Fuji Electric Small IPM Intelligent Power Module Instruction Manual
- June 12, 2024
- Fuji Electric
Table of Contents
- Small IPM Intelligent Power Module
- Control Power Supply Terminals VCCH, VCCL, COM
- Power Supply Terminals of High Side VB(U, V, W)
- Function of Internal BSDs (bootstrap Diodes)
- Input Terminals IN(HU,HV,HW), IN(LU,LV,LW)
- Over Current Protection Input Terminal IS
- Fault Status Output Terminal VFO
- Temperature Sensor Output Terminal TEMP
- Over Heating Protection
- Documents / Resources
Fuji Small IPM (Intelligent Power Module)
P633A Series
6MBPXS*060-50
Chapter 3 Detail of Signal Input/Output Terminals
Application Manual**
Small IPM Intelligent Power Module
Cautions
This Instruction contains the product specifications, characteristics, data,
materials, and structures as of June 2021. The contents are subject to change
without notice for specification changes or other reason. When using a product
listed in this Instruction be sure to obtain the latest specifications. The
application examples in this note show the typical examples of using Fuji
products and this note shall neither assure to enforce the industrial property
including some other rights nor grant the license.
Although Fuji Electric Co., Ltd. continually strives to enhance product
quality and reliability, a small percentage of semiconductor products may
become faulty. When using Fuji Electric semiconductor products in your
equipment, be sure to take adequate safety measures such as redundant,
flameretardant and fail-safe design in order to prevent a semiconductor
product failure from leading to a physical injury, property damage or other
problems.
The products described in this application manual are manufactured with the
intention of being used in the following industrial electronic and electrical
devices that require normal reliability.
- Compressor motor inverter
- Fan motor inverter for room air conditioner
- Compressor motor inverter for heat pump applications, etc.
If you need to use a semiconductor product in this application note for equipment requiring higher reliability than normal, such as listed below, be sure to contact Fuji Electric Co., Ltd. to obtain prior approval. When using these products, take adequate safety measures such as a backup system to prevent the equipment from malfunctioning when a Fuji Electric’s product incorporated in the equipment becomes faulty.
- ransportation equipment (mounted on vehicles and ships)
- Trunk communications equipment
- Traffic-signal control equipment
- Gas leakage detectors with an auto-shutoff function
- Disaster prevention / security equipment
- Safety devices, etc.
Do not use a product in this application note for equipment requiring extremely high reliability such as:
- Space equipment
- Airborne equipment
- Atomic control equipment
- Submarine repeater equipment
- Medical equipment
All rights reserved. No part of this application note may be reproduced
without permission in writing from Fuji Electric Co., Ltd.
If you have any question about any portion of this application note, ask Fuji
Electric Co., Ltd. or its sales agencies. Neither Fuji Electric Co., Ltd. nor
its agencies shall be liable for any injury or damage caused by any use of the
products not in accordance with instructions set forth herein.
Chapter 3 Detail of Signal Input/Output Terminals
| 1. Control Power Supply Terminals VCCH,VCCL,COM | 2-Mar |
|---|---|
| 2. Power Supply Terminals of High Side VB(U, V, W) | 6-Mar |
| 3. Function of Internal BSDs (Boot Strap Diodes) | 9-Mar |
| 4. Input Terminals IN(HU, HV, HW), IN(LU, LV, LW) | 14-Mar |
| 5. Over Current Protection Input Terminal IS | 17-Mar |
| 6. Fault Status Output Terminal VFO | 19-Mar |
| 7. Temperature Sensor Output Terminal TEMP | 20-Mar |
| 8. Over Heating Protection | 22-Mar |
Control Power Supply Terminals VCCH, VCCL, COM
<Voltage Range of control power supply terminals VCCH, VCCL>
- For control supply voltage, please connect a 15V10% DC power supply between VCCH, VCCL and COM terminals. Table 3-1 describes the operation of the product for various control supply voltages.
- A low impedance capacitor and a high frequency decoupling capacitor should be connected close to the terminals of the power supply.
