Lenovo P520 Think Station Instruction Manual
- June 15, 2024
- Lenovo
Table of Contents
Lenovo ThinkStation P520
Version: 6.0 | 07/20/2023
P520 Think Station
Downloads
Hardware Maintenance Manual| P520
HMM
---|---
Drivers & Software| P520 Drivers &
Software
Available Whitepapers| RTX GPU Support
Matrix
P520/P520c Power
Configurator
P520/P520 Memory
Configurator
Intel VROC
Support
To access additional whitepapers visit https://support.lenovo.com and select
‘PC’ then ‘Workstations’
SECTION I: Platform Overview
Description| The ThinkStation P520 is the most powerful Lenovo single CPU
workstation- a next-generation system that packs enough punch for any job and
is reliable enough for mission-critical environments
---|---
CPU
Processor Support | Xeon Scalable Processors |
---|---|
Socket Type | Socket-R4 (LGA 2066) |
Operating Systems
Preloaded| Windows 10 Pro 64-bit for Workstations Ubuntu 16.04 LTS
(configuration specific)
Ubuntu 18.04 LTS (configuration specific) Ubuntu 20.04 LTS (configuration
specific)
---|---
Supported| Red Hat Enterprise Linux 7.3 Red Hat Enterprise Linux 8.2 Ubuntu
16.04 LTS
Ubuntu 18.04 LTS
Ubuntu 20.04 LTS
Memory
Slots | Up to 8 DIMMs |
---|---|
Channels | Supports up to 8 DIMM Sockets, 4 Channels |
Type | 288-Pin, 1866/2133/2400/2666MHz/2933MHz ECC RDIMM |
ECC Support | Yes |
Speed | Up to 2933MHz |
Max DIMM Size | 64GB DDR4 ECC RDIMM |
Max System Memory | 512GB |
Storage
Total Bays/Size | 4 x 3.5″ |
---|---|
SATA | 6 x SATA Connectors, Gen 3 |
PCIe | 2 x M.2 PCIe Connectors Onboard |
Additional M.2 NVMe Drives Supported by Single Adapters
SAS| Supported via Optional Adapter
eSATA| 1 x eSATA Connector, Gen 3
Disclaimers| Additional parts/enclosures may be required for some
configurations
Video
Integrated Graphics | Not Available |
---|---|
Discrete Graphics | PCIe Add-In-Card, Details in Section Below |
Multi-GPU Support | Yes |
Type | PCIe Add-In-Card |
Bus Interface | PCIe x16 |
Slots
Slot 1 | PCIe 3.0 x8, Full Height, Full Length, 50W, Open Ended |
---|---|
Slot 2 | PCIe 3.0 x16, Full Height, Full Length, 75W, With Latch |
Slot 3 | PCIe 3.0 x4, Full Height, Full Length, 25W, Open Ended (PCH) |
Slot 4 | PCIe 3.0 x16, Full Height, Full Length, 75W, With Latch |
Slot 5 | PCI, Full Height, Full Length |
Slot 6 | PCIe 3.0 x4, Full Height, Half Length, 25W, Open Ended (PCH) |
Front I/O
USB | 4 x USB 3.1 Gen 1 Type-A 5Gb/s (includes one 15W charging port) |
---|---|
Audio | 1 x Combo Audio/Microphone Jack (3.5mm) |
Media Card Reader | Front 9-in-1 Media Card Reader Standard (USB 2.0) |
Optional: Front 15-in-1 Media Card Reader (requires Flex module)
Flex Bay| Flex Module: Supports Two 5.25″ Flex Bays With Several Options
Integrated
• Up to Two Half Height Optical Drives
• Up to Two 5.25” Slim ODD Cages
• Up to One Front Access Storage Enclosure
• Up to One Flex Module for One or More of the Following Options: 9.0mm
Optical/ 15-in-1 USB 3.1 Gen 1 Reader/Front eSATA/Dual Port Front
Thunderbolt/Front USB 3.1 Gen 1 Type-C/ 4-Digit Diagnostic Display
Note: 1. Only one can be supported from 15-in-1 reader, Thunderbolt, and
4-Digit display
2. Up to two ports are suppported from 1394, eSATA, and USB Type-C
Disclaimers| Note: Actual USB throughout will vary depending on the type and
quantity of USB devices used.
