M gear BLE Pass-Through Module Bluetooth 5.0 User Manual

June 6, 2024
M gear

M gear BLE Pass-Through Module Bluetooth 5.0

M gear BLE Pass-Through Module Bluetooth 5.0

Revision History

Date Release Author Description
2021/2/5 R01 LL/JW First released
2021/6/23 R02 LL/JW
2021/7/21 R03 LL/JW Add FCC Statement

Related Documents

Date Author Document(s)

Overview

BM200 is Bluetooth 5.0 Low Energy serial pass‐through module based on ultra‐low‐power Realtek RTL8762C SOC with built‐in high performance PCB antenna. Just simply connect BM200 module to MCU by using UART interface, focus on MCU firmware development and save time on BLE stack and hardware development, simple and neat.

Feature

  • Supports Bluetooth 5.0 Core Specification
  • Supports LE_1M, LE_2M, LR2 and LR8
  • ARM Cortex‐M4 with floating‐point unit (Maximum 40MHz)
  • Total 160KB SRAM
  • 4K bits eFuse for manufacturer use
  • Embedded 2Mbits flash
  • Supports AES128/192/256 encrypt /decrypt engine
  • Built‐in PCB antenna

PIN Configurations

M gear BLE Pass-Through Module Bluetooth 5.0 fig1

Descriptions of functional PINs

PIN NO. PIN NAME TYPE DESCRIPTIONS
1 GND POWER GROUND
2 NRESET I Hardware reset pin; low active
3 P4_3 IO General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull‐up and pull‐down.

4| P4_2| IO| General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull‐up and pull‐down.

5| P4_1| IO| General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull‐up and pull‐down.

6| P4_0| IO| General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull‐up and pull‐down.

7| P0_6| IO| General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull‐up and pull‐down.

8| P0_5| IO| General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull‐up and pull‐down.

9| VDDIO| POWER| Supply 1.8V~3.3V power for digital IO PAD VDDIO should be less than or equal to VDD
10| GND| POWER| GROUND
11| P0_4| IO| General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull‐up and pull‐down.

12| P0_3/Power on trap| IO| LOG_UART TX.

Power on trap: Pull-up for normal operation Pull-down to bypass executing program code in flash

(PAD internal pull-up by default)

13| P0_2| IO| General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull‐up and pull‐down.

14| P0_1| IO| General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull‐up and pull‐down.

15| P0_0| IO| General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull-up and pull-down.

16| P1_0/SWDIO| IO| General purpose IO; 8mA driving capability.

With wakeup function.

| | | With internal strong/weak pull-up and pull-down.

SWDIO (default).

---|---|---|---
17| P1_1/SWDCLK| IO| General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull‐up and pull‐down.

SWDCLK (default).

18| GND| POWER| GROUND
19| VDD| POWER| Supply 1.8V~3.3V power for Module
20| GND| POWER| GROUND
21| P3_3| IO| General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull‐up and pull‐down.

22| P3_2| IO| General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull‐up and pull‐down.

23| P3_1/UART_RX| IO| General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull‐up and pull‐down.

HCI_UART_RX (default).

24| P3_0/UART_TX| IO| General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull‐up and pull‐down.

HCI_UART_TX (default).

25| 32K_XI| A/IO| 32k crystal input or external 32k clock input (optional)

Pin share as GPIO when external 32k is not used.

26| 32K_XO| A/IO| 32k crystal input or external 32k clock input (optional)÷

Pin share as GPIO when external 32k is not used.

27| P2_2| IO| General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull‐up and pull‐down.

AUXADC input 2.

28| P2_3| IO| General purpose IO; 8mA driving capability. With wakeup function.

With internal strong/weak pull‐up and pull‐down. AUXADC input 3.

29| GND| POWER| GROUND

Electrical Characteristics

Parameter Minimum Typical Maximum Units
Storage Temperature ‐55 +125
Operation Temperature ‐30 +80
VDD 1.8 3 3.6 V
VDDIO (note: VDDIO ≦VDD) 1.8 3.6 V

Radio Characteristics

Condition: VDD=3V, VDDIO=3V, ambient temperature=25℃

Parameter Minimum Typical Maximum Units
Frequency Range 2402 2480 MHz

Sensitivity PER≦30.8%

(LE2M/LE1M/LR2/LR8)

| ‐93/‐96/‐99/‐104| ‐| ‐| dBm
Maximum Input level| ‐| ‐| ‐1| dBm
Maximum Output Power| | | 7| dBm

Digital IO Pin DC Characteristics

Parameter Condition Min Typical Max
Input high voltage (V) VDDIO=3.3V 2 3.3 3.6
Input low voltage(V) VDDIO=3.3V 0 0.9
Output hi voltage(V) VDDIO=3.3V 2.97 3.3
Output lo voltage(V) VDDIO=3.3V 0 0.33

Power Consumption

Condition: VDD=3V, VDDIO=3V, ambient temperature=25℃

Power Mode| Always on registers| 32K RCOSC| Retention SRAM| CPU| Wakeup Method| Current Consumption(typ.)
---|---|---|---|---|---|---
Power Down| ON| OFF| OFF| OFF| GPIO| 450nA
Deep LPS| ON| ON| Retention| OFF| GPIO,TIMER| 2.5uA
Active RX Mode| | | | | | 7.3mA
Active TX Mode| | | | | | 11.3mA

Antenna Peak gain & Efficiency

Frequency (MHz) Peak Gain (dBi) Efficiency (%)
2400 1.83 46
2450 0.37 44
2500 0.96 43

Antenna 2D Radiation Pattern Results

M gear BLE Pass-Through Module Bluetooth 5.0 fig2

Mechanical Dimensions

M gear BLE Pass-Through Module Bluetooth 5.0 fig3

Layout Footprint

M gear BLE Pass-Through Module Bluetooth 5.0 fig4

Application Schematic

M gear BLE Pass-Through Module Bluetooth 5.0 fig5

Layout Guideline

M gear BLE Pass-Through Module Bluetooth 5.0 fig6

M gear BLE Pass-Through Module Bluetooth 5.0 fig7

Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.

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