DELL EMC E660 VxRail Hyperconverged Storage User Manual

: June 11, 2024
: DELL EMC

Table of Contents

E660 VxRail Hyperconverged Storage
Executive Summary
Introduction
Additional Information
Product Description
References
References
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Dell EMC Statement of Volatility
Dell EMC VxRail E660/E660F/E660N
Statement of Volatility
08-Nov-2021

E660 VxRail Hyperconverged Storage

For Dell EMC Customer Use Only
Abstract
This document describes characteristics of the volatile and non-volatile memory components of the Dell EMC E660/E660F/E660N. The information contained within this document is pertinent to system owners that may need to qualify the risk associated with ensuring that all memory within a product has been cleared in compliance with regulatory requirements.

Copyright © 2021 Dell Inc, or its subsidiaries. All rights reserved. Dell, EMC, Dell EMC and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners.
Published December 2021 in the USA. Dell believes the information in this publication is accurate as of its publication date. The information is subject to change without notice.
THE INFORMATION IN THIS PUBLICATION IS PROVIDED “AS IS. DELL MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WITH RESPECT TO THE INFORMATION IN THIS PUBLICATION, AND SPECIFICALLY DISCLAIMS IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. USE, COPYING, AND DISTRIBUTION OF ANY EMC DELL SOFTWARE DESCRIBED IN THIS PUBLICATION REQUIRES AN APPLICABLE SOFTWARE LICENSE. Dell EMC
Hopkinton, Massachusetts 01748-9103
1-508-435-1000 in North America 1-866-464-7381
www.Dell.com

Executive Summary

To facilitate the most effective and efficient functionality, most information technology systems utilize various forms of data storage. These may include Random Access Memory (RAM), ReadOnly Memory (ROM), flash memory, virtual memory, and magnetic storage devices. Each form of storage maintains unique characteristics that may affect how organizations protect information stored by the system. In particular, storage devices may retain data for a period of time after power ceases to be provided. In order to adequately protect information and make appropriate decisions that support regulatory requirements, it is critical to understand all of the storage components and their memory volatility characteristics. This paper will provide the necessary information for organizations on which to base their decisions about the response to security incidents and regulatory compliance.

Introduction

Memory components are categorized as either volatile or non-volatile. Volatile memory includes Random Access Memory (RAM) such as Static RAM (SRAM) and Dynamic RAM (DRAM). Non-volatile memory includes Read-Only Memory (ROM), Electrically Erasable Programmable ROM (EEPROM), Non-Volatile RAM (NVRAM), and Flash memory devices. Because of their unique characteristics, systems may use a combination of memory types to maintain efficient and effective functionality. In order for organizations to determine mitigation steps following a security incident or to make decisions about steps that should be taken before changing the approved system confidentiality, a solid understanding of the memory volatility specific to the product needs to be established and well-documented.
Purpose
The purpose of this document is to provide organizations with knowledge about memory volatility within the DellEMC E660/E660F/E660N on which security decisions can be made and, where appropriate, remediation steps that can be incorporated into organizational processes.
Scope
This document provides a description of short-term memory storage components and their characteristics including, where appropriate, the method by which memory can be cleared. It is intended to provide product-specific memory volatility and may supplement organization-specific policy, standards, or guidance.

Additional Information

Abbreviations used in this document
OS = Operating System

Product Description

The following table displays the model, part numbers (if applicable), manufacturer and the Corporate Headquarters address for the manufacturer

Table 1 – Statement of Volatility

Statement of Volatility

Model| Manufacturer| Address
E660/E660F/E660N| Dell EMC| **** 228 South Street, Hopkinton, Ma 01748

Table 2 –Volatile Memory

per DIMM

Table 3 – Non-Volatile Memory

Type (BBRAM, Flash, EEPROM, etc.)| **Part Number| ****Size| User Modifiable (Y/N)| ****Function| ****Process to Clear
---|---|---|---|---|---
PLANAR
** CPU Internal CMOS RAM (Battery-backed CMOS RAM)| | 256 Bytes| No| Real-time clock and BIOS configuration settings| 1) Set NVRAM_CLR jumper to clear BIOS configuration settings at boot and reboot system;|
2) AC power off system, remove coin cell battery for 30 seconds, replace battery and power back on; 3) restore default configuration in F2 system setup menu.
BIOS SPI Flash| | 32 MB| Yes| Boot code, system configuration information, UEFI environment, Flash Disceptor, ME| Not possible with any utilities or applications and system is not functional if corrupted or removed.
BIOS Data SPI Flash| | 4 MB| No| 4MB Data SPI ROM storage BIOS setting| Not possible with any utilities or applications and system is not functional if corrupted or removed.
Type (BBRAM, Flash, EEPROM, etc.)| **Part Number| ****Size| User Modifiable (Y/N)| ****Function| ****Process to Clear
---|---|---|---|---|---
** iDRAC SPI Flash| | **** 4 MB| No| iDRAC Uboot (bootloader), server management persistent store (i.e iDRAC MAC Address, iDRAC boot variables), lifecycle log cache, virtual planar FRU and EPPID, rac log, System Event Log| User cannot clear the memory completely. However, user data, lifecycle log and archive, SEL, fw image repository can be cleared via Delete Configuration and Retire System, accessible in Lifecycle Controller interface
BMC EMMC (eMMC NAND Flash)| | **** 8 GB| **** No| Operational iDRAC FW, Lifecycle Controller (LC) USC partition, LC service diags, LC OS drivers, USC firmware, iDRAC MAD address, and EPPID, rac log, System Event Log, lifecycle log cache| User cannot clear the memory completely. However, user data, lifecycle log and archive, SEL, fw image repository can be cleared via Delete Configuration and Retire System, accessible in Lifecycle Controller interface
System CPLD RAM| | 448Kb| No| Not utilized| Not accessible
System Memory – BPS| | Up to 8 per CPU, Up to 512GB per DIMM| Yes| System OS RAM – App Direct| OS control/ System BIOS
CPU Vcore and VDDCR SOC FW (One time programmable)| | 16 KB| No| Operational parameters| User cannot clear memory
MEM_VDDQ FW| | 16 KB| No| Not utilized| User cannot clear memory
10 x 2.5” SAS/SATA/NVMe front Backplane
SEP internal flash| | 4Mbit in-chip SPI serial Flash| No| Firmware + FRU|

