Lenovo P360 Tiny Powerful Compact Workstation PC

Product Information

Specifications

• CPU: Intel Core i5-10000 Socket (LGA 775)
• Operating Systems: Windows 11, Windows 10, Ubuntu 20.04 LTS
• Memory: Supports up to 64GB DDR4 SODIMM
• Storage: PCIe SSD
• Video: Integrated Graphics
• Front I/O: USB, Audio ports
• Rear I/O: USB, HDMI, VGA, Serial Port, Ethernet
• Audio: Integrated Audio with Mic and Headphone Combo Jack
• Thermal: Temperature Sensors, Fan

FAQ

Can I upgrade the CPU?

• No, the CPU on the Lenovo P Tiny is not user-upgradable. It is soldered onto the motherboard.

How many USB ports are available?

• The Lenovo P Tiny has a total of 10 USB ports. There are 2 USB ports on the front panel and 8 USB ports on the rear panel.

What is the maximum memory supported?

• The Lenovo P Tiny supports a maximum of 64GB DDR4 SODIMM memory.

Product Usage Instructions

Setup and Installation

1. Unpack the Lenovo P Tiny.
2. Place it on a stable surface.
3. Connect the necessary peripherals such as monitor, keyboard, and mouse.
4. Plug in the power cord and turn on the device.
5. Follow the on-screen instructions to complete the initial setup.

Operating System Installation

To install the operating system:

1. Insert the operating system installation media (USB or DVD).
2. Restart the system and enter BIOS settings by pressing the designated key (usually F2 or Del) during startup.
3. Configure the boot order to prioritize the installation media.
4. Save the changes and exit BIOS settings.
5. Follow the on-screen instructions to install the operating system.

Memory Upgrade

To upgrade the memory:

1. Power off the Lenovo P Tiny and disconnect all cables.
2. Remove the cover of the device.
3. Locate the memory slots on the motherboard.
4. Insert the new memory modules into the slots, ensuring they are properly aligned.
5. Replace the cover and reconnect all cables.
6. Power on the device and verify the new memory capacity in the operating system.

Storage Upgrade

To upgrade the storage:

1. Power off the Lenovo P Tiny and disconnect all cables.
2. Remove the cover of the device.
3. Locate the PCIe SSD slot on the motherboard.
4. Insert the new PCIe SSD into the slot, ensuring it is properly aligned and secured.
5. Replace the cover and reconnect all cables.
6. Power on the device and format the new storage in the operating system.

Downloads

Hardware Maintenance Manual| P360 Tiny HMM
---|---
Drivers & Software| P360 Tiny Drivers & Software
Available Whitepapers|

SECTION I: Platform Overview

Description| Engineered to go where others can’t, the ThinkStation P360 Tiny combines simple and efficient design with the professional power of a workstation. The industry’s smallest workstation, at less than one-liter total volume, offers uncompromising performance in a form factor that is 96% smaller than a traditional desktop.
---|---

CPU

Operating Systems

Preloaded| Windows 11 Pro

Windows 11 Home Windows 10 Pro 64-bit Windows 10 IOT LTSC Ubuntu 20.04 LTS

---|---
Supported| Ubuntu 22.04 LTS

Ubuntu 20.04 LTS

Red Hat Enterprise Linux 8.6

---|---

Memory

Storage

Video

Front I/O

USB| 2 x USB 3.2 Gen 2 Type-A 10Gb/s

1 x USB 3.2 Gen 2 Type-C 20Gb/s

---|---
Audio| 1 x Combo Audio/Microphone Jack (3.5mm)
Disclaimers| Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.

