MEIG SLM500S Smart Module

Specifications

• Product Name: SLM500S
• Company: MeiG Smart Technology Co., Ltd
• File Name: SLM500S Hardware Design Manual
• Version Number: V1.06
• Release Date: 2022/08

Security Precautions

Pay attention to the following security precautions when using or repairing the SLM500S:

• When in a hospital or medical facility, observe restrictions on using the phone to prevent interference with medical devices.
• Turn off the wireless terminal or mobile phone before boarding an aircraft to comply with regulations and prevent interference with the communication system.
• Avoid using the mobile terminal in front of flammable gases or near potentially explosive electrical equipment.
• Keep in mind that the mobile terminal can interfere with TV, radio, computer, or other electrical equipment due to radio frequency energy.
• Do not use the handheld terminal or mobile phone while driving. Instead, use a hands-free device and stop before using the device.

Frequently Asked Questions (FAQ)

Q: Who owns the copyright of the manual?
A: The manual is exclusively owned by MeiG Smart Technology Co., Ltd. Copying, spreading, distributing, modifying, or using its content without written authorization is prohibited.

Q: Is there any guarantee for the content in the manual?
A: MeiG Smart does not provide any representations or warranties, either express or implied, for the content in the manual. MeiG Smart will not be liable for any specific merchantability or indirect, particular, and collateral damage.

Q: Can the document be disclosed to third parties?
A: The document is confidential and should not be disclosed to third parties, except for specific purposes.

Q: What should I do in case of property or health damage caused by abnormal operation?
A: MeiG Smart will not take any responsibility for property or health damage caused by abnormal operations. It is advised to develop the product according to the technical specification and design reference guidance defined in the product manual.

Technical data of meige intelligent products

SLM500S Hardware Design Manual
Released Date: 2022/08 File name: SLM500S Hardware Design Manual Version Number: V1.06 Company: MeiG Smart Technology Co., Ltd
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SLM500S Hardware Design Guide
IMPORTANT NOTICE
COPYRIGHT NOTICE
Copyright: ©MeiG Intelligent Technology Co., Ltd.
All contents of this manual are exclusively owned by MeiG Smart Technology Co., Ltd(MeiG Smart for short), which is under the protection of Chinese laws and copyright laws in international conventions. Anyone shall not copy, spread, distribute, modify or use its content in other ways without the written authorization of MeiG Smart. Those who violated will be investigated by corresponding legal liability in accordance with the law.

NON-GUARANTEE
MeiG Smart makes no representations or warranties, either express or implied, for any content in this document, and will not be liable for any specific merchantability and applicable or any indirect, particular and collateral damage.

CONFIDENTIALITY
All information contained in the document (including any attachments) is confidential. The recipient is aware that this document is confidential except for specific purposes and that the document shall not be disclosed to third parties.

DISCLAIMER
MeiG Smart will not take any responsibility for any property and health damage caused by the abnormal operation of customers. Please develop the product according to the technical specification and design reference guidance defined in the product manual. MeiG Smart has the right to modify the document according to technical requirement without announcement to the customer.

MeiG Intelligent Product Technical Data

SLM500S Hardware Design Guide
Security Warning
Pay attention to the following security precautions in the process of using or repairing any terminal or mobile phone. Terminal devices should be informed of the following security information. Otherwise, MeiG will not bear any consequences that the user does not follow these warning operations.

Logo

Requirement
When you are at a hospital or medical facility, observe the restrictions on using your phone. If necessary, please turn off the terminal or mobile phone, otherwise the medical device may malfunction due to radio frequency interference.
Turn off the wireless terminal or mobile phone before boarding. To prevent interference with the communication system, wireless communication equipment is prohibited on the aircraft. Ignoring the above will violate local laws and may result in a flight accident.

Do not use mobile terminals or mobile phones in front of flammable gases. Turn off the mobile terminal when you are near an explosion, chemical factory, fuel depot, or gas station. It is dangerous to operate a mobile terminal next to any potentially explosive electrical equipment.
The mobile terminal receives or transmits radio frequency energy when it is turned on. It can interfere with TV, radio, computer or other electrical equipment.

Road safety first! Do not use a handheld terminal or mobile phone while driving, please use a hands-free device. Stop before using your handheld terminal or mobile phone. GSM mobile terminals operate under RF signals and cellular networks, but are not guaranteed to be connected in all situations. For example, there is no credit or invalid SIM card. When in this situation and need emergency services, remember to use an emergency call. In order to be able to call and receive calls, the mobile terminal must be powered on and in a service area where the mobile signal is strong enough. Emergency calls are not allowed when certain network services or telephony features are in use, such as feature locks, keyboard locks. These functions should be removed before using an emergency call. Some networks require effective SIM card support.

MeiG Intelligent Product Technical Data

SLM500S Hardware Design Guide
SLM500S Hardware Design Manual_V1.06

MeiG Intelligent Product Technical Data

SLM500S Hardware Design Guide
Foreword
Thank you for using the SLM500S module from Meg Smart. This product can provide data communication services. Please read the user manual carefully before use, you will appreciate its perfect function and simple operation method.
The company does not assume responsibility for property damage or personal injury caused by improper operation of the user. Users are requested to develop the corresponding products according to the technical specifications and reference designs in the manual. Also pay attention to the general safety issues that mobile products should focus on.
Before the announcement, the company has the right to modify the contents of this manual according to the needs of technological development.

MeiG Intelligent Product Technical Data

Change Description
Initial establishment
Update the content
Add MIC and earphone design instructions
Update module 3D dimension diagram and recommended PCB package dimension diagram, increase pin interval size. Added 7.5 Packaging Information NTC resistance changed from 47K to 10K; Update ADC Description Changing PIN Definitions
Overall content modification

Author
Hardware Department Hardware Department Hardware Department
Hardware Department
Hardware Department Hardware Department Hardware Department

MeiG Intelligent Product Technical Data

SLM500S Hardware Design Guide

 Introduction

This document describes the hardware application interfaces of the module, including circuit connections and radio frequency interfaces. This helps users quickly learn about the interface definition, electrical performance, and structural dimensions of the module. Combining this document with other application documents, customers can quickly design various mobile communication solutions and provide more perfect solutions for end users.

Meige Smart
SLM500S Hardware Design Guide

Module Overview
The SLM500S module uses a quad-core base band processor based on ARM Cotex-A53. The main frequency is up to 1.4GHz, and the memory supports single- channel 32-bit LPDDR3/667MHz. The chip can support TD-LTE/FDD-LTE/WCDMA/GSM and other systems.
The SLM500S module supports the following operating frequency bands TDD-LTE: B34/38/39/40/41 FDD-LTE: B1/3/5/7/8/20 WCDMA: B1/B5/B8 GSM: B2/3/5/8
Note: The TDD-LTE B41 band bandwidth of SLM500S is 100MHz (2535 ~ 2655 MHz), and the channel is 40040 ~ 41240
The physical interface of the module is a 274-pin pad, and the hardware interface is as follows
Three 1.8V UART serial ports, including one four-wire port and two two-wire port One LCD (MIPI interface) Double Camera Interface (MIPI interface) A high- speed USB interface Three-channel audio input interface Two audio output interfaces Two UIM card ports GPIO interfaces Four sets of I2C interfaces (one set of CAM-specific I2C) Two SPI interfaces One SD card port Support GNSS, 2.4G WiFi, Bluetooth 4.2 functions

Summary of Features
Table 2.1:Main features of the module

Product Feature CPU GPU System memory Operating System Size
Network band SLM500S
Wi-Fi Meige Smart

Description
Quad-core A53 (64bit) 1.4GHz
Mail T820 MP1@680MHz
8GB eMMC + 1GB LPDDR3 Compatible with 16GB+2GB
Android10 40.5×40.5×2.8mmLCC 146pin+LGA 128pin TDD-LTE: B34/38/39/40/41 FDD- LTE: B1/3/5/8 WCDMA: B1/B5/B8 GSM: B2/3/5/8 IEEE 802.11b/g/n 2.4G

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SLM500S Hardware Design Guide

Bluetooth

FM

GNSS
Data access

TD-LTE FDD-LTE DC-HSPA+ EDGE GPRS

SIM

Display

Camera
Input devices Reset

Application interface

Meige Smart

BT 4.2

NO Support

GPS/Beidou/Glonass

Cat4 TD-LTE 117/30Mbps

Cat4 FDD-LTE 150/50Mbps

42/11.2Mbps

Class12, 236.8kbps/236.8kbps

Class12, 85.6kbps/85.6kbps

DSDS

3.0/1.8V

Support SIM detection

L/W/G+G with CSFB to W/G

Matrix: HD+1440*720

Support HD up to 60fps

LCD Size: User defined

Interface: MIPI DSI 4-lane;

