EBYTE CSRA64215 Wireless Audio Module User Manual

EBYTE CSRA64215 Wireless Audio Module

Overview

Brief introduction

E104-BT30 is a multifunctional and cost-effective module developed by our company for audio Bluetooth transmission. The main control uses the CSRA64215 chip of CSR to provide the module with high-quality sound and compatibility. The Bluetooth module uses a driver-free method. Users only need to connect the module to the application product to quickly achieve high-quality Bluetooth audio transmission and enjoy wireless music. And the module supports APTX, APTXLL, ACC and other high-quality sound effects.

Features

• Bluetooth V4.2+EDR standard specifications
• Support TWS
• Automatic reconnection
• MIC input
• APTX、ACC、Aptx Low latency
• AVRCP 1.5、A2DP 1.3 、HFP 1.5
• CSR latest sixth-generation CVC enhancement technology implements noise reduction and echo cancellation
• PCB antenna, the maximum communication distance is 50 meters in open air
• Battery level display

Application

• High-quality wireless stereo headphones;
• High-fidelity speaker and sound;
• Bluetooth car audio&video;
• Bluetooth speaker calling.

Specification and parameter

Electrical performance parameters

Main parameter

| Performance|

Remark

---|---|---
Min.| Typ.| Max.
Operating voltage（V）| 1.9| 3.3| 3.6| ≥3.3V can guarantee output power
Communication level（V）|

1.8

|

3.3

|

3.6

| Level is determined by VDD-PADS-1 level and

VDD-PADS-2 level

Operating temperature（℃）| -40| 20| +85| Industrial design
Operating frequency（MHz）| 2402| –| 2480| Support Bluetooth protocol standard frequency

band

Powe r consu mptio n

| Not connected current

(mA)

|

0.5

|

–

|

8

|

Bluetooth is discoverable

Connected unplayed

current (mA)

|

10

|

–

|

14

|

Bluetooth is connected but no music is playing

Audio output status

current (mA)

|

15

|

–

|

18

|

Bluetooth is connected and playing music

Max Tx power（dBm）| –| 9| 9| —
Receiving sensitivity（dBm）| –| -90.5| -92.0| BDR
Main parameter| Description| Remark
---|---|---

Distance for reference

|

50m

| Clear and open area, antenna height: 2.5m, indoor communication

≥10m

Crystal frequency| 26MHz| —
On-board Flash| 4M| —
Package| SMD| —
Connector| 1.1mm| Refer to size drawings and PCB package library for details
Size| 16*25mm| Refer to size drawings for details
Antenna| PCB| 50 ohm impedance

Size and pin definition

14

|

1V35-SMPS

|

P

| Module 1.35V power output, external decoupling capacitor is recommended,

see Recommended circuit for details

---|---|---|---

15

| VREGENA

BLE

|

I

| Bluetooth module power-on / power-off control pin, high level is effective.

Note that the module needs to be initialized before powering on.

16

|

VCHG

|

P

| Internal charger input, usually connected to VBUS, see Typical application

circuit for details

17| CHG_EXT| P| External battery charger control (reserved function)
18| VBAT_SE| P| Battery charge sensing input (reserved function)

19

|

VBAT-IN

|

P

| Battery power input pin, cannot exceed 3.6V, otherwise the module will be

damaged

20| GND| P| Ground, connect to power reference ground
21| USB-DN| I/O| USB cable negative (reserved function)
22| USB-DP| I/O| USB cable positive (reserved function)
23| PIO18| I/O| General-purpose I / O (reserved function)
24| PIO21| I/O| General-purpose I / O (reserved function)
25| PIO6| I/O| General-purpose I / O (reserved function)
26| PIO1| I/O| Next song Key input, high level is effective
27| PIO8| I/O| Previous song Key input, high level is effective

