BDE Technology BDE-RF7970N BDE Multiprotocol Fully Integrated 13.56-MHz RFID and NFC Module Instruction Manual

July 30, 2024
BDE Technology

BDE Technology BDE-RF7970N BDE Multiprotocol Fully Integrated 13.56-MHz

RFID and NFC Module

Specifications

  • Product Name: BDE-RF7970N
  • Description: BDE Multiprotocol Fully Integrated 13.56-MHz RFID and NFC Module
  • Operating Temperature: -40 to +85°C
  • Size: 12.3 mm x 13.8 mm
  • Antenna Type: ANT pin out for antenna (BDE-RF7970N) or Integrated PCB Antenna or U.FL Connector for External Antenna(BDE-RF7970A-1)

Product Usage Instructions

Module Configuration

The module is configured by selecting the desired protocol in the control registers. Direct access to all control registers allows fine-tuning of various reader parameters as needed.

Data Rates and Protocol Support

The module supports data rates up to 848 kbps and offers integrated protocol handling for ISO/IEC 15693, ISO/IEC 18000-3, ISO/IEC 14443 A and B, and FeliCaTM. It also supports NFC Forum tag types 1, 2, 3, 4, and 5.

Key Features Overview

  • Supports NFCIP-1 and NFCIP2 standards
  • Integrated encoders, decoders, and data framing for NFC operations
  • RF field detector with programmable wake-up levels for NFC passive transponder emulation
  • Programmable output power up to +23 dBm
  • Programmable system clock frequency output
  • UART communication for user interaction

Applications

The module can be used in various applications such as wireless networks, public transport ticketing, access control systems, medical equipment, digital door locks, and more.

FAQ

  • Q: What are the supported NFC standards?
    • A: The module supports NFCIP-1 (ISO/IEC 18092) and NFCIP2 (ISO/IEC 21481) standards.
  • Q: What is the operating temperature range of the module?
    • A: The module can operate within a temperature range of -40 to +85 degrees Celsius.
  • Q: What are the dimensions of the BDE-RF7970A-1 module?
    • A: The dimensions of the BDE-RF7970A-1 module are 42.0 mm x 79.5 mm x 3.5 mm.

General Description

The BDE RF7970 module is a multiprotocol integrated 13.56 MHz NFC/RFID module supporting all three NFC operation modes reader/writer, peer-to-peer, and card emulation according to ISO/IEC 14443 A and B, Sony FeliCa, ISO/IEC 15693, NFCIP 1 (ISO/IEC 18092), and NFCIP 2 (ISO/IEC 21481). Built-in programming options make the device suitable for a wide range of applications for NFC, proximity, and vicinity identification systems. The BDE RF7970N is a transceiver module and the BDE RF7970A 1 is an integration of BDE RF7970N module, PCB trace antenna and MCU module. The module s is configured by selecting the desired protocol in the control registers. Direct access to all control registers allows fine tuning of various reader parameters as needed. The BDE RF7970 N and BDE RF7970A 1 modules support data rates up to 848 kbps with all framing and synchronization tasks for the ISO protocols onboard. The TRF7970A device also supports reader and writer modes for NFC Forum tag types 1, 2, 3, 4, and 5.

Key Features

  • Supports Near Field Communication (NFC) Standards NFCIP 1 (ISO/IEC 18092) and NFCIP ‑ 2 (ISO/IEC
  • Completely Integrated Protocol Handling for ISO/IEC 15693, ISO/IEC 18000 3, ISO/IEC 14443 A and B, and FeliCa™
  • Integrated Encoders, Decoders, and Data Framing for NFC Initiator, Active and Passive Target Operation for All Three Bit Rates (106 kbps, 212 kbps, 424 kbps), and Card Emulation
  • RF Field Detector With P programmable Wake-up Levels for NFC Passive Transponder Emulation Operation
  • RF Field Detector for NFC Physical Collision Avoidance
  • Integrated State Machine for ISO/IEC 14443 A Anticollision (Broken Bytes) Operation(Transponder Emulation or NFC Passive Target)
  • Programmable Output Power: +20 dBm (100 mW), +23 dBm (200
  • Programmable System Clock Frequency Output (RF, RF/2, RF/4) from 13.56 MHz or 27.12 MHz Crystal or Oscillator
  • Programmable Modulation Depth
  • Dual Receiver Architecture With RSSI for Elimination of “Read Holes” and Adjacent Reader System or Ambient In Band Noise Detection
  • ANT pin out for antenna (BDE RF7970N)
  • Integrated PCB Antenna or U.FL Connector for External Antenna (BDE RF7970A 1
  • UART Communication for User
  • LGA 33 package (BDE RF 7970N) 1 .27mm Pitch Milli Grid Header (BDE RF7970A 1
  • Dimension: 12.3 mm x 13.8 mm (BDE RF7970N) Dimension: 42 mm x 79.5 mm (BDE RF7970A 1