Interface: Main: MIPI CSI 2-lanes; front: MIPI CSI 1-lanes

Camera Pixel: Max. Front 2Mp/Rear 5Mp

Video decode

1080p@30 fps:H.264/MPEG-4

Video encode

1080p@30 fps: H.264/MPEG-4

KeypadsPower on/offResetvolume+volume-

TP

Support hard reset

The name of the interface

Main Function Description

VBAT

4pinModule power input3.5V4.2VNominal value3.8V

SDIO *1

SD Cardsupport up to 256GB

USB

Support OTG USB_BOOTFor forced download

UART*3

One four-wire port and two two-wire port

I2C*4

Support

SPI2(master only) ADC1 PWM*1 Charger Vibration GPIO VRTC
RF Interface
Audio

Support
Support Support Linear Charger 1A Support 37 GPIOs Real-time clock backup battery Multi-mode LTE main antenna Multi-mode LTE diversity antenna GPS antenna 2.4G WiFi/BT antenna Three groups of analog MICs

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SLM500S Hardware Design Guide
One Hands free speaker. One earpiece One stereo headphone.
2.2.Block Diagram
The following figure lists the main functional parts of the module
Base band chips Power management chip The RF Transceiver chip WIFI/BT 2-in-1 chip The antenna interface LCD/CAM – MIPI interface EMCP memory chip AUDIO interface Serial port, SD card interface, SIM card interface, I2C interface and so on

Fig2.1Module function block diagram

Meige Smart

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3.Module Package
3.1.Pin Distribution Diagram

SLM500S Hardware Design Guide

Fig3.1Module pin diagram (top view) MeiG Intelligent Product Technical Data

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SLM500S Hardware Design Guide

3.2.Module Pin Description

Table 3.1:Pin description

Pin Name GPIO

Pad

Functional Description

Interrupt Characteristics

1

VBAT

PI,PO

Battery,3.5V-4.2V,default 3.8V

2

VBAT

PI,PO

Battery,3.5V-4.2V,default 3.8V

3

GND

GND

GND

4

MIC1_P

AI

Microphone 1 input plus

5

MIC1_N

AI

Microphone 1 input minus

6

MIC2_P

AI

Microphone 2 input

7

GND

GND

GND

8

EAR_P

AO

Earpiece output, plus

9

EAR_M

AO

Earpiece output, minus

10

SPKR_OU T_P

11

SPKR_OU T_M

12 GND

AO AO GND

Class-D speaker driver output, plus Class-D speaker driver output, minus GND

13 USB_DM

I/O

USB data minus

14 USB_DP

I/O

USB data plus

15 GND

GND

GND

16 USB_ID

DI

17

UIM2_DE T

GPIO9

DI

18

UIM2_RE SET

DO

19

UIM2_CL K

DO

20

UIM2_DA TA

I/O

21

UIM2_VD D

PO

22

UIM1_DE T

GPIO31

DI

23

UIM1_RE SET

DO

24

UIM1_CL K

DO

25

UIM1_DA TA

I/O

USB ID Configurable I/O,UIM2 removal detection UIM2 reset UIM2 clock UIM2 data PMIC output for UIM2 Configurable I/O,UIM1 removal detection UIM1 reset UIM1 clock UIM1 data

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26

UIM1_VD D

PO

27 GND

GND

28

VIB_DRV _P

PO

29 PWM

GPIO123 I/O

30 TP_INT GPIO144 DI

31 TP_RST GPIO145 DO

32 VDDSDIO

PO

33 GPIO87 GPIO87 I/O

34

UART0_T XD

GPIO60

I/O

35

UART0_R XD

GPIO61

I/O

36

UART0_C TS

GPIO62

I/O

37

UART0_R TS

GPIO63

I/O

38 SD_VDD

PO

39 SD_CLK

DO

40 SD_CMD

I/O

41 SD_D0

I/O

42 SD_D1

I/O

43 SD_D2

I/O

44 SD_D3

I/O

45 SD_DET GPIO78 DI

46

USB_BO OT

DI

47

TP_I2C_S CL

GPIO146

DO

48

TP_I2C_S DA

GPIO147

I/O

49

LCD_RES ET

GPIO50

DO

50 LCD_TE GPIO51 DO

51 GND

52

DSICLK M

53

DSICLK P

54 DSI_LAN

GND AO AO AIO

MeiG Intelligent Product Technical Data

SLM500S Hardware Design Guide

PMIC output for UIM1 GND Haptics driver output positive Configurable PWM Configurable I/O,TP INT Configurable I/O,TP RESET PMIC output 1.8V for SD-card IO Configurable I/O Configurable I/O,UART0 TX
Configurable I/O,UART0 RX
Configurable I/O,UART0 CTS
Configurable I/O,UART0 RTS PMIC output 2.95V for SD-card power Secure digital controller clock Secure digital controller command Secure digital controller data bit 0 Secure digital controller data bit 1 Secure digital controller data bit 2 Secure digital controller data bit 3 Configurable I/O,SD card detection Pullup to forced USB boot
Configurable I/O,TP I2C SCL
Configurable I/O,TP I2C SDA
Configurable I/O, LCD RESET Configurable I/O, LCD TE GND MIPI display serial interface 0 clock-
MIPI display serial interface 0 clock+ MIPI display serial interface 0 lane0-

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E0_M

55

DSI_LAN E0_P

56

DSI_LAN E1_M

57

DSI_LAN E1_P

58

DSI_LAN E2_M

59

DSI_LAN E2_P

60

DSI_LAN E3_M

61

DSI_LAN E3_P

62 GND

AIO AIO AIO AIO AIO AIO AIO GND

63

CSI1_CLK _M

AO

64

CSI1_CLK _P

AO

65

CSI1_LAN E0_M

AIO

66

CSI1_LAN E0_P

AIO

67

CSI1_LAN E1_M

AIO

68

CSI1_LAN E1_P

AIO

69 GND

GND

70

CSI0M_C LK_M

AO

71

CSI0M_C LK_P

AO

72

CSI0M_L ANE0_M

AIO

73

CSI0M_L ANE0_P

AIO

74

MCAM_M CLK

GPIO42

DO

75

SCAM_M CLK

GPIO43

DO

76 GND

GND

77

ANT_WIFI /BT

AIO

MeiG Intelligent Product Technical Data

SLM500S Hardware Design Guide

MIPI display serial interface 0 lane0+ MIPI display serial interface 0 lane1MIPI display serial interface 0 lane1+ MIPI display serial interface 0 lane2MIPI display serial interface 0 lane2+ MIPI display serial interface 0 lane3MIPI display serial interface 0 lane3+ GND MIPI camera serial interface 1 clockMIPI camera serial interface 1 clock+ MIPI camera serial interface 1 lane0MIPI camera serial interface 1 lane0+ MIPI camera serial interface 1 lane1MIPI camera serial interface 1 lane1+ GND MIPI camera serial interface 0 clockMIPI camera serial interface 0 clock+ MIPI camera serial interface 0 lane0MIPI camera serial interface 0 lane0+ Configurable I/O,main CAM MCLK Configurable I/O,front CAM MCLK GND RF signal for WIFI/BT

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78 GND

GND

79

MCAM_R ST

GPIO44

DO

80

MCAM_P WDN

GPIO46

DO

81

SCAM_R ST

GPIO45

DO

82

SCAM_P WDN

GPIO47

DO

83

CAM_I2C _SCL

GPIO74

DO

84

CAM_I2C _SDA

GPIO75

I/O

85 GND

GND

86 GND

87

ANT_MAI N

GND AIO

88 GND

GND

89 GND

GND

90 GPIO131 GPIO131 I/O

91

SENSOR_ I2C_SCL

GPIO127

DO

92

SENSOR_ I2C_SDA

GPIO128

I/O

93

DBG_UA RT_RX

DI

94

DBG_UA RT_TX

DO

95 VOL_UP

DI

96

VOL_DO WN

DI

97 GPIO85 GPIO85 I/O

98 GPIO89 GPIO89 I/O

99 GPIO8

GPIO8 I/O

100 GPIO7

GPIO7 I/O

101 GPIO132 GPIO132 I/O

102 GPIO134 GPIO134 I/O

103 GPIO11 GPIO11 I/O

104 GPIO10 GPIO10 I/O

105 GPIO133 GPIO133 I/O 106 GPIO121 GPIO121 I/O

MeiG Intelligent Product Technical Data

SLM500S Hardware Design Guide

GND Configurable I/O,main CAM RESET
Configurable I/O,main CAM PWDN
Configurable I/O,front CAM RESET
Configurable I/O,front CAM PWDN
Dedicated camera I2C SCL
Dedicated camera I2C SDA GND GND RF signal for main ANT GND GND Configurable I/O SENSOR I2C SCL
SENSOR I2C SDA
UART RX
UART TX KEY VOL+ KEY VOLConfigurable I/O Configurable I/O Configurable I/O Configurable I/O Configurable I/O Configurable I/O Configurable I/O Configurable I/O Configurable I/O, Configurable I/O

