SIBEL ISP1807 Built in Antenna Low Energy Module BT 5 Long Range Zigbee Thread ANT User Manual

SIBEL ISP1807 Built-in Antenna Low Energy Module BT 5 Long Range Zigbee

Thread ANT

Specifications

• Product Name: BLE Module ISP1807
• Built-in Antenna: Yes
• Wireless Technology: Bluetooth 5 Long Range, Zigbee, Thread, ANT+

Revision History:

Product Usage Instructions

Contact Information

• Contact : Sibel Health Inc.
• Address : 2017 N Mendell St. Unit 2SE Chicago, IL 60462
• Email : support@sibelhealth.com

Manufactured by Insight SiP

Address: 13 Chemin de la halte, Grasse, N/A 06130 France

 Specifications

Important Notice

The electrical specifications of the module are directly related to the Nordic Semiconductor specifications for the nRF52840 chipset. The below information is only a summary of the main parameters. For more detailed information, especially about current consumption, please refer to the up-to-date specification of the chipset available on the Nordic Semi website.

Absolute Maximum Ratings

Operating Conditions

Power Consumption

Clock Sources

1. including initial tolerance, drift, aging, and frequency pulling
2. Frequency tolerance after calibration

Radio Specifications

1. maximum measured values

Range Measurement

Range measurement between ISP1807-LR test board (configured as Central) and ISP1807-LR test board (configured as Peripheral).

Antenna Performance

• Typical Antenna Return Loss Module mounted on a USB dongle ground plane

• Radiation Pattern in 3 planes Module mounted on a USB dongle ground plane Gain measurement in dBi @ 2.45 GHz

Ground Plane Effect Simulation

Pin Description

The module uses an LGA format with a double row of pads on a 0.65 mm pitch. The pad layout follows the QFN Jedec standard for 2 row LGA parts. The NC pads are to be connected to isolated metal pads on the application PCB for mechanical stability and reliability (drop test).

ISP1807 pad placement and pin assignment for the LGA QFN package TOP VIEW

Mechanical Outlines

Mechanical Dimensions Package dimensions

Dimensional drawing for 62-pad LGA Package

SMT Assembly Guidelines

For PCB Land Patterns and Solder Mask layout, Insight SiP recommends using the same dimensions as module pads, ie 0.4 x 0.4 mm for standard pads and 0.8 x 0.8 for corner pads.

Antenna Keep-Out Zone

For optimal antenna performance, it is recommended to respect a metal exclusion zone to the edge of the board: no metal, no traces, and no components on any application PCB layer except mechanical LGA pads.

Product Development Tools

Hardware

To assist clients in developing their Bluetooth Smart solutions based on the ISP1807, Insight SiP offers a Development Kit containing:

• One Interface Board
• J-Link Lite CortexM-9 JTAG/SWD Emulator
• One Test Board
•  A Development Dongle
• 5 ISP1807 module samples
• Cables, power supply, and coin battery holder

Using this development kit, product developers can use a working solution as a starting point to develop their own products. Time to market is saved by avoiding starting from a blank sheet of paper. In addition, there may be some applications that use the hardware as is. Please refer to the documentation for more information: http://www.insightsip.com/fichiers_insightsip/pdf/ble/ISP1807/isp_ble_DS1807_DK.pdf

Firmware

ISP1807supports Bluetooth Low Energy protocol stacks. It also provides extensive software support for ANT, ZIGBEE, and THREAD applications as well as 2.4 GHz protocol stacks, including Gazell. All are available as downloads at www.nordicsemi.com.

• The S140 SoftDevice is a Bluetooth low energy (BLE) Central and Peripheral protocol stack solution. The S140 SoftDevice supports up to twenty connections with an additional observer and a broadcaster all running concurrently.

