Lenovo IBM High IOPS Modular Adapter with Low Profile Bracket User Guide

: June 3, 2024
: Lenovo

Table of Contents

Lenovo IBM High IOPS Modular Adapter with Low Profile Bracket
Features
Technical specifications
Physical specifications
Related publications
Trademarks
References
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Lenovo IBM High IOPS Modular Adapter with Low Profile Bracket

The new family of IBM® High IOPS Modular Adapters is the ultimate performance solution for embedded direct-attached storage for IBM System x®, IBM BladeCenter®, and IBM Flex System™. The offerings include 300 GB, 600 GB, and 800 GB Multi-Level Cell (MLC) adapters and a 300 GB Single Level Cell (SLC) adapter. Designed to offer high performance with low latency and a low CPU burden, these adapters can improve the performance of applications regardless of the mix of reads and writes. The IBM High IOPS Modular Adapters are built on the latest enterprise-level solid-state technologies and include sophisticated advanced features to help deliver consistently high levels of performance, endurance, and reliability under some of the most demanding conditions. The robust technology in these adapters helps optimize the number of program cycles to the flash storage, efficiently extending the rated endurance of flash storage.
The following figure shows an IBM High IOPS Modular Adapter

Figure 1. IBM High IOPS Modular Adapter with the low profile bracket

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Did you know?
IBM High IOPS Modular Adapters (Withdrawn) (withdrawn product)

Did you know?
The IBM High IOPS Modular Adapters can be fully rewritten up to 20 times per day (eMLC) or up to 140 times per day (SLC) throughout their entire five-year life expectancy.
Rigorous testing of IBM High IOPS Modular Adapters by IBM through the ServerProven® program assures a high degree of confidence in storage subsystem compatibility and reliability. Providing additional peace of mind, these adapters are covered under the IBM warranty.

Part number information
Table 1 lists the information for ordering part numbers and feature codes.

Table 1. Ordering part numbers and feature codes

Description	Part number	Feature code
IBM 300GB High IOPS MLC Modular Adapter	90Y4361	A3MZ
IBM 600GB High IOPS MLC Modular Adapter	90Y4365	A3N0
IBM 800GB High IOPS MLC Modular Adapter	90Y4369	A3N1
IBM 300GB High IOPS SLC Modular Adapter	90Y4373	A3N2

The part numbers for the adapters include the following items:

IBM High IOPS MLC Modular or SLC Modular Adapter with full height (3U) bracket attached Low profile (2U) bracket
USB Key with the documentation and drivers
Quick Install Guide
Important Notices
Warranty Flyer
IBM Safety Information
Technical Update Flyer

Features

The IBM High IOPS Modular Adapters use NAND flash memory as the basic building block of solid-state storage and contain no moving parts, thus are less sensitive to issues associated with vibration, noise, and mechanical failure. These adapters are built as block devices on a PCIe bus with advanced wear- leveling, ECC, and chip-level redundancy providing unparalleled reliability and efficiency. Based on the standard PCIe architecture coupled with the modular NAND SLC and MLC storage technologies, the High IOPS Modular Adapters are optimized for System x rack servers and can be deployed in blades through the PCIe expansion units.
Typical uses are applications with ultra-high-performance I/O needs, such as:

Web serving
Online transaction processing Data warehousing
Business intelligence and analytics Decision support
High-performance computing
The IBM High IOPS Modular Adapters have the following features:

Technology features:

Industry-standard PCIe form factor.
Enterprise-grade NAND SLC and MLC technology.
Modular NAND flash architecture.
Function as a PCIe storage and controller device. The operating system sees a block device. Bootable.

Performance and reliability features:

High performance of more than 200,000 read IOPS Access latency as low as 50 ?s
Up to 2 Gbps of sustained sequential throughput Enterprise-grade SLC and MLC
55-bit ECC protection per 512 bytes
Block level and page level failure protection DuraWrite advanced wear-leveling technology Dynamic Overprovisioning
Advanced Read Disturb Management
Recycler, Advanced Garbage Collection
Monitoring and management features:

Technical specifications

The following table presents the technical specifications for the IBM High IOPS Modular Adapters.
Table 2. IBM High IOPS Modular Adapter technical specifications

Specification| 300 GB MLC| 600 GB MLC| 800 GB MLC| 300 GB SLC
---|---|---|---|---
Part number| 90Y4361| 90Y4365| 90Y4369| 90Y4373
Interface| PCIe 2.0 x8 (x8-

wired)

| PCIe 2.0 x8 (x8-

wired)

| PCIe 2.0 x8 (x8-

wired)

| PCIe 2.0 x8 (x8-

wired)

Form factor| Full height| Full height| Full height| Full height
Capacity| 300 GB| 600 GB| 800 GB| 300 GB
Endurance| 11.5 PB TBW| 23 PB TBW| 30.7 PB TBW| 76.8 PB TBW
Sequential read IOPS (4 KB)| 172,000| 172,000| 218,000| 179,000
Sequential write IOPS (4 KB)| 79,000| 79,000| 75,000| 100,000
Sequential read rate (256 KB)| 1.5 GBps| 1.5 GBps| 2.0 GBps| 1.5 GBps
Sequential write rate (256 KB)| 500 MBps| 500 MBps| 1.0 GBps| 850 MBps
Access latency| 50 ?s| 50 ?s| 50 ?s| 50 ?s
Power requirements| 25 W| 25 W| 25 W| 25 W

A low-profile bracket is also included with the adapter.