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107 GPIO52 GPIO52 I/O

108 GPIO53 GPIO53 I/O

109 GPIO54 GPIO54 I/O

110 GPIO55 GPIO55 I/O

111

VDD_1V8 5

PO

112 GPIO122 GPIO122 I/O

113 GPIO33 GPIO33 I/O

114 PWRKEY

DI

115 GPIO130 GPIO130 I/O

116 GPIO93 GPIO93 I/O

117 GPIO90 118 GPIO92

GPIO90 I/O GPIO92 I/O

119 GPIO91 GPIO91 I/O

120 GND

121

ANT_GNS S

122 GND

GND AI GND

123 GPIO32 GPIO32 I/O

124 GPIO129 GPIO129 I/O

125

VDDCAMI O

126 VRTC

127

CHARGE _SEL

128 ADC

PO AI,AO DI AI

129 VDD_2V8 130 GND

PO GND

131 ANT_DRX

AI

132 GND

GND

133 BAT_SNS

134

BATT_TH ERM

135 GND

AI AI GND

136 HPH_R

AO

137 HPH_REF

AI

138 HPH_L

AO

139 HS_DET

AI

MeiG Intelligent Product Technical Data

SLM500S Hardware Design Guide

Configurable I/O Configurable I/O Configurable I/O Configurable I/O

PMIC output 1.85V for digital I/Os

Configurable I/O Configurable I/O KEY POWER ON/OFF Configurable I/O Configurable I/O,SPI CLK Configurable I/O,SPI CS Configurable I/O,SPI DI Configurable I/O,SPI DO GND

RF signal for GPS ANT

GND Configurable I/O Configurable I/O

PMIC output 1.8V for Camera IO

Coin-cell battery or backup battery

Charge path selection

Configurable ADC PMIC output 2.8V for TP and sensor GND RF signal for diversity ANT GND battery voltage input to ADC

Battery temperature input to ADC

GND Headphone output, right channel Headphone ground reference Headphone output, left channel MBHC mechanical insertion/removal-detection

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140 GND

GND

141 VBUS

PI

142 VBUS

PI

143 GND

GND

144 GND

GND

145 VBAT

PI,PO

146 VBAT

147

MIC_BIAS 1

148

RESERVE D

149

RESERVE D

150

RESERVE D

151 MIC3_N

PI,PO AO
AI

152 MIC3_P

AI

153

UART2_R XD

GPIO73

I/O

154

UART2_T XD

GPIO72

I/O

155

RESERVE D

156

VDDCAM A

PO

157

RESERVE D

158

RESERVE D

159

RESERVE D

160

RESERVE D

161

RESERVE D

162 GND

GND

163 GPIO40 GPIO40 I/O

164 GPIO41 GPIO41 I/O

165

RESERVE D

166 GPIO48 GPIO48 I/O

MeiG Intelligent Product Technical Data

SLM500S Hardware Design Guide
GND USB Voltage USB Voltage GND GND Battery,3.5V-4.2V,default 3.8V Battery,3.5V-4.2V,default 3.8V Microphone bias #1
Reserved
Reserved
Reserved Microphone 3 input minus Microphone 3 input plus Configurable I/O,UART2 RXD
Configurable I/O,UART2 TXD
Reserved
PMIC output 2.8V for Camera AVDD
Reserved
Reserved
Reserved
Reserved
Reserved GND Configurable I/O Configurable I/O Reserved Configurable I/O
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167 I2C4_SDA GPIO155 I/O

168 I2C4_SCL GPIO154 DO

169

RESERVE D

170

RESERVE D

171 GND

GND

172 GND

173

RESERVE D

174

RESERVE D

175

RESERVE D

176 GND

GND GND

177

RESERVE D

178

RESERVE D

179

RESERVE D

180

RESERVE D

181 GPIO77 GPIO77 I/O

182 GPIO139 GPIO139 I/O

183 CS_M

DI

184 CS_P

DI

185 BAT_ID

186

RESERVE D

187 GND

DI GND

188 GND

GND

189 GND

GND

190 GND

GND

191 GND

192

VDDCAM D

193

VDDCAM MOT

GND PO PO

MeiG Intelligent Product Technical Data

SLM500S Hardware Design Guide
Configurable I/O, I2C4 SDA for switching Charging and Flash LED Driver and Source Driver(if need) Configurable I/O, I2C4 SCL for switching Charging and Flash LED Driver and Source Driver(if need) Reserved
Reserved GND GND Reserved
Reserved
Reserved GND Reserved
Reserved
Reserved
Reserved Configurable I/O Configurable I/O Fuel gauge input,minus Fuel gauge input,plus Battery ID Reserved GND GND GND GND GND PMIC output 1.2V for Camera DVDD
PMIC output 2.8V
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194

RESERVE D

195

RESERVE D

196

RESERVE D

197

RESERVE D

198

RESERVE D

199

RESERVE D

200

RESERVE D

201 GPIO29 GPIO29 I/O

202 GND

GND

203 GND

GND

204 GND

GND

205 GPIO49 GPIO49 I/O

206 GND

GND

207 GND

GND

208 GND

GND

209 GND

GND

210 GND

GND

211 GND

GND

212 GND

GND

213 GND

GND

214 GND

GND

215 GND

GND

216 GND

GND

217 GND

GND

218 GND

GND

219 GND

GND

220 GND

GND

221 GND

GND

222 GND

GND

223 GND

GND

224 GND

GND

225 RESET_N

DI

MeiG Intelligent Product Technical Data

Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Configurable I/O GND GND GND Configurable I/O GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND PMIC RESET

SLM500S Hardware Design Guide 20 / 62

226 GND

GND

227 GND

GND

228 GND

GND

229 GND

GND

230 GND

GND

231 GND

GND

232 GPIO88 GPIO88 I/O

233 GND

GND

234 GND

GND

235 GND

GND

236 GND

GND

237 GND

GND

238 GND

239

RESERVE D

240 GND

GND GND

241 GND

GND

242 GPIO23 GPIO23 I/O

243 GND

GND

244 GND

GND

245 GND

246

RESERVE D

247 GND

GND GND

248 GND

GND

249 RGB_B

SINK IN

250 GND

GND

251 GND

GND

252 RGB_R

SINK IN

253 RGB_G

254

RESERVE D

255 GND

SINK IN GND

256 GND

257

RESERVE D

258 GND

GND GND

MeiG Intelligent Product Technical Data

GND GND GND GND GND GND Configurable I/O GND GND GND GND GND GND
Reserved
GND GND Configurable I/O GND GND GND
Reserved
GND GND Blue LED Driver GND GND Red LED Driver Green LED Driver
Reserved
GND GND
Reserved
GND

SLM500S Hardware Design Guide 21 / 62

SLM500S Hardware Design Guide

259 GND

GND

260 GRFC_7

DO

261 GND

GND

262 GRFC_5

DI,DO

263

RESERVE D

264 GPIO86 GPIO86 I/O

265

RESERVE D

266 GND

GND

267 GPIO136 GPIO136 I/O

268 GND

GND

269 GND

GND

270

RESERVE D

271 GND

GND

272 GND

GND

273 GND

GND

274 GND

GND

GND RFFE3 CLK GND RFFE3 DATA
Reserved
Configurable I/O
Reserved
GND Configurable I/O GND GND
Reserved
GND GND GND GND

All the GPIO could be programmed to be either input or output, when in input mode,they could be programmed to trigger interrupt to CPU
WPUWeak pull up
WPDWeak pull down

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3.3.Mechanical Dimensions

SLM500S Hardware Design Guide

Fig3.2Module 3D dimensionmm MeiG Intelligent Product Technical Data

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SLM500S Hardware Design Guide

