NXP UM11930 14 V Battery Management System User Manual

UM11930
RD33772C14VEVM 14 V battery management system
Rev. 1 — 25 September 2023
User manual

Document information

systems in electric vehicle applications. Targeting to meet ASIL C functional safety level requirements.

Revision history

IMPORTANT NOTICE
For engineering development or evaluation purposes only

NXP provides the product under the following conditions:
This evaluation kit or reference design is for use of ENGINEERING DEVELOPMENT OR  EVALUATION PURPOSES ONLY.
It is provided as a sample IC pre-soldered to a printed circuit board to make it easier to access inputs, outputs, and supply terminals. This evaluation kit or reference design may be used with any development system or other source of I/O signals by connecting it to the host MCU or computer board via off-the- shelf cables. Final device in an application will be heavily dependent on proper printed circuit board layout and heat sinking design as well as attention to supply filtering, transient suppression, and I/O signal quality.
The product provided may not be complete in terms of required design, marketing, and or manufacturing related protective considerations, including product safety measures typically found in the end device incorporating the product. Due to the open  construction of the product, it is the responsibility of the user to take all appropriate precautions for electric discharge. To minimize risks associated with the customers’ applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. For any safety concerns, contact NXP sales and technical support services.

 Introduction

This document is the user guide for the RD33772C14VEVM reference design. This document is intended for the engineers involved in the evaluation, design, implementation, and validation of a 14 V battery management system (BMS) in a vehicle. The scope of this document is to provide the user with information to evaluate the features of the 14 V BMS device. This document covers the hardware connection steps, software and tools installation and environment configuration for the kit usage. The RD33772C14VEVM allows the user to connect to a 14 V power supply for voltage sensing, current sensing, temperature sensing and the diagnostic of contactor status.

Finding kit resources and information on the NXP website

The NXP analog product development boards provide an easy-to-use platform for evaluating NXP products.
The boards support a range of analog, mixed-signal, and power solutions. They incorporate monolithic integrated circuits and system-in-package devices that use proven high-volume technology. NXP products offer longer battery life, a smaller form factor, reduced component counts, lower cost, and improved performance in powering state-of-the-art systems. NXP Semiconductors provides online resources for this user manual and its supported devices on http://www.nxp.com.
The information page for RD33772C14VEVM user manual is at http://www.nxp.com/RD33772C14VEVM. The information page provides overview information, technical and functional specifications, ordering information, documentation, and software. The Getting Started tab provides quick-reference information applicable to using the RD33772C14VEVM user manual, including the downloadable assets.
2.1 Collaborate in the NXP community
The NXP community is for sharing ideas and tips, ask and answer technical questions, and receive input on just about any embedded design topic. The NXP community is at http://community.nxp.com.

Getting ready

Working with the RD33772C14VEVM requires the kit contents, additional hardware, and a Windows PC workstation with installed software.

3.1 Kit contents

• Evaluation board in an antistatic bag
• Several cables
• Quick start guide

3.2 Additional hardware
In addition to the kit contents, the following hardware is necessary or beneficial when working with this kit.

• Low-voltage power supply 5 V to 14 V with current limit set initially to 1.5 A
• Current load, 0 A to 500 A
• Controller area network (CAN) card and cable
• Multilink FX debugger cable

3.3 Minimum system requirements
This reference design requires a Windows PC workstation. The kit requires the following to function properly with the demo software:

• Windows 10, 8 or 7 compatible PC with a USB port

3.4 Software
Installing software is necessary to work with this reference design. All listed software is available on http://www.nxp.com/RD33772C14VEVM.

