Fuji Electric P633C Small IPM Owner’s Manual
- June 16, 2024
- Fuji Electric
Table of Contents
P633C Small IPM
Small IPM (Intelligent Power Module)
P633C, P633A Series
6MBPXS06-50**
Mounting Instruction
Cautions
This Instruction contains the product specifications, characteristics, data,
materials, and structures as of
September 2023. The contents are subject to change without notice for
specification changes or other
reason. When using a product listed in this Instruction be sure to obtain the
latest specifications
The application examples in this note show the typical examples of using Fuji
products and this note
shall neither assure to enforce the industrial property including some other
rights nor grant the license
Although Fuji Electric Co., Ltd. continually strives to enhance product
quality and reliability, a small
percentage of semiconductor products may become faulty. When using Fuji
Electric semiconductor
products in your equipment, be sure to take adequate safety measures such as
redundant, flame
retardant and fail safe design in order to prevent a semiconductor product
failure from leading to a
physical injury, property damage or other problems
The products described in this application manual are manufactured with the
intention of being used in
the following industrial electronic and electrical devices that require normal
reliability.
・ Compressor motor inverter
・ Fan motor inverter for room air conditioner
・ Compressor motor inverter for heat pump applications, etc
If you need to use a semiconductor product in this application note for
equipment requiring higher
reliability than normal, such as listed below, be sure to contact Fuji
Electric Co., Ltd. to obtain prior
approval. When using these products, take adequate safety measures such as a
backup system to
prevent the equipment from malfunctioning when a Fuji Electric’s product
incorporated in the equipment
becomes faulty.
・Transportation equipment (mounted on vehicles and ships)
・Trunk communications equipment
・Traffic signal control equipment
・Gas leakage detectors with an auto shutoff function
・Disaster prevention / security equipment
・ Safety devices, etc
Do not use a product in this application note for equipment requiring
extremely high reliability
such as:
・Space equipment ・ Airborne equipment ・ Atomic control equipment
・Submarine repeater equipment ・ Medical equipment
All rights reserved. No part of this application note may be reproduced
without permission in writing from
Fuji Electric Co., Ltd
If you have any question about any portion of this application note, ask Fuji
Electric Co., Ltd. or its sales
agencies. Neither Fuji Electric Co., Ltd. nor its agencies shall be liable for
any injury or damage caused
by any use of the products not in accordance with instructions set forth
herein.
This chapter describes the precautions during transportation and storage for the product
1. Precautions during transportation and storage
-
This product must be stored at a normal temperature of 5 to 35 o C and relative humidity of 45 to 75
If the storage area is very dry, a humidifier may be required In such a case, use only deionized
water or boiled water, since the chlorine in tap water may corrode the leads -
This product should not be subjected to rapid changes in temperature to avoid condensation on the
surface of this product Therefore store this product in a place where the temperature is steady -
This product should not be stored on top of each other, since this may cause excessive external
force on the case -
This product should be stored with the lead terminals remaining unprocessed Rust may cause
presoldered connections to fail during later processing -
This product should be stored in antistatic containers or antistatic shipping bags
-
Under the above storage condition, use this product within one year
This chapter describes the precautions in unpacking for the product
2. Precautions in unpacking
- Removing the pin from the tube
• The products are packaged in tubes that are pinned at both ends
• Remove the pin on one side to pick out the product from the tube
• If the pin and the product are in contact with each other when removing the pin, a strong impact
might be applied to the product, which may cause deformation or damage to the product terminals
Make a gap between the pin and the product when removing the pin
• The recoil of removing the pins may cause deformation or damage to the terminals of the product,
so remove the pins while holding them
• If the product falls out from the tube when removing the pins, it may cause a strong impact to the
product, causing the product terminals to be deformed or damaged Remove the pin with the tube
opening facing up
• It is recommended to use a remover (removal jig) to remove the pins The following shows how to
remove the pins using a remover
A) Make a gap between the pin and the product ..(See Fig 2 1)
Fig. 2 1 Gap between the pin and the product
B) Push the pointed end of the pin with your index finger, and make a gap
between the pin and the
tube to insert the remover removal part as shown in Fig 2 2 ..(See Fig 2 3
C) Insert the removal part of the remover into the gap between the pin and the tube. (See Fig. 2 4)
D) Hold the pin with your finger and remove the pin with the tube opening
facing up.
( See Fig. 2 5, 2 6)
2. Removing the product from the tube
• Since the elements installed in the Small IPM are extremely weak to
electrostatic discharge,
appropriate ESD countermeasures are necessary in the assembly environment
within the range
described in the specifications In particular, when removing it out from the
tube, it is most likely to
cause electrical damage to the product
• When removing the product, do not strongly collide the products with each
other or bump the
product terminals against the tube A strong impact on the product may cause
deforming or damage
to the product terminals
This chapter describes the Through hole design for PCB attaching to the product.
3. Through hole design for PCB
Figures 3 1 to 3 4 show examples of recommended Through hole dimensions and
Through hole layout
designs.
• The Through hole dimensions are the inner diameter after plating (dimension
unit: mm).
• If the terminal cross sectional dimensions / Through hole clearance is too
large, solderability may
be impaired. Also, if the land diameter is too large, solder bridges are
likely to occur.
• The hole size and land size should be optimized as appropriate, taking into
consideration the printed
circuit board processing accuracy and mounting method.
