Integration Guide
recommending as “best practice” RF
design engineering testing and evaluation in case non-linear interactions
generate additional non-compliant limits due to module placement to host
components or properties.
2.12 How to make changes
This module is stand-alone modular. If the end product will involve the
Multiple simultaneously transmitting condition or different operational
conditions for a stand-alone modular transmitter in a host, host manufacturer
have to consult with module manufacturer for the installation method in end
system. According to the KDB 996369 D02 Q&A Q12, that a host manufacture only
needs to do an evaluation (i.e., no C2PC required when no emission exceeds the
limit of any individual device (including unintentional radiators) as a
composite. The host manufacturer must fix any failure.
Read User Manual Online (PDF format)
Read User Manual Online (PDF format) >>