DELL 500T Power Store User Guide
- June 29, 2024
- Dell
Table of Contents
- DELL 500T Power Store
- Product Information
- Product Usage Instructions
- Platform overview
- Description
- Base enclosure component descriptions
- Base enclosure embedded modules and 4-port cards
- Base enclosure I/O module types
- 24 Drive 2.5 Inch NVMe expansion enclosure (ENS24) component descriptions
- NVMe expansion enclosure LCC
- NVMe expansion enclosure internal components
- Technical specifications
- Dimensions and weight for the PowerStore 500T|
- Power requirements for PowerStore 500T
- Operating environment limits
- Air quality requirements
- References
- Read User Manual Online (PDF format)
- Download This Manual (PDF format)
DELL 500T Power Store
Specifications
- Model : Dell PowerStore 500T
- Version : 4.x
- Release Date : May 2024
Product Information
Platform Overview
The Dell PowerStore 500T is a high-performance storage solution designed to
meet the demands of modern data centers. It features a 2U, 25-drive base
enclosure that includes slots for 25 2.5-inch NVMe drives, a midplane, two
nodes, power supply module (AC or DC), and EMI shielding.
Drives
Each drive in the base enclosure is housed in a drive carrier, which
ensures smooth and reliable contact with the enclosure slot guides and mid-
plane connectors. The drive carriers have a handle with a latch and spring
clips for secure installation. Drive activity and fault LEDs are located on
the front of the enclosure. The PowerStore 500T supports two types of drives:
NVMe SSD and NVMe SCM. NVMe SSD drives in the PowerStore 500T are TLC-based.
Supported Drive Types
- NVMe SSD – QLC-based for PowerStore 3200Q, TLC-based for other models
- NVMe SCM – Can be mixed with NVMe SSD drives in the same base enclosure
NOTE: A minimum of six NVMe SSD or NVMe SCM drives must be installed in the base enclosure for proper initialization.
Product Usage Instructions
Installing Drives
- Ensure the PowerStore 500T is powered off before installing or removing drives.
- Open the drive carrier handle by releasing the latch and spring clips.
- Insert the NVMe SSD or NVMe SCM drive into the carrier ensuring proper alignment.
- Close the handle to secure the drive in place.
- Repeat the above steps for each drive to be installed.
Powering On the System
- Connect the PowerStore 500T to a power source using the provided power supply module.
- Press the power button on the front panel of the enclosure to turn on the system.
- Wait for the system to initialize and verify that all drive LEDs indicate proper activity.
FAQ
-
Q: What should I do if the base enclosure does not initialize
- A: If the base enclosure does not initialize, ensure that a minimum of six NVMe SSD or NVMe SCM drives are installed. If the issue persists, contact technical support for further assistance.
Dell PowerStore
Hardware Information Guide for PowerStore 500T Model
Version 4.x
Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better
use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss
of data and tells you how to avoid the problem.
WARNING: A WARNING indicates a potential for property damage, personal
injury, or death.
© 2020 – 2024 Dell Inc. or its subsidiaries. All rights reserved. Dell Technologies, Dell, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners.
Preface
As part of an improvement effort, revisions of the software and hardware
are periodically released. Some functions that are described in this document
are not supported by all versions of the software or hardware currently in
use. The product release notes provide the most up-to-date information about
product features. Contact your service provider if a product does not function
properly or does not function as described in this document.
NOTE: PowerStore X model customers: For the latest how-to technical manuals and guides for your model, download the PowerStore 3.2.x Documentation Set from the PowerStore Documentation page at dell.com/powerstoredocs.
Where to get help
Support, product, and licensing information can be obtained as follows
- Product information— For product and feature documentation or release notes, go to the PowerStore Documentation page at dell.com/powerstoredocs.
- Troubleshooting— For information about products, software updates, licensing, and service, go to Dell Support and locate the appropriate product support page.
- Technical support— For technical support and service requests, go to Dell Support and locate the Service Requests page. To open a service request, you must have a valid support agreement. Contact your Sales Representative for details about obtaining a valid support agreement or to answer any questions about your account.
Platform overview
Topics
Description
PowerStore 500T appliances serve Block and File services, and the software
stack is deployed directly on the system.
