Amphenol B102C Evaluation Bluetooth Module User Guide

Amphenol B102C Evaluation Bluetooth Module

Document information

Revision History

Aim of this Document
The aim of this document is the introduction of the EVB user guide for B102C.

Overview

• This document introduces the usage of B102C Evaluation board hardware.
• EVB provides a hard environment to develop an environment based on the application of the customer.

EVK Pattern

Table 2 1 Components List

PIN Description

Table 3 1 J1 PIN Description

Table 3 2 J 2 PIN Description

Table 3 3 J 4 PIN Description

Note

1. A Jumper Cap will be used if internal LDO will be used which is power supplied by a USB cable;

Table
3 4 UART connection

Power on

• Connect EVB to PC by USB A to USB Mini B cable, and then read port status through the device manager.

• The following status means the port works normally.

• If the port doesn’t work normally, please download and install the driver from the following link:  https://www.silabs.com/developers/usb-to-uart-bridge-vcp-drivers?tab=downloads.

AT commands

• < Amphenol_ B102 C AT command 1

Datasheet

Amphenol – Bluetooth module B102C

Document information

Revision History

Aim of this Document
This document aims to give a detailed product description including features and performance of the BT Module B102C.

Introduction

• B102C module is a Bluetooth module featuring BLE v5.0, powerful ARM® Cortex™-M4 MCU, and state-of-the-art power performance. The embedded low-power crystal improves power consumption by enabling optimal power-saving modes. B102C is delivered with Amphenol firmware that could support Bluetooth low Energy Serial Port Service, beacons, and simultaneous peripheral and central roles – all configurable from a host by using AT commands.
• B102C offers full flexibility for customers who prefer to add their application to run on the built-in Cortex-M4. With 4Mbits FLASH, 4Kb eFuse, and 160 KB SRAM.
• Additionally, Interfaces such as SPI, I2C, and UART are available. B102C has an RF pin for use with an external antenna at the same time as an internal PIFA antenna.

Key Features

• Based on Realtek RTL8762CMF
• Complete RF solution with integrated antenna
• Powerful 20 MHz Arm® Cortex®-M4F processor
• Over-the-air (OTA) firmware updates
• 160KB RAM, 4Mbits Flash
• 24 General Purpose I/O Pin
• 12-bit/400KSPS ADC
• 2 X UART
• 2 x SPI (master or slave)
• Low-power Real Timer Counters (RTC)

Application

• Beacons – iBeacon™, AltBeacon, Eddystone, etc
• Low-Power Sensors
• Building automation
• A4WP wireless chargers and devices
• Lighting Products
• Fitness devices
• Wearable
• Mouse, Keyboard. Multi-touch track pad
• Remote control toys

Module Overview

Product Overview

Table 2-1 Specification of B102C

Bluetooth

Version| BLE Version 5.0
RF
Frequency| 2402MHz~2480MHz
Modulation| GFSK at 1Mbps, 2Mbps data rates
Antenna| On-Board PCB antenna
Current Consumption
TX only @ 0 dBm| 15.6 mA
TX only @ +4 dBm| 18.8 mA
TX only @ +7 dBm| 21.8 mA
RX only @ 1 Mbps| 14.6 mA
Power down| 450nA
Deep Sleep mode| 2.5 µA
Electrical Character
Flash| 4Mb
eFuse| 4Kb
Interface| SPI, UART, I2C
Power supply| 3V to 3.6V
Operation Temperature| -30 to +85°C

Electrical specifications

Absolute maximum ratings
Table 2-2 Absolute maximum rating

Maximum ESD rating
Table 2-3 Maximum ESD rating

Operating conditions
Table 2-4 Operating condition

Digital Pins
Table 2-5 Digital Pins

Peripherals

UART
The UART is modeled after the industry standard 16550. However, the register address space has been relocated to 32-bit data boundaries for APB bus implementation. The UART is used for serial communication with a peripheral, modem (data carrier equipment, DCE) or data set. Data is written from a master (CPU) over the APB bus to the UART and it is converted to serial form and transmitted to the destination device. Serial data is also received by the UART and stored for the master (CPU) to read back. The UART contains registers to control the character length, baud rate, parity generation /checking, and interrupt generation. Although there is only one interrupt output signal from the UART, there are several prioritized interrupt types that can be responsible for its assertion. Each of the interrupt types can be separately enabled or disabled by the control registers.

Timer
The timer includes three identical 32-bit Timer Counter channels. Each channel can be independently programmed to perform a wide range of functions including frequency measurement, event counting, interval measurement, pulse generation, delay timing, and pulse width modulation. Each channel drives an internal interrupt signal which can be programmed to generate processor interrupts.