- High frequency noise on the power supply might cause malfunction of the internal control IC or erroneous fault signal output. To avoid these problems, the maximum amplitude of voltage ripple on the power supply should be less than 1V/µs.
- The potential at the COM terminal is different from that at the N(U, V, W) power terminal. It is very important that all control circuits and power supplies are referred to the COM terminal and not to the N(U, V, W) terminals. If circuits are improperly connected, current might flow through the shunt resistor and cause improper operation of the short-circuit protection function. In general, it is recommended to make the COM terminal as the ground potential in the PCB layout.
- The main control power supply is also connected to the bootstrap circuit which provide a power to floating supplies for the high side gate drivers.
- When high side control supply voltage VCCH falls below VCCH(OFF), only the IGBT which occurred the under voltage condition becomes off-state even though input signal is ON condition.
- When low side control supply voltage VCCL falls below VCCL(OFF), all lower side IGBTs become offstate even though the input signal is ON condition.
Table 3-1 Functions versus supply voltage VCCH, VCCL
| Control Voltage Range [V] 0 ~ 4 | Operations and functions |
|---|---|
| 0 ~ 4 | The product doesn’t operate. UV and fault output are not activated. |
dV/dt noise on the main P-N supply might cause malfunction of the IGBTs.
4 ~ 13| The product starts to operate. UV is activated, control input signals
are blocked and fault output VFO is generated.
13 ~ 13.5| UV is reset. IGBTs perform switching in accordance to input signal.
Drive voltage is below the recommended range, so VCE(sat) and the switching
loss will be larger than that under normal condition. High side IGBTs do not
switch until VB() 1 reaches VB(ON) after initial charging.
13.5 ~ 16.5| Normal operation. This is the recommended operating condition.
16.5 ~ 20| IGBTs perform switching. Because drive voltage is above the
recommended range, IGBT’s switching is faster and causes an increase in system
noise. Even with proper overcurrent protection design, the short-circuit peak
current can become very large and might lead to failure.
Over 20| Control circuit in the product might be damaged. It is recommended to
insert a Zener diode between each pair of control supply terminals if
necessary.
1：VB() is applied between VB(U)-U, VB(V)-V, VB(W)-W.
<Under Voltage (UV) protection of control power supply terminals VCCH, VCCL>
- Fig.3-1 shows the UV protection circuit of VCCH and VCCL. Fig.3-2 and Fig.3-3 shows the operation sequence of UV operation of VCCH and VCCL.
- As shown in Fig.3-1, a diode is electrically connected between VCCH-COM and VCCL-COM terminals. The diode is connected to protect the Small IPM from the input surge voltage. Do not use the diode for voltage clamp purpose otherwise the product might be damaged.
Power Supply Terminals of High Side VB(U, V, W)
<Voltage range of high side bias voltage for IGBT driving terminals VB(U, V, W)>
- The VB(*) voltage, which is the voltage difference between VB(U,V,W) and U,V,W, provides the power supply to the HVICs within the product.
- This power supply must be in the range of 13.0~18.5V to ensure that the HVICs can fully drive the high side IGBTs. The product includes UV protection for VB() to ensure that the HVICs do not drive the high side IGBTs when VB() drops below a specified voltage (refer to the datasheet). This function prevents the IGBT from operating in a high dissipation mode. Please note that the UV protection only works on the triggered phase and doesn’t generate fault output.
- Conventionally, three isolated power supplies are necessary for IGBT drive at the high side. In case of using bootstrap circuit, the IGBT drive power supply for high side can be generated from the high side/low side control power supply.
- The power supply of the high side is charged when the low side IGBT is turned on or when freewheel current flows the low side FWD. Table 3-2 describes the operation of the product for various control supply voltages. The control supply should be well filtered with a low impedance capacitor and a high frequency decoupling capacitor connected close to the terminals in order to prevent malfunction of the internal control IC caused by a high frequency noise on the power supply.
- When VB(*) falls below VB(OFF), only the triggered phase IGBT is off-state even though input signal is ON condition.
