QUECTEL 5G RG620T Series Industrial Grade Sub 6GHz 5G Module User Manual
- June 26, 2024
- QUECTEL
Table of Contents
5G RG620T Series Industrial Grade Sub 6GHz 5G Module
“`html
Product Information
Specifications
- Product Name: 5G Module Series
- Vacuum-Sealed Packaging MSL: 3
- Shelf Life in Packaging: 12 months
Product Usage Instructions
8.1. Storage Conditions
The module is provided with vacuum-sealed packaging rated as MSL
3. Follow these storage guidelines:
-
Store in Recommended Storage Condition to avoid issues like
blistering and cracks. -
If pre-baking is needed, ensure a dry environment such as a dry
cabinet.
8.2. Manufacturing and Soldering
For manufacturing and soldering, follow these
recommendations:
-
Refer to the Recommended Reflow Soldering Thermal Profile (See
Figure 48). -
Ensure solder joints meet temperature requirements.
-
Avoid coating materials that may react with PCB or shielding
cover. -
Avoid ultrasonic cleaning as it can damage the module’s
crystals.
FAQ
Q: What should I do if the vacuum-sealed packaging is
broken?
A: If the vacuum-sealed packaging is broken, consider pre-baking
the module before use to prevent issues like blistering and
cracks.
Q: Can I clean the module using ultrasonic technology?
A: Avoid using ultrasonic technology for module cleaning as it
can damage the crystals inside the module.
Q: How should I handle the module to prevent ESD damage?
A: Pay attention to ESD protection by wearing anti-static gloves
when handling the modules to prevent damage.
“`
7.2. Recommended Footprint
5G Module Series
Figure 46: Recommended Footprint
. NOTE
Keep at least 3 mm between the module and other components on the motherboard
to improve soldering quality and maintenance convenience.
RG500L_Series_QuecOpen_Hardware_Design
95 / 114
7.3. Top and Bottom Views
5G Module Series
Figure 47: Top and Bottom Views of the Module
NOTE Images above are for illustration purpose only and may differ from the
actual module. For authentic appearance and label, please refer to the module
received from Quectel.
RG500L_Series_QuecOpen_Hardware_Design
96 / 114
5G Module Series
8 Storage, Manufacturing & Packaging
8.1. Storage Conditions
The module is provided with vacuum-sealed packaging. MSL of the module is
rated as 3. The storage requirements are shown below.
1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the
relative humidity should be 3560 %.
2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended
Storage Condition.
3. Floor life: 168 hours 24 in a factory where the temperature is 23 ±5 °C
and relative humidity is below 60 %. After the vacuum-sealed packaging is
removed, the module must be processed in reflow soldering or other high-
temperature operations within 168 hours. Otherwise, the module should be
stored in an environment where the relative humidity is less than 10 % (e.g.,
a dry cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer
separation in PCB under the following circumstances:
The module is not stored in Recommended Storage Condition; Violation of the
third requirement mentioned above; Vacuum-sealed packaging is broken, or the
packaging has been removed for over 24 hours; Before module repairing.
5. If needed, the pre-baking should follow the requirements below:
The module should be baked for 8 hours at 120 ±5 °C; The module must be
soldered to PCB within 24 hours after the baking, otherwise it should be put
in a dry environment such as in a dry cabinet.
24 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering.
RG500L_Series_QuecOpen_Hardware_Design
97 / 114
5G Module Series
NOTE 1. To avoid blistering, layer separation and other soldering issues,
extended exposure of the module to
the air is forbidden. 2. Take out the module from the package and put it on
high-temperature-resistant fixtures before baking.
If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking
procedure. 3. Pay attention to ESD protection, such as wearing anti-static
gloves, when touching the modules.
8.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus
making the paste fill the stencil openings and then penetrate to the PCB.
Apply proper force on the squeegee to produce a clean stencil surface on a
single pass. To guarantee module soldering quality, the thickness of stencil
for the module is recommended to be 0.150.18 mm. For more details, see
document [5].
The recommended peak reflow temperature should be 235246 ºC, with 246 ºC as
the absolute maximum reflow temperature. To avoid damage to the module caused
by repeated heating, it is strongly recommended that the module should be
mounted only after reflow soldering for the other side of PCB has been
completed. The recommended reflow soldering thermal profile (lead-free reflow
soldering) and related parameters are shown below.