Applications

  • Mobile Devices (Tablets, Handsets)
  • Secure Pairing ( Bluetooth®, Wi Fi®, Other Paired Wireless Networks)
  • Public Transport or Event Ticketing
  • Passport or Payment (POS) Reader System
  • Retail Automation and Payment
  • Short Range Wireless Communication Tasks (Firmware
  • Product Identification or Authentication
  • Medical Equipment or Consumables
  • Access Control, Digital Door Locks
  • Sharing of Electronic Business Cards

Table 1. Module Variants


Part Number

| ****

Antenna Type

| ****

Description

| ****

Size (mm)

| Operating Temperature
---|---|---|---|---


BDE-RF7970N

| ****

ANT pin out

| A transceiver module with TRF7970A

and DCDC on board

| ****

12.3 x 13.8 x 2.7

| -40℃ to +85℃


BDE-RF7970A-1

| ****

PCB Antenna or U.FL connector

| An integration of BDE-RF7970N module, PCB trace antenna or U.FL connector, MCU module.| ****

42.0 x 79.5 x 3.5

| ****

-40℃ to +85℃

References

  1. RF7970A Resources: https://www.ti.com/product/TRF7970A
  2. MSPM0 Resources: https://www.ti.com/product/MSPM0L1304

Terminal Configuration and Functions

Pin Diagram

Pin Attributes and Pin Multiplexing

Table 2-1. Pin Description of BDE-RF7970N

Module Pin # Pin Name Type Description
1 GND Ground Power ground
2 IO2 I/O GPIO
3 IO3 I/O GPIO
4 SPI_SS/IO4 I/O SPI_CS, GPIO
5 IO5 I/O GPIO
6 SPI_MISO/IO6 I/O SPI_MISO, GPIO
7 SPI_MOSI/IO7 I/O SPI_MOSI, GPIO
Module Pin # Pin Name Type Description
--- --- --- ---
8 EN2 I Selection of power down mode
9 GND Ground Power ground
10 SPI_CLK I SPI_CLK, Data clock input for MCU communication

11

| ****

SYS_CLK

| ****

O

| If EN = 1 (EN2 = don’t care) the system clock for MCU is configured;

If EN = 0 and EN2 = 1, then system clock is set to 60 kHz

12| EN| I| Chip enable input
13| GND| Ground| Power ground
14| VCC| Power| Power supply input pin
15| GND| Ground| Power ground
16| GND| Ground| Power ground
17| GND| Ground| Power ground
18| GND| Ground| Power ground


19

| ****

VDD_X

| ****

Power

| Internally regulated supply (2.7 V to 3.4 V) for digital circuit and external

devices

20| GND| Ground| Power ground
21| GND| Ground| Power ground
22| GND| Ground| Power ground
23| RFOUT| O| RF Output
24| GND| Ground| Power ground
25| GND| Ground| Power ground
26| GND| Ground| Power ground
27| ASK_OOK| I/O| Selection between ASK and OOK modulation (0 = ASK, 1 = OOK)
28| IRQ| O| Interrupt request


29

| ****

MOD

| ****

I/O

| External data modulation input for direct mode, Subcarrier digital data

output

30| IO1| I/O| GPIO
31| GND| Ground| Power ground
32| GND| Ground| Power ground
33| GND| Ground| Power ground
34| GND| Ground| Power ground

Table 2 2 . Pin Description of BDE RF7970A 1

Module Pin # Pin Name Type Description
1 VCC Power Power supply
2 5V Power 5V power supply, leave NC if not used
3 GND Ground Power ground
4 GND Ground Power ground
5 PA18 I/O Reserved I/O, PA18 in MCU, leave NC if not used
6 RXD I UART RXD
7 RST I Reset pin, active low
8 TXD O UART TXD
9 SWCLK I SWD input clock
10 NC
11 SWDIO I/O SWD data IO
12 NC

Specifications

Absolute Maximum Ratings

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are\ stress ratings only, so functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification are not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.

