ROHM RB-D610Q306GD36 Microcontroller User Manual

ROHM RB-D610Q306GD36 Microcontroller User Manual

Dear customer

ROHM Co., Ltd. (“ROHM”), on the 1st day of April, 2024, has absorbed into merger with 100%-owned subsidiary of LAPIS Technology Co., Ltd.

Therefore, all references to “LAPIS Technology Co., Ltd.”, “LAPIS Technology” and/or “LAPIS” in this document shall be replaced with “ROHM Co., Ltd.”

Furthermore, there are no changes to the documents relating to our products other than the company name, the company trademark, logo, etc.

Thank you for your understanding.

Notes

1. The information contained herein is subject to change without notice.

2. When using LAPIS Technology Products, refer to the latest product information (data sheets, user’s manuals, application notes, etc.), and ensure that usage conditions (absolute maximum ratings, recommended operating conditions, etc.) are within the ranges specified. LAPIS Technology disclaims any and all liability for any malfunctions, failure or accident arising out of or in connection with the use of LAPIS Technology Products outside of such usage conditions specified ranges, or without observing precautions. Even if it is used within such usage conditions specified ranges, semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury, fire or the other damage from break down or malfunction of LAPIS Technology Products, please take safety at your own risk measures such as complying with the aerating characteristics, implementing redundant and fire prevention designs, and utilising backups and fail safe procedures.
   You are responsible for evaluating the safety of the final products or systems manufactured by you.

3. Descriptions of circuits, software and other related information in this document are provided only to illustrate the standard operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. And the peripheral conditions must be taken into account when designing circuits for mass production. LAPIS Technology disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, and other related information.

4. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of LAPIS Technology or any third party with respect to LAPIS Technology Products or the information contained in this document (including but not limited to, the Product data, drawings, charts, programs, algorithms, and application examples、etc.). Therefore LAPIS Technology shall have no responsibility whatsoever for any dispute, concerning such rights owned by third parties, arising out of the use of such technical information.

5. The Products are intended for use in general electronic equipment (AV/OA devices, communication, consumer systems, gaming/entertainment sets, etc.) as well as the applications indicated in this document. For use of our Products in applications requiring a high degree of reliability (as exemplified below), please be sure to contact a LAPIS Technology representative and must obtain written agreement: transportation equipment (cars, ships, trains, etc.), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems, etc. LAPIS Technology disclaims any and all liability for any losses and damages incurred by you or third parties arising by using the Product for purposes not intended by us. Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters, etc.

6. The Products specified in this document are not designed to be radiation tolerant.

7. LAPIS Technology has used reasonable care to ensure the accuracy of the information contained in this document. However, LAPIS Technology does not warrant that such information is error-free and LAPIS Technology shall have no responsibility for any damages arising from any inaccuracy or misprint of such information.

8. Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive.
   LAPIS Technology shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations.

9. When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act.

10. Please contact a ROHM sales office if you have any questions regarding the information contained in this document or LAPIS Technology’s Products.

11. This document, in part or in whole, may not be reprinted or reproduced without prior consent of LAPIS Technology. (Note) “LAPIS Technology” as used in this document means LAPIS Technology Co., Ltd.

Overview

This instruction manual is for the RB-D610Q306GD36 which is the reference board for ML610Q306 (hereinafter referred to as “MCU”).

This board can be combined with on-chip debug tool EASE1000 V2 and software development environment (DUT8 and MWU16) to do the following:

• Development and debugging of the MCU control software.
• Programming control and sound code data to the MCU internal Flash-ROM.
• Voice playback by the MCU.

Operational notes

The following describes the precautions to follow when handling the RB- D610Q306GD36.

• Turn off the power when inserting and removing jumper socket from PWR/SPVDD/VREF Jumper pin on the RBD610Q306GD36.
• Turn off the power when attaching and reattaching external board, device and cable from CN1/CN2/CNUE Connector on the RB-D610Q306GD36.
• Connect only monaural speakers to the jack.
• RB-D610Q306GD36 is a device used only by experts in R&D facilities for research and development purposes. RBD610Q306GD36 is not intended to be used in mass-produced products or parts thereof.
• The information in this document is subject to change without notice due to product improvement and technological improvement. Prior to use, please ensure that the information is up to date.
• LAPIS Technology does not provide any RB-D610Q306GD36 support. Replace only in case of initial failure.

Board Outline Drawing

Figure 1 shows an outline drawing of the RB-D610Q306GD36

Figure 1 Board Outline Drawing

Specification

Jumper pin (PWR/SPVDD/VREF)
This board has three jumper pins named PWR/SPVDD/VREF. Each jumper pin specification is explained blow.