This chapter describes the spacer for PCB attaching to the product
4. Spacer
• When using spacer between the PCB and the product for alignment during
soldering to printed
circuit board, it is recommended to support the product at the hatched area as
shown in Fig 4 1
• Select a spacer material that does not cause contamination or corrosion
5. Application of thermal grease
• It is recommended to apply thermal grease between the product’s aluminum
base and the heat sink
to ensure heat dissipation to the heat sink If the properties, amount, and
application method of the
thermal grease is not appropriate, it may result in poor heat dissipation and
lead to thermal failure
Table 5 1 shows the recommended thermal grease properties and thickness
• Assuming that the thickness is uniform, the required amount ( of thermal
grease can be
calculated from the following formula
• We recommend using the stencil mask method to control the appropriate
thermal grease thickness
(Fig 5 1 The recommended stencil mask pattern is shown in appendix
• It is recommended to check the spread of thermal grease by removing the
product after mounting
and check the extent of spreading
• In the case of liquid cooling, the temperature difference (temperature
gradient) between the heat
sink temperature and the temperature inside the product becomes large When
mounting the
product to heat sink, secure a thermal grease coating amount that can absorb
the distortion due to
the difference in thermal expansion when the temperature gradient is large
• In the case of a multiple structure heat sink, the number of fastening parts
increases and heat
transfer ( becomes uneven Therefore, it is necessary to suppress the
distortion, such as
securing the thermal grease coating amount in consideration of the generated
distortion during
design
Table 5-1. Recommended properties of thermal grease
|
Unit
|
Recommended value
---|---|---
Penetration (typ.)
|
–
|
328
Thermal conductivity
|
W/m・K
|
0.90
Thermal grease thickness
|
μm
|
100±30
6. Heat sink selection
This chapter describes the heat sink selection for the product
1. Selection
-
The junction temperature T vj should not exceed the maximum junction temperature rating for safe
operation Heat sink (cooling device) should be designed to ensures that T vj is always below the
maximum junction temperature rating -
If the IGBT or FWD junction temperature is higher than the maximum junction temperature rating, it
might cause damage to the chips Some types of the products have the overheating ( protection
function which works when the LVIC chip temperature exceeds the maximum junction temperature
rating However, if the temperature rises too quickly, the OH protection might not work -
When selecting a heat sink, please verify the chip temperature T vj by measuring T c at the position
shown in Figure 6 1 and calculating the T vj from device power dissipation and thermal resistance
In addition, this product has a built in temperature sensor, and T vj can be confirmed by the analog
voltage that is output according to the LVIC chip temperature Please use this as a reference when
selecting a heat sink -
For more detailed design, please refer to IGBT Module Application Manual (REH 984 and Small
IPM Application Manual
･ P 633 A Application Manual MT 6 M 08855
･ P 633 C Application Manual MT 6 M 16945
2. Shape
• As shown in Fig. 6-2, the heat sink flatness should be 0μm/100mm to
+100μm/100mm, and the
surface roughness (Rz) should be less than 10μm.
• If the heat sink surface is concave, a gap occurs between the heat sink and
the product, leading to
deterioration of cooling efficiency.
• If the flatness is +100μm/100mm or more, the aluminum base of the product
may deform and
cracks could occur in the internal isolating substrates.
3. Mounting (tightening)
• When mounting the product to a heat sink, the following fastening order is
recommended. Uneven
fastening due to excessive torque might lead to destruction or degradation of
the chip.
• Standard: Metric screw JIS B 1111
• Screw length: 8mm
• Screw head shape: Pan shape (head diameter 5.5 mm)
• Material: Stainless
• Use flat washers (JIS B1258 recommended). Washer head type screws can be
used as well.
• Avoid using the product to support the load of structure such as heat sink,
printed circuit board, etc.
• When mounting this product together with other components to the heat sink,
ensure the flatness of
the components mounted on the printed circuit board before mounting.
7. Soldering to Printed Circuit Board
• The product’s temperature during soldering might exceed the maximum
temperature rating To
prevent damage to the product and to ensure reliability, please use the
following soldering
temperature
Table 7.1 Soldering temperature and duration
Methods
|
Soldering Temp. & Time
---|---
Dip soldering
|
260±5oC, 10±1sec
• A stopper is provided on the terminal to prevent the immersion depth of the
terminal from coming
too close to the product body Use this stopper to secure the required distance
from the printed
circuit board and prevent the product body from being immersed in the solder
bath during flow
soldering
• It is not recommended to reuse the product after it is removed from the
printed circuit board
because there is a possibility that the removed product was subjected to
thermal or mechanical
damage during the removal process
8. Appendix
1. Stencil mask drawing for thermal grease application (recommended)
Package No. : P633A, P633C
This figure shows the view from the aluminum base surface. Please contact us
if you need a dxf file.
2. Isolation distance of heat sink
• When this product is mounted on a flat heat sink, there is a possibility
that discharge will occur
between the lead terminals and the heat sink, so the isolation voltage is 1.5
kVrms.
• By ensuring a creepage distance of 2.5 mm or more between the lead terminals
and the heat sink,
the isolation voltage will be 2.5 kVrms.
• By processing the heat sink as shown in Fig. 8-2, it is possible to secure a
clearance distance of
5.08 mm or more in accordance with UL.