*Table 3-2 Functions versus high side bias voltage for IGBT driving V()**
| Control Voltage Range [V] | Operations and functions |
|---|---|
| 0 ~ 4 | HVICs are not activated. UV does not operate. dV/dt noise on the main |
P-N supply might trigger the IGBTs.
4 ~ 12.5| HVICs start to operate. As the UV is activated, control input
signals are blocked.
12.5 ~ 13| UV is reset. The high side IGBTs perform switching in accordance to
input signal. Driving voltage is below the recommended range, so VCE(sat) and
the switching loss will be larger than that under normal condition.
13 ~ 18.5| Normal operation. This is the recommended operating condition.
18.5 ~ 20| The high side IGBTs perform switching. Because drive voltage is
above the recommended range, IGBT’s switching is faster and causes an increase
in system noise. Even with proper overcurrent protection design, the short-
circuit peak current can become very large and might lead to failure.
Over 20| Control circuit in the product might be damaged. It is recommended to
insert a Zener diode between each pair of high side power supply terminals.
<Under Voltage (UV) protection of high side power supply terminals VB(U,V,W)>
- Fig.3-4 shows the UV protection circuit of high side power supply VB(U, V, W).
- Fig.3-5 shows the operation sequence of UV operation of VB(U), VB(V), VB(W).
- As shown in Fig.3-4, diodes are electrically connected to the VB(U,V,W)-(U,V,W) and VB(U,V,W)COM terminals. These diodes protect the product from input surge voltage. Do not use these diodes for voltage clamp purpose otherwise the product might be damaged.
Function of Internal BSDs (bootstrap Diodes)
There are several ways in which the VB(U, V, W)-(U, V, W) floating supply can
be generated.
Bootstrap method is described here. The boot strap method is a simple and
cheap solution. However, the duty cycle and on-time are limited by the
requirement to refresh the charge in the bootstrap capacitor. As shown in Fig.
3-6, Fig. 3-8 and Fig. 3-11, the boot strap circuit consists of bootstrap
diode and resistor which are integrated in the Small IPM and an external
capacitor.
When the low side IGBT is OFF and the low side FWD is ON, freewheeling current
flows through the low side FWD. The voltage on the bootstrap capacitance
VC(t2) is calculated by the following equations.
Fig.3-8 shows the circuit diagram of charging operation, and Fig.3-9 shows the
timing chart.
VC(t2) = VCC – VF + VF(FWD) – Ib·R………Transient state
VC(t2) VCC………………………………Steady state
VF(D) : Forward voltage of Boost strap diode D
VF(FWD) : Forward voltage of lower side FWD
R : Bootstrap resistance
I: Bootstrap charging current
When both the low side and high side IGBTs are OFF, a regenerative current
flows continuously through the low side FWD. Therefore Vs drops to –VF of FWD,
then the bootstrap capacitor is recharged to restore the declined potential.
When the high side IGBT is turned ON and Vs exceeds VCC, the charging of the C
stops, and the voltage of the C gradually declines due to current consumed by
the drive circuit.
<Setting the bootstrap capacitance and minimum ON/OFF pulse width>
The parameter of bootstrap capacitor can be calculated by the following
equation:
?1: the maximum ON pulse width of the high side IGBT
??: the drive current of the HVIC (depends on temperature and frequency
characteristics)
d?b : the allowable discharge voltage. (see Fig.3-10)
- A certain margin should be added to the calculated capacitance.
- The bootstrap capacitance is generally selected 2~3 times the value of the calculated result.
- The recommended minimum ON pulse width (t2) of the low side IGBT should be basically determined such that the time constant C･R will enable the discharged voltage (dV) to be fully charged again during the ON period.
- However, if the control mode only has the high side IGBT switching (Sequence Fig.3-10), the time constant should be set so that the consumed energy during the ON period can be charged during the OFF period.
- The minimum pulse width is decided by the minimum ON pulse width of the low side IGBT or the minimum OFF pulse width of the high side IGBT, whichever is shorter.