GPIO

• Fully programmable pin assignment
• Selectable pull-up, and pull-down resistors per pin
• Pins retain their last state when system enters the sleep mode
• Ability to wake chip by any GPIOs in sleep mode

RF
BLE Specification
Table 3-1 BLE Specification

Pin Description

Table 4-1 Pin Definition

Note:

| | |

1. Type S： power/ground， I/O: GPIO;
2. Both UART_TX/RX and SWD can be used for firmware programming. Pull down Debug _TX and then power on the module to enter UART programming mode.
3. All the IO pins can be used for other functions.
4. SPI date rate: 5MHz
5. 400ksps, 12bit, AUXADC

Size

Assembly Information and Production Guidance

Production Guidance(Important)

• The stamp hole package module produced by Amphenol must completely be patched by the SMT machine within 24 hours after opening the firmware package. Otherwise, the module should be re-package by vacuum pumping and drying before patch.

• Devices for SMT patch:

  • Reflow soldering machine
  • AOI detector
  • Suction nozzle with 6-8mm caliber

• Device for drying:

  • Cabinet type oven
  • Anti-static and high thermos tolerant tray
  • Anti-static and high thermos tolerant gloves

• Conditions of product storage (Storage environment is shown in figure 7-1:

• Moisture bag must be stored at a temperature below 30 and humidity less than 85%RH.

• For dry packaging products, the guarantee period should be from 6 months’ date of packing seal.

• The humidity indicator card is in the hermetic package.

• Humidity indicator card and drying situation:

• 2 hours drying for module if the color ring at 30%, 40%, and 50% in humidity indicator card is blue after unpacking;

• 4 hours drying for module if the color ring at 30% in humidity indicator card is pink after unpacking;

• 6 hours drying for module if the color ring at 30%, 40% in humidity indicator card is pink after unpacking;

• 12 hours drying for module if the color ring at 30%, 40%, and 50% in humidity indicator card is pink after unpacking.

• Drying parameters:

• Drying temperature: 125℃±5℃；

• Alarm temperature: 130℃；

• SMT patch when the device cools down below 36℃ in a natural condition;

• Dry times: 1;

• Please dry again if the module is unsoldering 12 hours after the last drying.

• SMT is unsuitable if the module is packed over 3 months. There would be serious oxidation of the pad because of immersion gold causing false welding and lack of weld. Amphenol does not assume the

• corresponding responsibility;

• ESD protection is required before SMT;

• SMT patch should based on the reflow profile diagram, maximum temperature 245℃, The reflow profile diagram is shown in Figure 10;

• To guarantee the reflow soldering qualification rate, vision and AOI detection should be done in 10% of products for the first patch to make sure the rationality of temperature control, device adsorption mode, and position. Detect 5 to 10 samples every hour in the following batch production.

Considerations

• Operator should wear anti-static gloves during production;
• No more than drying time;
• Any explosive, flammable, and corrosive material is not allowed to be added to drying;
• The module should be put into an oven with a high thermos-tolerant tray. Ventilation should exist between each module and no direct contact with the oven;
• Make sure the oven is closed when drying to prevent temperature leaking;
• Reduce opening time or keep closing the door of the oven during drying;
• Use an anti-static glove to take out the module when its temperature is below 36℃ by naturally cooling it down after drying;
• Make sure no water and dirt in the bottom of the module;
• Temperature and humidity control is level 3 for initial modules. Storage and drying conditions are based on IPC/JEDEC J-STD-020.

Storage Condition
Moisture Sensitivity level 3

1. Calculated shelf life in a sealed bag is 12 months at <40° C and < 90% relative humidity(RH);

2. Peak Package body temperature: 260 ° C;

3. After the bag is opened, devices that will be subjected to reflow solder or another high-temperature process must:
   Mounted within: 168 hours of factory conditions < 30° C/60% RH, or stored at <10% RH;
   If both of these conditions are not met, baking is required before mounting;

4. Devices require bake, before mounting if:

   • Humidity indicator card is >10% when read at 23 ± 5° C
   • 3a or 3b not met.

5. If baking is required, devices may be baked for 48 hours at 125 ± 5° C

Temperature Curve of Secondary Reflow

1. Ramp Up
   Temp：<150℃，Time：60～90s, Ramp up degree: 1～3℃/S ;

2. Pre-Heat
   Temp：150℃~200℃，time：60-120s， Ramp up degree: 0.3-0.8 ℃/S;

3. Curing
   Peak temp 235℃~250℃ (Max ＜245℃），time: 30-70s;

4. Cooling down
   Temp：217℃~170℃， Ramp up degree: 3～5℃/S;

Recommended reflow profile

Package information

• Production modules are delivered in reels, with 1200 modules in each reel.

