Uascent UAM052 Wi-Fi Single Band 1T1R 802.11b User Manual

UAM052 Wi-Fi Single Band 1T1R 802.11b

Shenzhen Uascent Technology Co., LtdUniversal
Ascent Holdings Limited
UAM052
Wi-Fi Single-band 1T1R 802.11b/g/n/ax
Module Datasheet

Office: 7 / F, Building A2, Chuangzhi Yuncheng Phase 1, Xili
Street, Nanshan District, Shenzhen City, CHINA
TEL: +86-0755-82571152
E-MAIL: marketing@uascent-iot.com
Website: www.uascent-iot.com
Customer Approval :………………..
Company…………………………
Title……………………
Signature………………..
Date…………………
Uascent………………..

Revision History.

Overview.

1.1 Introduction.
UAM052 is a cost-effective WIFI+BLE module developed by Uascent Technology, supporting Bluetooth dual mode 5.2 and IEEE 802.11 b/g/n/ax protocol standards, lightweight TCP/IP protocol stack, STA, AP, and Direct modes, and Matter protocol.
Users can use this module to add networking functions to existing devices or build independent network controllers.
1.2 Features.

• Operate at ISM frequency bands (2.4GHz).
• Standard IEEE 802.11b/g/n/ax.
• Support WiFi+ Bluetooth 5.2.
• Support Wi-Fi and BLE coexist.
• Support BLE assists in fast Wi-Fi connection.
• Built-in single core RISC-V MCU with a main frequency of up to 320MHz, can be used as an application processor.
• Built-in 64KB ROM,512KB SRAM,4Mbit Flash ,32byte eFuse.
• Built-in TR switch, BALUN, LNA, PA, and PCB onboard antenna.
• Support remote firmware OTA upgrade.
• Support STA , AP, STA+ APand Direct working modes.
• Support WPA/WPA2 /WPA3 security protocol.

1.3 Recommended Operating Rating.

1.4 Reference power consumption for conventional continuous operation.

TX model
IRF| 11b 11M| 280| mA
IRF| 11g 54M| 250| mA
IRF| 11n HT20 MCS7| 250| mA
IRF| 11n HT40 MCS7| 250| mA
IRF| 11ax HE20 MCS7| 250| mA
IRF| 11ax HE40 MCS7| 250| mA
RX model
IRF| 11b 11M| 80| mA
IRF| 11g 54M| 80| mA
IRF| 11n HT20 MCS7| 80| mA
IRF| 11n HT40 MCS7| 80| mA
IRF| 11ax HE20 MCS7| 80| mA
IRF| 11ax HE40 MCS7| 80| mA

1.5 ESD Specifications

Module usage precautions.

When using the WIFI module of Uascent Technology, a certain tolerance should be reserved for the output current of the power supply. It is recommended that the output current of the power supply be ≥ 500mA, and a suitable power supply IC packaging should be selected. When supplying LDO power, attention should be paid to the issue of heating, and when supplying DC-DC power, attention should be paid to the issue of overshoot at the moment of power on.

WiFi Specification.

Features|

Descriptions

---|---
Main Chipset| BEKEN ：BK7235
Operating Frequency| 2.412～2.462GHz
Operating Voltage| 3.0~3.6V
WIFI Standard| IEE 802.11b/g/n/ax
PHY Data rates| Wi-Fi:     802.11b: 11, 5.5, 2, 1 Mbps
802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps HT20 MCS0-MCS7
HT40 MCS0-MCS7 HE20 MCS0-MCS7
HE40 MCS0-MCS7
Transmit Output| Wi-Fi: 802.11b@11Mbps 16±2dBm
802.11g@54Mbps 15±2dBm
Power| 802.11n@HT20 MCS7 14±2dBm
802.11n@HT40 MCS7 14±2dBm
802.11ax@HE20 MCS7 14±2dBm
802.11ax@HE40 MCS7 14±2dBm
EVM| 802.11b /11Mbps: EVM≦-10dB
802.11g /54Mbps: EVM≦-25dB
802.11n /HT20 MCS7: EVM≦-27dB
802.11n /HT40 MCS7: EVM≦-27dB
802.11ax /HE20 MCS7: EVM≦-27dB
802.11nax/HE40 MCS7: EVM≦-27dB
Receiver Sensitivity (HT20)| 802.11b@8% PER11Mbps≦ -88dBm
802.11g@10% PER 54Mbps≦-74dBm
802.11n@10% PER MCS 7≦-70dBm
Operating Channel| Wi-Fi 2.4GHz:
11: (Ch. 1-11) – United States(North America)
13: (Ch. 1-13) – Europe
14: (Ch. 1-14) – Japan
Antenna| PCB onboard antenna

Pin Descriptions.

4.1 Pin Outline. 4.2 Pin Definition.

※ P:POWER
I:INPUT
O:OUTPUT

Dimensions.

5.1 Module Picture.
5.2 Module Mechanical Dimensions. 5.3 PCB Layout Reference.

Antenna Information.

6.1 Antenna type.
This module antenna type is PCB on-board antenna with antenna gain of -1.3dBi (MAX)
6.2 Module layout considerations.
The UAM027-A0 module shall be welded to the PCB board. In order to obtain the best RF performance. Under the PCB on-board antenna, there should be no copper laying, device and wiring. During PCB design, the corresponding area should be cleared. As shown in the following figure.

Environmental Requirements.