Figure 48: Recommended Reflow Soldering Thermal Profile
RG500L_Series_QuecOpen_Hardware_Design
98 / 114
5G Module Series
Table 56: Recommended Thermal Profile Parameters
Factor Soak Zone Ramp-to-soak slope Soak time (between A and B: 150 °C and 200 °C) Reflow Zone Ramp-up slope Reflow time (D: over 217°C) Max temperature Cool-down slope Reflow Cycle Max reflow cycle
Recommended Value
03 °C/s 70120 s
03 °C/s 4070 s 235246 °C -30 °C/s
1
NOTE
1. The above profile parameter requirements are for the measured temperature
of the solder joints. Both the hottest and coldest spots of solder joints on
the PCB should meet the above requirements.
2. If a conformal coating is necessary for the module, do NOT use any coating
material that may chemically react with the PCB or shielding cover, and
prevent the coating material from flowing into the module.
3. Avoid using ultrasonic technology for module cleaning since it can damage
crystals inside the module. 4. Due to the complexity of the SMT process,
please contact Quectel Technical Supports in advance for
any situation that you are not sure about, or any process (e.g. selective
soldering, ultrasonic soldering) that is not mentioned in document [5].
8.3. Packaging Specifications
This chapter describes only the key parameters and process of packaging. All
figures below are for reference only. The appearance and structure of the
packaging materials are subject to the actual delivery.
The module adopts carrier tape packaging and details are as follow:
RG500L_Series_QuecOpen_Hardware_Design
99 / 114
8.3.1. Carrier Tape
Dimension details are as follows:
5G Module Series
Figure 49: Carrier Tape Dimension Drawing
Table 57: Carrier Tape Dimension Table (Unit: mm)
W
P
T
A0
B0
K0
K1
F
E
72
56
0.4
44.7
41.7
4.2
5.2
34.2
1.75
8.3.2. Plastic Reel
Figure 50: Plastic Reel Dimension Drawing RG500L_Series_QuecOpen_Hardware_Design
100 / 114
Table 58: Plastic Reel Dimension Table (Unit: mm)
øD1
øD2
380
180
8.3.3. Mounting Direction
5G Module Series
W 72.5
Figure 51: Mounting Direction
8.3.4. Packaging Process
Place the module into the carrier tape and use the cover tape to cover it;
then wind the heat-sealed carrier tape to the plastic reel and use the
protective tape for protection. 1 plastic reel can load 200 modules.
RG500L_Series_QuecOpen_Hardware_Design
101 / 114
Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it.
5G Module Series
Place the vacuum-packed plastic reel into the pizza box.
Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can
pack 800 modules.
Figure 52: Packaging Process
RG500L_Series_QuecOpen_Hardware_Design
102 / 114
5G Module Series
9 Related AT Commands
9.1. AT+CFUN Set UE Functionality
This command controls the functionality level. It can also be used to reset the UE.
AT+CFUN=0 turns off radio and (U)SIM power. AT+CFUN=1,1 or AT+CFUN=4,1 can reset the UE. AT+CFUN=1 enters full functionality mode. AT+CFUN=4 enters airplane mode.
AT+CFUN Set UE Functionality
Test Command AT+CFUN=?
Response +CFUN: (list of supported
Read Command AT+CFUN?
OK Response +CFUN:
Write Command AT+CFUN=
OK Response OK
Maximum Response Time Characteristics Reference
If there is any error related to MT functionality: +CME ERROR:
/
3GPP TS 27.007
RG500L_Series_QuecOpen_Hardware_Design
103 / 114
5G Module Series
Parameter
Integer type. Functionality level.
0
Minimum functionality (Disable RF function and (U)SIM function)
1
Full functionality
4
Airplane mode (Disable RF function)
15
Reboot the modem and AP synchronously
Integer type.
0
Do not reset the UE before setting it to
(Default value when
1
Reset the UE before setting it to
Error code.
Example
AT+CFUN=0 OK AT+CFUN=1 OK
//Switch UE to minimum functionality. //Switch UE to full functionality.
NOTE
1. AT+CFUN=1,1 or AT+CFUN=4,1 can only reset the UE, which is not fully
compliable with 3GPP TS 27.007.
2. The execution of AT+CFUN command will not affect GNSS function.
9.2. AT+QSCLK Enable/Disable Sleep Mode
This command controls whether MT enters sleep mode. When entering into sleep mode is enabled, the MT can directly enter sleep mode.
AT+QSCLK Enable/Disable Sleep Mode
Test Command AT+QSCLK=?
Response +QSCLK: (list of supported
Read Command AT+QSCLK?
OK Response +QSCLK:
Write Command
OK Response
RG500L_Series_QuecOpen_Hardware_Design
104 / 114
AT+QSCLK=
OK 300 ms /
5G Module Series
Parameter
Integer type. Enable/disable sleep mode.
0 Disable
1 Enable
NOTE
1. AT+QSCLK=1 enables the module to enter sleep mode. At this time, the USB
is powered down and the module’s modem part enters airplane mode.
