TAIWAN SEMICONDUCTOR 821-TSS42L AN-1005 Discrete Semiconductors Instruction Manual
- June 4, 2024
- TAIWAN SEMICONDUCTOR
Table of Contents
AN-1005
Mounting and lead forming instructions for
TO220 package
Introduction .
Purpose
The objective in this document is to discuss the mounting and lead forming for
TO-220 package,
and provide user the guideline for appropriate handling.
Scope
The document describes the mounting considerations that contain screw torque
mounting
methods, lead forming process and soldering recommendation value in the
application.
The influence on mounting of To-220
Thermal Resistance
The RӨJA is junction to ambient thermal resistance and it consists of many
thermal resistances. The
relationship between them is shown as following:
RӨJA = RӨJC + RӨCH + RӨH + RӨHA
RӨJC : Junction-Case thermal resistance
RӨCH : Case-Heat sink thermal resistance
RӨH : Heat sink thermal resistance
RӨHA : Heat sink-Ambient resistance
Fig 1. Thermal resistance structure
The contact surface between device and heat sink significantly affect thermal
performance. The bad
contact can cause air gap between them and thermal resistance can be
increased. When the
device’s heat cannot be effectively transferred to heat sink, it might cause
excessive heat to damage
the device.
Hence, the mounting torque is importance in application. If the torque is too
low, the thermal
resistance can be increased due to it doesn’t provide enough contact pressure.
If the torque is too high, the pressure may cause product deformation and it
is not helpful to reduce thermal
resistance.
Furthermore, the heat sink flatness should be considered. The bumpy or unclear
heat sink can result
in uneven contact surface and the air gap between them that can increase the
thermal resistance.
Fig 2. Uneven contact surface
Mechanical stress failure
The improper mounting process or uneven contact surface can cause external
mechanical stress on
device. The high mechanical stress may cause some issue on the device, such as
die crack, package
crack and inner delamination. The following examples are failure samples for
unsuitable mounting
process.
For this case, the serious crack can be observed on package by visual
inspection. The failure is due
to the excessive stress on device.
(a) Back side of lead frame crack (b) Mold compound crack
Fig 3. Package crack
The other case, the device’s electrical characters test data are abnormal.
After de-cap it, the finding
indicate that the die has some cracks. According to die crack direction
analysis, the failure is the
result of improper screw mounting process.
Fig 4. Die crack
Screw Mounting
When two objects are fastened together using a nut and a screw, it can create
the axial tension.
The axial tension is also called tightening force that is difficult to
measure. In general, the torque
control is applied for screw fastening and can be carried out easily. The
relationship between
torque and axial tension is given by following formula. The different thread
or size of screw can
influence the tightening force. It needs to refer to the screw datasheet to
estimate the clamp force.
Fig 5. The relationship between torque and axial tension
T : Torque
K : Torque coefficient
d : Normal size of screw
F : Axial tension
= K ∙ d ∙ F
Screw mounting is a traditional assembly method accomplished with fastening a
screw, nut and
washer. As mentioned in the previous section, it needs to provide appropriate
torque to minimize
thermal resistance and avoid excessive mounting torque to damage the device.
Fig 6. Screw mounting of TO-220
The following lists are recommendations for mounting process:
-
The mounting torque is recommended to be 0.9Nm (for M3 pitch 0.5mm)
-
Self-tapping screws should not be used.
-
The metallic washer between the screw head and the device tab is recommended to reduce
the stress. -
Device attach to the heat sink before soldering in order to avoid shearing stress to damage the
die during fastening
Lead processes
Lead cutting
The TO-220 lead can be cut before mounting or after mounting and soldering.
When cutting after
soldering, the harsh mechanical mishandling during cutting that could cause
external stress to
damage solder joint, but generally does not harm component body. When cutting
before mounting,
the leads have to be fixed firmly by a clamp (see Fig 8).
Lead bending
Improper bending or lead forming can cause many problem, such as the die
damage , the internal
connection delamination or micro cracking on the solder plating of leads to
expose the copper.
In order to prevent those problems, the lead forming guideline is provided as
following:
-
Leads must be formed before mounting on a PCB or a heat sink.
-
For manual lead bending, an un-tapered snipe-nose plier is recommended for fixture; see Fig 7.
-
Clamp the leads firmly between the package body and the bend point. This way can relieve
tensile stress during bending process and prevent component body damage; see Fig 8. -
TO-220 package have wider leads near package body, the bending distance – L needs to be
longer than the distance between the package body to narrow lead portion; see Fig 8. -
Bend radius R should not less than the thickness of the lead T; see Fig 8.
-
The leads should not be bent at an angle of more than 90°; see Fig 8.
-
Do not bend the leads laterally; see Fig 9(a).
-
Do not bend directly at the edge of the package; see Fig 9(b).
(a) Correct method (b) wrong
method
Fig 7. Manual lead bending
Fig 8. Lead forming and cutting
(a) Bend the leads laterally. (b)
Bend directly at the edge of the package.
Fig 9. Incorrect lead bending methods
Soldering
Wave soldering is reliable method for assembly that is typically used for
soldering through-hole
component. Dual wave soldering is common method for wave-soldering (see Fig.
10). The durations, ramp rates and max temperature are depended on the
materials and the soldering equipment. According to JESD22-B106 definition for
the heat resistance of solder wave. The recommended max value is 260°C, the
sum of first and second wave should be less than 10s [1].
Fig.10 Dual wave Solder profile
Reference
[1] JEDEC Solid State Technology Association: JESD22-B106. “Resistance to
Solder Shock for
Through-Hole Mounted Devices.ˮ, 2005.
Authors
Fengcai Song : Application Engineer : Fengcai@mail.tsyew.com.cn
Reyn Qin : Site Engineering Manager : Reyn.Qin@mail.tsyew.com.cn
HL Lin : Product Application Manager : hl_lin@mail.ts.com.tw
Taiwan Semiconductor Co., Ltd.
Headquarters
Address: 11F. No. 25 Sec. 3, Beishin Rd, Shindian District, New Taipei
City, Taiwan R.O.C.
Telephone: +886-2-8913-1588
E-mail:
marketing@mail.ts.com.tw
Website: www.taiwansemi.com