The S140 SoftDevice integrates a Bluetooth low energy Controller and Host, and provides a full and flexible API for building Bluetooth low energy nRF52 System on Chip (SoC) solutions:

•  Bluetooth 5.0 compliant low energy single-mode protocol stack suitable for Bluetooth low-energy products.
• Concurrent central, observer, peripheral, and broadcaster roles with up to 20 concurrent connections along with one Observer and one Broadcaster.
• Link layer supporting LE 1M PHY and LE 2M PHY
• LL Privacy
• LE Data Packet Length Extension
• LE Secure Connections pairing model

Development Tools

The following development tools and software are recommended for using and testing the ISP1807 module:

• Nordic Semiconductor nRFgo Studio: Downloadable after registering at www.nordicsemi.com.
• Nordic Semiconductor Master Control Panel: Downloadable after registering at www.nordicsemi.com.
• Keil MDK-ARM Lite: Downloadable from https://www.keil.com/demo/eval/arm/htm.
• Segger J-Link Lite: Downloadable from http://www.segger.com/jlink-software.html.
• nRF52 Software Development Kit (SDK): nRF52 SDK can be downloaded after registering at www.nordicsemi.com. It contains examples of source codes applications (C language):
  • Precompiled HEX files
  • Source code
  • Keil ARM project files
  • IAR project files

Packaging Information

Marking

Prototype Packaging

For engineering samples and prototype quantities up to 99 units, deliveries are provided in thermoformed trays or cut tapes. They are delivered in a sealed pack with a desiccant pack and humidity sensors. Please see section 7.2 for more information on moisture sensitivity. Please order with the “ST” code packaging suffix.

Jedec Trays

For pre-production volumes, ISP1807 are available in Jedec trays. They are delivered in a sealed pack with a desiccant pack and humidity sensors. These Jedec trays are also suitable for further baking. Please see section 7.2 for more information on moisture sensitivity. Please order with the “JT” code packaging suffix. Refer to tray sizes below. Complete information on Jedec trays is available on request.

Tape and Reel
ISP1807 is also available in Tape & Reel. They are delivered in a sealed pack with a desiccant pack and humidity sensors. Reels are proposed in standard quantities of 500 units (180mm / 7” reel) or 2000 units (330mm / 13” reel) only. Please order with “RS” code packaging suffix for 500-unit reels and “R2” for 2000-unit reels.

Top view position of modules within the reel.

Ordering Information

Refer to the following documentation for more information on development kit and test board:

• http://www.insightsip.com/fichiers_insightsip/pdf/ble/ISP1807/isp_ble_DS1807_DK.pdf
• http://www.insightsip.com/fichiers_insightsip/pdf/ble/ISP1807/isp_ble_ANXXXXX.pdf

Storage and Soldering Information

Storage and Handling

• Keep this product away from other high-frequency devices which may interfere with operation such as other transmitters and devices generating high frequencies.
• Do not expose the module to the following conditions:
  • Corrosive gasses such as CI2, H2S, NH3, SO2, or NOX
  • Extreme humidity or salty air
  • Prolonged exposure to direct sunlight
  • Temperatures beyond those specified for storage
• Do not apply mechanical stress
• Do not drop or shock the module
• Avoid static electricity, ESD, and high voltage as these may damage the module

Moisture Sensitivity

All plastic packages absorb moisture. During typical solder reflow operations when SMDs are mounted onto a PCB, the entire PCB and device population are exposed to a rapid change in ambient temperature. Any absorbed moisture is quickly turned into superheated steam. This sudden change in vapor pressure can cause the package to swell. If the pressure exerted exceeds the flexural strength of the plastic mold compound, then it is possible to crack the package. Even if the package does not crack, interfacial delamination can occur. Since the device package is sensitive to moisture absorption, it is recommended to bake the product before assembly. The baking process for dry packing is 24 hours at 125°C  ISP1807 has been tsted MSL-3 according to standards. After baking, modules can be exposed to ambient room conditions (approximately 30°C/60%RH) for 168 hours before assembly on the PCB.

Soldering information

The recommendation for the RoHS reflow process is according to Jedec J-STD-020 and 033 standard profiles.