Rear I/O

Optional 2 x Rear Port

HDMI| 1 x Standard

Optional 2 x Rear Port

Type-C| Optional 1 x Rear Port
VirtualLink| NA
VGA Port| Optional 2 x Rear Port
Serial Port| Optional 2 x Rear Port
Ethernet| 1 x Standard

Optional 1 x Rear Port

PS/2| NA
IEEE 1394| NA
eSATA| NA
Parallel Port| NA
Optional USB Adapter| Optional Single Type-C + DP Port
Optional Network Adapter| Intel I350-T2 Quad Port Gigabit Ethernet Adapter Intel I350-T4 Quad Port Gigabit Ethernet Adapter
Disclaimers| Note: Actual USB throughout will vary depending on the type and quantity of USB devices used.

Ethernet

Audio

Channels of ADC support 16-bit PCM format

Thermal

Temp Sensors| Ambient Sensor VR Sensor

M.2 Sensor

---|---
Fans| 1 x CPU Fans

Power Specifications

BIOS

Chassis Information

Weight: 680.389g

Slim 170W Power Brick (Delta, ADP-170CB) Dimensions: 1507722mm

Weight: 457g

Thermal Solutions| One System Fan Standard
Dimensions| 37mm / 1.5″ H

182.9mm / 7.2″ D

179mm / 7.047″ W

Weight| 1.4kg / 3.84lbs

Packaging Dimensions

Security & Serviceability

Customer Support Center

Operating Environment

Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton
Humidity| Relative Humidity Operating: 20% to 80% (non-condensing) Relative Humidity Storage/Transit: 20% to 90% (non-condensing) Wet Bulb Temperature Operating: 25⁰C (77⁰F) max

Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max

Altitude| Operating: -15.2m to 3048m (-50ft to 10000ft) Storage: -15.2m to 10668m (-50ft to 35000ft)
Vibration| Package Vibration:

Random,1.04G at 2-200 Hz, 1 octave/min Operating Vibration:

Random,0.27G at 5-500 Hz, 0.5 octave/min Non-Operating Vibration:

Random,1.04G at 2-200 Hz, 1 octave/min

Shock| Operating Shock: Bottom half-sine pulse with a change in velocity of

37.4 cm/sec (14.7 inches/sec)

Rack Operation Shock: 45-G faired square wave with a velocity change of 441 cm/sec (173.7 inches/sec)

Non-operating Shock: 45-G faired square wave with a velocity change of 441 cm/sec (173.7 inches/sec)

SECTION II: Platform Detail

Motherboard Core

Supported Components

i5-12500T i5-12400 i5-12400T i3-12300 i3-12300T i3-12100 i3-12100T
Memory Type| SODIMM 4800 MHz
Memory| 8GB 4800MHz  DDR5  SDRAM SODIMM

16GB 4800MHz  DDR5  SDRAM SODIMM

32GB 4800MHz  DDR5  SDRAM SODIMM

Storage

M.2 PCIe Solid State Drive (SSD)| 512GB M.2 PCIe SSD, Gen 4 x4, NVMe, OPAL

1024GB M.2 PCIe SSD, Gen 4 x4, NVMe OPAL

2048GB M.2 PCIe SSD, Gen 4 x4, NVMe OPAL

---|---

Optical Drive/Removable Media

Drive

Keyboard and Pointing Devices

PCIe Adapters

Network| Intel I350-T2 Dual Port Gigabit Ethernet Adapter Intel I350-T4 Quad Port Gigabit Ethernet Adapter
---|---
Thunderbolt| Rear Thunderbolt PCIe Adapter
WiFi Cards| Intel PCIe WiFi Card with BT External Antenna Kit (Intel AX201 non- vPro)

Intel PCIe WiFi Card with BT External Antenna Kit (Intel AX211 vPro) Foxconn PCIe WiFi Card with BT External Antenna Kit (Foxconn RTL8852BE non-vPro)

Foxconn PCIe WiFi Card with BT External Antenna Kit (Foxconn RZ616 non-vPro)