Rear I/O
USB| 2 x USB 2.0 Type-A 480Mb/s
4 x USB 3.1 Gen 1 Type-A 5Gb/s
---|---
Audio| 3 x Rear (Line Out, Line In, MIC); Retaskable to 5.1
DisplayPort| As Supported by GPU
HDMI| As Supported by GPU
DVI| As Supported by GPU
VirtualLink| As Supported by GPU
VGA Port| As Supported by GPU
Serial Port| Optional 1 x Rear Port
Ethernet| 1 x 1GbE – RJ45
PS/2| 2 x PS/2
IEEE 1394| Not Available
eSATA| Optional PCIe Bracket
Parallel Port| Not Available
Optional Network Adapter| Intel I210-T1 Single Port Gigabit Ethernet Adapter
Intel I350-T2 Dual Port Gigabit Ethernet Adapter
Intel I350-T4 Quad Port Gigabit Ethernet Adapter
PCI-E 1 x WiFi Card With BT HP External Antenna Kit (8265 AC)
Disclaimers| Note: Actual USB throughout will vary depending on the type and
quantity of USB devices used.
Ethernet
Vendor | Intel Jacksonville I219LM |
---|---|
Speeds | 10/100/1000Mbps |
Functions | PXE, ASF, WOL, Jumbo Frames, Teaming |
Connectors | 1 x RJ45 |
Audio
Vendor | Realtek |
---|---|
Type | HD (5.1) |
Internal Speaker | Yes |
Connectors | 3 x Rear 3.5mm Jacks (Line In, Line Out, Microphone In) |
Chipset | ALC662 |
Number of Channels | 6 Channels |
Number of Bits/Audio Resolution | 6 Channel DAC supports 16/20/24 bit PCM |
Stereo ADC supports 16/20 bit PCM
Thermal
Temp Sensors| Ambient Thermal Sensor – Thermal Diode Connected to Super I/O
CPU VR Sensor – Thermal Diode Connected to Super I/O
DIMM VR Sensor- Thermal Diode Connected to Super I/O PSU Thermal Sensor-
Thermistor
PCI Zone 1 Sensor- Thermistor PCI Zone 1 Sensor- Thermistor PCI Zone 1 Sensor-
Thermistor
M.2 Sensor- Thermistor
---|---
Fans| 1 x CPU Fan 4-pin Header With 3-pin Key
1 x Rear System Fan 4-pin Header, Lotes ABA-WAF-050-K01
1 x Front Fan 4-pin Header Lotes ABA-WAF-050-K01
2 x ODD Bay Fan 4-pin Header With 3-pin Key (optional) 1 x PSU Fan Main PSU
Power Connector, 2 x DIMM Fans
Power Specifications
Power Supply | 900W and 690W | 1000W |
---|---|---|
Power Efficiency | 92% Efficient @ 50% Load | 92% Efficient @ 50% Load |
Main | C14 | C14 |
Operating Voltage Range | 100 – 240V | 100 – 240V |
Rated Voltage Range | 90-264VAC | 90-264VAC |
Rated Line Frequency | 47Hz / 63Hz | 47Hz / 63Hz |
Operating Line Frequency Range | 50Hz / 60Hz | 50Hz / 60Hz |
Rated Input Current | 9A-15A | 9A-15A |
Graphics | 2 x 8 pin (6+2) | 2 x (8 pin + 6 pin) |
Power Supply Fan | Yes | Yes |
ENERGY STAR® Qualified (config dependent) | Yes | Yes |
80 PLUS Compliant | Yes | Yes |
Built-in Self Test (BIST) LED | Yes | Yes |
Aux Power Drop | Yes | Yes |
BIOS
Vendor | AMI |
---|
Chassis Information
Color | Graphite Black |
---|---|
PSU | 1000W, 900W and 690W Available, Autosensing, 92% PSU, 80 PLUS Platinum |
Qualified
Thermal Solutions| Two System Fans Standard (1 front, 1 rear), One Fan per
CPU, One PSU Fan
Dimensions| 440mm/17.3″ H
460mm/18.1″ D
165mm/6.5″ W
Weight| 24kg / 52.91lbs
Packaging Dimensions
Height (mm/in) | 575mm / 22.64″ |
---|---|
Width (mm/in) | 302mm / 11.89″ |
Depth (mm) | 580mm / 22.83″ |
Security & Serviceability
TPM | Infineon SLB9665TT TPM 2.0 |
---|---|
Asset ID | Yes, 1024 x 8bit |
vPro | Intel vPro for WS (AMT 9.x) |
Cable Lock Support | Yes, Optional Kensington Cable Lock |
Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control | Yes |
Power-On Password | Yes |
Setup Password | Yes |
NIC LEDs (integrated) | Yes |