The PowerStore 500T hardware consists of a 2U, two node storage solution. The
enclosure as a whole is called a base enclosure.
Between the front and rear of the enclosure, a mid-plane distributes power and signals to all the enclosure components. On the front of the base enclosure, drives connect to the mid-plane. On the rear of the base enclosure, the nodes and power supply modules connect to the mid-plane. The I/O modules connect directly to the node. Each node contains an internal battery backup module, redundant fan modules, DDR4 memory, and one Intel Cascade Lake 12C processor.
Base enclosure component descriptions
Topics
- Base enclosure component overview
- Base enclosure front view
- Base enclosure rear view
- Node internal components
Base enclosure component overview
The 2U, 25-drive base enclosure consists of the following components
- Slots for 25 2.5-inch NVMe drives
- Midplane
- Two nodes
- Power supply module (AC or DC)
- EMI shielding
Drives
Each drive resides in a drive carrier. The drive carriers are metal and
plastic assemblies that provide smooth, reliable contact with the enclosure
slot guides and mid-plane connectors. Each carrier has a handle with a latch
and spring clips. The latch holds the drive in place to ensure proper
connection with the mid-plane. Drive activity and fault LEDs are on the front
of the enclosure.
There are two supported drive types
- NVMe SSD
- The NVMe SSD drives in the PowerStore 3200Q are QLC-based.
- The NVMe SSD drives in all other PowerStore models are TLC-based.
- NVMe SCM
You can mix NVMe SSD and NVMe SCM drives in the same base enclosure. If you mix drive types, the system uses the NVMe SCM drives for metadata tiering.
NOTE: A minimum of six NVMe SSD or NVMe SCM drives must be installed in the base enclosure. If the minimum number of drives is not populated, the base enclosure will not initialize.
Midplane
The mid-plane separates the front-facing drives from the rear-facing nodes. It
distributes power and signals to all components in the enclosure. The nodes
and drives plug directly into the mid-plane.
Nodes
Each base enclosure contains two nodes. The node is the intelligent component
providing the compute capability of the base enclosure.
Node power supply module
Each node contains a power supply module that connects the system to an
exterior power source. The system supports either AC power or DC power. If one
power supply fails, the redundant power supply can keep the entire base
enclosure running.
The power supplies include LEDs to indicate component status. A latch on the
module locks it into place to ensure proper connection.
EMI shielding
EMI compliance requires a properly installed electromagnetic interference
(EMI) shield in front of the base enclosure drives. When installed in cabinets
that include a front door, the base enclosure includes a simple EMI shield.
Other installations require a front bezel that has a locking latch and
integrated EMI shield. Remove the bezel or shield to remove and install the
drives.
Base enclosure front view
The front of the base enclosure contains the following elements
Table 1. Base enclosure component locations
Location | Description |
---|---|
1 | SSD or SCM NVMe drives |
2 | Base enclosure power on LED |
3 | Drive power and activity LED |
4 | Drive fault LED |
Table 2. Base enclosure and drive LEDs
LED | Location | State | Description |
---|---|---|---|
Drive fault | 1 | Amber | Fault has occurred. |
Off | No fault has occurred. | ||
Drive activity | 2 | Blue | Drive activity. |
Off | The drive is powered off. | ||
Base enclosure power and fault | 3 | Blue | Power is on. No fault has occurred. |
Amber* | Power is on. Fault has occurred within the enclosure. | ||
Blue and amber alternating | System not initialized. | ||
Off | The power is off. |
Failure of the following components results in the amber fault state
- Fan module
- Power supply
- DIMM
- Internal battery backup module
- Node
- Embedded module
- 4-port card
- I/O module
- Internal M.2 boot module
System identification tags
The Service Tag and World Wide Name Seed are serialized labels for tracking
hardware components.
Service Tag
The Service Tag for the 25-slot base enclosure is a black pull-out tag that is
located between the drives in slots 16 and 17. The Service Tag includes the
following information:
- Quick Resource Locator (QRL)
- Array Model Name
- Dell Service Tag Number (ST) with seven alphanumeric characters
- Express Service Number (EX)
World Wide Name Seed Tag
The World Wide Name (WWN) Seed Tag is a blue pull-out tag that is located
between the drives in slots 7 and 8. The WWN Seed Tag includes the following
information
- Serial Number (SN) that matches the Dell Service Tag Number on the black Service Tag
- Part Number (PN)
- Serial Number (SN) with 14 alphanumeric characters
- WWN Seed
Base enclosure rear view
The rear of the base enclosure contains two nodes: node A and node B. Each
node contains the following hardware components
- One embedded module
- Two optional I/O modules
- One power supply module with either AC power or DC power
NOTE: The figure below shows the AC power supply.
