innodisk ESPL-G4P1 PCIe To Four PoE Module

June 17, 2024
innodisk

innodisk ESPL-G4P1 PCIe To Four PoE Module

Product Information

Specifications

  • Form Factor: Standard PCIe
  • Input I/F: PCI Express 2.1 x 4
  • Output I/F: PoE/PoE+ x 4
  • Output Connector: RJ45 x 4
  • Dimension (WxLxH): 169.55 x 111.15 x 19.6 mm

Features

Innodisk ESPL-G4P1 is designed with a Standard PCIe form factor, ESPL-G4P1 supports PCIe Gen 2.1 with a single lane to four PoE/PoE+ LAN ports, optimized for higher performance and lower power, which brings you a flexible expansion solution for embedded systems.

Electrical Specifications

Power Requirement

Item Connector Rating
Input voltage mPCIe Golden Finger +3.3 DC +-5%

Power Consumption

Max (W) Voltage(V) Max (A)
86.2 12 *PoE Power Source 7.18

FAQ

  • Q: What is the purpose of ESPL-G4P1?
  • A : ESPL-G4P1 is designed to provide a flexible expansion solution for embedded systems with its support for PCIe Gen 2.1 and four PoE/PoE+ LAN ports.

REVISION HISTORY

Revision Description Date
1.0 First Released Oct, 2023

Product Introduction

Overview

Innodisk ESPL-G4P1 is designed with a Standard PCIe form factor, ESPL-G4P1 supports PCIe Gen 2.1 with a single lane to four PoE/PoE+ LAN ports, optimized for higher performance and lower power, which brings you a flexible expansion solution for embedded systems.

innodisk-ESPL-G4P1-PCIe-To-Four-PoE-Module-fig-1

Features

  • Supports four GbE LAN ports
  • Four independent PSE channels
  • Complies with IEEE 802.3af, up to 15.4W at 48V per PoE port
  • Complies with IEEE 802.3at, up to 25.5W at 52V per PoE port
  • Supports 12V~24V power input via 4pin PCIE-ATX
  • Supplies total power up to 75W
  • Complies with EN61000-4-5 2kV Surge protection
  • Optional Industrial Temperature (-40°C to +85°C) support
  • 30μ” golden finger, 3-year warranty
  • Industrial design, manufactured in Innodisk Taiwan

innodisk-ESPL-G4P1-PCIe-To-Four-PoE-Module-fig-2

Product Specifications

Device Parameters

Table 1 : Device Parameters

Form Factor Standard PCIe
Input I/F PCI Express 2.1 x 4
Output I/F PoE/PoE+ x 4
Output Connector RJ45 x 4
Dimension (WxLxH) 169.55 x 111.15 x 19.6 mm

Electrical Specifications

Power Requirement

Table 2 : Power Requirement

Item Connector Rating
Input voltage mPCIe Golden Finger +3.3 DC +-5%

Power Consumption

Table 3 : Power Consumption

Max (W) Voltage(V) Max (A)
86.2 12 7.18

*PoE Power Source

Environmental Specifications

Temperature Ranges

Table 4: Temperature Ranges

Temperature Range
Operating Standard Grade: 0°C to +70°C Industrial Grade: -40°C to +85°
Storage -55°C to +95°

Humidity

Relative Humidity: 10 95%, non-condensing

Shock and Vibration

Table 5: Shock and Vibration

Reliability Test Conditions Reference Standards
Vibration 7 Hz to 2K Hz, 20G, 3 axes IEC 68-2-6
Mechanical Shock Duration: 0.5ms, 1500 G, 3 axes IEC 68-2-27

Mean Time Between Failure (MTBF)
Reliability prediction methodology provides the basis for reliability evaluation and analysis. The purpose of the prediction is to predict the lifetime of the product in units of failure rate and MTBF

Table 6: Mean Time Between Failure (MTBF

Product Condition MTBF (Hours)


ESPL-G4P1-C1/W1

| The analysis is at 25°C ambient temperature by

Telcordia SR-332, Issues 4, Method I, Case 3 under

Ground Benign, Controlled

environment, 50% operation stress

| ****


5,734,443

CE and FCC Compatibility
ESPL G4P1 conforms to CE and FCC requirements.