Regulatory approval

• The B102C module has received regulatory approval from the following countries:
• United States/FCC ID: 2BAG9-B102C00101
• Europe: CE

Gain table for individual regulatory region

• The default firmware uses a common gain table that meets IEEE 802.11 specifications and regulatory regions
• (B102C – United States/FCC, Europe/CE). In some cases, the output power is limited by the regulatory region with the most stringent transmit power limits. If the product’s destination is known, the region-specific gain table can optionally be embedded into the firmware to optimize performance.

United States

• The B102C modules have received Federal Communications Commission (FCC) CFR47 Telecommunications,
• Part 15 Subpart C “Intentional Radiators” single-modular approval following Part 15.212

Important Notice to OEM integrators

1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
3. Separate approval is required for all other operating configurations, including portable configurations concerning Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module’s intentional emissions are compliant (i.e. fundamental and out-of-band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or that emissions are compliant with the transmitter(s) rule(s).
   The Grantee will guide the host manufacturer for Part 15 B requirements if needed.

Important Note
notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to application that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application.

End Product Labeling

• When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door, or cover is easily removed. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: 2BAG9-B102C00101”
• The FCC ID can be used only when all FCC compliance requirements are met.

Antenna Installation

1. The antenna must be installed such that 20 cm is maintained between the antenna and users,
2. The transmitter module may not be co-located with any other transmitter or antenna.
3. Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation.

Antenna type| BT/2.4GHz band

Peak Gain (dBi)

---|---
On-board PCB| 1.40

If these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product that integrates this module. The end user manual shall include all required regulatory information/warnings as shown in this manual.

FCC STATEMENT

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and
2. this device must accept any interference received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used per the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

List of applicable FCC rules
This module has been tested and found to comply with 15.247 requirements for Modular Approval. The modular transmitter is only FCC-authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

This device is intended only for OEM integrators under the following conditions: (For module device use)

1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2. The transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed.

Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance 20 cm between the radiator & your body.
The user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance.

• List of Applicable FCC Rules
• FCC Part 15 Subpart C 15.247
• Specific Operational Use Conditions
• The module has Bluetooth functions.
• Operation Frequency:
• Bluetooth: 2402 ~ 2480 MHz
• Number of Channel: 40
• Type: On-board antenna
• Gain: 1.40 dBi Max

The host manufacturer installing this module into their product must ensure that the final composite product complies with the FCC requirements by a technical assessment or evaluation of the FCC rules, including the transmitter operation. The host manufacturer has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warnings as shown in this manual.

Europe
The B102C module is/are a Radio Equipment Directive (RED) assessed radio module that is CE marked and has been manufactured and tested to be integrated into a final product. The B102C modules have/have been tested to RED 2014/53/EU Essential Requirements mentioned in the following European Compliance table. The device could be used with a separation distance of 20cm to the human body.

European Compliance

EN 301 489-17
Radio| EN 300 328| 3.2

The ETSI guides modular devices in the “Guide to the Application of harmonised Standards covering articles 3.1b and 3.2 of the RED 2014/53/EU (RED) to multi- radio and combined radio and nonradio equipment” document available at
http://www.etsi.org/deliver/etsi_eg/203300_203399/203367/01.01.01_60/eg_203367v010101p.pdf.

Labeling and User Information Requirements
The label on the final product that contains B102C modules must follow CE marking requirements.

Conformity Assessment

• From ETSI Guidance Note EG 203367, section 6.1, when non-radio products are combined with a radio product:
• If the manufacturer of the combined equipment installs the radio product in a host non-radio product in equivalent assessment conditions (i.e. host equivalent to the one used for the assessment of the radio product) and according to the installation instructions for the radio product, then no additional assessment of the combined equipment against article 3.2 of the RED is required.

Simplified EU Declaration of Conformity

• Hereby, Shanghai Amphenol Airwave Communication Electronics Co. Ltd. declares that the radio equipment type B102C is in compliance with Directive 2014/53/EU.
• The full text of the EU declaration of conformity is available at the following internet address: https://www.amphenol-mcp.com/wireless-modules/B102C;

Approved Antenna Types

• For the B102C module, the approval is received using the on-board PCB antenna.

Other Regulatory information

• If the customer needs another regulatory jurisdiction certification or to recertify the module for other reasons, contact Microchip for the required utilities and documentation.

References

• ETSI - Welcome to the World of Standards!

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