Quality and User Information

Certifications

• Bluetooth SIG Declaration ID n° D046560
• CE Certified, DoC Insight SiP Ref TR190901
• TELEC Certified n° pending
• KCC Certification n° R-C-iNs-ISP1807
• FCC Certification FCC ID: 2BCQV-12056
• IC certification IC: 31164-BLE1807001
• RoHS and Reach compliant
• Conflict Mineral Declaration available

EC – CE Certification

This device can be operated in at least one Member State without infringing applicable requirements on the use of radio spectrum.

USA – User information

FCC Part 15.19(a) This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC Part 15.105 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and the receiver. Connect the equipment to an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help.
FCC Part 15.21

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This transmitter must not be co-located or operated in conjunction with any other antenna or transmitter. OEM Responsibilities to comply with FCC

• This module is limited to OEM installation only.
• The OEM integrator is responsible for ensuring that the end user has no manual instructions to remove or install module.
• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures.
• Separate approval will be required for all other operating configurations, including different antenna configurations other than the supplied antennas.

As long as the condition above is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Also, the OEM integrator is responsible for providing to the host manufacturer for compliance with the Part 15B requirements.

Host User Manual

The host manual shall include the following regulatory statement:

• Part 15.19: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
• Part 15.21 Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

Host Product Labeling

The module is labeled with its own FCC. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:

• Contains FCC ID: 2BCQV-12056”

Canada – User information

This intends to inform how to specify the IC ID of our module “ISP1807” on the product. According to Canadian standards “RSS-210” and “RSS-Gen”, the host device should have a label that indicates that it contains our module. The label should use the below example wording or any similar wording that expresses the same meaning:

• Contains IC: 31164-BLE1807001”
  The label of the host device should also include the below IC Statement. When it is not possible, this information should be included in the User Manual of the host device:

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

RF Exposure Information

This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF)Exposure Guidelines in Supplement C toOET65 and RSS-102 of the IC radio frequency (RF) Exposure rules. When the module is used in operation in portable RF exposure conditions, installation in the non-authorized host requires SAR evaluation.

Discontinuity

Normally a product will continue to be manufactured as long as all of the following are true:

• The manufacturing method is still available.
• There are no replacement products.
• There is demand for it in the market.

In case of obsolescence, Insight SiP will follow Jedec Standard JSD-48. A Product Discontinuation Notice (PDN) will be sent to all distributors and made available on Insight SiP’s website. After this, the procedure goes as follows:

• The last Order Date will be 6 months after the PDN was published.
• The last Shipment Date will be 6 months after the Last Order Date, i.e. 12 months after PDN.

Disclaimer
Insight SiP’s products are designed and manufactured for general consumer applications, so testing and use of the product shall be conducted at the customer’s own risk and responsibility. Please conduct validation and verification and sufficient reliability evaluation of the products in the actual condition of mounting and operating environment before commercial shipment of the equipment. Please also pay attention (i) to applying a soldering method that doesn’t deteriorate reliability, (ii) to minimize any mechanical vibration, shock, or exposure to any static electricity, and (iii) not to overstress the product during and after the soldering process.

The products are not designed for use in any application that requires especially high reliability where malfunction of these products can reasonably be expected to result in personal injury or damage to the third party’s life, body or property, including and not limited to (i) aircraft equipment, (ii) aerospace equipment, (iii) undersea equipment, (iv) power plant control equipment, (v) medical equipment, (vi) transportation equipment, (vii) traffic signal equipment,(viii) disaster prevention/crime prevention equipment.
The only warranty that Insight SiP provides regarding the products is its conformance to specifications provided in datasheets. Insight SiP hereby disclaims all other warranties regarding the products, express or implied, including without limitation any warranty of fitness for a particular purpose, that they are defect-free, or against infringement of intellectual property rights. Insight SiP customers agree to indemnify and defend Insight SiP against all claims, damages, costs, and expenses that may be incurred, including without any limitation, attorney fees and costs, due to the use of products.

Contact

• Sibel Health Inc. 2017 N Mendell St. Unit 2SE
• Chicago, IL 60462
• support@sibelhealth.com
• Manufactured by:
• Insight SiP
• 13 chemin de la halte, Grasse, N/A 06130 France

References

• Nordic Semiconductor | Empowering Wireless Innovation - nordicsemi.com

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