Access Panel Key Lock | Unique Key Lock Kit – Optional Common Key Lock Kit – |
Optional
Boot Sequence Control| Yes
Padlock Support| Not Supported
Boot without keyboard and/or mouse| Yes
Access Panel| Tool-less Side Cover Removal
Optical Drive| Tool-less
Hard Drives| Tool-less
Expansion Cards| Tool-less
Processor Socket| Tool-less
Color coded User Touch Points| Yes
Color-coordinated Cables and Connectors| Yes
Memory| Tool-less
System Board| Retained With Screws
Restore CD/DVD/USB Set| Not Included, Restore Media Available via Lenovo
Customer Support Center
Operating Environment
Air Temperature | Operating: 10⁰C to 35⁰C (50⁰F to 95⁰F) |
---|---|
Storage | Storage: -40⁰C to 60⁰C (-40⁰F to 140⁰F) in Original Shipping Carton |
Storage: -10⁰C to 60⁰C (14⁰F to 140⁰F) Without Carton
Humidity| Relative Humidity Operating: 10% to 80% (non-condensing) Relative
Humidity Storage/Transit: 10% to 90% (non-condensing) Wet Bulb Temperature
Operating: 25⁰C (77⁰F) max
Wet Bulb Temperature Non-operating: 40⁰C (104⁰F) max
Altitude| Operating: -15.2m to 3048m (-50ft to 10000ft) Storage: -15.2m to
10668m (-50ft to 35000ft)
Vibration| Package Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes XYZ 6 faces
Operating Vibration:
Random,0.27G at 5-500 Hz, 30 Minutes Per Surface (X,Y,Z) Non-Operating
Vibration:
Random,1.04G at 2-200 Hz, 15 Minutes Per Surface (±X,±Y,±Z)
Shock| Operation Shock: 3ms (15G) for 4 Axis (+X, -X, +Y,-Y)
3ms (30G) for 2 Axis (+Z, -Z), Half-sine Wave, Each Side Will do One Time
Rack Operation Shock: 5ms (15G) for 6 Axis (+X, -X, +Y,-Y,+Z, -Z), Half- sine
Wave, Each Side Will do One Time
Non-operating Shock: Trapezoidal Wave, 50G, 9ms, 6 Sides (+X, -X, +Y,- Y, +Z
,-Z), Filter 300Hz, Each Side Shock One Time
SECTION II: Platform Detail
Board Size | 13.44″ x 9.96″ (341.5mm x 253mm) |
---|---|
Layout | Custom ATX |
Motherboard Core
Processor Support | Xeon Scalable Processors |
---|---|
Socket Type | Socket-R4 (LGA 2066) |
Memory Support | DDR4 up to 2933MHz RDIMM Memory |
Voltage Regulator | Intel VR13 – 165W TDP Capable |
Chipset (PCH) | Intel C422 Chipset |
Flash | 32MB |
Super I/O | Nuvoton NCT6685 |
Clock | Intel Native isCLK |
Audio | Realtek ALC662 Codec |
Ethernet | Intel Jacksonville I219LM |
SAS | Optional via Broadcom Adapter |
Supported Components
Processor Level | Cascade-Lake-W Skylake-W |
---|---|
Processor | Intel Xeon Cascade Lake W-2295 Intel Xeon Cascade Lake W-2275 Intel |
Xeon Cascade Lake W-2265 Intel Xeon Cascade Lake W-2255 Intel Xeon Cascade
Lake W-2245 Intel Xeon Cascade Lake W-2235 Intel Xeon Cascade Lake W-2225
Intel Xeon Cascade Lake W-2223
Processor Level| Cascade-Lake-W Skylake-W
Processor| Intel Xeon Cascade Lake W-2295 Intel Xeon Cascade Lake W-2275 Intel
Xeon Cascade Lake W-2265 Intel Xeon Cascade Lake W-2255 Intel Xeon Cascade
Lake W-2245 Intel Xeon Cascade Lake W-2235 Intel Xeon Cascade Lake W-2225
Intel Xeon Cascade Lake W-2223
Storage
3.5″ SATA Hard Disk Drive (HDD)| 1TB SATA HDD 7200rpm, 6Gb/s, 3.5″
2TB SATA HDD 7200rpm, 6Gb/s, 3.5″
4TB SATA HDD 7200rpm, 6Gb/s, 3.5″ (enterprise class) 6TB SATA HDD 7200rpm,
6Gb/s, 3.5″ (enterprise class)
---|---
2.5″ SATA Hard Disk Drive (HDD)| 500GB 2.5″ SATA HDD 7200rpm (FIPS certified)
2.5″ SATA Solid State Drive (SSD)| 256GB SATA SSD, 6Gb/s, TLC, 2.5″, OPAL
512GB SATA SSD, 6Gb/s, TLC, 2.5″ OPAL
512GB SATA SSD, 6Gb/s, TLC, 2.5″, Non-OPAL