Table 3. Base enclosure hardware component locations
Location | Description |
---|---|
1 | Node B |
Table 3. Base enclosure hardware component locations (continued)
Location | Description |
---|---|
2 | Power supply module |
3 | I/O module slots 0 and 1 |
4 | Embedded module |
5 | Node A |
Base enclosure embedded modules and 4-port cards
About embedded modules
Each node contains one embedded module that can hold one 4-port card for
front-end connectivity and internal communication between nodes and
appliances. The first two ports of the 4-port card on the embedded module
connect to a Top-of-Rack (ToR) switch. The second two ports are reserved for
backend connectivity to an NVMe expansion enclosure.
The 4-port card is optional if the base enclosure is configured for block-
optimized storage and is not part of a cluster.
NOTE: Both nodes must have the same type of embedded modules in the same slots.
The embedded module contains the following components
- One 4-port card (optional)
- Two fixed 10GbE optical ports
- Two RJ45 LAN connectors
- System management port ( )
- Service port ( )
- One USB port
- One non-maskable interrupt (NMI) button
- One mini-serial port (unused)
- One micro DB9 serial port (service)
NOTE: The following figure shows the location of these components on the embedded module in node A. The locations of the components in node B are mirrored.
Figure 6. Embedded module rear view with component locations
Table 4. Embedded module component locations
Location | Description |
---|---|
1 | 4-port card |
2 | RJ 45 LAN connector – system management port |
3 | Micro DB9 serial port (service) |
4 | Fixed 10GbE optical ports |
5 | Mini serial port (unused) |
Table 4. Embedded module component locations (continued)
Location | Description |
---|---|
6 | RJ45 LAN connector – service port |
7 | USB port |
8 | Non-maskable interrupt (NMI) button |
About the 4-port card
The 4-port card is an optional 25GbE SFP-based component that is located
within the embedded module. The 4-port card is required for connecting to NVMe
expansion enclosures.
The 4-port 25GbE SFP based embedded module supports 10GbE or 25GbE SFP28, 25GbE passive TwinAx, and 10GbE active or passive TwinAx. The ports may be configured individually with TwinAx or any of the supported SFPs.
NOTE: 25GbE SFPs only support 25GbE speeds.
Embedded module and 4-port card LED status
Figure 7. Embedded module LEDs
Table 5. Embedded module LEDs
LED | Location | State | Description |
---|---|---|---|
Unsafe to remove | 1 | White | Do not remove the node. Improper removal could |
cause data loss.
Off| Safe to remove the embedded module when the embedded module has been
properly prepared.
Node power| 2| Green| Node is on (main power).
Green blinking| Node is initializing a serial over LAN session.
Off| Node is off.
Node fault| 3| Amber| Fault has occurred.
Blue| Node in Degraded Mode.
Amber or blue blinking| The system is booting.
Blue and amber alternating (green for 3 seconds)| System not initialized. A
management IP address has not been assigned.
Blue and amber alternating at one second intervals.| Node in Service Mode.
Off| No fault has occurred, normal operation.
Table 5. Embedded module LEDs (continued)
LED | Location | State | Description |
---|---|---|---|
4-port card port link | 4 | Green | Link up with high speed. |
Amber | Link up with degraded speed. | ||
Off | Link down. | ||
Ethernet port activity | 5 | Amber blinking | Port activity. |
Off | No port activity. | ||
Ethernet port link | 6 | Green | Link established. |
Off | No link was established. | ||
2-port card port link | 7 | Green | Link up with high speed. |
Amber | Link up with degraded speed. | ||
Off | Link down. | ||
Embedded module fault | 8 | Amber | Embedded module has faulted. |
Off | No fault has occurred, normal operation. |
Base enclosure I/O module types
4-port 25GbE SFP based I/O module
The 4-port 25GbE SFP based I/O module is an Ethernet I/O module that is used
to serve Ethernet network traffic and iSCSI block protocol to hosts for the
platform. The I/O module supports 10GbE SFP, 10GbE active and passive TwinAx,
25GbE SFP28, and 25GbE passive TwinAx.
