TDK B66302G Ferrites and Accessories Instructions
- June 12, 2024
- TDK
Table of Contents
TDK B66302G Ferrites and Accessories Instructions
- To IEC 63093-8
- For miniature transformers, e.g. DC/DC converters for surface mounting
- Available with SMD coil former
- Delivery mode: single units
Magnetic characteristics (per set)
l/A = 3.1 mm–1
e = 15.5 mm
Ae = 5 mm2
Amin = 3.6 mm2
Ve = 78 mm3
Approx. weight 0.50 g/set
Ungapped
Material | AL value nH | me | PVW/set | Ordering code |
---|---|---|---|---|
N30 | 1000 +30/–20% | 2460 | B66302G0000X130 | |
T38 | 2100 +40/–30% | 5170 | B66302G0000X138 | |
N49 | 400 +30/–20% | 760 | < 0.065 (100 mT, 500 kHz, 100 °C) | B66302G0000X149 |
N87 | 550 +30/–20% | 1350 | < 0.035 (200 mT, 100 kHz, 100 °C) | B66302G0000X187 |
Other AL values/air gaps and materials available on request ─ see Processing remarks on page 4.
Accessories
SMD coil former with gullwing terminals
Material: GFR liquid crystal polymer (UL 94 V-0, insulation class to IEC
60085: F max. operating temperature 155 °C), color code black (coil former)
and white (cover cap). Laperos E 130i E106764 (M), POLYPLASTICS CO LTD
Vectra E 130i E83005 (M), CELANESE INTERNATIONAL CORP.
Solderability: to IEC 60068-2-58, test Td, method 6 (Group 3): 245 °C, 3
s
Resistance to soldering heat: to IEC 60068-2-58, test Td, method 6 (Group
3): 255 °C, 10 s permissible soldering temperature for wire-wrap connection on
coil former: 400 °C, 1 s
Winding: see Processing notes, 2.1
Plastic cover cap
Used to protect the transformer against external influences, for stamping and
for improved processing on assembly machines.
Material: GFR polyamide (UL 94 V-0, insulation class to IEC 60085:
F max. operating temperature 155 °C), color code white
Stanyl TW250F6 E47960 (M), DSM ENGINEERING PLASTICS B V
Sections | ANmm2 | lN mm | AR valuemW | Terminals | Ordering code |
---|---|---|---|---|---|
1 | 2.7 | 14.9 | 190 | 8 | B66302D1008T001 |
2 | 1.7 | 14.9 | 302 | 8 | B66302D1008T002 |
Plastic cover cap | B66302A2000X000 |
Coil former
**Plastic cover cap
**
Cautions and warnings
Mechanical stress and mounting
Ferrite cores have to meet mechanical requirements during assembling and for a
growing number of applications. Since ferrites are ceramic materials one has
to be aware of the special behavior under mechanical load.
As valid for any ceramic material, ferrite cores are brittle and sensitive to any shock, fast temperature changing or tensile load. Especially high cooling rates under ultrasonic cleaning and high static or cyclic loads can cause cracks or failure of the ferrite cores. For detailed information see data book, chapter “General – Definitions, 8.1”.
Effects of core combination on AL value
Stresses in the core affect not only the mechanical but also the magnetic
properties. It is apparent that the initial permeability is dependent on the
stress state of the core. The higher the stresses are in the core, the lower
is the value for the initial permeability. Thus the embedding medium should
have the greatest possible elasticity.
For detailed information see data book, chapter “General – Definitions, 8.1”.
Heating up
Ferrites can run hot during operation at higher flux densities and higher
frequencies.
NiZn-materials
The magnetic properties of NiZn-materials can change irreversible in high
magnetic fields.
Ferrite Accessories
Our ferrite accessories have been designed and evaluated only in combination
with our ferrite cores. We explicitly point out that our ferrite accessories
or our ferrite cores may not be compatible with those of other manufacturers.
Any such combination requires prior testing by the customer and will be at the
customer‘s own risk. We assume no warranty or reliability for the combination
of our ferrite accessories with cores and other accessories from any other
manufacturer.
Processing remarks
The start of the winding process should be soft. Else the flanges may be
destroyed.
- Too strong winding forces may blast the flanges or squeeze the tube that the cores can not be mounted any more.
- Too long soldering time at high temperature (>300 °C) may effect coplanarity or pin arrangement.
- Not following the processing notes for soldering of the J-leg terminals may cause solderability problems at the transformer because of pollution with Sn oxyde of the tin bath or burned insulation of the wire. For detailed information see chapter “Processing notes”, section 2.2.
- The dimensions of the hole arrangement have fixed values and should be understood as a recommendation for drilling the printed circuit board. For dimensioning the pins, the group of holes can only be seen under certain conditions, as they fit into the given hole arrangement. To avoid problems when mounting the transformer, the manufacturing tolerances for positioning the customers’ drilling process must be considered by increasing the hole diameter.
Cautions and warnings
Display of ordering codes for TDK Electronics products
The ordering code for one and the same product can be represented differently
in data sheets, data books, other publications, on the company website or in
order-related documents such as shipping notes, order confirmations and
product labels. The varying representations of the ordering codes are due to
different processes employed and do not affect the specifications of the
respective products. Detailed information can be found on the Internet under
www.tdk-electronics.tdk.com/orderingcodes.
