EBYTE E10-433MD-SMA SI4463 433MHz 100mW DIP Wireless Module User Manual

June 6, 2024
ebyte

E10-433MD-SMA User Manual
SI4463 433MHz 100mW DIP Wireless Module

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Overview

Brief introduction

E10-433MD-SMA is a DIP wireless module working at 433MHz developed based on chip SI4463 from Silicon Labs. Due to the use of the imported Si4463 as the core of the module, its stability has been well received by users, and compatibility is not a concern. The module is aimed at smart home, wireless meter reading, scientific research and medicine, and medium and long-distance wireless communication equipment. Since RF performance and component selection are in accordance with industrial standards, and the product has obtained FCC, CE, RoHS, and other international authoritative certification reports, users do not need to worry about its performance. With its stable and reliable characteristics, it is favored by the majority of users. Compared with the old products, it has made great progress in receiving current, receiving sensitivity, transmitting power, receiving rate range, and anti-interference ability. A high precision 26MHz crystal is used. Since the module is a pure RF transceiver module, you need to use the MCU driver or a dedicated SPI debug tool.

 Feature
  • The communication distance tested is up to 2km
  • The maximum transmission power of 100mW, software multi-level adjustable;
  • Support the global license-free ISM 433MHz band;
  • Support air date rate of 1.2kbps~1000kbps;
  • Support multiple modulation methods, (G)FSK, 4(G)FSK, (G)MSK, OOK ;
  • Support 64/128-byte Transceiver Data Register (FIFO);
  • Support 2.5V~3.6V power supply, power supply over 3.3 V can guarantee the best performance;
  • Industrial grade standard design, support -40 ~ 85 °C for working over a long time;
  • SMA connector, good for connecting an external antenna.
 Application
  • Home security alarm and remote keyless entry;
  •  Smart home and industrial sensors;
  • Wireless alarm security system;
  • Building automation solutions;
  • Wireless industrial-grade remote control;
  • Health care products;
  • Advanced Meter Reading Architecture(AMI);
  • Automotive industry applications.

Specification and parameter

Limit parameter
Main parameter Performance Remark
Min. Max.
Power supply (V) 0 4.

module
Blocking power (dBm)| –| 10| Chances of burn is slim when modules are used in short distance
Operating temperature (°C)| -40| 85| /

Operating parameter
Main parameter Performance Remark
Min. Typ. Max.
Operating voltage (V) 2. 3.
Communication level (V) 3.
Operating temperature (°C) -40
Operating frequency (MHz) 425 433
Power consumption on TX current (mA)
RX current (mA) 13
Sleep current (i.tA) 0.6
Max Tx Power (dBm) 19 20
Receiving sensitivity (dBm) -124 -126
Air data rate (bps) 0.123k
Main parameter Description Remark
--- --- ---
Distance for reference 2000m Test condition: clear and open area, antenna

gain: 5dBi, antenna height: 2.5m, air data rate: kbps
FIFO| 64Byte| Max length transmitted each time
Crystal frequency| 26MHz|
Modulation| GFSK
(recommended)| (G)FSK, 4(G)FSK, (G)MSK, OOK
Package| DIP|
Connector| 1 .5mm|
Communication interface| SPI| 0-10Mbps
Size| 16.6 *24mm|
Antenna| SMA-K| 50-ohm impedance

Size and pin definition

No. Name Direction Function
1 GN D Ground
2 SDN Shutdown Input Pin. It is low level when working (See SI4463 manual

for more details)
3| GPIO3| output| GPIO (see more from SI4463 datasheet)
4| GPIO2| output| GPIO (see more from SI4463 datasheet)
5| nSEL| input| SPI Chip select for starting SPI communication
6| MOSI| input| SPI master output slave input
7| MISO| output| SPI master input slave output
8| SCK| input| Serial Clock Input
9| IRQ| output| SPI interrupt request
10| GPIO1| output| GPIO (see more from SI4463 datasheet)
11| GPIO0| output| GPIO (see more from SI4463 datasheet)
12| VCC| | Power supply :1.8~ 3.6 V DC, 3.3V is recommended

Basic operation

Hardware design
  • It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and the module needs to be reliably grounded.;
  • Please pay attention to the correct connection of the positive and negative poles of the power supply. The reverse connection may cause permanent damage to the module;
  • Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the maximum value the module will be permanently damaged;
  • Please check the stability of the power supply, the voltage can not fluctuate frequently;
  • When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, so the whole machine is beneficial for long-term stable operation.;
  • The module should be as far away as possible from the power supply, transformers, high-frequency wiring, and other parts with large electromagnetic interference.;
  • High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(well-grounded), it must be close to the digital part of the module and routed in the Bottom Layer;
  • Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees;
  • It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect the performance. It is recommended to keep them away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;
  • Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog, power traces) around the module that will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done.
  • If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a risk of damage);
  • Try to stay away from some physical layers such as TTL protocol at 2.4GHz, for example, USB3.0;
  • The mounting structure of the antenna has a great influence on the performance of the module. It is necessary to ensure that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna extension cable to extend the antenna to the outside;
  • The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly weakened.
Software editing
  • GPIO0 \ GPIO1 \ GPIO2 \ GPIO3 are configurable I/O ports for various applications, see more in SI4463 datasheet.It can be floated when not used.
  • IRQ pin can also be disconnected. The SPI query mode can be used to obtain the interrupt status. However, it is recommended to use the external interrupt of the MCU.
  • SPI communication rate should not be set too high, usually around 1Mbps.
  • Please refer to “Operating Modes and Timing” for the SI4463 status switch, the switch between TX and RX should be through Ready, can not be switched directly.
  • Re-initialize register configuration when the chip is idle for higher stability.
  • For controlling GPIO2 ,GPIO3 externally,pin status is as follows:
    In tx mode:GPIO2 = 0; GPIO3 = 1;
    In rx mode:GPIO2 = 1; GPIO3 = 0;
    If the SI4463 is required to control itself, the mode of the configuration pins can be as follows when the program is initialized:
    SI44XX_GPIO_CONFIG( 0, 0, 32|0x40, 33|0x40, 0, 0, 0 );

