DELL P2725HB Monitor Instruction Manual
- July 4, 2024
- Dell
Table of Contents
DELL P2725HB
Disassembly Procedures
S1 Turn off the monitor.
S2 Place the monitor on a soft cloth or cushion
Press and hold the stand release button at the back of the display Lift the
stand assembly up and away from the monitor
S3 Unlock 4 screws on “Rear Cover”
(Screw Torque:
9±1 kgf)
S4 Use hands or “Bar Scraper” to disassemble “Rear Cover” from “Middle Frame” according to the sequence shown in the picture
S5 Pull out “Control board FFC” from “Interface board” and tear off it from “Main Shielding” to take off “Rear Cover”
S6 Unlock 3 screws to disassemble “Control board” from “Rear Cover” Tear off “Control board FFC” from “Rear Cover” and take off “Control board” from “Rear Cover”
S7 Disassemble
“Control board FFC” from “Control board”
S8 Tear off a black tape from “USB board FFC” and “Panel” Disassemble “USB board FFC” from “USB board” and “Interface board” Unlock 1 screw on “USB board” Disassemble “USB board” from “Middle Frame”
S9 Tear off a gasket from “USB Shielding” (see pink mark) Tear off a gasket from “USB board” (see red mark)
S10 Disassemble “USB board” from “USB Shielding”
S11 Tear off a tape from “Backlight wire” Unplug “Backlight wire” from “Power board” and “Panel”
S12 Tear off 2 conductive tapes from “Main Shielding and “Panel”
S13 Tear off a long tape from “LVDS FFC” Disassemble “LVDS FFC” from “Panel” Take off “Main Shielding” from “Panel”
S14 Unlock 15
screws to disassemble “Middle Frame” from “Panel” Take off “Middle Frame” from
“Panel”
S15 Disassemble “MYLAR” from “Main Shielding”
S16 Unlock 2
hexagonal screws
(Screw Torque:
5.0±0.6 kgf)
S17 Unlock 5 PCBA screws
S18 Disassemble “Interface board” and “Power board” from “Main Shielding” Unplug all cables from “Interface board”
S19 Remove electrolyte capacitors (red mark) from printed circuit boards
S19-1 Cut the glue between bulk cap. and PCB with a knife
S19-2 Ensure cutting path within the glue, don’t touch bulk cap. or PCB
S19-3 Take out bulk cap. pin solder with
soldering iron and absorber
Product material information
The following substances, preparations, or components should be disposed of or recovered separately from other WEEE in compliance with Article 4 of EU Council Directive 75/442/EEC.
| Capacitors / condensers (containing PCB/PCT) | No used |
|---|---|
| Mercury containing components | No used |
| Batteries | No used |
| Printed circuit boards (with a surface greater than 10 square cm) | Product has |
printed circuit boards (with a surface greater than 10 square cm)
Component contain toner, ink and liquids| No used
Plastic containing BFR| No used
Component and waste contain asbestos| No used
CRT| No used
Component contain CFC, HCFC, HFC and HC| No used
Gas discharge lamps| No used
LCD display > 100 cm2| Product has an LCD greater than 100 cm2
External electric cable| Product has external cables
Component contain refractory ceramic fibers| No used
Component contain radio-active substances| No used
Electrolyte capacitors (height > 25mm, diameter > 25mm)| Product has
electrolyte capacitors (height >25mm, diameter > 25mm)
Tools Required
List the type and size of the tools that would typically can be used to
disassemble the product to a point where components and materials requiring
selective treatment can be removed.
Tool Description:
– Screwdriver
– Scraper Bar
– Penknife
– Soldering iron and absorber