Symbols and terms
Symbol | Meaning | Unit |
---|---|---|
A | Cross section of coil | mm2 |
Ae | Effective magnetic cross section | mm2 |
AL AL1 | Inductance factor; AL = L/N2Minimum inductance at defined high | |
saturation ( ma) | nHnH | |
Amin | Minimum core cross section | mm2 |
AN | Winding cross section | mm2 |
AR | Resistance factor; AR = RCu /N2 | mW = 10–6 W |
B | RMS value of magnetic flux density | Vs/m2, mT |
DB | Flux density deviation | Vs/m2, mT |
Bˆ | Peak value of magnetic flux density | Vs/m2, mT |
DBˆ | Peak value of flux density deviation | Vs/m2, mT |
BDC | DC magnetic flux density | Vs/m2, mT |
BR | Remanent flux density | Vs/m2, mT |
BS | Saturation magnetization | Vs/m2, mT |
C0 | Winding capacitance | F = As/ V |
CDF | Core distortion factor | mm–4.5 |
DF | Relative disaccommodation coefficient DF = d/mi | |
d | Disaccommodation coefficient | |
Ea | Activation energy | J |
f | Frequency | s–1, Hz |
fcutoff | Cut-off frequency | s–1, Hz |
fmax | Upper frequency limit | s–1, Hz |
fmin | Lower frequency limit | s–1, Hz |
fr | Resonance frequency | s–1, Hz |
fCu | Copper filling factor | |
g | Air gap | mm |
H | RMS value of magnetic field strength | A/m |
Hˆ | Peak value of magnetic field strength | A/m |
HDC | DC field strength | A/m |
Hc | Coercive field strength | A/m |
h | Hysteresis coefficient of material | 10–6 cm/A |
h/mi 2 | Relative hysteresis coefficient | 10–6 cm/A |
I | RMS value of current | A |
IDCˆI | Direct currentPeak value of current | AA |
J | Polarization | Vs/m2 |
k | Boltzmann constant | J/K |
k3 | Third harmonic distortion | |
k3c | Circuit third harmonic distortion | |
L | Inductance | H = Vs/A |
DL/L | Relative inductance change | H |
--- | --- | --- |
L0 | Inductance of coil without core | H |
LH | Main inductance | H |
Lp | Parallel inductance | H |
Lrev | Reversible inductance | H |
Ls | Series inductance | H |
le | Effective magnetic path length | mm |
lN | Average length of turn | mm |
N | Number of turns | |
PCu | Copper (winding) losses | W |
Ptrans | Transferrable power | W |
PV | Relative core losses | mW/g |
PF | Performance factor | |
Q | Quality factor (Q = wL/Rs = 1/tan dL) | |
R | Resistance | W |
RCu | Copper (winding) resistance (f = 0) | W |
RhDRh | Hysteresis loss resistance of a coreRh change | WW |
Ri | Internal resistance | W |
Rp | Parallel loss resistance of a core | W |
Rs | Series loss resistance of a core | W |
Rth | Thermal resistance | K/W |
RV | Effective loss resistance of a core | W |
s | Total air gap | mm |
T | Temperature | °C |
DT | Temperature difference | K |
TC | Curie temperature | °C |
t | Time | s |
tv tan d | Pulse duty factorLoss factor | |
tan dL tan dr tan de tan dhtan d/mi | Loss factor of coil(Residual) loss factor |
at H ® 0 Relative loss factorHysteresis loss factorRelative loss factor of
material at H ® 0|
U| RMS value of voltage| V
Û| Peak value of voltage| V
Ve| Effective magnetic volume| mm3
ZZn| Complex impedanceNormalized impedance |Z|n = |Z| /N2 ´ e (le /Ae)| WW/mm
a| Temperature coefficient (TK)| 1/K
---|---|---
aF| Relative temperature coefficient of material| 1/K
ae| Temperature coefficient of effective permeability| 1/K
er| Relative permittivity|
F| Magnetic flux| Vs
h| Efficiency of a transformer|
hB| Hysteresis material constant| mT-1
hi| Hysteresis core constant| A–1H–1/2
ls| Magnetostriction at saturation magnetization|
m| Relative complex permeability|
m0| Magnetic field constant| Vs/Am
ma| Relative amplitude permeability|
mapp| Relative apparent permeability|
me| Relative effective permeability|
mi| Relative initial permeability|
mp’| Relative real (inductive) component of m (for parallel
components)|
mp”| Relative imaginary (loss) component of m (for parallel components)|
mr| Relative permeability|
mrev| Relative reversible permeability|
ms’| Relative real (inductive) component of m (for series components)|
ms”| Relative imaginary (loss) component of m (for series components)|
mtot| Relative total permeability|
| derived from the static magnetization curve|
r| Resistivity| Wm–1
Sl/A| Magnetic form factor| mm–1
tCu| DC time constant tCu = L/RCu = AL/AR| s
w| Angular frequency; w = 2 Pf| s–1
The following applies to all products named in this publication:
- Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application.
- We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component.
- The warnings, cautions and product-specific notes must be observed.
- In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices.
- We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.
- Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and Conditions of Supply
- Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only requirements mutually agreed upon can and will be implemented in our Quality Management System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon.
- The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, InsuGate, LeaXield, MiniBlue, MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks.
References
- Material data sheets | TDK Electronics - TDK Europe
- Display of the order number | TDK Electronics - TDK Europe
- Trademarks | TDK Electronics - TDK Europe
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