---|---

SECTION III: Supported Component Detail

CPU Specifications

CPU| Int el i9- 129

00

2.4

GH

z/1 6C

/2 4T

/3 0M

65

W DD R5 48

00

vPr o

| Int el i7- 127

00

2.1

GH

z/1 2C

/2 0T

/2 5M

65

W DD R5 48

00

vPr o

| Int el i5- 126

00

3.3

GH

z/ 6C

/12

T/1 8M

65

W DD R5 48

00

vPr o

| Int el i5- 125

00

3.0

GH

z/ 6C

/12

T/1 8M

65

W DD R5 48

00

vPr o

| Int el i5- 124

00

2.5

GH

z/ 6C

/12

T/1 8M

65

W DD R5 48

00

| Int el i3- 123

00

3.5

GH

z/4 C/ 8T/

12

M 60 W DD R5 48

00

| Int el i3- 121

00

3.3

GH

z/4 C/ 8T/

12

M 60 W DD R5 48

00

| Int el i9- 129

00

T 1.4 GH

z/1 6C

/2 4T

/3 0M

35

W DD R5 48

00

vPr o

| Int el i7- 127

00

T 1.4 GH

z/1 2C

/2 0T

/2 5M

35

W DD R5 48

00

vPr o

| Int el i5- 126

00

T 2.1 GH

z/ 6C

/12

T/1 8M

35

W DD R5 48

00

vPr o

| Int el i5- 125

00

T 2.0 GH

z/ 6C

/12

T/1 8M

35

W DD R5 48

00

vPr o

| Int el i5- 124

00

T 1.8 GH

z/ 6C

/12

T/1 8M

35

W DD R5 48

00

| Int el i3- 123

00

T 2.3 GH

z/4 C/ 8T/

12

M 35 W DD R5 48

00

| Int el i3- 121

00

T 2.2 GH

z/4 C/ 8T/

12

M 35 W DD R5 48

00

---|---|---|---|---|---|---|---|---|---|---|---|---|---|---

of Cores| 16| 12| 6| 6| 6| 4| 4| 16| 12| 6| 6| 6| 4| 4

of Threads| 24| 20| 12| 12| 12| 8| 8| 24| 20| 12| 12| 12| 8| 8

Processor Base Frequency| 2.4

G

| 2.1

G

| 3.3

G

| 3.0

G

| 2.5

G

| 3.5

G

| 3.3

G

| 1.4

G

| 1.4

G

| 2.1

G

| 2.0

G

| 1.8

G

| 2.3

G

| 2.2

G

Max Turbo Frequency| 5.1

G(1

–

cor e)

| 4.9

G(1

–

cor e)

| 4.8

G(1

–

cor e)

| 4.6

G(1

–

cor e)

| 4.4

G(1

–

cor e)

| 4.4

G(1

–

cor e)

| 4.3

G(1

–

cor e)

| 4.8

G(1

–

cor e)

| 4.7

G(1

–

cor e)

| 4.6

G(1

–

cor e)

| 4.4

G(1

–

cor e)

| 4.2

G(1

–

cor e)

| 4.2

G(1

–

cor e)

| 4.1

G(1

–

cor e)