•  S32 design studio integrated development environment (IDE) for Arm

Getting to know the hardware

4.1 Kit overview
The RD33772C14VEVM is a hardware tool for evaluation and development. It is ideal for rapid prototyping of a 14 V BMS. This board can be used to evaluate the features of the MC33772C device.
4.2 Board features

• Power supply input from 9 V to 18 V
• Up to 10 channels temperature sensing
• Up to 4 channels pack voltage measurement
• Redundant current measurement
• External positive temperature coefficient (PTC) for self-heating function of lithium-ion battery
• Hardware short circuit protection and software (SW) overcurrent protection
•  1 channel CAN and 1 channel local interconnect network (LIN) communication with vehicle control unit (VCU)

4.3 Board functions implemented
Table 1. Board functions

up to 4 channels pack voltage
Current measurement| 1 channel by MC33772C
1 channel by MCU
Temperature measurement| 3 channels for cell
1 channel for metal-oxide-semiconductor field-effect transistor (MOSFET)
1 channel for shunt resistor
1 channel for cell balancing
3 channels reserved
Communication| serial peripheral interface (SPI) (internal)
1 channel LIN (external)
1 channel CAN (external)

Table 1. Board functions…continued

MOSFET diagnostic
pre-driver
PTC| self-heating for battery cell

4.4 Device features
This reference design features the following NXP products:
Table 2. Device features

operation, 40 V transient
•   3 to 6 cells management
•   0.8 mV total cell voltage measurement error
•   Isolated 2.0 Mbit/s differential communication or 4.0 Mbit/s SPI
•   Addressable on initialization
•   Synchronized cell voltage and current measurement with coulomb count
•   Total stack voltage measurement
•   Seven general-purpose input/output (GPIO) or temperature sensor inputs
•   5.0 V reference supply output with 5 mA capability
•   Automatic over/undervoltage and temperature detection routable to fault pin
•   Integrated sleep mode over/undervoltage and temperature monitoring
•   Onboard 300 mA passive cell balancing with diagnostics
•   Hot plug capable
•   Detection of internal and external faults, as open lines, shorts, and leakages
•   Designed to support ISO 26262 up to automotive safety integrity level (ASIL) D safety system
•   Fully compatible with the MC33771 for a maximum of 14 cells
•   Qualified in compliance with AEC-Q100

Table 2. Device features…continued

Single, multiple, or lockstep Cortex-M7 cores, 120 MHz to 240 MHz + floating point unit (FPU)
•   512 kB to 8 MB flash with error correcting code (ECC)
•   Firmware over-the-air (FOTA): A/B firmware swap with zero downtime and roll‑back support; automatic address translation
•   12-bit 1 Msps analog-to-digital converter (ADC), 16-bit enhanced modular input/output system (eMIOS) timer with logic control unit for motor control
•   Low-power Run and Standby modes, fast wake-up, clock, and power gating
•   −40 °C to +125 °C AEC-Q100
•   Minimum 15-year longevity
•   Safety, security, and connectivity
•   ISO 26262 up to ASIL B/D
•   Fault collection and control unit
•   Hardware and software watchdogs, clock/power/temperature monitors
•   Safety documentation and SafeAssure community support
•   Hardware security engine (HSE) security engine – AES-128/192/256, Rivest, Shamir, and Adleman public key cryptosystem (RSA), ECC, secure boot, and key storage; side channel protection; ISO 21434 intended
•   Ethernet TSN/AVB (10/100 Mbit/s), I3C, controller area network flexible data rate (CAN FD), flexible input/output (FlexIO) (SPI/IIC/IIS/SENT protocol), serial audio interface (SAI), quadruple serial peripheral interface (QSPI)
FS26| safety system basis chip (SBC) with low power fit for ASIL D| •   Input supply up to 40 V DC
•   HV buck, adjustable step down DC-DC converter 3.2 V to 6.35 V (50 mV step), 1.5 A DC
•   VCORE, adjustable step down DC-DC converter 0.8 V to 3.3 V (10 mV step), 800 mA to 1500 mA
•   Boost controller 5.5 V to 17 V, external switch
•   LDO1 and LDO2, configurable 3.3 V or 5.0 V, up to 300 mA DC output current capability
•   Voltage reference (VREF), accurate voltage reference 3.3 V or 5 V, 1 %, 30 mA DC output current capability
•   2 trackers, 10 mV offset, 125 mA DC output current capability
•   32 bits SPI [including cyclic redundancy check (CRC)] •   Long duration timer (with dedicated part number)
•   Third-generation fail-safe state machine with independent safety monitoring unit
•   Target < 25 µA in Low-power mode in LPOFF and < 50 µA in Standby (MCU powered)
•   AMUX: battery, internal safety critical voltages, precise reference voltage and temperature, GPIOs
•   GPIO: wake-up or HS/LS driver