The TBW value assigned to a solid-state device is the total bytes of written data (based on the number of P/E cycles) that a device can be guaranteed to complete (the percentage of remaining P/E cycles is equal to the percentage of remaining TBW). The IBM warranty for solid-state storage is limited to devices that have not reached the maximum guaranteed number of program/erase cycles. Solid-state storage that reaches this limit might fail to operate according to its specifications. Because of such behavior by these devices, careful planning must be done to use solid-state storage in the application environments to ensure that the TBW of the device is not exceeded before the end of the required life expectancy.

Supported servers
The IBM High IOPS Modular Adapters can be installed in the System x and IBM iDataPlex® servers identified in Table 3 and the BladeCenter and Flex System servers identified in Table 4.
Table 3. Supported System x and iDataPlex servers (Part 1)

|

---|---|---|---|---|---|---|---|---|---|---|---|---
90Y4361| A3MZ| IBM 300GB High IOPS MLC Modular Adapter| N| N| N| N| N| N| N| N| N| N
90Y4365| A3N0| IBM 600GB High IOPS MLC Modular Adapter| N| N| N| N| N| N| N| N| N| N
90Y4369| A3N1| IBM 800GB High IOPS MLC Modular Adapter| N| N| N| N| N| N| N| N| N| N
90Y4373| A3N2| IBM 300GB High IOPS SLC Modular Adapter| N| N| N| N| N| N| N| N| N| N

Table 3. Supported System x and iDataPlex servers (Part 2)

Part number| Feature code|

Product Description

| | | | | | | | | | | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---
90Y4361| A3MZ| IBM 300GB High IOPS MLC Modular Adapter| N| N| N| Y| N| N| Y| Y| Y| Y| Y| Y
90Y4365| A3N0| IBM 600GB High IOPS MLC Modular Adapter| N| N| N| Y| N| N| Y| Y| Y| Y| Y| Y
90Y4369| A3N1| IBM 800GB High IOPS MLC Modular Adapter| N| N| N| Y| N| N| Y| Y| Y| Y| Y| Y
90Y4373| A3N2| IBM 300GB High IOPS SLC Modular Adapter| N| N| N| Y| N| N| Y| Y| Y| Y| Y| Y

Table 4. Supported BladeCenter and Flex System servers

Part number| Feature code| Product description| | | | | | | | |
---|---|---|---|---|---|---|---|---|---|---|---
90Y4361| A3MZ| IBM 300GB High IOPS MLC Modular Adapter| N| N| N| Y†| N| N| N| N| N
90Y4365| A3N0| IBM 600GB High IOPS MLC Modular Adapter| N| N| N| Y†| N| N| N| N| N
90Y4369| A3N1| IBM 800GB High IOPS MLC Modular Adapter| N| N| N| Y†| N| N| N| N| N
90Y4373| A3N2| IBM 300GB High IOPS SLC Modular Adapter| N| N| N| Y†| N| N| N| N| N

The HS23 supports these adapters with the addition of the IBM BladeCenter PCI Express Gen 2 Expansion Blade II, part number 68Y7484.

See the IBM ServerProven website for the latest compatibility information for System x, BladeCenter, iDataPlex, and Flex System servers at: http://ibm.com/servers/eserver/serverproven/compat/us/

Supported operating systems
The IBM High IOPS Modular Adapters support the following operating systems:

Microsoft Windows Server 2012
Microsoft Windows Server 2008 R2
Microsoft Windows Server 2008, Datacenter x64 Edition Microsoft Windows Server 2008, Enterprise x64 Edition Microsoft Windows Server 2008, Web x64 Edition
Red Hat Enterprise Linux 6 Server x64 Edition
Red Hat Enterprise Linux 5 Server x64 Edition
Red Hat Enterprise Linux 5 Server with Xen x64 Edition SUSE Linux Enterprise Server 11 for AMD64/EM64T
SUSE Linux Enterprise Server 11 with Xen for AMD64/EM64T SUSE Linux Enterprise Server 10 for AMD64/EM64T
SUSE Linux Enterprise Server 10 with Xen for AMD64/EM64T VMware vSphere 5.1
VMware vSphere 5
VMware ESX 4.1
VMware ESXi 4.1

See the IBM ServerProven website for the latest information about the specific versions and service packs supported at http://ibm.com/servers/eserver/serverproven/compat/us/. Click System x servers, then Disk controllers to see the support matrix. Click the check mark that is associated with the System x server in question to see the details of the operating system support.
Warranty
The IBM High IOPS Modular Adapters carry a 1-year, customer-replaceable unit (CRU) limited warranty. When installed in a supported IBM server, these adapters assume your system’s base warranty and any IBM ServicePac® upgrade.