Cache| 30

M

| 25

M

| 18

M

| 18

M

| 18

M

| 12

M

| 12

M

| 35

M

| 25

M

| 18

M

| 18

M

| 18

M

| 12

M

| 12

M

TDP| 65

W

| 65

W

| 65

W

| 65

W

| 65

W

| 60

W

| 60

W

| 35

W

| 35

W

| 35

W

| 35

W

| 35

W

| 35

W

| 35

W

Solid State Storage Specifications

Drive| NVMe 2280 M.2 512GB PCIe SSD (OPAL)| NVMe 2280 M.2 1TB PCIe SSD (OPAL)| NVMe 2280 M.2 2TB PCIe SSD (OPAL)
---|---|---|---
Dimensions Millimeters (W x D x H)| 22x80x2.38mm| 22x80x2.38mm| 22x80x2.38mm
Interface Type| PCIe Gen 4×4| PCIe Gen 4×4| PCIe Gen 4×4
Power Active (AVG)| 5.8W| 5.8W| 5.8W
Power Idle| 35mW| 35mW| 35mW
Typical Sequential Read| 6000 MB/s| 6400 MB/s| 6400 MB/s
Typical Sequential Write| 3200 MB/s| 3800 MB/s| 5000 MB/s
Burst Random Read (4K Queue Depth 32/8 thread);| 500K IOPS| 550K IOPS| 550K IOPS
Burst Random Write (4K Queue Depth 32/8 thread)| 370K IOPS| 400K IOPS| 400K IOPS
Operating Temperature Range| 0 to 70°C| 0 to 70°C| 0 to 70°C
Endurance Rating (Lifetime Writes)| 150 TB| 300 TB| 600 TB
Mean Time Between Failures (MTBF)| 2.0M POH| 2.0M POH| 2.0M POH
Hardware Encryption| AES 256 bit| AES 256 bit| AES 256 bit

Optical Drive Specifications

Unit:mm（Without Bezel-W x H x D)

| 128±0.4×9.0 ±0.4×127±0.4(Max)

Unit:mm（Without Bezel-W x H x D)

Disc Capacity| NA| NA
Type| DVDROM| DVDWriter
External Dimensions| NA| NA
Speed| NA| NA
Bay Type| 9.0mm Tray| 9.0mm Tray
Color| Business Black or without bezel| Business Black or without bezel
Removable| No| No
Internal Buffer Size| 0.5MB Min| 0.5MB Min
Writes| NA| 8XDVD+R / 8XDVD+RW /

6XDVD+R DL

8XDVD-R / 6XDVD-RW / 6XDVD- R DL

24XCD-R / 16XCD-RW

Reads| 8XDVD-ROM / 24XCD-ROM| 8XDVD-ROM / 24XCD-ROM
Source| DC Power 5V| DC Power 5V
---|---|---
DC Power Requirements| +5V±5%| +5V±5%
DC Current| Max 2.5A@5v| Max 2.5A@5v
Operating Systems Supported| All Windows OS| All Windows OS
Temperature| Operating: 5ºC to 45 ºC

Non-Operating:-30ºC to 60ºC

| Operating: 5ºC to 45 ºC

Non-Operating:-30ºC to 60ºC

Relative Humidity| Operating >

Read: 15 % to 85 % (Non- Condensing)

Write 15 % to 80 % (Depend on the Temperature) Storage/Transportation>

10 % to 80 % (Non-Condensing)

| Operating >

Read: 15 % to 85 % (Non- Condensing)

Write 15 % to 80 % (Depend on the Temperature) Storage/Transportation>

10 % to 80 % (Non-Condensing)

Integrated Graphics Adapter

Discrete Graphics Adapter

Adapter| Nvidia T600(min iDP x4) – 4GB GDDR6| Nvidia T1000(mi

niDP x4) – 4GB GDDR6

Tiny LP

| Nvidia T1000 – 8GB GDDR6

Tiny LP

| Nvidia T400

（miniDP X3）4GB

| RTX 3060| WX3200
---|---|---|---|---|---|---
Bus Interface| PCI

Express 3.0 ×8

| PCI

Express 3.0 ×8

| PCI

Express 3.0 ×8

| PCI

Express 3.0 ×8

| PCIe 4.0

x16

| PCIe 3.0

x8

Display Interface| Four mini- DisplayPo rt connector s| Four mini- DisplayPo rt connector s| Four mini- DisplayPo rt connector s| Three mini- DisplayPo rt connector s| HDMI1: 7680432