1024GB SATA SSD, 6Gb/s, TLC, 2.5″ OPAL
2048GB SATA SSD, 6Gb/s, TLC, 2.5″ OPAL
M.2 PCIe Solid State Drive (SSD)| 256GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
512GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
1024GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
2048GB M.2 PCIe SSD, Gen 3 x4, NVMe, OPAL
PCIe Add-in-Card Solid State Drive (SSD)| 480GB Half Height, Half Length, PCIe
NVMe SSD, Gen 3 x4 – Intel 905p
RAID
RAID Levels and Requirements| M.2 RAID via Intel VROC
SATA RAID via Onboard Intel Controller or Broadcom Adapter SAS RAID via
Broadcom Adapter
---|---
Notes| Supported RAID levels for a system will vary from the stated
capabilities of the RAID controller due to dependencies on the number and
capacity of physical disks in the system and on customer requirements for
performance, fault tolerance, or data redundancy.
Max supported RAID 0/1/5/10.
Optional Hard Disk Drive Controllers| Broadcom 9460-16i ROC PCIe Adapter,
Supports 0/1/5/10 Broadcom 9440-8i IOC PCIe Adapter, Supports 0/1/5/10
Intel VROC| Intel Virtual RAID On CPU (VROC) – Basic, Supports 0/1/10
Intel Virtual RAID On CPU (VROC) – Premium, Supports 0/1/5/10
Optical Drive/Removable Media
DVD-ROM Drive | DVD-ROM Drive – 16x/48x Slim SATA DVD-ROM |
---|---|
DVD Burner/CD-RW Drive | DVD Burner/CD-RW Rambo Drive Slim ODD DVD Burner/CD-RW |
Blu-Ray Burner Drive | Blu-Ray Burner Drive w/AACS encryption Slim Blu-Ray ODD |
DVD Burner
Media Card Reader Specifications| Front 9-in-1 USB 2.0 Media Card Reader
Standard
Optional Front 15-in-1 Media Card Reader (requires Flex module)
Keyboard and Pointing Devices
Keyboard| Traditional USB Keyboard Traditional PS/2 Keyboard Smart Card USB
Keyboard Calliope USB Keyboard
---|---
Pointing Devices| Calliope USB Mouse Lenovo USB Laser Mouse Fingerprint USB
Mouse PS/2 Optical Mouse
Expansion Bays
5.25″ External Access Bays| Two 5.25″ Flex Bays, Supports the Following:
• Up to Two Half Height Optical Drives
• Up to Two 5.25” Slim ODD Cages, Each Supports One 9.0mm Optical Drive
• Up to One 5.25″ Slim ODD and HDD Cage for One 9.0mm Optical Drive Plus One
3.5″ or 2.5″ SATA Disk
• Up to One Front Access Storage Enclosure for One 3.5″ or 2.5″ SATA Disk
• Up to One Flex Module for One or More of the Following Options: 9.0mm
Optical/15-in-1 USB 3.1 Gen 1 Reader/Front eSATA/Front Thunderbolt/Front USB
3.1 Gen 1 Type-C
Note: 1. Only one can be supported from the following: 15-in-1 memory card
reader, dual Thunderbolt ports
Note: 2. Up to two ports are suppported from 1394, eSATA, and USB Type-C
---|---
PCIe Adapters
Network| Intel I210-T1 Single Port Gigabit Ethernet Adapter Intel I350-T2 Dual
Port Gigabit Ethernet Adapter Intel I350-T4 Quad Port Gigabit Ethernet Adapter
Bitland BN8E88 1000M PCIe ASF FH
Aquantia 5G Ethernet Adapter (single port) Intel X540-T2 10G Ethernet Adapter
(dual port) Intel X550-T2 10G Ethernet Adapter (dual port)
---|---
Thunderbolt| Front Thunderbolt Card Kit – Supports Two Optional Thunderbolt
Ports (USB Type-C) on Flex Module, One of Two Ports Supports Video Out Rear
Thunderbolt PCIe Adapter
WiFi Cards| Intel PCIe WiFi Card With BT External Antenna Kit (8265 AC)
PCIe to M.2 Adapter Card| PCIe x4 to M.2 Adapter (for NVMe SSD) Quad M.2 PCIe
Adapter
SECTION III: Supported Component Detail
CPU Specifications
HDD Specifications