4-port BaseT I/O module
The 4-port BaseT I/O module can interface at speeds of 1 Gb/s and 10 Gb/s and
supports both Ethernet network traffic and iSCSI (Block) on the same node.
Ports can be configured as both IP and iSCSI simultaneously. The I/O module
comes with four 10-Gb/s RJ-45 ports, one power/fault LED, activity LED, and
link LED for each port.
4-port 32Gb Fibre Channel I/O module
The 4-port 32Gb Fibre Channel I/O module is used to serve Fibre Channel block
protocol via SAN to hosts for the platform. The I/O module is available with
either 16G FC SFP modules or with 32G FC SFP modules. Each port has an optical
16G/32G capable SFP connection to a host or switch port.
I/O module LED status
Figure 8. Base enclosure 4-port I/O module LEDs
Table 6. Base enclosure 4-port I/O module LEDs
LED | Location | State | Description |
---|---|---|---|
Port link | 1 | Green or blue | Link up |
Off | Link down | ||
Power fault | 2 | Green | Power on |
Amber | Power fault |
Base enclosure AC power supply
Table 7. Base enclosure AC power supply LEDs
LED | Location | State | Description |
---|---|---|---|
Fault | 1 | Solid amber | Power supply or backup fault. Check the cable |
connection.
Off| No fault.
Supply output status| 2| Green| Outputs are normal.
Off| Outputs are faulted or disabled.
AC power (input)| 3| Green| AC power is on.
Off| AC power is off. Verify the source power.
Base enclosure DC power supply
Table 8. Base enclosure DC power supply LEDs
LED | Location | State | Description |
---|---|---|---|
DC power (input) | 1 | Green | DC power is on. |
Off | DC power is off. Verify the source power. | ||
DC power (output) | 2 | Green | The power supply is operating normally. |
Off | The power supply is not operating properly. | ||
Fault | 3 | Amber | Power supply fault. Check the cable connection. |
Amber blinking | Over temperature fault. | ||
Off | No fault. |
Node internal components
Included within the node are the following components
- Dual inline memory modules (DIMMs)
- Internal battery backup module
- Internal M.2 boot module
- Fan modules
Dual inline memory modules
Six 288-pin DIMM sockets with six 16 GB DDR4 DIMMs for 96 GB of DDR4 memory.
Internal battery backup module
Provides power to the CPU and enables cache vaulting during power loss or node
panic. Encrypts and backs up cache data to the internal M.2 boot module.
Internal M.2 boot module
Each node has one 240 GB internal M.2 boot module.
Fan modules
Six redundant fan modules connect to the motherboard within the node. These
fan modules provide continuous airflow through the front drives and through
the rear of the node to keep the components at optimal operating temperatures.
Each fan module contains two fan rotors.
NOTE: If two fan rotors fail within the same node, the system performs a protective thermal shutdown of the node.
24 Drive 2.5 Inch NVMe expansion enclosure (ENS24) component descriptions
Topics
NVMe expansion enclosure
NVMe expansion enclosure
The NVMe expansion enclosure includes slots for 24 2.5-inch NVMe SSD drives.
It uses an NVMe interface for communication between the nodes and the NVMe
expansion enclosure. The NVMe expansion enclosure uses the RDMA over Converged
Ethernet (RoCE) network protocol to enable Remote Direct Memory Access (RDMA).
This allows the system to encapsulate RDMA packets over Ethernet, which
results in low latency, lower CPU usage, and higher bandwidth. Because
PowerStore utilizes an NVMe over Fabric (NVMe/OF) standard, the NVMe expansion
enclosure delivers an end-to-end NVMe solution.
NOTE: The NVMe expansion enclosure requires that the base enclosure
includes a 25 GbE 4-port card.
NOTE: The NVMe expansion enclosure does not support NVMe SCM drives and
is not supported with SCM-only base enclosures.