0@60Hz DP3： 5120288

0@60Hz

| 4 x mDP
Graphics Chipset| TU117-850| TU117-875| TU117-875| TU117-825| Dev team, pls help to fill in
Memory Clock Frequency (MHz)| 5001MHz| 5001MHz| 5001MHz| 5001MHz| 8000MHz| Dev team, pls help to fill in
Memory Size| 4GB| 4GB| 8GB| 4GB| 12GB GDDR6| 4GB GDDR5
Memory Interface| 128bit| 128bit| 128 bit| 64bit| 192-bit| 128-bit
Memory Bandwidth| Up to 160GB/s| 32.4 Gbps| 32.4 Gbps| 32.4 Gbps
GPU Cores| 640| 896| 896| 384
GPU Core Frequency (MHz)| Base:735 MHz Max Boost:2100 MHz| Base:1065 MHz Boost:1395 MHz Max Boost:2100 MHz| Base:1065 MHz Boost:1395 MHz Max Boost:2100 MHz| Base:420 MHz Boost:1425 MHz Max Boost:2100 MHz
---|---|---|---|---
Maximum Power Consumption| 40W| 50W| 50W| 30W| 170W| 55W
Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or Digital)| DisplayPort 1.4a

Maximum pixel clock: 2660M

Pixels per second Maximum bandwidth:

32.4 Gbps Example of maximum resolutions with CVT-RB timings:

• 7680 ×

4320 × 24

bpp at 120 Hz

• 7680 ×

4320 × 24

bpp at 60 Hz

• 5120 ×

2880 × 24

bpp at 60 Hz

HDMI™ 2.0b

Maximum resolution:

• 7680 ×

4320 × 24

bpp at 30 Hz Simultaneous display support

Up to four simultaneous displays

| DisplayPort 1.4a

Maximum pixel clock: 2660M

Pixels per second Maximum bandwidth:

32.4 Gbps Example of maximum resolutions with CVT-RB timings:

• 7680 ×

4320 × 24

bpp at 120 Hz

• 7680 ×

4320 × 24

bpp at 60 Hz

• 5120 ×

2880 × 24

bpp at 60 Hz

HDMI™ 2.0b

Maximum resolution:

• 7680 ×

4320 × 24

bpp at 30 Hz Simultaneous display support

Up to four simultaneous displays

| DisplayPort 1.4a

Maximum pixel clock: 2660M

Pixels per second Maximum bandwidth:

32.4 Gbps Example of maximum resolutions with CVT-RB timings:

• 7680 ×

4320 × 24

bpp at 120 Hz

• 7680 ×

4320 × 24

bpp at 60 Hz

• 5120 ×

2880 × 24

bpp at 60 Hz

HDMI™ 2.0b

Maximum resolution:

• 7680 ×

4320 × 24

bpp at 30 Hz Simultaneous display support

Up to four simultaneous displays

| DisplayPort 1.4a

Maximum pixel clock: 2660M

Pixels per second Maximum bandwidth:

32.4 Gbps Example of maximum resolutions with CVT-RB timings:

• 7680 ×

4320 × 24

bpp at 120 Hz

• 7680 ×

4320 × 24

bpp at 60 Hz

• 5120 ×

2880 × 24

bpp at 60 Hz

HDMI™ 2.0b

Maximum resolution:

• 7680 ×

4320 × 24

bpp at 30 Hz Simultaneous display support

Up to four simultaneous displays

| HDMI1: 76804320

@60Hz DP3： 51202880@

60Hz

Thermal Solution| Active| Ultra- quiet Active Fansink| Ultra- quiet Active Fansink| Active| Active Fansink| Active Fansink
Dimension| 2.713

inches ×

6.137

inches, single-slot

| 2.713

inches ×

6.137

inches, single-slot

| 2.713

inches ×

6.137

inches, single-slot

| 2.713

inches ×

6.137

inches, single-slot

| 225.55mm

117.5mm 35.8mm

| 6.6″ L,

single slot

Advanced Display| Not Available| Not Available
SLI/NVLink Support| Not Available| Not Available
Disclaimers| |

Intel® Ethernet Specifications

Card| Intel Wi-Fi 6 AX201| 2X2 AX RTL8852B| 2X2 AX

Foxconn

| Intel AX211 Wi-Fi 6E| Intel I350- T2 Dual| Intel I350- T4 Quad
---|---|---|---|---|---|---
| 2*2ax+BT