Drive| 500GB SATA –7200rpm, 6Gb/s, 2.5″| 1TB SATA –
7200rpm, 6Gb/s, 3.5″| 2TB SATA –7200rpm, 6Gb/s, 3.5″| 4TB SATA –7200rpm,
6Gb/s, 3.5″| 6TB SATA –7200rpm, 6Gb/s, 3.5″
---|---|---|---|---|---
3.5″ SATA Hard Disk Drive (HDD)| Not Available| Yes| Yes| Yes| Yes
2.5″ SATA Hard Disk Drive (HDD)| Yes| Not Available| Not Available| Not
Available| Not Available
Connector| SATA| SATA| SATA| SATA| SATA
Transfer Rate (Gb/sec)| 160MB/s OD
Read
| Average Data Rate, Read/Write 156MB/s| Average Data Rate, Read/Write
156MB/s| Sustained Data Transfer Rate 216- 226MB/s| Sustained Data Transfer
Rate 216- 226MB/s
Spindle Speed (RPM)| 7,200| 7,200| 7,200| 7,200| 7,200
Power Off to Spindle Stop (sec)| NA| NA| NA| NA| NA
DC Power to Drive Ready (sec)| 3.5| <10.0| <17.0| <17.0| <17.0
Average Latency (msec)| 4.2| 4.16| 4.16| 4.16| 4.16
Input (VDC)| 5| 5| 5| 5| 5
Typical (Watts)| 1.9| 6.19| 6.7| 7.35| 8.13
Idle (Watts)| 0.7| 4.6| 4.5| 5.45| 6.21
Physical Dimensions| 69.85mm x 100.34mm x 7mm| 101.6mm x
146.99mm x 19.88mm| 101.6mm x
146.99mm x 26.1mm| 101.85mm x 147mm x 26.1mm| 101.85mm x 147mm x 26.1mm
Weight (grams)| 90| 420| 535| 680| 705
Operating (C) Ambient| 0 to 60| 0 to 60| 0 to 60| 5 to 60| 5 to 60
Operating (C) Base Casting| 60| 60| 60| 60| 60
Non-Operating (C) Ambient| (-40 to 70)| (-40 to 70)| (-40 to 70)| (-40 to 70)|
(-40 to 70)
Gradient (C per Hour)| 20| 20| 20| 20| 20
Operating (Gs @ 2ms)| 400| 70| 80| Read 70 Gs
/ Write 40 Gs| Read 70 Gs
/ Write 40 Gs
Non-Operating (Gs @ 2ms)| 1000| 350| 300| 300| 250
Solid State Storage Specifications
Drive| 512GB
2.5″ SATA SSD| 1TB
2.5″ SATA SSD| 2TB
2.5″ SATA SSD| 256GB NVMe M.2 SSD TLC| 512GB NVMe M.2 SSD TLC| 1024G B NVMe
M.2 SSD TLC| 2048G B NVMe M.2 SSD TLC| 480GB AIC
Optan e™ SSD
---|---|---|---|---|---|---|---|---
Dimensions Millimeters (W x D x H)| 70 x
100 x
7.0| 70 x
100 x
7.0| 70 x
100 x
7.0| 22 x
80 x
2.3| 22 x
80 x
2.3| 22 x
80 x
2.3| 22 x
80 x
2.3| 20 x
168 x
104
Interface Type| SATA- III| SATA- III| SATA- III| PCIe
Gen 3 x4 NVMe| PCIe
Gen 3 x4 NVMe| PCIe
Gen 3 x4 NVMe| PCIe
Gen 3 x4 NVMe| PCIe
Gen 3 x4 NVMe
Power Active (AVG)| 1.9W| 2.2W| 6W| 5W| 5W| 5W| 5W| 18W
Power Idle| 50mW| 50mW| 50mW| 50mW| 50mW| 50mW| 50mW| 7W
Typical Sequential Read| 540MB /s| 540MB /s| 530MB /s| 3000M B/s| 3200M B/s|
3200M B/s| 3500M B/s| 2700M B/s
Typical Sequential Write| 500MB /s| 500MB /s| 500MB /s| 1300M B/s| 1600M B/s|
1600M B/s| 3000M B/s| 2200M B/s
Operating Temperature Range| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to 55°C| 0 to
55°C| 0 to 55°C| 0 to 55°C| 0 to 85°C
Endurance Rating (Lifetime Writes)| 150TB| 300TB| 600TB| 85TB| 150TB| 300TB|
600TB| 8.76PB
Mean Time Between Failures (MTBF)| 2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH|
2.0M POH| 2.0M POH| 2.0M POH| 2.0M POH
Hardware Encryption| AES 256-bit| AES 256-bit| AES 256-bit| AES 256-bit| AES
256-bit| AES 256-bit| AES 256-bit| No
Disclaimers| SSD performance measured with Crystal Disk Mark version 6.0.2
with the default 1000 MB data set. Sequential measurements are with 1 Thread,
Queue-Depth 32. Random measurements are with 4 threads and queue-depth 32.
Discrete Graphics Adapter
Intel® Ethernet SpecificationsEthernet
SECTION IV: BIOS / Certifications / Standards / Environmental
BIOS Specifications
WMI Support| Compliant With Microsoft WBEM and the DMTF Common Information
Model
---|---