NVMe expansion enclosure front view
The NVMe expansion enclosure front view includes the following components:
- PCIe NVMe SSD drives in 2.5-inch carriers (hot-swappable)
- Status LEDs
Table 9. NVMe expansion enclosure front view component locations
Location | Description |
---|---|
1 | Expansion enclosure status LEDs |
2 | 2.5-inch NVMe drives |
3 | Drive status and activity (blue) |
Table 9. NVMe expansion enclosure front view component locations (continued)
Location | Description |
---|---|
4 | Drive fault LED (amber) |
5 | World Wide Name (WWN) Seed Tag |
6 | Service Tag |
Table 10. Drive status LEDs
LED | Location | Color | State | Description |
---|---|---|---|---|
Drive power and activity | 3 | Blue | On | Powering up and powered up |
Blinking | Drive activity | |||
Drive fault | 4 | Amber | On | Fault |
— | Off | No fault |
Table 11. NVMe expansion enclosure front view status LEDs
LED | Location | Color | State | Description |
---|---|---|---|---|
Drive Status | 1 | Amber | On | Drive fault, unsupported drive, or rebuilding |
Green | On | No fault | ||
Temperature Status | 2 | Amber | On | Overheating component |
Green | On | No fault | ||
Electrical Status | 3 | Amber | On | PSU failure or incorrect voltage range |
Green | On | No fault | ||
Memory Status | 4 | Amber | On | DIMM failure |
Green | On | No fault | ||
Drive Interface Status | 5 | Amber | On | Clockboard or Ethernet interface failure |
Green | On | No fault | ||
Indication LED | 6 | — | Off | Powered on and healthy |
Blue | Blinking | System ID mode enabled | ||
Amber | Blinking | Hardware fault |
NVMe expansion enclosure rear view
The rear of the NVMe expansion enclosure includes the following components:
- Two Link Controller Cards (LCCs) that contain the following components:
- Access Module
- Drive Interface Board located behind the Access Module
- Two power supply modules
Table 12. NVMe expansion enclosure hardware component locations
Location | Description |
---|---|
1 | LCC 1 |
2 | Access Module |
3 | Power supply module |
4 | LCC 2 |
5 | Drive Interface Board |
NVMe expansion enclosure LCC
About LCCs
Each NVMe expansion enclosure contains two LCCs, and each LCC contains an
Access Module and a Drive Interface Board that is located behind the Access
Module. The Drive Interface Board connects the front-end to the back-end and
contains the PCIe switches that connect the drives and the Access Module.
The Access Module manages and reports the environmental conditions of the NVMe expansion enclosure such as power, thermal, status indicators, and component presence. The Access Module employs NVMe-oF (NVMe over Fabrics) technology by using RDMA over Converged Ethernet (RoCE) for Ethernet. This technology allows the Access Module to perform the translation of the persistent storage data received over the Ethernet interfaces and transfer it onto the PCIe connections of the NVMe drives. The Access Module also applies the data protection that is deployed by the system.
The Access Module contains the following components
- Two 100GbE ports (QSFP28) for connecting the NVMe expansion enclosure to the base enclosure and for daisy chaining additional NVMe expansion enclosures.
- One micro USB port (not used)
- One USB port (not used)
- Two 1GbE RJ45 management ports (for support only)
The following figure shows the location of these components
Table 13. Access Module component locations
Location | Description |
---|---|
1 | 100GbE ports (QSFP28) |
2 | Micro USB port (not used) |
3 | USB port (not used) |
4 | 1GbE RJ45 management ports (for support only) |
Table 14. Access Module LEDs
LED | Location | State | Description |
---|---|---|---|
Power status | 1 | Green | Power on. |
Off | Power off. | ||
Fault status | 2 | Amber | Faulted hardware. |
Off | No fault has occurred. Normal operation. | ||
System ID | 3 | Blinking blue | System ID mode is enabled. |
Off | System ID mode is not enabled. | ||
Daisy chain ID | 4 | 50–52 | Identifies where in the daisy chain the expansion |
enclosure is located:
- 50 – First expansion enclosure
- 51 – Second expansion enclosure
- 52 – Third expansion enclosure
NVMe expansion enclosure AC power supply
The NVMe expansion enclosure includes two 1800W AC power supplies.