5.0 Non- vPro PCIE M.2 2230 Module (CNVi)

| E WIFI 6

+BT5.1 PCIE M.2 WW

| RZ616 WIFI6e

+BT5.x PCIE M.2 2230

module

| 2*2ax+BT

5.x vPro CNVi PCIE M.2 module

| Port Gigabit Ethernet Adapter (Stony Lake T2)| Port Gigabit Ethernet Adapter (Stony Lake T4)
---|---|---|---|---|---|---
Supplier PN| Coming soon| Coming soon| Coming soon| Coming Soon| I350T2G1 P20, MM# 928941| I350T4G1 P20, MM# 928942
Data Rates Supported| 5G/2.4G WIFI| 5G/2.4G WIFI| 6G/5G/2.

4G WIFI

| 6G/5G/2.

4G WIFI

| 10/100/10

00Mbps (Copper)

| 10/100/10

00Mbps (Copper)

Controller Details| Coming soon| Coming soon| Coming soon| Coming Soon| Intel Ethernet Controller I350| Intel Ethernet Controller I351
Controller Bus Architecture| PCIe Gen3| PCIe Gen3| PCIe Gen3| PCIe Gen3| PCIe 2.1 (5GT/s)| PCIe 2.1 (5GT/s)
Data Transfer Mode| Wireless

+BT

| Wireless

+BT

| Wireless

+BT

| Wireless

+BT

| Ethernet| Ethernet
Power Consumption| Coming soon| Coming soon| Coming soon| Coming Soon| Copper: I350-T2 V2= 4.4W| Copper: I350T4V2

= 5W

IEEE Standards Compliance| 802.11

abgn+acR 2 +ax MIMO 2X2

| 802.11

abgn+acR 2 +ax MIMO 2X2

| 802.11

abgn+acR 2 +axR2 MIMO 2X2

| 802.11

abgn+acR 2 +axR2 MIMO 2X2

| IEEE 802.3/10B ASE-T, 100BASE- TX, 1000BAS E-T| IEEE 802.3/10B ASE-T, 100BASE- TX, 1000BAS E-T
Boot ROM Support| Core boot UEFI boot| Core boot UEFI boot| Core boot UEFI boot| Core boot UEFI boot| PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgen t Software via PXE or BootP, WDMS or UEFI| PXE boot, Intel iSCSI Remote Boot for Windows, Linux and Vmware, Intel BootAgen t Software via PXE or BootP, WDMS or UEFI
Network Transfer Mode (Full/Half Duplex)| Supported| Supported| Supported| Supported| Supported| Supported
Network Transfer Rate| Coming soon| Coming soon| Coming soon| Coming Soon| 1,000Mbps Full Duplex| 1,000Mbps Full Duplex
Operating System Driver Support| Windows 10/11,

Linux

| Windows 10/11,

Linux

| Windows 10/11,

Linux

| Windows 10/11,

Linux

| Windows 10/11,

Linux, Free BSD, XEN,Vmw are

| Windows 10/11,

Linux, Free BSD, XEN,Vmw are

Manageability| Coming soon| Coming soon| Coming soon| Coming Soon| Supported| Supported
Manageability Capabilities Alerting| Coming soon| Coming soon| Coming soon| Coming Soon| Supported| Supported
TDP| Coming soon| Coming soon| Coming soon| Coming Soon| Firmware Based Thermal| Firmware Based Thermal
| | | | | Management| Management
---|---|---|---|---|---|---
Operating Temperature Range| 0°C –