?: Series resistance of Bootstrap diode ΔRF(BSD)
?: Bootstrap capacitance
d?: the allowable discharge voltage.
?CC: Voltage of HVICs and LVIC power supply (ex.15V)
?b(min): the minimum voltage of the high side IGBT drive (Added margin to UV.
ex. 14V)
- The initial charge of the bootstrap capacitor is required to start-up the inverter.
- The pulse width or pulse number should be large enough to make a full charge of the bootstrap capacitor.
- For reference, the charging time of 10F capacitor through the internal bootstrap diode is about 2ms.
Input Terminals IN(HU,HV,HW), IN(LU,LV,LW)
- Fig.3-15 shows the input interface circuit between the MPU and the product. It is possible that the input terminals connect directly to the MPU. It should not need the external pull up and down resistors connected to the input terminals, input logic is active high and the pull down resistors are built in.
- The RC coupling at each input (parts shown dotted in Fig.3-15) might change depending on the PWM control scheme used in the application and the wiring impedance of the application’s PCB layout.
< Input terminal circuit>
- The input logic of this product is active high. This logic has removed the sequence restriction between the control supply and the input signal during startup or shut down operation. Therefore it makes the system failsafe. In addition, the pull down resistors are built in to each input terminals in Fig.3-16. Thus, external pull-down resistors are not needed reducing the required external component. Furthermore, a 3.3V-class MPU can be connected directly since the low input signal threshold voltage.
- As shown in Fig.3-16, the input circuit integrates a pull-down resistor. Therefore, when using an external filtering resistor between the MPU output and input of the product, please consider the signal voltage drop at the input terminals to satisfy the turn-on threshold voltage requirement. For instance, R=100Ω and C=1000pF for the parts shown dotted in Fig.3-15.
- Fig.3-16 shows that the internal diodes are electrically connected to the VCCL-IN(LU, LV, LW) and IN(HU, HV, HW, LU, LV, LW)-COM terminals. Do not use these diodes for voltage clamp purpose otherwise the product might be damaged.
< IGBT drive state versus Control signal pulse width>
tIN(ON) is a recommended minimum turn-on pulse width for changing the IGBT
state from OFF to ON, and tIN(OFF) is a recommended minimum turn-off pulse
width for changing the IGBT state from ON to OFF. Fig.3-17 and Fig.3-18 show
IGBT drive state for various control signal pulse width. A: IGBT may turn on
occasionally, even when the ON pulse width of control signal is less than
minimum tIN(ON). Also if the ON pulse width of control signal is less than
minimum tIN(ON) and voltage below -5V is applied between U-COM,V-COM,W-COM ,
it may not turn off due to smalfunction of the control circuit.
B: IGBT can turn on and is saturated under normal condition.
C: IGBT may turn off occasionally, even when the OFF pulse width of control
signal is less than minimum tIN(OFF). Also if the OFF pulse width of control
signal is less than minimum tIN(OFF) and voltage below -5V is applied between
U-COM, V-COM, W-COM , it may not turn on due to malfunction of the control
circuit.
D: IGBT can turn fully off under normal condition.
Over Current Protection Input Terminal IS
- Over current (OC) protection is a function of detecting the IS voltage determined with the external shunt resistor, connected to N(U, V, W) and COM.
- Fig.3-19 shows the over current sensing voltage input IS circuit block, and Fig.3-20 shows the OC operation sequence.
- To prevent the product from unnecessary operations due to normal switching noise or recovery current, it is necessary to apply an external R-C filter (time constant is approximately 0.7µs) to the IS terminal. The shunt resistor should be connected to the product as close as possible.
- Fig.3-19 shows that the diodes in the product are electrically connected to the VCCL-IS and ISCOM terminals. Do not use these diodes for voltage clamp purpose otherwise the product might be damaged.
t1 : IS input voltage does not exceed VIS(ref), while the collector current of
the lower side IGBT is under the normal operation.
t2 : When IS input voltage exceeds VIS(ref), the OC is detected.
t3 : The fault output VFO is activated and all lower side IGBT shut down
simultaneously after the over current protection delay time td(IS). Inherently
there is dead time of LVIC in td(IS).
t4 : After the fault output pulse width tFO, the OC is reset. Then next input
signal is activated.