ROM-Based Setup Utility (F1)| System Configuration Setup Program (text only
interface) Available at Power-on With F1 Key
Bootblock Recovery| Recovers System BIOS if the Flash ROM Becomes Corrupted
Replicated Setup| Saves System Configuration Settings to a File That Can Then
be Used to Replicate the Settings to Other Systems
Boot Control| Boot Control Available Through ROM-based Setup Utility or With
F12 Key at Power-on
Memory Change Alert| Power-on Error Message in the Event of a Decrease in
System Memory
Thermal Alert| Power-on Error message in the Event of a Fan Failure
Asset Tag| Supports Ability to Set SMBIOS Type 2 Baseboard Asset Tag Field
System/Emergency ROM Flash Recovery with Video| Supports Process to Recover
the System BIOS if the Flash ROM Becomes Corrupted
Remote Wakeup/Remote Shutdown| System Admin Can Power On/Off a Client Computer
from a Remote Location to Provide Maintenance
Quick Resume Time| Supports Low Power S3 (suspend to RAM) and Prompt Resume
Times
ROM Revision Level| System UEFI (BIOS) Version Reported in SMBIOS Type 0
Structure and in BIOS Setup
Keyboard-less Operation| System Can be Booted Without a Keyboard
Per-port Control| Allows I/O Ports to be Individually Enabled/Disabled Through
ROM- based Setup or WMI Interface
Adaptive Cooling| Offers Multiple Settings for Fan Control Ranging Between
Better Performance and Better Acoustics
Security| User and Administrator Passwords Can Protect Boot and ROM-based
Setup
– Support Electronic Lock
– Chassis Intrusion Detection
– UEFI Secure Boot Support
– HDD Password Can Protect HDD Data
– Windows UEFI Firmware Update Support
– Device Guard Support
– Optional Access Panel Lock, Kensington Lock, and Pad Lock
Intel(R) AMT (includes ASF 2.0)| Allows System to be Supported from a Remote
Location
Intel(R) TXT| Intel(R) Trusted Execution Technology Provides a Security
Foundation to Build Protections Against Software Based Attacks
Memory Modes| Supports Mirroring, Lock Step, and Sparing Memory Modes
Windows 10 Ready| Supports Windows 10 Requirements for Secure Flash, UEFI v
2.6 Device Guard Support Spec
Industry Standard Specification Support
UEFI | Unified Extensible Firmware Interface v2.7 |
---|---|
ACPI (Advanced Configuration and power Management Interface) | Advanced |
Configuration and Power Interface v6.1
ASF 2.0| DMTF Alert Standard Format Specification v2.0
ATA (IDE)| AT Attachment 6 with Packet Interface (ATA/ATAPI-6)
CD Boot| El Torito Bootable CD-Rom Format Specification, v1.0
EHCI| Enhanced Host Controller Interface for Universal Serial Bus, Revision
v1.0
PCI| 1 PCI Slot
PCI Express| PCI Express Base Specification v3.0
SATA| Serial ATA Revision 3.0 Specification
TPM| Trusted Computing Group TPM Specification v2.0
UHCI| Universal Host Controller Interface Design Guide, Revision v1.1
USB| Universal Serial Bus Revision v1.1 Universal Serial Bus v2.0 Universal
Serial Bus v3.0
SMBIOS| DMTF System Management Spec v3.2.1
XHCI| XHCI SPEC Revision v1.2
Social and Environmental Responsibility
Quality Control| Lenovo is a member of an eco declaration system that enforces
regular independent quality control
---|---
Hazardous Substances and Preparation| • Products do not contain more than;
0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1%
polybrominated biphenyls (PBB) or 0.1% polybrominated diphenyl ethers (PBDE).