Fig3.3Recommended PCB package sizemm

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SLM500S Hardware Design Guide
4.Interface Application
4.1.Power Supply
For battery-powered devices, the VBAT module has a voltage input range of 3.5V to 4.2V and a recommended voltage of 3.8V. In GSM band, when the module is transmitted at maximum power, the current peak can reach up to 3A instantly, resulting in a large voltage drop on VBAT. It is recommended to use a large capacitor to stabilize voltage close to VBAT. It is recommended to use a 22uF ceramic capacitor, and a 100nF capacitor in parallel can effectively remove high-frequency interference. At the same time, in order to prevent ESD and surge damage to the chip, it is recommended to use appropriate TVS tube and 4.5V voltage regulator tube at module VBAT pin. When PCB layout, capacitor and TVS tube should be as close as possible to module VBAT pin. The user can directly power the module with a 3.8v lithium ion battery. When using the battery, the impedance between the VBAT pin and the battery should be less than 150m.
Fig4.1VBAT input reference circuit The DC input voltage is +5V. The following figure shows the recommended circuit for using dc-dc power supply

Fig4.2DC-DC power supply circuit MeiG Intelligent Product Technical Data

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SLM500S Hardware Design Guide
Note :If the user does not use battery power supply, please note that a 10K resistor is connected to pin 134 (BATT_THERM) of the module and pulled down to GND, so as to prevent the software from judging abnormal battery temperature after the module is powered on and leading to shutdown.
The connection diagram is as follows:

Fig4.3Diagram of connection when not powered by battery
Users can directly use the 3.8V lithium ion battery to power the module, or use the Nickel-cadmium or nickel-manganese battery to power the module. However, the maximum voltage of the nickel-cadmium or nickel-manganese battery cannot exceed the maximum allowed voltage of the module. Otherwise, the module may be damaged. When using a battery, the impedance between the VBAT pin and the battery should be less than 150m.
4.1.1.Power Pin
The VBAT pins (1, 2, 145, 146) are used for power input. In the user’s design, please pay special attention to the design of the power supply part to ensure that the drop of VBAT is not less than 3.5V even when the module consumption reaches 3A. If the voltage drop is less than 3.5V, the module may shut down. PCB wiring from VBAT pins to the power supply should be wide enough to reduce voltage sags in transmission burst mode.

VBAT lowest voltage sag

4.2.Power On/Off

Do not turn on the module when the temperature and voltage upper limits of the module are exceeded. In extreme cases such operations can cause permanent damage to the module.
4.2.1.Power On

The user can start the module by pulling down the PWRKEY pin (114) for at least 3 seconds. The pin

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SLM500S Hardware Design Guide
has been pulled up to the 1.8V power supply in the module. The recommended circuit is as follows.
Fig4.5Power on using external signal driver module
Fig4.6Use the button circuit to boot The following figure shows the boot sequence description:

Fig4.7PWRKEY startup sequence table
*This is a reference timing diagram. Because there may be slight differences with the actual measurement, the actual measurement shall prevail.
4.2.2.Module Shutdown
The user can shut down the machine using the PWRKEY pin.

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SLM500S Hardware Design Guide
4.2.2.1PWRKEY Shutdown The user can power off the device by lowering the PWRKEY signal for at least 3 seconds. Power off
circuit can refer to the design of power on circuit. After the module detects the shutdown action, a prompt window will pop up on the screen to confirm whether to execute the shutdown action.
You can forcibly shut down the PWRKEY by holding it down for at least 15 seconds.
4.2.3.Module Reset
The SLM500S module supports the reset function. Users can quickly restart the module by pulling down the RESET_N pin of the module.
Recommended circuits are as follows:
Fig4.8Use the button circuit to reset

Fig4.9Reset module using external signal
The typical voltage of the pin is 1.8V at high current level, so the user with 3V or 3.3V level can not directly use GPIO of MCU to drive the pin, and an isolation circuit is required, as shown in Figure 4.9.

4.3.VCOIN

When the VBAT is disconnected and the user needs to save the real-time clock, the VCOIN pin should not be suspended and should be connected to a large external capacitor or battery. When the external capacitor is connected, the recommended value is 100uF, which can keep the real-time clock for 30 seconds. The RTC power module uses an external capacitor or battery to supply power to the RTC inside

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the module.

SLM500S Hardware Design Guide

Fig4.10The external capacitor supplies power to the RTC Chargeable battery power:

Fig4.11Chargeable batteries power the RTC NotesThis VCOIN power supply is 2.5-3.1V, typical typically 3.0V.

4.4.Power Output

The SLM500S has multiple power outputs. Used for LCD, Camera, touch panel and so on. In application, it is recommended to add parallel 33PF and 10PF capacitors in each power supply to effectively remove high-frequency interference.
Table 4.1:The power to describe

Signal

Voltage

UIM1_VDD UIM2_VDD SD_VDD VDD_1V85 VDD_2V8 VRTC VDDCAMIO VDDCAMD VDDCAMMOT VDDCAMA VDDSDIO

1.8V/3V 1.8V/3V 3.0V 1.85V 2.8V 3.0V 1.8V 1.2V 2.8V 2.8V 1.8V/3V

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Drive current
50mA 50mA 400mA 200mA 150mA
200mA 400mA 100mA 150mA 100mA

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SLM500S Hardware Design Guide

4.5.Serial Port

The SLM500S provides three sets of UART serial ports Table 4.2:UART Pin description

Name
UART0_TXD UART0_RXD UART0_CTS UART0_RTS DBG_UART_RX DBG_UART_TX UART2_RXD UART2_TXD

Pin Direction

34

DI

35

DO

36

DI

37

DO

93

DI

94

DO

153 DI

154 DO

You can refer to the following connection mode:

Function
UART0 Data sending UART0 Data receiving UART0 Clear to sendCTS UART0 Request to sendRTS UART1 Data receiving UART1 Data sending UART2 Data receiving UART2 Data sending

Fig4.12Serial port connection diagram
When the serial port level used by the user does not match the module, in addition to increasing the level conversion IC, the figure below can also be used to achieve level matching. Here, only TX and RX matching circuits are listed, and other low-speed signals can refer to these two circuits.

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SLM500S Hardware Design Guide

Fig4.13TX connection diagram

Fig4.14RX connection diagram
Note: When using Figure 14 and 15 for level isolation, it is necessary to pay attention to the output timing of VDD1V85. The serial port can communicate normally only after VDD1V85 is output normally.
Table 4.3:Serial Port Hardware Parameters

Description
Input low level Input high level Output low level Output high level

MIN

MAX

Unit

–

0.63

V

1.17

–

V

–

0.45

V

1.35

–

V

Note:

1. The serial port of the module is CMOS interface, which cannot be directly connected to RS232 signal. Use an RS232 converter chip if necessary.

2. If the 1.8V output of the module cannot meet the high level range of the client, please add a level conversion circuit.

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SLM500S Hardware Design Guide

4.6.MIPI Interface
The SLM500S supports the Module Industry Processor Interface(MIPI) Interface for Camera and LCD. The module supports a maximum HD+(1440*720) display, in which the Main Camera supports a maximum of 2 lane MIPI and the Front Camera supports 1 lane MIPI.
MIPI is a high-speed signal cable. During the Layout phase, Layout the cables according to the impedance and length requirements:
1. MIPI differential wiring, 100ohm impedance control, priority is given to each pair of separate wrapping. In the case of insufficient space, CLK needs to wrap the ground, while the others need to wrap the ground together, but it should be noted that when the ground cannot be wrapped, the space between the pair and the pair should be extended.
2. Equal length control: 0.5mm between P and N, ±2mm between groups based on CLK.
3. The length of the MIPI cable should not exceed 75mm(3000mil), and the number of through-holes on the path should not exceed four.
4.6.1.LCD Interface
The SLM500S module supports one set of MIPI LCD screens with a maximum resolution of 1440 x 720. The signal interfaces are shown in the following table
Table 4.4:PIN Interface

Main Screen Interface

Name
DSI0_CLK_M DSI0_CLK_P DSI0_LANE0_M DSI0_LANE0_P DSI0_LANE1_M DSI0_LANE1_P DSI0_LANE2_M DSI0_LANE2_P DSI0_LANE3_M DSI0_LANE3_P LCD_RESET LCD_TE VDD_2V8 VDDCAMIO

Pin

Description

52 MIPI_LCD clock line
53

54

55

56

57 MIPI_LCD data line
58

59

60

61

49

LCD reset pin

50

LCD frame sync signal

129

2.8V power supply

125

1.8V power supply

The GPIO of the module can be used as the LCD_ID. If the GPIO is used as the LCD_ID, please confirm the internal circuit of the LCD. If the resistor divider mode is used in the LCD, please note that the

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SLM500S Hardware Design Guide
voltage must meet the voltage range of GPIO. MIPI is a high-speed signal cable. To avoid EMI interference, you are advised to place a common-
mode inductor near the LCD.