28

| VDD-PADS

-1

|

P

|

Input and output port power supply 1, usually 1.8V power supply connection

29

|

1V8-SMPS

|

P

| Module 1.8V power output, external decoupling capacitor is recommended, see

4.2 Recommended circuit for details

30

| VDD-PADS

-2

|

P

|

Input and output port power 2, usually 1.8V power connection

31

|

PIO7

|

I/O

| Volume +      Key input, high level effective, long press to continuously

increase;

32| PIO9| I/O| Play / Pause      Key input, high level effective

33

|

PIO0

|

I/O

| Volume –      Key input, high level effective, long press to continuously

decrease;

34| MIC-AN| I| Channel A line or microphone input negative
35| MIC-AP| I| Channel A line or microphone input positive
36| MIC-BIAS| I| Microphone bias
37| LINE-BN| I| Channel B line input negative
38| LINE-BP| I| Channel B line input positive
39| SPK-RN| O| Right channel speaker output negative
40| SPK-RP| O| Right channel speaker output positive
41| SPK-LN| O| Left channel speaker output negative
42| SPK-LP| O| Left channel speaker output positive
43| GND| P| Ground, connect to power reference ground
pay attention:

The function description of the above pins is only for the default program functions of our company. If you need other functions, please contact us for customization. For the self-developed pin functions, please refer to the official user manual of CSRA64215.

Quick start

This quick use requires our test baseboard.
Instruction
Power supply options:
The jumper cap on this circuit is used to select the power supply mode, which is selected according to the user’s power supply mode.
Boot:
Press the S1 self-locking switch, and then LED0 (green) blinks. 2 seconds later, LED0 and LED2 (blue) blink alternately. At this time, the Bluetooth named E104-BT30 V1.0 can be searched on the phone, and you can connect
AUX_OUT output power: Connect the 3.5mm headphones here
Power amplifier circuit:
If the user has a 3W speaker, you can directly connect the two terminals of the power amplifier circuit. Key control circuit:
PLAY:
Music play and pause button, it has the following states.

When connect to a mobile phone, short press the PLAY button to play music and pause.
When connect to a mobile phone, long press to disconnect the current connection and enter the discoverable state. At this time, LED1 (red) will blink once.
When connect to a mobile phone, when there is an incoming call, short press the PLAY button to answer the call. V-: This button is volume reduction.

There are long-press and short-press of the button.Long-press can continuously decrease the volume. Short-press decreasesit a little.
V +: This button is volume increase. There are long-press and short-press of the button. Long-press continuously increases the volume, and short-press increases it a bit.
Note: The above two volume buttons cannot synchronize the volume of the mobile phone by default. If you need to synchronize the volume of the mobile phone, you need to turn on the “volume synchronization control” in the developer mode of the mobile phone. After it is turned on, please clear the phone pairing and then connect again.
PREV: This button is the previous song button, which can control the phone to play the previous music
NEXT: This button is the next song button, which can control the phone to play the next music,
H: On/Off circuit
If it is currently turned off, press it again to turn it on. If it is turned on,
press it again and then turn it off.
Power on, MFB indicator (green) is always on.
Power off, MFB indicator (green) goes out.
TWS function use:
Requires two modules.
TWS refers to the multi-connection mode, which is also called “pair-to-box”. Two speakers can be configured as the master and slave.The master enters the initiating connection mode, and the slave enters the waiting connection mode.
Enter TWS host: PLAY button + PREV button, the blue light flashes quickly after pressing both buttons simultaneously for 2 seconds
Enter slave mode: PLAY button + NEXT button, the blue light flashes quickly after pressing both buttons simultaneously for 2 seconds
When there is a master and a slave, wait for the two sides to connect (about 10s). After the host long presses the PALY button, the phone can connect to the host and use TWS normally.
End TWS connected: Press PREV and NEXT simultaneously for about two seconds to end TWS connected mode.