Table 15. NVMe expansion enclosure AC power supply LEDs
LED|
---|---
Fault|
DC power (output) – Not supported|
AC power (input)|
NVMe expansion enclosure internal components
Included within the NVMe expansion enclosure are the following components:
Fan modules
Six redundant fan modules provide continuous airflow through the front drives
and through the rear of the expansion enclosure to keep the components at
optimal operating temperatures. Each fan module contains two fan rotors.
NOTE: If three fan rotors fail in an expansion enclosure, the system performs a protective thermal shutdown of the expansion enclosure.
Figure 17. NVMe expansion enclosure fan modules
Clock Distribution Boards
Two Clock Distribution Boards provide a common clock to the drives.
Figure 18. NVMe expansion enclosure Clock Distribution Boards
Dual inline memory modules (DIMMs)
Two 8 GB DDR4 DIMMs provide 16 GB of memory. The DIMMs are located inside the
Access Module in slots 2 and 3.
Technical specifications
Topics
- Dimensions and weight for the PowerStore 500T
- Dimensions and weight for the NVMe expansion enclosure
- Power requirements for PowerStore 500T
- Power requirements for the NVMe expansion enclosure
- Considerations for TLC and QLC drives
- Operating environment limits
- Shipping and storage requirements
Dimensions and weight for the PowerStore 500T|
Table 16. Base enclosure dimensions and weight
Dimension | Value |
---|---|
Weight (fully populated) | 37.4 kg (82.4 lbs) |
Vertical size | Two NEMA units |
Height | 8.64 cm (3.4 in) |
Width | 44.45 cm (17.5 in) |
Depth | 79.5 cm (31.3 in) |
NOTE: The weight does not include mounting rails. Allow 3.6 kg (8 lbs) for a rail set.
Dimensions and weight for the NVMe expansion enclosure
Table 17. NVMe expansion enclosure dimensions and weight
Dimension | Value |
---|---|
Weight (fully populated) | 26.08 kg (57.5 lb) (not including cable management |
arms or mounting rails)
Vertical size| Two NEMA units
Height| 8.89 cm (3.5 in)
Width| 43.18 cm (17 in)
Depth| 65.30 cm (25.71 in)
Depth with cable management arms| 84.86 cm (33.41 in)
Power requirements for PowerStore 500T
Power requirements vary depending on system configuration, loading, and environmental conditions. The table below provides worst case data. To estimate power consumption values for your specific environment, use the Dell Power Calculator.
Table 18. Power requirements for AC power
Requirement | PowerStore 500T |
---|---|
Maximum input power | 100 to 240 VAC ± 10%, single phase |
AC line current (operating maximum) | 10 A max at 100 VAC |
5 A max at 200 VAC
Power consumption (operating maximum at 200 VAC)| 1004.1 VA (984 W)
Heat dissipation (operating maximum at 200 VAC)| 3.54 x 106 J/hr (3,358
Btu/hr)
AC inlet type (high line)| IEC320-C14 appliance coupler per power zone (200
VAC)
AC inlet type (low line)| IEC320-C20 appliance coupler per power zone (100
VAC)
Normal input frequency| 47 Hz–63 Hz
Maximum inrush current| 45 Apk “cold” per line cord at any line voltage
AC protection| 20 A fuse on each power supply, single line
Ride-through time| 10 ms min
Current sharing| ± 5 percent of full load between power supplies
Startup surge current| 120 Apk “hot” per line cord, at any line voltage
Table 19. Power requirements for DC power
Requirement | PowerStore 500T |
---|---|
DC line voltage | -39 to -72 DC |
DC line current (operating maximum) | 28.2 max at -39 VDC |
22.9 max at -48 VDC
15.3 max at -72 VDC
Power consumption (operating maximum)| 1100 W
Heat dissipation (operating maximum at 200 VAC)| 3.96 x 106 J/hr (3,753
Btu/hr)
DC inlet type| Positronics PLBH3W3M4B0A1/AA
Maximum inrush current| 40 A peak
DC protection| 50 A fuse in each power supply
Ride-through time| 1 ms min at -50 V input
Current sharing| ± 5 percent of full load between power supplies
Table 20. High ambient temperature shutdown
Ambient temperature | Hardware fault | Consequence |
---|---|---|
Above 45° C (113° F) | None | Noncritical warning generated . |
Above 50° C (122° F) | None | A critical alert is generated. The system shuts |
down after five minute timer expires. If the temperature
Table 20. High ambient temperature shutdown (continued)
Ambient temperature | Hardware fault | Consequence |
---|---|---|
returns to less than 45° C (113° F) , the system powers on. | ||
Any | The three hottest drives have an average temperature of 50° C (122° F) |
The system shuts down after five minute timer expires.