User cannot clear the memory

Backplane external FRU| | 256 Bytes| No| ** FRU| User cannot clear the memory
HBA 355i
SPI Flash| | 128 Mb| No| Card firmware| User cannot clear the memory
NVSRAM| | 128 KB| No| Configuration data| User cannot clear the memory
** FRU| | 2 Kb| No| Card manufacturing information| User cannot clear the memory

Type (BBRAM, Flash, EEPROM, etc.)| **Part Number| ****Size| User Modifiable (Y/N)| ****Function| ****Process to Clear
****H755
** NV Flash| | 512 Gb| No| Card for,firmware| User cannot clear the memory
BMU| | 180 KB| No| Battery management control|
SPI Flash| | 128 Mb| No| Holds cache data during power loss|
NVSRAM| | 128 KB| No| Configuration data| User cannot clear the memory
FRU| | 2 Kb| No| Card manufacturing information| User cannot clear the memory
SPD| | 2 Kb| No| Memory configuration data| User cannot clear the memory
Left Status Control Panel
Microcontroller| | 8 KB| No| Driving Health and Status LED| User cannot clear the memory
Left Titan 2

**** Microcontroller

| | 2 MB| **** No| For field maintenance. Have license, service tag and system information. Driving Health and Status LED| ** User cannot clear the memory
Right FIO 1U Package 1
** SPI Flash| | 32 Mb| No| Easy Restore functionality. Contains service tag, copy of SEL logs| ****

User cannot clear the memory

TPM

Trusted Platform Module (TPM)

| | 128 Bytes| Yes| Storage of Encryption keys| F2 Setup option
BOSS
Raid controller SPI Flash| | 8 Mb| No| Boot code, Firmware| Use Flash tool, type “go.nsh w y”
FRU| | 2 Kb| No| Card Mfg Information| By writing to Flash
Power Supplies
Delta
MCU| | 64 KB| Yes| Boot code and firmware| Before firmware update, the memory will be clear.
EEPROM| | 2 KB| No| PSU Information| User cannot clear the memory
Artesyn
Primary MCU| | 64 KB| Yes| Boot code and firmware| Before firmware update, the memory will be clear.

Type (BBRAM, Flash, EEPROM, etc.)| **Part Number| Size| User Modifiable (Y/N)| ****Function| ****Process to Clear
** Secondary MCU| | 128 KB| Yes| Boot code and firmware| Before firmware update, the memory will be clear.
DCDC MCU| | 32 KB| Yes| Boot code and firmware| Before firmware update, the memory will be clear.
Liteon
Primary MCU| | 64K| Yes| Boot code and firmware| Before firmware update, the memory will be clear.
Secondary MCU| | 128K| ** Yes| Boot code and firmware| Before firmware update, the memory will be clear.
LOM
SPI Flash| | 8 MB| Yes| Firmware| User cannot clear the memory
R1A/R1B/R1C/R1-Paddle/R2A/R2B/R3A/R3-Paddle/R4A/R4B
MCU| | 8 kB| No| Riser information| User cannot clear the memory
STD/LC RIO**
MCU| | 8 kB| No| Rear IO Information| User cannot clear the memory

References

Industrial Security Field Operations (ISFO) Process Manual for Certification and Accreditation of Classified Systems under the National Industrial Security Programs Operating Manual (NISPOM)”, Revised March 1, 2010 Defense Security Service
DoD 5220.22-M, “National Industrial Security Program Operating Manual (NISPOM)”
United States Department of Defense. Revised February 28, 2006.
http://www.dss.mil/isp/fac_clear/download_nispom.html
ODAA Process Guide for C&A of Classified Systems under NISPOM
Defense Security Service
http://www.dss.mil/isp/odaa/request.html
Health Insurance Portability and Accountability Act of 1996 (HIPAA, Title II)
http://www.cms.gov/HIPAAGenInfo/02_TheHIPAALawandRelated%20Information.asp
Gramm–Leach–Bliley Act (GLB), also known as the Financial Services Modernization Act of 1999, (Pub.L. 106102, 113 Stat. 1338)
http://www.gpo.gov/fdsys/pkg/PLAW-106publ102/content- detail.html
Sarbanes–Oxley Act of 2002 (Pub.L. 107-204, 116 Stat. 745, enacted July 30, 2002)
http://www.gpo.gov/fdsys/pkg/PLAW-107publ204/content- detail.html
Payment Card Industry Data Security Standard (PCI DSS)
https://www.pcisecuritystandards.org/pdfs/pr_080930_PCIDSSv1-2.pdf