Fig4.15LCD Interface
SLM500S does not support internal backlight drive. The backlight drive circuit of LCD needs to be added by customers themselves. For details, please refer to the following figure:

Fig4.16LCD backlight drive circuit

4.6.2.MIPI Camera Interface

SLM500S module supports MIPI Camera interface and provides Camera dedicated power supply. The

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SLM500S Hardware Design Guide

rear Camera is CSI1 interface, supporting two sets of data lines and supporting 5M pixels. The front Camera is CSI0 interface and supports a set of data lines, which can support 2M pixels. The module provides power for the Camera, including VDDCAMA (2.8V), VDDCAMIO (1.8V), VDDCAMMOT (2.8V) (focusing motor power) and VDDCAMD (1.2V).
Table 4.5:MIPI Camera Interface

Name
CSI1_CLK_M CSI1_CLK_P CSI1_LANE0_M CSI1_LANE0_P CSI1_LANE1_M CSI1_LANE1_P MCAM_MCLK MCAM_RST MCAM_PWDN CAM_I2C_SCL CAM_I2C_SDA VDDCAMIO VDDCAMD VDDCAMMOT VDDCAMA

Rear Camera Interface

Pin

Description

63 Camera MIPI CLK
64

65

66

67

Camera MIPI DATA

68

74

Camera CLK

79

CacmamerearaReset

80

CacmamerearaSleep

83

I2CccaaCmmloeecrrkaa

84

I2C Data

125

Output 1.8V,Camera IOVDD

192

Output 1.2V,Camera DVDD

193

Output 2.8V,Camera AFVDD

156

Output 2.8V,Camera AVDD

Front Camera Interface

Name

Pin

CSI0M_CLK_M

70

CSI0M_CLK_P

71

CSI0M_LANE0_M

72

CSI0M_LANE0_P

73

SCAM_MCLK

75

SCAM_RST

81

SCAM_PWDN

82

CAM_I2C_SCL

83

CAM_I2C_SDA

84

VDDCAMIO

125

VDDCAMD

192

VDDCAMMOT

193

VDDCAMA

156

MeiG Intelligent Product Technical Data

Description Camera MIPI CLK

Camera MIPI DATA

Camera CLK

CacmaemraerRaeset

CacmaemraerSaleep

I2CccaaCmmloeecrrkaa

I2C Data

Output 1.8V,Camera IOVDD

Output 1.2V,Camera DVDD

Output 2.8V,Camera AFVDD

Output 2.8V,Camera AVDD

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SLM500S Hardware Design Guide
If the user designs a CAMERA module with auto-focus function, please note that the I2C of the module cannot be directly connected to the AF device, and the I2C of the AF device should be connected to the driver chip of the CAMERA.
The rate of the MIPI interface is high. During cabling, use 100 ohm impedance to control the cable, and pay attention to the cable length. Do not add a small capacitor to the MIPI signal cable, because the rising edge time of MIPI data may be affected and MIPI data may be invalid

Fig4.17MIPI Camera1 reference circuit

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SLM500S Hardware Design Guide

Fig4.18MIPI Camera0 reference circuit
The power supply required by the Camera, including AVDD-2.8V, AFVDD-2.8V (focus motor power supply) and DVDD-1.2V (CAM core voltage), can be designed with reference to the following LDO circuit.

Fig4.19Camera imaging diagram

4.7.Capacitive Touch Interface

The module provides a set of I2C interfaces that can be used to connect capacitive touch, as well as the required power supply and interrupt pins. The default interface pins of capacitive touch software are defined as follows:

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SLM500S Hardware Design Guide

Table 4.6:Capacitive touch interface definition

Name
TP_I2C_SCL TP_I2C_SDA TP_INT TP_RST VDD_2V8

Pin

IN/OUT Description

47

DO

48

I/O

30

DI

31

DO

129

PO

The I2C interface with capacitive touch needs to be pulled up to VDD_1V85 INT Reset 2.8V

Note: The interface definition for capacitive touch can be adjusted by software, and users can change GPIO and I2C according to design needs.

4.8.Audio Interface
The module provides three analog audio inputs. MIC1_P/N is used to connect the main mic; MIC2_P/N can be used to connect the headset mic, and MIC3_P/N can be used to connect the noisecanceling mic. The module also provides three channels of analog audio output (HPH_L/R, REC_P/N, SPK_P/N). The definition of audio PIN is as follows:
Table 4.7:Audio pin

Name
MIC1_P MIC1_N MIC2_P MIC3_P MIC3_N MIC_BIAS1 HPH_REF HPH_L HPH_R HS_DET EAR_M EAR_P SPKR_OUT_M SPKR_OUT_P

Pin IN/OUT Description

4

AI

5

AI

6

AI

152 AI

151 AI

147 AO

137 GND

138 AO

136 AO

139 AI

9

AO

8

AO

11 AO

10 AO

MIC1 differential input + MIC1 differential input MIC2 single input MIC2 differential input + MIC3 differential input MIC1 bias voltage Earphone reference Gnd Earphone left channel Earphone right channel Earphone plug detection Receiver differential output + Receiver differential output Speaker differential output + Speaker differential output –

It is recommended that users choose the following circuit according to the actual application situation to get better sound effect.

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4.8.1.Receiver Interface Circuit

SLM500S Hardware Design Guide

Fig4.20Receiver interface circuit
4.8.2.Microphone Receiving Circuit

Fig4.21Microphone interface circuit MeiG Intelligent Product Technical Data

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SLM500S Hardware Design Guide
4.8.3.Headphone Interface Circuit
The module integrates a stereo headphone jack. You are advised to reserve ESD devices during the design phase to prevent ESD damage. The HS_DET pin of the module can be set as interrupt. By default, this pin is headset interrupt in the software. Users can use this pin to detect the plug and unplug of the headset.
Note: HP_L must increase the pull-down resistance of 100K.

Fig4.22Headphone interface circuit
Note:1. The headphone holder in Figure 4.24 is type NO. If NC headphone is used, 10K is reserved on HP_DET and pulled up to VDD_2V8.
4.8.4.Speaker Interface Circuit
The speaker interface adopts differential output, with built-in class D power amplifier driver. Under 4.2V VBAT power supply, the typical output power is 800mW when the load is 8 , and the output signal is SPKR_OUT_P/SPKR_OUT_M.

Fig4.23Internal audio amplifier circuit MeiG Intelligent Product Technical Data

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SLM500S Hardware Design Guide
You can also add an audio power amplifier externally and use HPH_R as a single-ended input signal. The reference circuit is shown in the figure below.

4.24Recommended circuit with external audio amplifier
4.8.5 SPI Interface
There are two sets of GPIO compatible I2S interfaces inside the module. The pins used for this function are listed below:

Name
GPIO90 GPIO91 GPIO92 GPIO93 GPIO52 GPIO53 GPIO54 GPIO55

Pin

IN/OUT Description

117

DO

119

DO

118

DI

116

DO

107

DO

108

DO

109

DI

110

DO

SPI0_CS SPI0_DO SPI0DI SPI0 CLK SPI2_CS SPI2_DO SPI2DI SPI2 CLK

4.9.USB Interface

The SLM500S supports a USB 2.0 High Speed interface. The 90 ohm differential impedance must be controlled during Layout and the external cable length must be controlled according to the cable length inside the module. The module also supports OTG function. OTG power supply needs external IC power supply.
The voltage input range during charging is as follows:
Table 4.8:Voltage input range during charging

PIN

Min

Typical

Max

Unit

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SLM500S Hardware Design Guide

VBUS

4.5

–

9.7

V

The USB insertion detection of the module is realized by VBUS and DP/DM data cable. When the USB cable is inserted, the VBUS voltage is detected first, and then the USB cable or charger is determined by detecting the pull up and down state of DM/DP. Therefore, if the user needs to use USB function, please be sure to connect VBUS to the 5V power supply on the data line.