 Basic application

Basic circuit diagram

FAQ

The communication range is too short
  • The communication distance will be affected when an obstacle exists.
  • Data loss rate will be affected by temperature, humidity, and co-channel interference.
  • The ground will absorb and reflect wireless radio waves, so the performance will be poor when testing near the ground.
  • Seawater has a great ability in absorbing wireless radio waves, so performance will be poor when testing near the sea.
  • The signal will be affected when the antenna is near a metal object or put in a metal case.
  • The power register was set incorrectly, the air data rate is set as too high (the higher the air data rate, the shorter the distance).
  • The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the transmitting power.
  • Due to antenna quality or poor matching between antenna and module.
The module is easy to damage
  • Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.
  • Please check the stability of the power source, the voltage cannot fluctuate too much.
  • Please make sure antistatic measures are taken when installing and using, high-frequency devices that have electrostatic susceptibility.
  •  Please ensure the humidity is within a limited range, some parts are sensitive to humidity.
  • Please avoid using modules under too high or too low temperatures.
BER(Bit Error Rate) is high
  • There are co-channel signal interference nearby, please be away from interference sources or modify frequency and channel to avoid interference;
  • The poor power supply may cause messy code. Make sure that the power supply is reliable.
  • The extension line and feeder quality are poor or too long, so the bit error rate is high;

Production guidance

Reflow soldering temperature
Profile Feature Curve characteristics Sn-Pb Assembly Pb-Free Assembly
Solder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin) Min preheating temp. 100°C 150°C
Preheat temperature max (Tmax) Mx preheating temp. 150°C 200°C
Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec
Average ramp-up rate(Ts max to Tp) Average ramp-up rate 3°C/second max

3°C/second max
Liquidous Temperature (TL)| Liquid phase temp.| 183°C| 217°C
Time (to) Maintained Above (TL)| Time below liquid phase line| 60-90 sec| 30-90 sec
Peak temperature (Tp)| Peak temp.| 220-235°C| 230-250°C
Average ramp-down rate (Tp to Tsmax)| Average ramp-down rate| 6°C/second max| 6°C/second max
Time 25°C to peak temperature| Time to peak temperature for 25°C| max 6 minutes| max 8 minutes

Reflow soldering curve

E10 Series

Model No.| IC| Frequency (Hz)| Tx power (dBm)| Test distance km| Package| Antenna
---|---|---|---|---|---|---
E10-868MS30| SI4463| 868M| 30| 6| SMD| Stamp hole/IPEX
E10-915MS20| SI4463| 915M| 20| 2.5| SMD| Stamp hole/IPEX
E10-868MS20| SI4463| 868M| 20| 2.5| SMD| Stamp hole/IPEX
E10-433MS1W| SI4463| 433M| 30| 6| SMD| Stamp hole
E10-433MD3| SI4438| 433M| 20| 2| SMD| IPEX
E10-433MD-SMA| SI4463| 433M| 20| 2| DIP| SMA-K
E10-433MS| SI4463| 433M| 20| 2| SMD| Stamp hole

 Antenna guidance

Antenna recommendation

The antenna is an important role in the communication process. A good antenna can largely improve the communication system. Therefore, we recommend some antennas for wireless modules with excellent performance and reasonable prices.

Model No.| Type| Frequency ncy Hz| Interface| Gain
dBi| Height| Cable| Function feature
---|---|---|---|---|---|---|---
TX433-NP-4310| PCB| 433M| SMA-J| 2| 43.8*9.5mm| –| Built-in FPC antenna
TX433-JW-5| Rubber| 433M| SMA-J| 2| 50mm| –| Flexible &omnidirectional
TX433-JWG-7| Rubber| 433M| SMA-J| 3.| 75mm| –| Flexible &omnidirectional
TX433-JK-20| Rubber| 433M| SMA-J| 3| 210mm| –| Flexible &omnidirectional
TX433-JK-11| Rubber| 433M| SMA-J| 3.| 110mm| –| Flexible &omnidirectional
TX433-XP-200| Sucker| 433M| SMA-J| 4| 19cm| 200cm| Sucker antenna, High gain
TX433-XP-100| Sucker| 433M| SMA-J| 4.| 18.5cm| 100cm| Sucker antenna, High gain
TX433-XPH-300| Sucker| 433M| SMA-J| 6| 96.5cm| 300cm| Big sucker antenna, ultra-high gain
TX433-JZG-6| Rubber| 433M| SMA-J| 3.| 52mm| –| Short straight &omnidirectional
TX433-JZ-5| Rubber| 433M| SMA-J| 2| 52mm| –| Short straight &omnidirectional

Package method for bulk order

Revision history

Version Date Description Issued by
1.00 2017/10/16 Initial version huaa
1.10 2018/5/23 Content updated huaa
1.20 2018/9/19 Model No. split Huaa

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Documents / Resources

| EBYTE E10-433MD-SMA SI4463 433MHz 100mW DIP Wireless Module [pdf] User Manual
E10-433MD-SMA, SI4463 433MHz 100mW DIP Wireless Module
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