Any| Two fans fault| The system shuts down after five minute timer expires.
Power requirements for the NVMe expansion enclosure
Power requirements vary depending on system configuration, loading, and
environmental conditions. The table below describes the maximum expected power
draw. To estimate power consumption values for your specific environment, use
the Dell Power Calculator.
Table 21. Power requirements
Requirement | Description |
---|---|
AC line voltage | 100 to 240 VAC +/- 10%, single-phase, 47 to 63 Hz |
AC line current (operating maximum) | 6.49 A max at 100 VAC |
3.31 A max at 200 VAC
Power consumption (operating maximum at 200 VAC)| 663 VA (630 W)
Power factor| 0.92 minimum at full load 100V/200V
Heat dissipation (operating maximum at 200 VAC)| 2.27 x 106 J/hr (2,150
Btu/hr)
In-rush current| 82A max for 1/2 Line cycle per line cord at 200 VAC
Startup surge current| 100A Max for up to 125uSec
AC protection| 15 A fuse on each power supply, both Line and Neutral
AC inlet type| IEC320-C14 appliance coupler, per power zone
Ride-through time| 10-millisecond minimum
Current sharing| +/- 5% of full load between power supplies
Considerations for TLC and QLC drives
TLC drives retain data for up to 90 days while powered off. Data corruption
may occur if the drives are powered off for more than 90 days. QLC drives
retain data for up to 30 days while powered off. Data corruption may occur if
the drives are powered off for more than 30 days. Data corruption may occur
for either drive type if they are stored in temperatures above 40° C (104° F).
Limit Type | Limit |
---|---|
Temperature | 5°C through 35°C normal, 35°C through 40°C for 10% of the time |
Humidity | -12°C DP and 8% to 85% RH (non-condensing) |
Temperature Gradient (disk) | 20°C/hr |
Altitude Compensation | Normal: Lower temp 1°C per 300 M above 950 M |
Improbable: Lower temp 1°C per 175 M above 950 M
Operating environment limits
Table 22. Operating environment limits
Limit Type | Limit |
---|---|
Temperature | 5°C through 35°C normal, 35°C through 40°C for 10% of the time |
Humidity | -12°C DP and 8% to 85% RH (non-condensing) |
Temperature Gradient (disk) | 20°C/hr |
Altitude Compensation | Normal: Lower temp 1°C per 300 M above 950 M |
Improbable: Lower temp 1°C per 175 M above 950 M
Shipping and storage requirements
CAUTION: Systems and components must not experience changes in temperature and humidity that are likely to cause condensation to form on or in that system or component. Do not exceed the shipping and storage temperature gradient of 45°F per hr (25°C per hr).
Table 23. Shipping and storage requirements
Requirement | Description |
---|---|
Ambient temperature | -40° F to 149°F (-40°C to 65°C) |
Temperature gradient | 45°F per hr (25°C per hr) |
Relative humidity | 10% to 90% noncondensing |
Elevation | -50 ft to 35,000 ft (-16 m to 10,600 m) |
Unpowered storage time | Do not exceed six consecutive months of unpowered |
storage.
Base enclosure airflow
The base enclosure uses an adaptive cooling algorithm that increases or
decreases fan speed as the unit senses changes to the external ambient
temperature. Exhaust increases with ambient temperature and fan speed, and is
roughly linear within recommended operating parameters. Note that the
information in the table below is typical, and was measured without cabinet
front/rear doors that would potentially reduce front-to-back air flow.
Table 24. Base enclosure airflow
Max Airflow CFM | Min Airflow CFM | Max Power Usage (Watts) |
---|---|---|
165 CFM | 50 CFM | 850 W |
Environmental recovery
If the system exceeds the maximum ambient temperature by approximately 10°C
(18°F), the nodes in the system begin an orderly shutdown that saves cached
data, and then shut themselves down. Link control cards (LCCs) in each
expansion enclosure in the system power down drives but remain powered on.