PARAMETER MIN MAX UNIT Notes
VDD -0.3 4.1 V
RF pin TBD TBD dBm
Storage Temperature -40 85 °C

Recommended Operating Conditions

PARAMETER MIN MAX UNIT Notes
VDD 2.7 3.6 V
Operating Temperature -40 85 °C

ESD Ratings

| VALUE| UNIT
---|---|---

V (ESD) Electrostatic discharge

| Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)| ±2000|

V

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

| ±500

  1. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
  2. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process

Mechanical Specifications

Mechanical Dimension

Figure 5-1 and 5-2 shows the mechanical dimension of the module

Recommended Land Pattern

Figure 5-2 shows the recommended land pattern of the BDE-RF7970N module.

Recommended Ejector Header

Figure 5-3 shows the recommended and default ejector header of the BDE-RF7970A module.

Revision History

Revision Date Description
V0.1 6-March-2024 Preliminary, draft

FCC Warning

Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01

List of applicable FCC rules

FCC Part 15.2 25

Specific operational use conditions

This transmitter/module and its antenna(s) must not be co-located or operating in conjunction with any transmitter. This information also extends to the host manufacturer’s instruction manual.

Limited module procedures

Not applicable

Trace antenna designs

It is not applicable as a trace antenna which is not used on the module.

RF exposure considerations

This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. The host product manufacturer would provide the above information to end users in their end product manuals.

Antennas

Integrated PCB Antenna; 0 dBi; 13.56 13.56 MHz

Label and compliance information

The end product must carry a physical label or shall use e-labeling followed by KDB784748D01 and KDB 784748 stating “Contains Transmitter Module FCC ID: 2ABRU 7970”.

Information on test modes and additional testing requirements

For more information on testing, please contact the manufacturer.

Additional testing, Part 15 Subpart B disclaimer

The modular transmitter is only FCC-authorized for the specific rule parts (FCC Part 15.2 25 ) listed on the grant, and the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed when contains digital circuity.

FCC Statements

(OEM) The integrator has to assure compliance of the entire end product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore, the module should be transmitting and the evaluation should confirm that the module’s intentional emissions (15C) are compliant (fundamental / out of band). Finally the integrator has to apply the appropriate equipment authorization (e .g. Verification) for the new host device per the definition in § Integrator is reminded to ensure that these installation instructions will not be made available to the end user of the final host device.
The final host device, into which this RF Module is integrated has to be labeled with an auxiliary label stating the

FCC ID of the RF Module, such as “Contains FCC ID: 2ABRU 7970 “

This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:

  1. this device may not cause harmful interference, and
  2. this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. The Integrator will be responsible for satisfying SAR/ RF Exposure requirements when the module integrated into the host device.

Module statement

The single modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of § 15.2 12(a)(1) as summarized below.

  1. The radio elements have the radio-free quency circuitry shielded.
  2. The module has buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal.
  3. The module contains power supply regulations on the module.
  4. The module contains ns a permanently attached antenna.
  5. The module demonstrates compliance in a stand-alone configuration.
  6. The module is labeled with its permanently affixed FCC ID label
  7. The module complies with all specific rules applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee.
  8. The module complies with RF exposure requirements.

NOTE: This equipment has been tested and found to comply with the limits for a

Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference\ in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be\ determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and the receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help

IC Statements

The final host device, into which this RF Module is integrated” has to be labeled with an auxiliary label stating the IC of the RF Module, such as” Contains transmitter module IC: 25657 7970”
This device contains license-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic

Development Canada’s license exempts RSS(s). Operation is subject to the following two conditions:

  1. This device may not cause interference.
  2. This device must accept any interference, including interference that may cause undesired operation of the device.

Contact

References

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