RoHS Compliance

ESPL G4P1 is fully compliant with the RoHS directive.

Hardware

Layout

innodisk-ESPL-G4P1-PCIe-To-Four-PoE-Module-fig-3

Pin Define

Table 7: PCIe x 4 Golden Finger Pin Define

Signal Name Pin # Pin # Signal Name
+12V B1 A1 PRSNT
+12V B2 A2 +12V
+12V B3 A3 +12V
GND B4 A4 GND
SMCLK B5 A5 NC
SMDAT B6 A6 NC
GND B7 A7 NC
+3.3V B8 A8 NC
--- --- --- ---
NC B9 A9 +3.3V
NC B10 A10 +3.3V
WAKE B11 A11 PERST

Mechanical Key
NC| B12| A12| GND
GND| B13| A13| REFCLK+
RX0+| B14| A14| REFCLK-
RX0-| B15| A15| GND
GND| B16| A16| TX0+
PRSNT| B17| A17| TX0-
GND| B18| A18| GND
RX1+| B19| A19| NC
RX1-| B20| A20| GND
GND| B21| A21| TX1+
GND| B22| A22| TX1-
RX2+| B23| A23| GND
RX2-| B24| A24| GND
GND| B25| A25| TX2+
GND| B26| A26| TX2-
RX3+| B27| A27| GND
RX3-| B28| A28| GND
GND| B29| A29| TX3+
NC| B30| A30| TX3-
PRSNT| B31| A31| GND
GND| B32| A32| NC

ESPL G4P1 Mechanical Drawing

innodisk-ESPL-G4P1-PCIe-To-Four-PoE-Module-fig-4

Packing List

  • ESPL-G4P1 PCIe Board x 1

Software Support

  • Windows: XP(32bit), 7(32/64bit), 8/8.1(32/64 bit), 10(32/64bit)
  • Linux: Kernel 2.4 above

Installation Guide

Please download the driver from Intel’s official website. Or you can download the Intel i210 chip driver from Intel’s official web site directly.

https://www.intel.com/content/www/us/en/products/details/ethernet/gigabit- controllers/i210-controllers/downloads.html

Appendix

CERTIF CATE OF CONFORMITY

  • Equipment: PCle to 4Port POE Module

  • Brand Name: Innodisk

  • Test Model No. : E%PL-G#P1|

  • Multiple Listing: E%PL-G#P1 (%: Form factor: (2: 2.5*SSD,3:DDR3 DIMM, D: Dongle,G: NGFF_M.2, H:mPCle Half, L: PCle Low profile, M:mPCle, S: PCle Standard, X: Multi, Z: Others) |

    : Output items: (1:1Port,2:2Ports,3:3Ports,4:4Ports, A~Z: TBD, X: Multi)) |

  • Applicant: Innodisk Corporation

  • Test Report No. : CE171003D26

We, Bureau Veritas Consumer Products Services (H.K.) Ltd., Taoyuan Branch, declare that the equipment above has been tested in our facility and found compliance with the requirement limits of applicable standards, by the Directive 2014/30/EU. The test record, data evaluation and Equipment Under Test (EUT) | configurations represented herein are true and accurate under the standards herein specified.

  • EN55032:2015 +AC:2016, Class A
  • EN 61000-3-2:2014 (Not applicable)
  • EN 61000-3-3:2013 (Not applicable)
  • EN 55024:2010
  • EN 61000-4-2:2009 / IEC 61000-4-2:2008 ED. 2.0
  • EN 61000-4-3:2006 +A1:2008 +A2:2010 / IEC 61000-4-3:2010 ED. 3.2
  • EN 61000-4-4:2012 / IEC 61000-4-4:2012 ED. 3.0 (Not applicable)
  • EN 61000-4-5:2014 / IEC 61000-4-5:2014 ED. 3.0 (Not applicable)
  • EN 61000-4-6:2014 / IEC 61000-4-6:2013 ED. 4.0 (Not applicable)
  • EN 61000-4-8:2010 / IEC 61000-4-8:2009 ED. 2.0
  • EN 61000-4-11:2004 / IEC 61000-4-11:2004 ED. 2.0 (Not applicable)

NOTE: The above EN/EC basic standards are applied with the latest version if the customer has no special requirement.