80°C

| 0°C –

80°C

| 0°C –

80°C

| 0°C –

80°C

| 0°C to 55°C (32°F to 131°F)| 0°C to 55°C (32°F to 131°F)

of Ports| 2| 4

Data Rate Per Port| 10/100/1000Mbps (copper), 1000Mbps (fiber)| 10/100/1000Mbps (copper), 1000Mbps (fiber)
System Interface Type| PCIe Gen3 x4| PCIe Gen3 x4| PCIe Gen3 x4| PCIe Gen3 x4| PCIe Gen 2.1| PCIe Gen 2.1
NC Sideband Interface| Coming soon| Coming soon| Coming soon| Coming Soon| Not Available| Not Available
Jumbo Frames Supported| Coming soon| Coming soon| Coming soon| Coming Soon| Yes| Yes
1000Base-T| Coming soon| Coming soon| Coming soon| Coming Soon| Yes| Yes
IEEE 1588| Coming soon| Coming soon| Coming soon| Coming Soon| Supported| Supported
Supported Under vPro| No| No| No| Yes| Not Available| Not Available
Disclaimers|

Ethernet

Model| Intel I350- T2 Dual Port Gigabit Ethernet Adapter (Stony Lake T2)| Intel I350- T4 Quad Port Gigabit Ethernet Adapter (Stony Lake T4)| Intel Wi-Fi 6 AX201

2*2ax+BT

5.0 vPro PCIE M.2 2230 Module (CNVi)

| 2X2 AX RTL8852B E WIFI 6

+BT5.1 PCIE M.2 WW

| 2X2 AX

Foxconn RZ616 WIFI6e

+BT5.x PCIE M.2 2230

module

| Intel AX211 Wi-Fi 6E

2*2ax+BT

5.x vPro CNVi PCIE M.2 module

---|---|---|---|---|---|---
Connector| 2 x Ports RJ-45 Copper| 4 x Ports RJ-45 Copper
Website| i350 T2| i350 T4
Auto-Negotiation| IEEE 802.3

Auto-negotiaton

| IEEE 802.3

Auto-negotiaton

| IEEE*

802.11ax* Auto-negotiaton

| IEEE*

802.11ax* Auto-negotiaton

| IEEE*

802.11ax* Auto-negotiaton

| IEEE*

802.11ax* Auto-negotiaton

Intel® vPro™| Not Available| Not Available
Intel® Standard Manageablity| Supported| Supported
Power Optimizer Platform Low-power Management Systems| Supported| Supported
Energy Efficient Ethernet| Supported| Supported
TCP/UDP Checksum and Segmentation Offload (IPv4 and IPv6)| Supported| Supported| Supported| Supported| Supported| Supported
Receive Side Scaling| Supported| Supported
Dual Tx and Rx Queues| Yes| Yes
Jumbo Frames (up to 9KB)| Supported| Supported
---|---|---
Teaming| Supported| Supported
Wake from Deep Sx| Supported| Supported
Server Operating System Support| Windows Server 2008, 2012, 2016.

2019

Linux (RHEL/SLES), Free BSD, Xen, Vmware

| Windows Server 2008, 2012, 2016.

2019

Linux (RHEL/SLES), Free BSD, Xen, Vmware

Network Proxy/ARP Support| Supported| Supported

SECTION IV: BIOS / Certifications / Standards /Environmental

BIOS Specifications

WMI Support| Compliant with Microsoft WBEM and the DMTF common information model
---|---
ROM-Based Setup Utility (F1)| System configuration setup program (text/graphic interface) available at power-on with F1 key
Bootblock Recovery| Recovers system BIOS if the flash ROM is corrupted
Replicated Setup| Saves system configuration settings to a file that can then be used to replicate the settings to other systems
Boot Control| Boot control available through ROM-based setup utility or with F12 key at power-on
Memory Change Alert| Power-on error message in the event of a decrease in system memory
Thermal Alert| Power-on error message in the event of a fan failure
Asset Tag| Supports ability to set SMBIOS type 2 baseboard asset tag field
System/Emergency ROM Flash Recovery with Video| Supports process to recover the system BIOS if the flash ROM is corrupted
Remote Wakeup/Remote Shutdown| System admin can power on/off a client computer from a remote location to provide maintenance
Quick Resume Time| Supports low power S3 (suspend to RAM) and prompt resume times
ROM Revision Level| System UEFI (BIOS) version reported in SMBIOS type 0 structure and in BIOS setup
Keyboard-less Operation| System can be booted without a keyboard
Per-port Control| Allows I/O ports to be individually enabled/disabled through ROM- based setup or WMI interface
Adaptive Cooling| Offers multiple settings for fan control ranging between better performance and better acoustics
Security| Supervisor, user and power-on passwords can protect boot and ROM- based setup