USB is in high-speed mode. You are advised to connect a serial common-mode inductor close to the USB connector to effectively suppress EMI interference. At the same time, the USB interface is an external interface. It is recommended to add TVS to prevent electrostatic damage caused by plugging and unplugging data cables. Users should notice that the load capacitance of TVS should be less than 1PF when selecting TVS. The connection diagram is as follows:

Fig4.25 USB Connection diagram
4.9.1.USB OTG
The SLM500S module provides the USB OTG function, which uses the following pins: Table 4.19:USB OTG

Name
VBUS USB_DM USB_DP USB_ID

Pin
141142 13 14 16

Description
OTG power supply requires external IC power supply USB DATAUSB DATA+ USB ID

The recommended circuit diagram of USB_OTG is shown below:

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SLM500S Hardware Design Guide

Fig4.26Schematic of USB-OTG connection
4.10.Charging Interface
The SLM500S module is integrated with 1A linear charging scheme. The charging contents in this manual are explained only by the internal charging scheme. The SLM500S module can charge over discharged batteries, including trickling charge, constant current charge, and constant voltage charge.
Trickle charging: it is divided into two parts, trickle charging -A: when the battery voltage is lower than 2.05V, the charging current is 70mA; Trickle charging -B: the charging current is 450mA when the battery voltage is between 2.05V and 3.05V;
Constant current charging: when the battery voltage between 3.05V and 4.18V constant current charging, adapter charging charging current 1.0A, USB charging current 450mA;
Constant voltage charging: when the battery voltage reaches 4.18V, it enters the constant voltage charging, the charging current gradually decreases, the charging current decreases to about 100mA, and the charging ends.

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SLM500S Hardware Design Guide
Fig4.27Charging diagram
4.10.1.Charging Detection
When the VBUS PIN voltage is higher than 4.0V, a hardware interrupt will occur inside the module, and the software will judge USB_HS_DP/USB_HS_DM status to identify whether the charger or USB data cable is inserted.
4.10.2.Charge Control
The SLM500S module can charge over discharged batteries, including trickle charge, pre-charge, constant current charge, and constant voltage charge. When the VBAT voltage is lower than 3.05V, the module is pre-charged. When VBAT is between 3.05V and 4.2V, the optimal constant current and constant voltage charging method for lithium battery is adopted. The current charging cut-off voltage of the software is 4.2V, and the back flush voltage is 4.05V.
4.10.3.BAT_THERM
The SLM500S module comes with battery temperature detection, which you can implement with BATT_THERM (134PIN). This requires the battery to integrate an NTC resistor (negative temperature coefficient) at room temperature of 10K and connect the NTC resistor pin to the BATT_THERM pin. During the charging process, the software reads the voltage of the BATT_THERM pin to determine whether the battery temperature is too high. If it is found to be too high or too low, it will immediately stop charging to prevent battery damage. The schematic diagram of battery charging connection is shown below.

Fig4.28Charging circuit connection diagram

4.11.UIM Interface

The SLM500S supports two SIM card interfaces to achieve dual-card dual- standby. It supports hot swap of SIM cards and automatically identifies 1.8V and 3.0V cards. Below is the recommended SIM interface circuit. To protect SIM cards, TVS devices are recommended for static protection. The peripheral circuit of the SIM card should be close to the SIM card holder.

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The reference circuit is as follows:

SLM500S Hardware Design Guide

Fig4.29UIM card interface circuit
4.12.SD Interface
The SLM500S supports SD card interfaces with a maximum of 256GB. The reference circuit is as follows:

Fig4.30 SD interface circuit MeiG Intelligent Product Technical Data

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SLM500S Hardware Design Guide

4.13.I2C Bus Interface

SLM500S module supports four hardware I2C bus interfaces, including one Camera dedicated CCI interface. Pin definitions and default functions are as follows:
Table 4.10:I2C interface

Name
CAM_I2C_SCL CAM_I2C_SDA TP_I2C_SCL TP_I2C_SDA SENSOR_I2C_SCL SENSOR_I2C_SDA I2C4_SDA I2C4_SCL

Pin

Description

83 Camera I2C
84

47

48

Universal I2C, default for TP

91 General I2C
92

167 General I2C
168

ADC

The SLM500S module uses a power management chip to provide two ADC functional signals: ADC (128PIN) and BAT_ID (185PIN).
ADC signal has a resolution of 12bit, and its performance parameters are as follows:
Table 4.11:ADC performance parameters

Describe Input Voltage Range ADC Resolution Sampling Frequency

Minimum –

Typical 1.2 49

Maximum Unit

–

V

12

bits

–

kHz

4.15.PWM
PWM pin can be used to do LCD backlight adjustment, by adjusting the duty ratio to adjust the backlight brightness.

4.16.MOTOR
The SLM500S supports motor function, which can be achieved by VIB_DRV_P (28PIN). The reference schematic diagram is as follows:

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SLM500S Hardware Design Guide

Fig4.31motor Interface circuit
4.17. Antenna Interface
The module provides four antenna interfaces: MAIN antenna, DRX antenna, GPS antenna and WiFi/BT antenna. To ensure good wireless performance of the user’s product, the user should select an antenna whose input impedance is 50 ohm and standing wave coefficient is less than 2 in the working frequency band.

Main Antenna
The module provides the MAIN antenna interface pin RF_MAIN. The antenna on the user’s MAIN board shall be connected to the antenna pin of the module with a characteristic impedance of 50 ohm micros trip line or ribbon line.
To facilitate antenna debugging and certification testing, an RF connector and antenna matching network should be added. The recommended circuit diagram is as follows:

Fig4.32MAIN Antenna interface connects the circuit

In the figure, R101, C101 and C102 are antenna matching devices. The specific component values can be determined after the antenna is debugging in the antenna factory. 0R is displayed by default for R101, and not for C101 and C102.

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MEIG SLM500S Smart Module

If there are fewer components that can be placed between the antenna and the output end of the module, or RF test head is not required in the design, the antenna matching circuit can be simplified as shown in the figure below:
Fig4.33MAIN antenna interface simplifies the connection circuit Note: In the figure above, R101 is pasted by default, C101 and C102 are not pasted by default.
4.17.2.DRX Antenna
The module provides the DRX antenna interface pin RF_DIV. The antenna on the user’s motherboard shall be connected to the antenna pin of the module using a micro strip line or ribbon line with a characteristic impedance of 50 ohm.
To facilitate antenna debugging and certification testing, an RF connector and antenna matching network should be added. The recommended circuit diagram is as follows:

Fig4.34The DRX antenna port connects to the circuit

Note: R102, C103, C104 are antenna matching devices, the specific component value can be determined after the antenna is debugging in the antenna factory. 0R is attached by default to R102, C103 and C104 are not attached by default.
If there are fewer components that can be placed between the antenna and the output end of the module, or RF test head is not required in the design, the antenna matching circuit can be simplified as shown in the figure below:

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SLM500S Hardware Design Guide
Fig4.35The DRX antenna port simplifies the connection circuit Note: R102 default paste 0R, C103 and C104 default do not paste.
4.17.3.GPS Antenna
GNSS antenna pin RF_GPS is provided by the module. The antenna on the user’s motherboard shall be connected to the antenna pin of the module using a micros trip line or ribbon line with a characteristic impedance of 50 ohm.
LNA is integrated in the module. To improve GNSS reception performance, customers can use external active antennas. The recommended circuit connection is shown in the figure below:

Fig4.36Connect active antenna
4.17.4.WiFi/BT Antenna
The module provides WiFi/BT antenna pin RF_WIFI/BT. The antenna on the user’s motherboard shall be connected to the antenna pin of the module using a microstrip line or ribbon line with a characteristic impedance of 50 ohm.

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SLM500S Hardware Design Guide
To facilitate antenna debugging and certification testing, an RF connector and antenna matching network should be added. The recommended circuit diagram is as follows:
Fig4.37WiFi_BT antenna interface connection circuit Note: R301, C301, C302 are antenna matching devices. The specific component values can be determined after the antenna is debugging in the antenna factory. 0R is displayed by default for R301, C301 and C302 are not displayed by default. If there are fewer components that can be placed between the antenna and the output end of the module, or RF test head is not required in the design, the antenna matching circuit can be simplified as shown in the figure below:

Fig4.38WIFI_BT antenna interface simplifies connection circuit Note: R301 is pasted by default, C301 and C302 are not pasted by default.