7.1 Recommended Reflow Profile.
Referred to IPC/JEDEC standard.
Peak Temperature : <245°C
Number of Times : ≤2 times

7.2 Note.
Note:Take and use the module, please insure the electrostatic protective measures.

1. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 ℃ for the MID motherboard.
   About the module packaging, storage and use of matters needing attention are as follows:

2. The module of the reel and storage life of vacuum packing:

3. Shelf life: 8 months, storage environment conditions: temperature in: < 40 ℃, relative humidity: < 90% r.h.

4. The module vacuum packing once opened, time limit of the assembly:
   Card:

5. check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption.

6. factory environmental temperature humidity control: ≦ -30 ℃, ≦ 60% r.h..

7. Once opened, the workshop the preservation of life for 168 hours.

8.  Once opened, such as when not used up within 168 hours:

9. The module must be again to remove the module moisture absorption.

10. The baking temperature: 125 ℃, 8 hours.

11. After baking, put the right amount of desiccant to seal packages.

7.3 Humidity sensitive control.

CAUTION
This bag contains
MOISTUR-SENSITIVE DEICES
3 # blank, see adjacent bar code label

1. Calculatied shelf life an sealed bag: 12 months at < 40°C and <90% relative humidity(RH)

2. Peak package body temperature : 260 c

3. After bag is opened ,devices that will be subjected to reflow solder  of other high temperature process must
   a) Mounted within: 168 hrs. of factory confitions 30°C /60%RH, OR
   b) Stored at<10% RH

4. Devices require bake,before mounting, if:
   a) Humidity Indicator Care is > 10% when read at23 + ST
   b) 3a or 3b not met.

5. if baking is required , devices may be baked for 48 hrs. at 125 + 5
   Note : If device containers cannot be subjected to high temperature of shorted bake times are desired, reference IPC/JDEC J-STD-033 for bake procedure
   bag Seal Date :…………………………
   Note : level and body temperature defined by IPC/JEDEC J-STD-020

Package style.

8.1 Packaging Detail.
The module and the humidity indicator card are placed together in vacuum anti- static packaging, separated by a certain amount of paper, and neatly placed in the packaging box.The packaging must have reliable moisture-proof and anti- collision measures.
Note 1:
There is a “triangular arrow” on the humidity indicator card indicating at 30%RH (as shown in the picture below). If the chemical changes to pink in the circle it points to, the element is damp and needs baking. Note 2:
Please confirm the packaging style with our sales staff before purchasing this product. If no packing style is specified before purchase, we will ship the goods by our own choice of packing method.

Transport regulations.

In the process of logistics or express transportation, attention should be paid to handling with care to avoid direct rain and snow.

Disclaimer and copyright notice.

All information in this document is provided according to the product status quo and subject to change without notice.
The contents of this document disclaim any warranties, including any warranties of fitness for sale, fitness for a particular purpose or non- infringement, and any warranties mentioned elsewhere in any proposal, specification or sample.
This document is not liable for any infringement of patent rights arising from the use of the  information contained in this document.
This document does not grant any license, express or implied, to use any intellectual property rights, estoppel or otherwise.
All trademarks mentioned herein are the property of their respective owners.

Attention.

Due to product version upgrade or other reasons, the content of this manual may be changed.
Shenzhen Uascent Technology Co., Ltd. reserves the right to modify the content of this manual without any notice or prompt. If users need to obtain the latest product information, please apply for the final document with our company.This manual is only used as a guide. Shenzhen Uascent Technology Co., Ltd. tries its best to provide the latest information in this manual, but does not guarantee that the content of the manual is completely accurate.
None of the statements, information and recommendations contained in this manual constitute any warranty, express or implied.

FCC statements:

This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesired operation.

NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications or changes to this equipment. Such modifications or changes could void the user’s authority to operate the equipment.
The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction. Federal Communication Commission (FCC) Radiation Exposure Statement Power is so low that no RF exposure calculation is needed.
Important Note: In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the Federal Communications Commission of the U.S. Government (FCC) and the Canadian  Government authorizations are no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator shall be responsible for re-evaluating the end-product (including the transmitter) and obtaining a separate FCC authorization in the U.S. and Canada. OEM Integrators – End Product Labeling Considerations: This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: ” Contains, FCC ID: 2A68EJX-UAM052″. The grantee’s FCC ID can be used only when all FCC compliance requirements are met.
OEM Integrators – End Product Manual provided to the End User: The OEM integrator shall not provide information to the end user regarding how to install or remove this RF module in end product user manual. The end user manual must include all required regulatory information and warnings as outlined in this document.
2.2 List of applicable FCC rules
The device compliance with FCC Part 15.247
2.3 Summarize the specific operational use conditions
The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required for the installed module
2.4 Limited module procedures
Device is single module approval
2.5 Trace antenna designs
PCB onboard antenna, antenna gain is -1.3dBi the antenna size as below

2.6 RF exposure considerations
Compliance with FCC Part 2.1093
This device is intended only for OEM integrators under the following conditions: 1.The antenna must be installed such that 20 cm is maintained between the antenna and users. 2. The transmitter module may not be co-located with any other transmitter or antenna. As long as the two conditions above are met, additional transmitter testing will not be required.
2.7 Antennas
PCB onboard antenna, antenna gain is -1.3dBi.
2.8 Label and compliance information
The label compliance with FCC requirement, and the end product must be labeled in a visible area with the
following: ” Contains, FCC ID: 2A68EJX-UAM052″
2.9 Information on test modes and additional testing requirements
The module under Continuous transmit ion and lager than 98% duty cycle
2.10 Additional testing, Part 15 Subpart B disclaimer
The test results compliance with FCC Part 15B requirement.

Uascent Technology Co., Ltd
www.uascent-iot.com

References

• Wi-Fi Module, BT Module, IoT Module Manufacturer & Supplier - Fn-Link

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