2. AT+QSCLK=0 disables the module to enter sleep mode. At this time, the USB
is powered up and the module’s modem part is in normal operating mode. Under
such condition, the module will never go into sleep mode.
9.3. AT+QADC Read ADC Value
This command reads the voltage value of specified ADC channel.
AT+QADC Read ADC Value
Test Command AT+QADC=?
Response +QADC: (range of supported
Read Command AT+QADC=
OK Response +QADC:
Maximum Response Time Characteristics
OK 300 ms /
RG500L_Series_QuecOpen_Hardware_Design
105 / 114
5G Module Series
Parameter
Integer type. Channel number of the ADC. 0 ADC channel 0 1 ADC channel 1 2 ADC channel 2 Integer type. Indicates whether the ADC value read is successful. 0 Failed 1 Successful Integer type. The voltage of specified ADC channel. Unit: mV.
RG500L_Series_QuecOpen_Hardware_Design
106 / 114
5G Module Series
10 Appendix References
Table 59: Related Documents Document Name [1] Quectel_RG500L_EVB_User_Guide [2] Quectel_RG500L_Series_Quecopen_GNSS_Application_Note [3] Quectel_RF_Layout_Application_Note [4] RG500L_Series_QuecOpen_Thermal_Design_Guide [5] Quectel_Module_SMT_Application_Note
Table 60: Terms and Abbreviations
Abbreviation ADC bps CA CHAP CPE CS CTS DC-HSDPA DL DRX ESD FDD
Description Analog-to-Digital Converter Bits Per Second Carrier Aggregation Challenge Handshake Authentication Protocol Customer-Premises Equipment Coding Scheme Clear To Send Dual-carrier High Speed Downlink Packet Access Downlink Discontinuous Reception Electrostatic Discharge Frequency Division Duplex
RG500L_Series_QuecOpen_Hardware_Design
107 / 114
FR GLONASS GNSS GPS HB HPUE HR HSDPA HSPA HSUPA IC I2C I2S I/O LB LED LGA LNA LTE MAC MB MCU MDC MDIO MHB MIMO NR
Full Rate Global Navigation Satellite System (Russia) Global Navigation Satellite System Global Positioning System High Band High Power User Equipment Half Rate High Speed Downlink Packet Access High Speed Packet Access High Speed Uplink Packet Access Integrated Circuit Inter-Integrated Circuit Inter- IC Sound Input/Output Low Band Light Emitting Diode Land Grid Array Low Noise Amplifier Long Term Evolution Media Access Control Middle Band Microcontroller Unit Management Data Clock Management Data Input/Output Middle/High Band Multiple Input Multiple Output New Radio
RG500L_Series_QuecOpen_Hardware_Design
5G Module Series 108 / 114
NSA PA PAP PC PCB PCIe PCM PDU PHY PMIC PRX QAM QPSK RF RHCP RX SA SCS SD SIMO SMD SMS SPI TDD TRX TX UART
Non-Stand Alone Power Amplifier Password Authentication Protocol Personal Computer Printed Circuit Board Peripheral Component Interconnect Express Pulse Code Modulation Protocol Data Unit Physical Layer Power Management Integrated Circuit Primary Receive Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Right Hand Circularly Polarized Receive Stand Alone Sub-Carrier Space Secure Digital Single Input Multiple Output Surface Mount Device Short Message Service Serial Peripheral Interface Time Division Duplexing Transmit & Receive Transmit Universal Asynchronous Receiver/Transmitter
RG500L_Series_QuecOpen_Hardware_Design
5G Module Series 109 / 114
UL UMTS USB (U)SIM VBAT Vmax Vnom Vmin VIHmax VIHmin VILmax VILmin VImax VImin VOHmax VOHmin VOLmax VOLmin VSWR WCDMA WLAN WWAN
Uplink Universal Mobile Telecommunications System Universal Serial Bus Universal Subscriber Identity Module Voltage at Battery (Pin) Maximum Voltage Value Nominal Voltage Value Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value Absolute Minimum Input Voltage Value Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value Voltage Standing Wave Ratio Wideband Code Division Multiple Access Wireless Local Area Network Wireless Wide Area Network
5G Module Series
RG500L_Series_QuecOpen_Hardware_Design
110 / 114
5G Module Series
11 Warning statements
11.1. FCC
11.1.1. Important Notice to OEM integrators
1. This module is limited to OEM installation ONLY. 2. This module is limited
to installation in mobile or fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations,
including portable configurations with respect to Part 2.1093 and different
antenna configurations 4. For FCC Part 15.31 (h) and (k): The host
manufacturer is responsible for additional testing to verify compliance as a
composite system. When testing the host device for compliance with Part 15
Subpart B, the host manufacturer is required to show compliance with Part 15
Subpart B while the transmitter module(s) are installed and operating. The
modules should be transmitting and the evaluation should confirm that the
module’s intentional emissions are compliant (i.e. fundamental and out of band
emissions). The host manufacturer must verify that there are no additional
unintentional emissions other than what is permitted in Part 15 Subpart B or
emissions are complaint with the transmitter(s) rule(s). The Grantee will
provide guidance to the host manufacturer for Part 15 B requirements if
needed.
