Panasonic MD-P200 The Peasants Owner’s Manual
- June 15, 2024
- Panasonic
Table of Contents
Owner’s Manual High accuracy, high quality, ultrasonic flip-chip
device bonding.
MD-P200 The Peasants
MD-P200 Die Bonder
Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe
MD-P200’s die bonding is carried out immediately after epoxy dispensing,
thereby making it possible to finish the bonding operation before the epoxy has
deteriorated. This realizes stable and high quality bonding at all bond
positions on a substrate. In addition, the bonding stage camera enables pre-
bonding inspection immediately after epoxy dispensing and post-bonding control
immediately after the bonding of a die. This process enables manufacturing
with real-time quality inspection.User-friendly operationA large touch panel
and interactive software realize an easy and reliable operating environment
for all users from beginners to experts.
Key Features
High accuracy
Ultrasonic flip-chip device bonding
High quality bonding process
Easy and reliable operating environment
Manufacturing with real-time quality inspection.
Factory Solutions Business Division Europe,
Panasonic Connect Europe GmbH,
Caroline-Herschel-Str. 100,
85521 Ottobrunn,
Germany.
https://eu.connect.panasonic.com/gb/en/products/microelectronics/mdp200-die-
bonder
| Model Number | NM-EFD1B |
|---|---|
| Productivity | 0.56s/IC (Under the fastest conditions) 0.75s/IC for thermosonic |
bonding(Including
process time of 0.2 seconds. Under the fastest conditions)
Placement Accuracy| XY (3σ at PFSC conditions): ±7µm (Flip bonding), ±15µm
(With pre-centering), ±25µm
(Direct bonding)
Substrate dimensions| L 50 x W 30 to L 280 x W 140 (For thermosonic: L 200mm x
W 150mm)
Die dimensions (mm)| L 0.25 x W 0.25 to L 6 x W 6
Number of die types| Up to 12 types (For AWC)/ Up to 10 types (Tray with the
palette changer)/ Up to 5 types
(Wafer frame with the palette changer)
Configuration of die feeder| Wafer frame, Pre-expanded ring, Tray
Adhesive dispenser| Air-powered writing, Stamping pin
Bonding Load| Pneumatic head: 0.5N to 10N (Option: 1N to 50N) VCM head for
thermosonic process: 1N
to 50N (Option: 2N to 100N)
Head Heating| Constant heating, Up to 250°C for the pneumatic head, Up to
300°C for the VCM head
Substrate Heating| Constant heating, Up to 300°C
Number of nozzles| Up to 24 nozzles (Pickup nozzle, Bonding nozzle, Stamping
tool) (Not available for the
thermosonic nozzle)
Power Source| 3-phase AC 200V ±10V, 50 / 60Hz, Up to 4kVA (Up to 7kVA for
heating specification)
Pneumatic Source| 0.5MPa, 30L/min (A.N.R.) (Up to 150L/min for full-featured
machine including cooling air)
Dimensions (mm)| Standard specification (Up to 200mm substrate length.
including loader/unloader) W
1950mm x D 1370mm x H 1720mm (Machine body: W 1190 mm x D 1190mm x H
1720mm)
Mass| 2200kg (including loader / unloader)
References
Read User Manual Online (PDF format)
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