Hardware circuit design and requirements

Hard design

• VREGENABLE（MFB）cannot directly pull up the resistor to VBAT, VREGENABLE（MFB）controls the turning on and off of the Bluetooth chip. You must wait until the chip is powered on to complete the initialization before you can start the turn it on, and cannot delay via resistors and capacitors(unstable). Related delay circuit can refer to the recommended circuit in the official user manual.
• The audio output and MIC input of the module are both differential circuits. For related hardware design, please refer to our hardware design circuit.
• The module is a PCB antenna. Do not route or copper under the antenna during layout and wiring. Hollowing is recommended.
• High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of  Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees；
• It is recommended to use a USB or battery to power the module. The ripple factor of the power supply should be as small as possible, and the module should be reliably grounded;
• Please pay attention to the correction of the positive and negative of the power supply, reverse connection may cause permanent damage to the module;
• Please check the power supply to ensure that it is between the recommended power supply voltage, if the maximum value is exceeded, the module will be permanently damaged;
• When designing current supply circuit, 30% margin is recommended to be remained so as to ensure long-term stable operation of the whole module;
• The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other parts with large electromagnetic interference;
• It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect the performance. It is recommended to keep them away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;
• Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog, power traces) around the module that will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;
• The module must not be installed inside metal shield, which will greatly reduce the transmission distance.

Recommended application circuit

Refer to “Recommended Circuit.pdf” for recommended circuit.

FAQ

Communication range is too short

• The communication distance will be affected when obstacle exists.
• Data lose rate will be affected by temperature, humidity and co-channel interference.
• The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
• Seawater has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
• The signal will be affected when the antenna is near metal object or put in a metal case.
• When the power supply at room temperature is lower than the recommended low voltage, the lower the voltage is, the lower the transmit power is.

Module is easy to damage

• Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will
• Please check the stability of power supply and ensure the voltage not to fluctuate too much.
• Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic susceptibility.
• Please ensure the humidity is within limited range for some parts are sensitive to humidity.
• Please avoid using modules under too high or too low temperature.

Welding guidance

Reflow Soldering Temperature

Preheat Temperature min （Tsmin）

| Minimum preheating

temperature

|

100℃

|

150℃

Preheat temperature max (Tsmax)

| Maximum preheating

temperature

|

150℃

|

200℃

Preheat Time (Tsmin to Tsmax)(ts)| Preheating time| 60-120 sec| 60-120 sec
Average ramp-up rate(Tsmax to Tp)| Average rising rate| 3℃/second max| 3℃/second max
Liquidous Temperature (TL)| Liquid phase temperature| 183℃| 217℃
Time（tL）Maintained Above（TL）| Time above liquidus| 60-90 sec| 30-90 sec
Peak temperature（Tp）| Peak temperature| 220-235℃| 230-250℃
Aveage ramp-down rate（Tp to Tsmax）| Average descent rate| 6℃/second max| 6℃/second max

Time 25℃ to peak temperature

| Time of 25 ° C to peak

temperature

|

6 minutes max

|

8      minutes max

Reflow Soldering Curve

E104-BT30

Model No.

| ****

Chip

| Frequency| Distance| Size| ****

Package

| ****

Interface

---|---|---|---|---|---|---
Hz| m| mm
E104-BT30-V1.0| CSRA64215| 2.402-2.485G| 50| 25162.0| SMD| Stereo（R\L）

Disclaimer

• This manual is as comprehensive and detailed as possible based on the existing materials. Our company reserves the right to modify the manual without further notice.
• This manual is only used as guide. All information in this manual does not constitute any expressed or implied warranty.

Revision history

About us

Sales hotline: 4000-330-990 Tel: 028-61399028
Support : support@cdebyte.com Website : www.ebyte.com
Address: Innovation Center B333~D347, 4# XI-XIN road,High-tech district (west), Chengdu, Sichuan, China

Documents / Resources

| EBYTE CSRA64215 Wireless Audio Module [pdf] User Manual
CSRA64215, Wireless Audio Module, CSRA64215 Wireless Audio Module, Audio Module, Wireless Audio, E104-BT30
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