Physical specifications

The IBM High IOPS Modular Adapters have the following physical specifications:
Dimensions and weight (approximate):

Height: 16 mm (0.6 in.)
Width: 68 mm (2.7 in.)
Depth: 168 mm (6.6 in.)
Weight: 227 g (0.5 lb)

Shipping dimensions and weight (approximate):

Height: 114 mm (4.5 in.)
Width: 241 mm (9.5 in.)
Depth: 318 mm (12.5 in.)
Weight: 648 g (1.4 lb)

Operating environment
The IBM High IOPS Modular Adapters are supported in the following environment:

Temperature (operational): 5 – 40 °C (41 – 104 °F) at 0 – 3,048 m (0 – 10,000 ft)
Temperature (non-operational): -40 – 60 °C (-40 – 140 °F) at 0 – 10,700 m (0 – 35,105 ft)
Relative humidity: 8 – 85% (non-condensing)
Maximum altitude (operational): 3,048 m (10,000 ft)

Agency approvals
The IBM High IOPS Modular Adapters have the following agency approvals:

UL
cUL
IEC60950
EMC
FCC
TUV
VDE
CE
VCCI
BSMI
C-tick
MIC
KCC

For more information, see the following documents:

IBM US Announcement Letter for the IBM High IOPS Modular Adapters:
http://ibm.com/common/ssi/cgi-bin/ssialias?infotype=dd&subtype=ca&&htmlfid=897/ENUS112-213
IBM High IOPS Modular Adapters configuration information and requirements :
http://ibm.com/support/entry/portal/docdisplay?lndocid=SERV-IOMA
IBM High IOPS Modular Adapters documentation:
http://ibm.com/support/entry/portal/docdisplay?lndocid=MIGR-5092804
IBM System x Configuration and Options Guide :
http://www.ibm.com/systems/xbc/cog/
IBM ServerProven:
http://ibm.com/servers/eserver/serverproven/compat/us/
Related product families
Product families related to this document are the following:
PCIe Flash Adapters

Notices
Lenovo may not offer the products, services, or features discussed in this document in all countries. Consult your local Lenovo representative for information on the products and services currently available in your area. Any reference to a Lenovo product, program, or service is not intended to state or imply that only that Lenovo product, program, or service may be used. Any functionally equivalent product, program, or service that does not infringe any Lenovo intellectual property right may be used instead. However, it is the user’s responsibility to evaluate and verify the operation of any other product, program, or service. Lenovo may have patents or pending patent applications covering subject matter described in this document. The furnishing of this document does not give you any license to these patents. You can send license inquiries, in writing, to:
Lenovo (United States), Inc.
8001 Development Drive
Morrisville, NC 27560
U.S.A.
Attention: Lenovo Director of Licensing
LENOVO PROVIDES THIS PUBLICATION ”AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY, OR FITNESS FOR A PARTICULAR PURPOSE. Some jurisdictions do not allow disclaimer of express or implied warranties in certain transactions, therefore, this statement may not apply to you.
This information could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of the publication. Lenovo may make improvements and/or changes in the product(s) and/or the program(s) described in this publication at any time without notice.
The products described in this document are not intended for use in implantation or other life support applications where malfunction may result in injury or death to persons. The information contained in this document does not affect or change Lenovo product specifications or warranties. Nothing in this document shall operate as an express or implied license or indemnity under the intellectual property rights of Lenovo or third parties. All information contained in this document was obtained in specific environments and is presented as an illustration. The result obtained in other operating environments may vary. Lenovo may use or distribute any of the information you supply in any way it believes appropriate without incurring any obligation to you.
Any references in this publication to non-Lenovo Web sites are provided for convenience only and do not in any manner serve as an endorsement of those Web sites. The materials at those Web sites are not part of the materials for this Lenovo product, and use of those Web sites is at your own risk. Any performance data contained herein was determined in a controlled environment. Therefore, the result obtained in other operating environments may vary significantly. Some measurements may have been made on development-level systems and there is no guarantee that these measurements will be the same on generally available systems. Furthermore, some measurements may have been estimated through extrapolation. Actual results may vary. Users of this document should verify the applicable data for their specific environment.
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This document, TIPS0937, was created or updated on June 6, 2013.
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Trademarks

Lenovo and the Lenovo logo are trademarks or registered trademarks of Lenovo in the United States, other countries, or both. A current list of Lenovo trademarks is available on the Web at
https://www.lenovo.com/us/en/legal/copytrade/.
The following terms are trademarks of Lenovo in the United States, other countries, or both:

Lenovo®
BladeCenter®
Flex System
ServerProven®
System x®
iDataPlex®
The following terms are trademarks of other companies:
Linux® is the trademark of Linus Torvalds in the U.S. and other countries.
Microsoft®, Windows Server®, and Windows® are trademarks of Microsoft Corporation in the United States, other countries, or both.
Other company, product, or service names may be trademarks or service marks of others.