Oct. 17, 2017
No. 47-2, 14th Ling, Chia Pau Vil., Lin Kou Dist., New Taipei City, Taiwan (R.O.C.
Tel: 886-2-26052180 Fax: 886-2-26051924

CERTIFICATE OF CONFORMITY

  • Equipment: PCle to 4Port POE Module

  • Brand Name

  • Innodisk
    Test Model No. : E%PL-G#P1

  • Multiple Listing: E%PL-G#P1 (%: Form factor: (2: 2.5″SSD,3:DDR3 DIMM,D: Dongle, G: NGFF_M.2. H:mPCle Half, L: PCle Low profile, M: mP Cle, S: PCle Standard, X: Multi,2:Others) | #: Output items: ( 1:1Port,2:2Ports,3:3Ports,4:4Ports, A~Z: TBD, X: Multi))

  • Applicant Innodisk Corporation

  • Test Report No. : FV171003D26

We, Bureau Veritas Consumer Products Services (H.K.) Ltd., Taoyuan Branch, declare that the equipment above has been tested in our facility and found to comply with the requirement limits of applicable standards. The test record, data evaluation and Equipment Under Test (EUT) configurations represented herein are true and accurate under the standards herein specified.

47 CFR FCC Part 15, Subpart B, Class A ICES-003:2016 Issue 6, Class A ANSI C63.4:2014

No. 47-2, 14th Ling, Chia Pau Vil., Lin Kou Dist., New Taipei City, Taiwan (RO.C.)

Innodisk Corporation REACH Declaration

REACH Declaration
Tel:(02)7703-3000

Fax:(02) 7703-3555 Internet:

https://www.innodisk.com/
Innodisk Corporation pursues its social responsibility for global environmental preservation by committing to be compliant with REACH regulation (REGULATION (EC) No 1907/2006). We hereby confirm that the products), Scope: Flash Memory, DRAM Module and Embedded Peripherals Products.

  • The standard products not listed in Appendix 2 meet the requirements of REACH SVHC regulations(SVHCs < 0.1% in Article), as described in the candidate list table currently including 224 substances and shown on the ECHA website.
    (http://echa.europa.eu/de/candidate-list-table).

  • The standard products listed in Appendix 2 contain(s) one or more hazardous substances or constituents exceeding 0.1 % by weight in an article if not otherwise specified in the candidate list table. Where the threshold value is exceeded, the substances in question are to be declared in the accompanying. (SVHCs > 0.1% in Article).

(Guarantor)

  • Company name Innodisk Corporation
  • Company Representative
  • Company Representative Title  QA Manager
    Date: 2022 / 06 / 14

Innodisk Corporation

Manufacturer Products: All Innodisk EM FLASH, DRAM and EP products

  • Innodisk Corporation declares that all products sold to the company, are complied with European Union RoHS Directive (2011/65/EU) and (EU) 2015/863 requirements.
  • Innodisk Corporation agrees that both parties shall settle any dispute arising from or in connection with this Declaration of Conformity by friendly negotiations.
  • We declare, that our products are permitted by the following exemptions specified in the Annex of the RoS directive.
  • 7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e. g. piezoelectric devices, or in a glass or ceramic matrix compound.
  • 6(c) Copper alloy containing up to 4% lead by weight. (This exemption applies to products that use antennas)

innodisk-ESPL-G4P1-PCIe-To-Four-PoE-Module-fig-9

Innodisk Corporation

innodisk-ESPL-G4P1-PCIe-To-Four-PoE-Module-fig-10 (Guarantor)

  • Company name: _ Innodisk Corporation A A AMART A FREa
  • Company Representative  Randy Chien
  • Company Representative Title  Chairman
  • Date: 2021 / 06 / 09

Contact us

  • Headquarters (Taiwan)
  • 5F., No. 237, Sec. 1, Datong Rd., Xizhi Dist., New Taipei City 221, Taiwan
  • Tel: +886-2-77033000
  • Email: sales@innodisk.com
  • Branch Offices:

USA

Europe

Japan

China

www.innodisk.com
© 2018 Innodisk Corporation. All rights reserved. Specifications are subject to change without prior notice.
October 13, 2023

References

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