• PWR jumper pin

PWR jumper pin can switch the supply source of VDD pin of MCU.

When attaching “EASE1000 V2” on the board, PWR jumper pin set to “EASE” if power supply from 13pin of CNUE
connector.
PWR jumper pin set to “USR” if power supply from CN1 connector.

• SPVDD jumper pin

SPVDD jumper pin can switch the supply source of SPVDD pin of MCU.

SPVDD jumper pin set to “VDD” if power supply from VDD as same as selecting PWR jumper pin.
SPVDD jumper pin set to “USR” if power supply from CN1 connector.

• VREF jumper pin

VREF jumper pin can switch the supply source of VREF pin of MCU.

VREF jumper pin set to “VDD” if power supply from VDD as same as selecting PWR jumper pin.
VREF jumper pin set to “USR” if power supply from CN2 connector.

Figure 2 Jumper pin and Power circuit

ADC
Apply voltage to the AIN0-AIN3 pins of MCU from 5-8 pins of CN2 when using ADC function. Mount a noise reduction capacitor on board land indicated by “C5-C8” if necessary. Figure 3 shows the ADC circuit processing example.

Figure 3 ADC circuit processing example

LED

P20-22 pins of MCU allow direct LEDs drive. Enable to use LEDs connecting these pins when the N-channel open drain output is selected. Unmounted register on the board indicated by “R4-R6” when not using LEDs. Figure 4 shows the LED circuit processing example.

Figure 4 LED circuit processing example

Jack
Jack is connected to SPP/SPM pins of the MCU.
Connect only monaural speakers to the jack.

CN1 Connector

The through hole indicated by “CN1” is enable to mount connector that specification is single row, 8 position and 2.54mm(0.1mil) pich.
The table of CN1 connector pin related to the MCU is shown below.

CN2 Connector

The through hole indicated by “CN2” is enable to mount connector that specification is Double row, 12 position and 2.54mm(0.1mil) pich.
The table of CN2 connector pin related to the MCU is shown below.

CNUE connector

CNUE connector is used to connect the on-chip debug tool EASE1000 V2 manufactured by LAPIS Technology Co.,Ltd.
Refer to the “EASE1000 V2 User’s Manual” for details.

Appendix

PCB layout
Figure 5 shows the RB-D610Q306GD36 PCB layout.

Figure 5 PCB layout

BOM list, Schematic

| Parts Number| Symbol| Contents| Qty.| Vendor
---|---|---|---|---|---
1| QTU-11929| RB-D610Q306GD36| PWB| 1| LAPIS Technology Co., Ltd.
2| C1608X7R1E105K| C1,C2,C3,C4| Ceramic Capacitor 1uF/25V X7R| 4| TDK
3| –| C5,C6,C7,C8| Unmounted| 4| –
4| TSW-108-07-F-S| CN1| Unmounted| 1| Samtec
5| TSW-112-07-L-D| CN2| Unmounted| 1| Samtec
6| HIF3FC-14PA-2.54DSA| CNUE| 14pin Header| 1| HIROSE
7| MJ-354A0| JACK| Monaural Speaker Jack| 1| MARUSHIN
8| SML-M13UT| LED1,LED2,LED3| LED Red| 3| ROHM
9| MCR03EZPJ561| R1,R2,R3| Resistor 560Ω ±5%| 3| ROHM
10| MCR03EZRJ000| R4,R5,R6| Resistor 0Ω ±5%| 3| ROHM
11| MCR03EZPJ102| R7,R8,R9,R10| Resistor 1kΩ ±5%| 4| ROHM
12| XJ8B-0311| J1,J2,J3| 3pin Header| 3| OMRON
13| XJ8A-0214| –| Jumper Socket| 3| OMRON
14| HK-3-G| TP1,TP2,TP3,TP4,TP5| Check pin| 5| MAC8
15| Test Pad| AIN0,AIN1,AIN2,AIN3| Unmounted| 4| –
16| ML610Q306-NNNGD| U1| MCU| 1| LAPIS Technology Co., Ltd.
17| FF013-P3555-AR791| –| Rubber leg, Push rivet| 4| KOYO FASTENER

LAPIS Technology Co., Ltd

TITLE| RB-D610Q306GD36
APPLICATION| ML610Q306 WQFN36 Reference Board
DWG No| QTS-11803
SHEET| 1 of 1| Rev 1.0

Revision History

References

• Notice of Site Integration | LAPIS Technology

Read User Manual Online (PDF format)

Download This Manual (PDF format)

Download this manual  >>