Fault Status Output Terminal VFO
As shown in Fig.3-21, it is possible to connect the fault status output VFO terminal directly to the MPU. VFO terminal is open drain configured, thus this terminal should be pulled up by a resistor of approximate 10kW to the positive side of the 5V or 3.3V external logic power supply, which is the same as the input signals. It is also recommended that the by-pass capacitor C1 should be connected at the MPU, and the inrush current limitation resistance R1, which is more than 5kW, should be connected between the MPU and the VFO terminal. These signal lines should be wired as short as possible.
- Fault status output VFO function is activated by the UV of VCCL, OC and OH. (OH protection function is applied to “6MBP**XSF060-50”.)
- Fig.3-21 shows that the diodes in the IPM are electrically connected to the VCCL-VFO and VCCLCOM terminals. Do not use these diodes for voltage clamp purpose otherwise the product might be damaged.
- Fig.3-22 shows the Voltage-current characteristics of VFO terminal at fault state condition. The IFO is the sink current of the VFO terminal as shown in Fig.3-21.
Temperature Sensor Output Terminal TEMP
- As shown in Fig. 3-23, the temperature sensor output TEMP can be connected to MPU directly.
- It is recommended that a by-pass capacitor and >10kW of inrush current limiting resistor are connected between the TEMP terminal and the MPU. These signal lines should be wired as short as possible to each device.
- The product has a built-in temperature sensor, and it can output an analog voltage according to the LVIC temperature. This function doesn’t protect the product, and there is no fault signal output.
- “6MBP**XSF060-50” has built-in overheating protection. If the temperature exceeds TOH, fault signal will output due to the overheating protection function.
- Since the position of the IGBT chip and the position of the temperature sensor are different, it is not possible to respond to sudden rise in Tvj such as during motor lock and short circuit (see Fig. 2-2).
- A diode is electrically connected between TEMP-COM terminal as shown in Fig. 3-12. The diode protect the product from input surge voltage. Do not use the diode for voltage clamp purpose otherwise the product might be damaged.
- Fig.3-24 shows the LVIC temperature versus TEMP output voltage characteristics. A Zener diode should be connected to the TEMP terminal when the power supply of MPU is 3.3V. Fig. 3-25 shows the LVIC temperature versus TEMP output voltage characteristics with 22kΩ pull-down resistor.
- Fig.3-26 shows the operation sequence of TEMP terminal at during the LVIC startup and shut down conditions.
t1-t2 : TEMP function is activated when VCCL exceeds VCCL(ON). If VCCL is
lower than VCCL(ON), the TEMP terminal voltage is the same as the clamp
voltage.
t2-t3 : TEMP terminal voltage rises to the voltage determined by LVIC
temperature. In the case that the temperature is under clamping condition, the
TEMP terminal voltage is the clamp voltage even though VCCL is above VCCL(ON).
t3-t4 : TEMP function is reset when VCCL falls below VCCL(OFF). TEMP terminal
voltage is the same as the clamp voltage.
Over Heating Protection
- The over heating (OH) protection functions is integrated into “6MBP**XSF060-50”.
- The OH function monitors the LVIC junction temperature. Since the position of the IGBT chip and the position of the temperature sensor are different, it is not possible to respond to sudden rise in Tvj such as during motor lock and short circuit (see Fig. 2-2).
- The TOH sensor position is shown in Fig.2-2.
- As shown in Fig.3-27, the product shuts down all low side IGBTs when the LVIC temperature exceeds TOH. The fault status is reset when the LVIC temperature drops below TOH – TOH(hys).
t1 : The fault status is activated and all IGBTs of the lower side arm shut
down, when LVIC temperature exceeds TOH.
t2 : When LVIC temperature falls below TOH – TOH(hys), the fault status is
reset after tFO and next input signal is activated. TOH(hys) is the over
heating protection hysteresis
MT6M08855 a
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