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SLM500S Hardware Design Guide

5.Electrical, Reliability

5.1.Absolute Maximum

The table below shows the absolute maximum values that the module can withstand. Exceeding these limits may cause permanent damage to the module.
Table 5.1:Absolute maximum

Parameter

Min

VBAT

–

VBUS

–

Peak current

–

Typical

Max

Unit

–

6

V

–

12

V

–

3

A

5.2.Working Temperature

The following table shows the operating temperature range of the module: Table 5.2:Module operating temperature

Parameter

Min

Typical

Max

Unit

Working temperature

-25

–

Storage temperature

-40

–

75

90

5.3.Working Voltage
Table 5.3:Module operating voltage

Parameter

Min

Typical

Max

Unit

VBAT

3.5

3.8

4.2

V

VBUS

4.5

5

9.2

V

Hardware shutdown voltage

3.4

–

–

V

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5.4.Digital Interface Features

Table 5.4:Digital Interface Features (1.8V)

Parameter VIH VIL VOH VOL

Description Input high level voltage Input low level voltage Output high level voltage Output low level voltage

SLM500S Hardware Design Guide

Min

Typical Max

Unit

1.26

–

–

–

1.6

–

–

–

–

V

0.54

V

–

V

0.2

V

5.5.SIM_VDD Features
Table 5.5:SIM_VDD Features

Parameter VO IO

Description

Min

Output voltage
–

Output current

–

Typical

Max

3

–

1.8

–

–

50

Unit V mA

5.6.PWRKEY Features
Table 5.6:PWRKEY features

Parameter PWRKEY

Description

Min

Typical

Max

Unit

High level Low level Valid time

1.4

–

–

–

3000

–

V

0.6

V

ms

5.7.VCOIN Features
Table 5.7:VCOIN features

Parameter VCOIN-IN VCOIN-OUT

Description

Min

VCOIN Input voltage

2.5

VCOIN Output voltage –

MeiG Intelligent Product Technical Data

Typical

Max

3.0

3.1

3.0

3.35

Unit V V
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SLM500S Hardware Design Guide

5.8.ConsumptionVBAT=3.8V

Table 5.8:Consumption

Parameter VBAT

Description
Power supply voltage

Ivbat Imax

Average current
Call flow consumption Digital transmission Peak current

Conditions

Min Typical Max Unit

The voltage must be between the maximum and minimum

3.5 3.8

4.2

V

Shutdown mode

–

–

67

uA

GSM Standby consumption

–

2.36 –

mA

WCDMA Standby consumption

–

2.99 –

mA

FDD Standby consumption

–

3.47 –

mA

TDD Standby consumption

–

2.98 –

mA

GSM900 CH62 32dBm

–

–

278.11 mA

WCDMA2100 CH10700 22.5 dBm –

–

GPRS GSM900 CH62 PCL5 1DL 4UL

–

–

EGPRS GSM900 CH62 PCL8 1DL 4UL

–

–

Power is controlled at maximum output power

–

–

490.18 mA 547.6 mA

535.5 mA

3

A

Electrostatic Protection

The module is not protected against electrostatic discharge. Therefore, you must pay attention to ESD protection when producing, assembling, and operating modules.

5.10.Module Operating Frequency Band
The following table lists the operating bands of the modules in accordance with 3GPP TS 05.05 technical specification.
Table 5.9:Module operating frequency band

Band

Receiving

GSM850

869 894MHz

EGSM900

925 960MHz

DCS1800

1805 1880MHz

PCS1900

1930 1890MHz

WCDMA B1

2110 2170 MHz

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Transmitting
824 849MHz 880 915MHz 1710 1785MHz 1850 1910MHz 1920 1980 MHz

Physical Channel
128~251 0~124975~1023 512~885 512~661 TX: 9612~9888

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WCDMA B5
WCDMA B8
LTE B1
LTE B3
LTE B5
LTE B7
LTE B8
LTE B20 LTE B34 LTE B38 LTE B39 LTE B40 LTE B41

869894MHz
880915MHz
21102170 MHz
18051880 MHz
869894MHz
26202690MHz
925960MHz
791821MHz 20102025 MHz 25702620 MHz 18801920 MHz 23002400 MHz 24962690 MHz

824849MHz
925960MHz
19201980 MHz
17101785 MHz
824849MHz
25002570MHz
880915MHz
832862MHz 20102025 MHz 25702620 MHz 18801920 MHz 23002400 MHz 24962690 MHz

RX: 10562~10838
TX: 4132~4233
RX: 4357~4458 TX: 2712~2863 RX: 2937~3088 TX: 1800018599
RX: 0~599
TX: 19200~19949
RX: 1200~1949 TX: 2040020649 RX: 2400~2649 TX: 2075021449 RX: 2750~3449 TX: 2145021799 RX: 3450~3799 TX: 2415024449 RX: 6150~6449 3620036349 3775038249 3825038649 3865039649 3965041589

Note: THE LTE TDD B41 band bandwidth of SLM500S is 100MHz (2555 ~ 2655 MHz), and the channel is 40240 ~ 41240.

5.11.RF Characteristics

The table below lists the conducted RF output power of the module in accordance with 3GPP TS 05.05 technical specification, 3GPP TS 134121-1 standard.
Table 5.10:Conducted output power

Band GSM850EGSM900 DCS1800 WCDMA LTE

Standard Output(dBm) 33dBm 30dBm 24 dBm 23 dBm

Output Tolerance(dBm) ±2 ±2 +1/-3 ±2.7

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SLM500S Hardware Design Guide

5.12.Module Conduction Receiving Sensitivity

The following table lists the conductive reception sensitivity of the module, which is tested under static conditions.
Table 5.11:Conduction reception sensitivity

Band GSM850EGSM900 DCS1800PCS1900 WCDMAB1 WCDMAB5 WCDMAB8 LTEFDD/TDD

Reception SensitivityTYP <-108dBm <-108dBm <-109 dBm <-109 dBm <-109 dBm Shown in Table 6.12

Reception SensitivityMAX 3GPP 3GPP 3GPP 3GPP 3GPP 3GPP

Table 5.12:LTE reference sensitivity 3GPP Dual Antenna Requirements (QPSK)

E-UTRA Band Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 … 17 18 19 20 21 22 23 24

1.4 MHz
-102.7 -101.7 -104.7 -103.2 -102.2 -101.7

3 MHz
-99.7 -98.7 -101.7 -100.2 -99.2 -98.7
–

5 MHz
-100 -98 -97 -100 -98 -100 -98 -97 -99 -100 -100 -97 -97 -97

–
-104.7

–
-101.7

-97 -1007 -100 -97 -100 -97 -100 -100

10 MHz
-97 -95 -94 -97 -95 -97 -95 -94 -96 -97 -97 -94 -94 -94

15 MHz -95.2 -93.2 -92.2 -95.2
-93.2
-94.2 -95.2

20 MHz -94 -92 -91 -94
-92
-93 -94

-94 -977 -97 -94 -97 -94 -97 -97

-95.27 –

-95.2

–

-91.2

-90

-95.2

-92.2

-91

-95.2

-94

MeiG Intelligent Product Technical Data

Duplex mode
FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD

FDD FDD FDD FDD FDD FDD FDD FDD

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SLM500S Hardware Design Guide

25

-101.2

-98.2 -96.5

-93.5

-91.7

-90.5

FDD

26

-102.7

-99.7 -97.56

-94.56 -92.76

FDD

27

-103.2

-100.2 -98

-95

FDD

28

-100.2 -98.5

-95.5

-93.7

-91

FDD

31

-99.0

-95.7 -93.5

FDD

…

33

–

–

-100

-97

-95.2

-94

TDD

34

–

–

-100

-97

-95.2

–

TDD

35

-106.2

-102.2 -100

-97

-95.2

-94

TDD

36

-106.2

-102.2 -100

-97

-95.2

-94

TDD

37

–

–

-100

-97

-95.2

-94

TDD

38

–

–

-100

-97

-95.2

-94

TDD

39

–

–

-100

-97

-95.2

-94

TDD

40

–

–

-100

-97

-95.2

-94

TDD

41

–

–

-98

-95

-93.2

-92

TDD

5.13.WIFI Main RF Performance

The following table lists the main RF performance under WIFI conduction. Table 5.13:WIFI Main RF performance parameters under conduction

Launch Performance 2.4G

Transmitted power (minimum rate) Transmitted power (maximum rate) EVM (Maximum rate)

802.11B 19 18 20%

802.11G 17 15 -27

Receiving Performance 2.4G

Reception sensitivity Minimum speed Maximum speed

802.11B -89 -86

802.11G -88 -71.5

802.11N 16 13 -30
802.11N -87 -69.5

dBm dBm dB
dBm dBm

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SLM500S Hardware Design Guide

5.14.BT Main RF Performance

The following table lists the main rf properties under BT conduction. Table 5.14:Main RF performance parameters under BT conduction

Transmission power Reception sensitivity

Launch Performance

DH5 10

2DH5 6

Receiving Performance

DH5 -91.5

2DH5 -91.5

3DH5 6
3DH5 -83

dBm dBm

5.15.Main RF Performance of GNSS

The main RF performance under GNSS conduction is listed in the following table. Table 5.15:Main RF performance parameters under GNSS conduction

GNSS Working Band:1575.42MHZ

GNSSC Carrier to noise ratioN040dB/Hz

GNSS Sensitivity GNSS Startup time

Capture (cold start) -148 hot start 5

Capture (hot start) -156 start 10

tracking -160 cold start 38

dBm S

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6.Production
6.1.Top and Bottom Views of Modules

SLM500S Hardware Design Guide

Fig6.1Top and bottom views of modules
6.2.Recommended Welding Furnace Temperature Curve

Fig6.2Recommended welding furnace temperature curve
6.3.Humidity Sensitive Characteristic (MSL)

The SLM500S meets humidity sensitivity level 3. The temperature & lt; 30 degrees and relative humidity < 60% of the environmental conditions, dry packaging according to IPC/JEDEC standard JSTD-020C specification. The temperature & lt; 40 degrees and relative humidity < Shelf life is at least 6

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SLM500S Hardware Design Guide

months when unopened in 90% of environmental conditions. After unpacking, table 22 lists the shelf life of modules corresponding to different moisture sensitivity levels.
Table 6.1:Humidity sensitivity level differentiation

Level
1 2 2a 3 4 5 5a
6

Factory environment 30/60%RH
Indefinite quality at ambient 30/85% RH 1 year 4 weeks 168 hours 72 hours 48 hours 24 hours Force bake before use. After baking, the module must be fitted within the time limit specified on the label.