11.1.2. Important Note
notice that any deviation(s) from the defined parameters of the antenna trace,
as described by the instructions, require that the host product manufacturer
must notify to XXXX that they wish to change the antenna trace design. In this
case, a Class II permissive change application is required to be filed by the
USI, or the host manufacturer can take responsibility through the change in
FCC ID (new application) procedure followed by a Class II permissive change
application.
11.1.3. End Product Labeling
When the module is installed in the host device, the FCC ID label must be
visible through a window on the final device or it must be visible when an
access panel, door or cover is easily re-moved. If not, a second label must be
placed on the outside of the final device that contains the following text:
“Contains FCC ID: XMR2023RG500LLA” The FCC ID can be used only when all FCC
compliance requirements are met.
RG500L_Series_QuecOpen_Hardware_Design
111 / 114
5G Module Series
11.1.4. Antenna Installation
(1) The antenna must be installed such that 20 cm is maintained between the
antenna and users, (2) The transmitter module may not be co-located with any
other transmitter or antenna. (3) Only antennas of the same type and with
equal or less gains as shown below may be used with this module. Other types
of antennas and/or higher gain antennas may require additional authorization
for operation.
RG500L-LA: Dipole antenna &FPC Antenna & PCB Antenna
Band
Frequency (MHz)
Gain (dBi)
WCDMA B2/LTE-FDD B2
1850-1910
0.75
5G NR n2
1850-1910
0.73
WCDMA B4
1710-1755
0.33
LTE FDD B4
1710-1755
3.1
WCDMA B5
824-849
-10.68
LTE-FDD B5
824849
1.6
5G NR n5
824849
-10.68
LTE-FDD B7
25002570
4.0
5G NR n7
25002570
1.42
LTE-FDD B8
880-915
-8.6
LTE-FDD B28/5G NR n28
703-748
-8.7
LTE-FDD B42
3400-3600
-4.29
LTE-FDD B66
1710-1780
3.1
5G NR n66
1710-1780
-0.2
5G NR n78
33003800
6.5
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
11.1.5. Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user
regarding how to install or remove this RF module in the user’s manual of the
end product which integrates this module. The end user manual shall include
all required regulatory information/warning as show in this manual.
11.1.6. Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to
the following two conditions: (1) This device may not cause harmful
interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
RG500L_Series_QuecOpen_Hardware_Design
112 / 114
5G Module Series
This equipment has been tested and found to comply with the limits for a Class
B digital device, pursuant to Part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with the
instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one of the
following measures: – Reorient or relocate the receiving antenna. – Increase
the separation between the equipment and receiver. – Connect the equipment
into an outlet on a circuit different from that to which the receiver is
connected. – Consult the dealer or an experienced radio/TV technician for
help.
Any changes or modifications not expressly approved by the party responsible
for compliance could void the user’s authority to operate this equipment. This
transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter.
11.1.7. List of applicable FCC rules
This module has been tested and found to comply with part 22, part 24, part
27, part 90, 15.247 and 15.407 requirements for Modular Approval. The modular
transmitter is only FCC authorized for the specific rule parts (i.e., FCC
transmitter rules) listed on the grant, and that the host product manufacturer
is responsible for compliance to any other FCC rules that apply to the host
not covered by the modular transmitter grant of certification. If the grantee
markets their product as being Part 15 Subpart B compliant (when it also
contains unintentional-radiator digital circuity), then the grantee shall
provide a notice stating that the final host product still requires Part 15
Subpart B compliance testing with the modular transmitter installed.
11.1.8. This device is intended only for OEM integrators under the following
conditions:(For module device use)
- The antenna must be installed such that 20 cm is maintained between the
antenna and users, and 2) The transmitter module may not be co-located with
any other transmitter or antenna. As long as 2 conditions above are met,
further transmitter test will not be required. However, the OEM integrator is
still responsible for testing their end-product for any additional compliance
requirements required with this module installed.
11.1.9. Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
RG500L_Series_QuecOpen_Hardware_Design
113 / 114
5G Module Series
This equipment should be installed and operated with minimum distance 20 cm
between the radiator & your body.
trace design
RG500L_Series_QuecOpen_Hardware_Design
114 / 114
Read User Manual Online (PDF format)
Read User Manual Online (PDF format) >>