(See legal reference and Note B1)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons
(CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons,
carbontetrachloride, 1,1,1- trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB),
0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP)
with 10-13 carbon atoms in the chain containing at least 48% per mass of
chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in
concentrations above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available
at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_produc
ts.html#environment
Batteries| Not Available
Safety, EMC Connection to the Telephone Network and Labeling| Not Applicable,
no Connection to a Telephone Network
Safety, EMC Connection to the Telephone Network and Labeling
System Software Manager| Lenovo ThinkStation Supports Software Management
Tools by Lenovo Vantage
---|---
Regulations & Standards
EMC & Safety| FCC DoC for North America VCCI Certification for Japan BSMI
Certification for Taiwan EU/EFTA CE Mark & DoC
UL/CUL(P920,P720,P520,P520c), cTUVus(P330) UL-GS(P920,P720,P520,P520c), TUV-
GS(P330)
IEC60950-1 CB Report/Certificate Saudi Arabia SASO
Kuwait KUCAS China CCC Mark
Hong Kong SAR (CB report) Singapore PSB
South Africa SABS Russia-EAC Morocco-CM Mexico-NOM Kazakhstan-EAC Belarus-EAC
Serbia KVALITET Ukraine UKrCEPRO India-BIS
USA Chemical Emission Test
---|---
Environmentals
Energy Star | ENERGY STAR® v7.0 |
---|---|
EPEAT | EPEAT® Silver Certification Available on Select Models |
Greenguard | Greenguard |
RoHS | RoHS Compliant |
ErP Lot-3 2013 | Yes |
Hazardous Substances | • Products do not contain more than; 0.1% lead, 0.01% |
cadmium, 0.1% mercury, 0.1% hexavalent chromium, 0.1% polybrominated biphenyls
(PBB) or 0.1% polybrominated diphenol ethers (PBDE)
• Products do not contain Asbestos
• Products do not contain Ozone Depleting Substances: Chlorofluorocarbons
(CFC), hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons,
carbontetrachloride, 1,1,1- trichloroethane, methyl bromide
• Products do not contain more than; 0.005% polychlorinated biphenyl (PCB),
0.005% polychlorinated terphenyl (PCT) in preparation
• Products do not contain more than 0.1% short chain chloroparaffins (SCCP)
with 10-13 carbon atoms in the chain containing at least 48% per mass of
chlorine in the SCCP
• Parts with direct and prolonged skin contact do not release nickel in
concentrations above 0.5 microgram/cm_/week
Disclaimers| EPEAT registered where applicable. EPEAT registration varies by
country. See www.epeat.net for registration status by
country.
References
- lenovo.com/social_responsibility/us/en/ThinkGreen_produc
- lenovo.com/social_responsibility/us/en/ThinkGreen_products
- workstations :: thinkstation p series workstations :: thinkstation p520 Lenovo PC Support - Lenovo Support US
- Lenovo Support | Drivers, Troubleshooting, Warranty, Repair | Lenovo Support US
- Lenovo Support | Drivers, Troubleshooting, Warranty, Repair | Lenovo Support US
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