– Chassis Intrusion Detection

| –  UEFI Secure Boot Support

–  HDD Password Can Protect HDD Data

–  Windows UEFI Firmware Update Support

–  Device Guard Support

–  BIOS Guard, Boot Guard Support

---|---
Intel(R) AMT (includes ASF 2.0)| Allows system to be supported from a remote location
Intel(R) TXT| Intel(R) trusted execution technology provides a security foundation to build protections against software based attacks
Memory Modes| Supports mirroring, lock step, and sparing memory modes
Windows 10 Ready| Supports Windows 10 requirements for secure flash, UEFI v 2.7 device guard support spec

Industry Standard Specification Support

Configuration and Power Interface v6.2
ASF 2.0| DMTF Alert Standard Format Specification v2.0
ATA (IDE)| AT Attachment 6 with Packet Interface (ATA/ATAPI-6)
CD Boot| El Torito Bootable CD-Rom Format Specification, v1.0
EHCI| Enhanced Host Controller Interface for Universal Serial Bus, Revision v1.0
PCI| PCI Local Bus v3.0

PC Firmware Specification 3.1

PCI Express| PCI Express Base Specification v4.0
SATA| Serial ATA Revision 3.0 Specification
TPM| Trusted Computing Group TPM Specification v2.0
UHCI| Universal Host Controller Interface Design Guide, Revision v1.1
USB| Universal Serial Bus Revision v1.1 Universal Serial Bus v2.0 Universal Serial Bus v3.0 Universal Serial Bus v3.2
SMBIOS| DMTF System Management Spec v3.2.1
XHCI| XHCI SPEC Revision v1.2

Social and Environmental Responsibility

Quality Control| Lenovo is a member of an eco declaration system that enforces regular independent quality control
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Hazardous Substances and Preparation| • Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE). (See legal reference and Note B1)

• Products do not contain Asbestos

• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC),

| hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1- trichloroethane, methyl bromide

• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation

• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP

• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm²/week

REACH Article 33 information about substances in articles is available at: https://www.lenovo.com/us/en/social_responsibility/social_responsibility_resources/

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Batteries| UN38.3,MSDS
Safety, EMC Connection to the Telephone Network and Labeling| Not applicable

Acoustic Noise Emissions Declaration

Safety, EMC Connection to the Telephone Networkand Labeling

tools by Lenovo Vantage.

Regulations & Standards

EMC & Safety| FCC/IC VCCI BSMI KC RCM TUV-GS

cTUVus

IEC60950-1&IEC62368 CB Report/Certificate Saudi Arabia EQM

Kuwait KUCAS China CCC Mark South Africa SABS

Russia/Belarus/Kazakhstan/Kyrgyzstan/Armenia-EAC Morocco-CM

Mexico-NOM Serbia KVALITET Ukraine UKrCEPRO India-BIS

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| China SRRC Indonesia-SDPPI Malaysia-SIRIM Philippines-NTC
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Environmental

cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated diphenol ethers (PBDE)

• Products do not contain Asbestos

• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons, carbontetrachloride, 1,1,1- trichloroethane, methyl bromide

• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005% polychlorinated terphenyl (PCT) in preparation

• Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10-13 carbon atoms in the chain containing at least 48% per mass of chlorine in the SCCP

• Parts with direct and prolonged skin contact do not release nickel in concentrations above 0.5 microgram/cm_/week

TCO Certification| 9.0

References

• workstations :: thinkstation p series workstations :: thinkstation p360 tiny Lenovo PC Support - Lenovo Support EC

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