After unpacking, at temperature < 30 degrees and relative humidity < SMT within 168 hours in 60% of environmental conditions. Bake if the above conditions are not met. Note: Oxidation risk: Baking SMD packaging can cause metal oxidation and, if excessive, can lead to solder ability problems during circuit board assembly. Baking SMD packages for temperature and time, thus limiting solder ability considerations. The accumulated baking time at temperatures greater than 90 ° C and up to 125 ° C should not exceed 96 hours.

6.4.Baking Requirements

Due to the moisture sensitive nature of the modules, the SLM500S should be fully baked before reflow soldering, otherwise the modules may be permanently damaged during reflow soldering. The SLM500S should be baked for 192 hours at 40°C +5°C /-0°C with relative humidity less than 5%, or the module should be baked for 72 hours at 80°C +5°C. The user should be aware that the tray is not resistant to high temperatures and should remove the module from the tray for baking, otherwise the tray may be damaged by high temperatures.
Table 6.2:Baking needs:

Baking Temperature 40°C±5°C 120°C±5°C

Humidity <5% <5%

Baking Time 192 hours 4 hours

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7.Appendix

7.1.The related documents
Table 7.1:The related documents

File Name

Comment

[1]

GSM 07.07

Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME)

[2]

GSM 07.10

Support GSM 07.10 multiplexing protocol

Digital cellular telecommunications(Phase 2+); Use of Data Terminal

[3]

GSM 07.05

Equipment­Data Circuit terminating Equipment(DTE­DCE) interface for

Short Message service(SMS)and Cell Broadcast Service(CBS)

Digital cellular telecommunications system (Phase 2+);Specification of

[4]

GSM 11.14

the UIM Application Toolkit for the Subscriber Identity Module­Mobile

Equipment (UIM­ME) interface

[5]

GSM 11.11

Digital cellular telecommunications system (Phase 2+);Specification of the Subscriber Identity Module ­ Mobile Equipment (UIM­ME) interface

[6]

GSM 03.38

Digital cellular telecommunications system (Phase 2+); Alphabets and language- specific information

[7]

GSM 11.10

Digital cellular telecommunications system (Phase 2)Mobile Station (MS) conformance specificationPart 1Conformance specification

[8]

AN_Serial Port AN_Serial Port

7.2.Terminology and Interpretation
Table 7.2:Terminology and Interpretation

Term

Explanation

ADC AMR CS CSD CTS DTE DTR DTX EFR EGSM

Analog-to-Digital Converter Adaptive Multi-Rate Coding Scheme Circuit Switched Data Clear to Send Data Terminal Equipment (typically computer, terminal, printer) Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Enhanced GSM

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SLM500S Hardware Design Guide

ESD ETS FR GPRS GSM HR IMEI Li-ion MO MS MT PAP PBCCH PCB PCL PCS PDU PPP RF RMS RX UIM SMS TDD TE TX UART URC USSD Telephone book abbreviation FD LD MC ON RC SM

Electrostatic Discharge European Telecommunication Standard Full Rate General Packet Radio Service Global Standard for Mobile Communications Half Rate International Mobile Equipment Identity Lithium-Ion Mobile Originated Mobile Station (GSM engine), also referred to as TE Mobile Terminated Password Authentication Protocol Packet Broadcast Control Channel Printed Circuit Board Power Control Level Personal Communication System, also referred to as GSM 1900 Protocol Data Unit Point-to-point protocol Radio Frequency Root Mean Square (value) Receive Direction Subscriber Identification Module Short Message Service Time Division Distortion Terminal Equipment, also referred to as DTE Transmit Direction Universal Asynchronous Receiver & Transmitter Unsolicited Result Code Unstructured Supplementary Service Data
explain
UIM fix dialing phonebook UIM last dialing phonebook (list of numbers most recently dialed) Mobile Equipment list of unanswered MT calls (missed calls) UIM (or ME) own numbers (MSISDNs) list Mobile Equipment list of received calls UIM phonebook

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NC

Not connect

SLM500S Hardware Design Guide

MeiG Intelligent Technology Co., LTD Address: 5th floor, Building G, Vijing Center, 2337 Gudai Road, Minhang District, Shanghai Zip code200233
Tel+86-21-54278676
Fax+86-21-54278679
Web http://www.meigsmart.com

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Doc Products with CE Marking comply with the radio Equipment Directive2014/53/EUand UK Radio Equipment Regulations (SI 2017/1206) The full text of the EU declaration of conformity is available at the following internet address: http://www.meigsmart.com RF exposure statement
RF exposure information: The Maximum Permissible Exposure (MPE) level has been calculated based on a distance of d=20 cm between the device and the human body. To maintain compliance with RF exposure requirement, use product that maintain a 20cm distance between the device and human body. Temperature: -40°C ~ +75°C Bands: The Radio equipment operation with following frequecy bands Maximum tune-up power(dBm) BT3.0: 5dBm(eirp) Ble: 5dBm(eirp) 2.4GWIFI:17.83dBm(eirp) GSM 900:32dBm GSM 1800:31dBm WCDMA band8:23dbm LTE Band7:24dbm LTE Band8:24dbm LTE Band28:24dbm LTE Band34:24dbm LTE Band38:24dbm LTE Band40:24dbm

15.19 Labeling requirements. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. 15.21 Changes or modification warning. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. 15.105 Information to the user. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.

However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help RF warning for Mobile device: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
This module is intended for OEM integrators only. Per FCC KDB 996369 D03 OEM Manual v01 guidance, the following conditions must be strictly followed when using this certified module:

KDB 996369 D03 OEM Manual v01 rule sections
2.2 List of applicable FCC rules This module has been tested for compliance to FCC Part 15 2.3 Summarize the specific operational use conditions The module is tested for standalone mobile RF exposure use condition. Any other usage conditions such as co-location with other transmitter(s) or being used in a portable condition will need a separate reassessment through a class II permissive change application or new certification. 2.4 Limited module procedures Not application

Trace antenna designs Not application 2.6 RF exposure considerations This equipment complies with FCC mobile radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body. If the module is installed in a portable host, a separate SAR evaluation is required to confirm compliance with relevant FCC portable RF exposure rules. 2.7 Antennas The following antennas have been certified for use with this module; antennas of the same type with equal or lower gain may also be used with this module. The antenna must be installed such that 20 cm can be maintained between the antenna and users.

Label and compliance information The final end product must be labeled in a visible area with the following: “Contains FCC ID: 2APJ4-SL500SA”. The grantee’s FCC ID can be used only when all FCC compliance requirements are met. 2.9 Information on test modes and additional testing requirements This transmitter is tested in a standalone mobile RF exposure condition and any co- located or simultaneous transmission with other transmitter(s) or portable use will require a separate class II permissive change re-evaluation or new certification. 2.10 Additional testing, Part 15 Subpart B disclaimer This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radiator) rule requirement applicable to the final host. The final host will still need to be reassessed for compliance to this portion of rule requirements if applicable. As long as all conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. Manual Information To the End User:

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual OEM/Host manufacturer responsibilities OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reassessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B before it can be placed on the US market. This includes reassessing the transmitter module for compliance with the Radio and EMF essential requirements of the FCC rules. This module must not be incorporated into any other device or system without retesting for compliance as multi- radio and combined equipment

References

• 美格智能—全球领先的无线通信模组及解决方案提供商

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