If the system detects that the temperature has dropped to an acceptable level,
it restores power to the base enclosures and the LCCs restore power to their
drives.
Air quality requirements
The products are designed to be consistent with the requirements of the American Society of Heating, Refrigeration and Air Conditioning Engineers (ASHRAE) Environmental Standard Handbook and the most current revision of Thermal Guidelines for Data Processing Environments, Second Edition, ASHRAE 2009b.
Cabinets are best suited for Class 1 datacom environments, which consist of tightly controlled environmental parameters, including temperature, dew point, relative humidity and air quality. These facilities house mission-critical equipment and are typically fault-tolerant, including the air conditioners.
The data center should maintain a cleanliness level as identified in ISO 14664-1, class 8 for particulate dust and pollution control. The air entering the data center should be filtered with a MERV 11 filter or better. The air within the data center should be continuously filtered with a MERV 8 or better filtration system. In addition, efforts should be maintained to prevent conductive particles, such as zinc whiskers, from entering the facility.
The allowable relative humidity level is 20 to 80% non condensing, however, the recommended operating environment range is 40 to 55%. For data centers with gaseous contamination, such as high sulfur content, lower temperatures and humidity are recommended to minimize the risk of hardware corrosion and degradation. In general, the humidity fluctuations within the data center should be minimized. It is also recommended that the data center be positively pressured and have air curtains on entry ways to prevent outside air contaminants and humidity from entering the facility.
For facilities below 40% relative humidity, it is recommended to use grounding straps when contacting the equipment to avoid the risk of Electrostatic discharge (ESD), which can harm electronic equipment.
As part of an ongoing monitoring process for the corrosiveness of the
environment, it is recommended to place copper and silver coupons (per ISA
71.04-1985, Section 6.1 Reactivity), in airstreams representative of those in
the data center. The monthly reactivity rate of the coupons should be less
than 300 Angstroms. When monitored reactivity rate is exceeded, the coupon
should be analyzed for material species and a corrective mitigation process
put in place.
Storage time (unpowered) recommendation: do not exceed 6 consecutive months of
unpowered storage.
Fire suppressant disclaimer
Fire prevention equipment in the computer room should always be installed as
an added safety measure. A fire suppression system is the responsibility of
the customer. When selecting appropriate fire suppression equipment and agents
for the data center, choose carefully. An insurance underwriter, local fire
marshal, and local building inspector are all parties that you should consult
during the selection of a fire suppression system that provides the correct
level of coverage and protection.
Equipment is designed and manufactured to internal and external standards that
require certain environments for reliable operation. Compatibility claims and
recommendations on fire suppression systems are not provided through Dell. It
is not recommended to position storage equipment directly in the path of high-
pressure gas discharge streams or loud fire sirens to minimize the forces and
vibration adverse to system integrity.
NOTE: The previous information is provided on an as-is basis and provides no representations, warranties, guarantees, or obligations on the part of our company. This information does not modify the scope of any warranty set forth in the terms and conditions of the basic purchasing agreement between the customer and the manufacturer.
Shock and vibration
Products have been tested to withstand the shock and random vibration levels.
The levels apply to all three axes and should be measured with an
accelerometer on the equipment enclosures within the cabinet and shall not
exceed any of the values in this table.
Table 25. Platform Response Levels
Platform condition | Response measurement level |
---|---|
Nonoperational shock | 25 Gs for 3-milliseconds |
Operational shock | 6 Gs for 11-milliseconds |
Nonoperational random vibration | 0.40 Grms at 5-500 Hz for 30 minutes |
Operational random vibration | 0.21 Grms at a frequency range between 5-500 Hz |
for 10 minutes
Systems that are mounted on an approved package have completed transportation testing to withstand shock and vibrations in the vertical direction only. The levels shall not exceed the values in this table.
Table 26. Packaged System Measurement Levels
Packaged system condition| Response measurement
level
---|---
Transportation shock| 10 Gs for 12-milliseconds
Transportation random vibration| 0.28 Grms at a frequency range between 1-100
Hz for 4 hours
References
Read User Manual Online (PDF format)
Read User Manual Online (PDF format) >>