innodisk EGPL-T102 Single 10GbE LAN Module Instruction Manual

innodisk EGPL-T102 Single 10GbE LAN Module

Product Specifications

Device Parameters

• Form Factor: M.2 2280 B-M
• Input I/F: PCI Express 3.0 x 2
• Output I/F: 10GbE LAN x 1
• Output Connector: RJ45 x 1
• Dimension (WxLxH): M.2 Board: 22 x 80 x 14.5 mm, Daughter Board: 31.75 x 28 x 17.7 mm

Electrical Specifications

1. 2.2.1. Power Requirement Input voltage: +3.3 DC +-5%
2. Power Consumption

Environmental Specifications

1. Temperature Ranges
2. Operating: -20 to 55°C
3. Storage: Not specified
4. Humidity
5. Relative Humidity: 10-95%, non-condensing
6. Shock and Vibration
7. Refer to table for detailed shock and vibration specifications.
8. Mean Time between Failure (MTBF)
9. MTBF: 11,259,017 Hours

CE and FCC Compatibility
Innodisk EGPL-T102 conforms to CE and FCC requirements.

RoHS Compliance
Innodisk EGPL-T102 is fully compliant with RoHS directive.

Hardware

1. LayoutDetailed layout information is provided in the manual.
2. Pin DefineDetailed pin definitions are provided in the manual.

REVISION HISTORY

1.1

| 1.  Add PTP Feature

2.  Support -20 to 55C

| Apr, 2024

Product Introduction 1.1. Overview

Innodisk EGPL T102 is designed with M.2 2280 form factor with B/M key, EGPL T102 supports PCIe Gen 3.0 with dual lane to single 10 GbE LAN, optimized for higher performance and lower power, which brings you a flexible expansion solution for embedded systems.

Features

• Marvell AQtion Ethernet Controller
• Support 10G/5G/2.5G/1000M/100M/10M LAN speed
• Lowest power and smallest 10GbE expansion solution
• Support x2/x1 PCI Express with Gen3/Gen2
• Tiny daughter board with high speed shielding cable
• Support Precision Time Protocol (PTP-1588v2)/AVB
• Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV
• Operation temperature -20°C to +55°C support
• 30μ” golden finger, 3-year warranty
• Industrial design, manufactured in Innodisk Taiwan

Product Specifications

Device Parameters

Table 1: Device Parameters

28 x 17.7

Electrical Specifications

Power Requirement

Table 2: Power Requirement

Power Consumption

Table 3: Power Consumption

Environmental Specifications

Temperature Ranges

Table 4: Temperature Ranges

Humidity
Relative Humidity: 10 95%, non condensing

Shock and Vibration

Table 5: Shock and Vibration

Mean Time between Failure (MTBF)
Reliability prediction methodology provides the basis for reliability evaluation and analysis. The purpose of the prediction is to predict the life time of the product in units of failure rate and MTBF.

Table 6: Mean Time between Failure (MTBF)

Telcordia SR-332, Issues 4, Method I, Case 3 under

Ground Benign, Controlled

environment, 50% operation stress

| 11,259,017

CE and FCC Compatibility
EGPL T102 conforms to CE and FCC requirements.

RoHS Compliance
EGPL T102 is fully compliant with RoHS directive.

Hardware

Layout

CN1

| WAFER SMD/20P/90D P:0.5mm H2.75mm| GbE LAN Signal LED Signal

CN1

| WAFER SMD/20P/90D P:0.5mm H2.75mm| GbE LAN Signal LED Signal

CN2

| 10GbE RJ45 DIP/1X1/90D 8P8C

w/LED:GO-GO Tab/D

| ****

GbE LAN Port LED Indicator

---|---|---

Pin Define

Table 9: M.2 B M Key Pin Define

Module Key M
NC| 58|  |
NC| 56| 57| GND
PEWAKE#| 54| 55| REFCLKp
CLKREQ#| 52| 53| REFCLKn
PERST#| 50| 51| GND
NC| 48| 49| PERp0
NC| 46| 47| PERn0
NC| 44| 45| GND
SMB_DATA| 42| 43| PETp0
SMB_CLK| 40| 41| PETn0
NC| 38| 39| GND
NC| 36| 37| PERp1
NC| 34| 35| PERn1
NC| 32| 33| GND
NC| 30| 31| PETp1
NC| 28| 29| PETn1
NC| 26| 27| GND
NC| 24| 25| NC
NC| 22| 23| NC
NC| 20| 21| CONFIG_0 (GND)
---|---|---|---
Module Key B
NC| 10| 11| NC
NC| 8| 9| NC
NC| 6| 7| NC
3.3V| 4| 5| NC
3.3V| 2| 3| GND
 |  | 1| CONFIG_3 (GND)

I/O Connector Mechanical Drawing & Pin Defines

Table 10: Wire to Board SMD 20P Connector Pin Define

EGPL T102 Mechanical Drawing

Cable Mechanical Drawing

Packing List

• EGPL-T102 M.2 Board x 1
• EGPL-T102 Daughter Board x 1
• Board to Board LAN Cable x 1

Software Support

• Microsoft Windows System 10 and later releases
• Linux Kernel 3.10 and later releases

Installation Guide

Please download driver from Myinnodisk or Innodisk official web site.

https://myinnodisk.innodisk.com/myinnodisk/Login.aspx

Appedix

Innodisk Corporation
REACH Declaration
Tel: (02)7703-3000 Fax:(02) 7703-3555 Internet: https://www.innodisk.com/

Innodisk Corporation pursues its social responsibility for global environmental preservation by committing to be compliant with REACH regulation (REGULATION (EC) No 1907/2006).
We hereby confirm that the products),Scope: Flash Memory, DRAM Module and Embedded Peripherals Products.

• The standard products of not listed in the Appendix2 meet the requirements of REACH SVHC regulations(SVHCs < 0.1% in Article), as described in the candidate list table currently including 233 substances (release date: 17-Jan-2023) and shown on the ECHA website. https://echa.europa.eu/candidate-list-table

• The standard products listed in the Appendix2 contain(s) one or more hazardous substances or constituents exceeding 0.1% by weight in article if not otherwise specified in candidate list table.
  Where the threshold value is exceeded, the substances in question are to be declared in accompanying. (SVHCs > 0.1% in Article).

• Comply with REACH Annex XVII.

Contact us

Branch Offices:
USA
usasales@innodisk.com
+1-510-770-9421

Europe
eusales@innodisk.com
+31-40-3045-400
© 2024 Innodisk Corporation. All right reserved. Specifications are subject to change without prior notice.

References

• Innodisk – Industrial Grade Flash, DRAM Modules and Embedded Peripherals
• Innodisk – Industrial Grade Flash, DRAM Modules and Embedded Peripherals
• MyInnodisk - Innodisk Corporation

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