Table 2. Device features…continued

LIN 2.1/SAE J2602 compliant
•   Baud rate up to 20 kBd
•   Very low electromagnetic emission (EME)
•   High electromagnetic immunity (EMI)
•   Passive behavior in unpowered state
•   Input levels compatible with 3.3 V and 5 V devices
•   Integrated termination resistor for LIN follower applications
•   Wake-up source recognition (local or remote)
•   K-line compatible
•   Very low current consumption in Sleep mode with local and remote wake-up
•   High electrostatic discharge (ESD) robustness: ±6 kV according to IEC 61000-4-2 for pins LIN, VBAT, and WAKE_N
•   Transmit data (TXD) dominant time-out function
•   Bus terminal and battery pin protected against transients in the automotive environment (ISO 7637)
TJA1145| high speed CAN transceiver| •   ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant
•   Data rates up to 5 Mbit/s in the CAN FD fast phase
•   Autonomous bus biasing
•   Fully compatible with the TJA1145, with improved electromagnetic compatibility (EMC) performance
•   ±6 kV ESD protection, according to IEC TS 62228 on pins BAT and WAKE and on the CAN bus pins
•   CAN bus pins short-circuit proof to ±58 V
•   Suitable for use in 12 V and 24 V systems
•   AEC-Q100 qualified

4.5 Block diagram

4.6 Connectors
Figure 2 shows the location of connectors on the board. Table 3, Table 4, and Table 5 list the pinouts for J2, J5, and J6.
Table 3. Joint Test Access Group (JTAG) connector (J2) description

Table 4. J5 connector description

Table 4. J5 connector description…continued

Table 5. J6 connector description

Configuring the hardware

The RD33772C14VEVM is used in a standalone configuration. There is no connector to add an expansion board. All required cables are included in the kit.

• For power on the board, need an external 12 V DC power source supply B+ and B- Connect the low-voltage connector to J6, the CAN/local interconnect network (LIN) wire communicates with PC with external CAN/LIN tool
• Connect battery simulation cable to J5 and source from 12 V DC
• Connect the debug tool to J2 for software purpose

References

1. MC33772C product summary page http://www.nxp.com/MC33772C
2.  S32K344 product summary page http://nxp.com/s32k3
3. FS26 product summary page http://nxp.com/fs26

Legal information

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Suitability for use in automotive applications (functional safety) — This NXP product has been qualified for use in automotive applications. It has been developed in accordance with ISO 26262, and has been ASIL classified accordingly. If this product is used by customer in the development of, or for incorporation into, products or services (a) used in safety critical applications or (b) in which failure could lead to death, personal injury, or severe physical or environmental damage (such products and services hereinafter referred to as “Critical Applications”), then customer makes the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, safety, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. As such, customer assumes all risk related to use of any products in Critical Applications and NXP and its suppliers shall not be liable for any such use by customer. Accordingly, customer will indemnify and hold NXP harmless from any claims, liabilities, damages and associated costs and expenses (including attorneys’ fees) that NXP may incur related to customer’s incorporation of any product in a Critical Application.
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Notice: All referenced brands, product names, service names, and trademarks are the property of their respective owners.
NXP — wordmark and logo are trademarks of NXP B.V.
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Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© 2023 NXP B.V.
All rights reserved.
For more information, please visit: http://www.nxp.com
Date of release: 25 September 2023

References

• FS26 | Safety SBC with Low Power fit for ASIL D | NXP Semiconductors
• S32K3 Auto General-Purpose MCUs | NXP Semiconductors
• MC33772C | 6-Channel Li-Ion Battery Cell Controller IC | NXP Semiconductors
• RD33772C14VEVM | 14 V BMS Reference Design | NXP Semiconductors

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