NXP UM12004 TEA2376DK1011 Programming Board User Manual

NXP UM12004 TEA2376DK1011 Programming Board

Product Information

• Specifications
  • Model: TEA2376DK1011 programming board and IC samples
  • Controller: TEA2376DT interleaved PFC
  • Communication: I2C interface
  • Includes: 20 TEA2376DT IC samples, 1 TEA2376DB1604v3 programming board

Product Usage Instructions

• Safety Warnings
  • When operating the TEA2376DK1011 programming kit, be aware of the following safety warnings:
  • High voltages present pose a risk of electric shock, personal injury, and fire ignition.
  • Operate the product in a designated test area by qualified personnel only.
  • Never leave the product unattended.
• Kit Content
  • The TEA2376DK1011 programming kit includes the following:
  • 20 TEA2376DT IC samples
  • 1 TEA2376DB1604v3 programming board
• Programming Kit Quick Start Guide
  • The quick start guide for the programming kit includes the following steps:
  • Connect the TEA2376DT samples and TEA2376DB1604 programming board as per the provided pin configuration.
  • Refer to the IC pinning diagrams for proper connections.
  • Visit the NXP TEA2376 webpage for additional resources like user manuals, data sheets, and application notes.

FAQs

• Q: Can the TEA2376DK1011 programming kit be used for commercial purposes?
  • A: No, the kit is intended for engineering development or evaluation purposes only.
• Q: What is included in the kit?
  • A: The kit includes 20 TEA2376DT IC samples and 1 TEA2376DB1604v3 programming board.

Document Information

settings, I2C, TEA2376DB1514, RDK01DB1563, programming kit, quick start guide
Abstract| This user manual describes how to get started with the TEA2376DK1011 programming kit.

Important notice

• IMPORTANT NOTICE: For engineering development or evaluation purposes only.

NXP provides the product under the following conditions:

• This evaluation kit or reference design is for use in ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY.
• It is provided as a sample IC pre-soldered to a printed circuit board to make it easier to access inputs, outputs, and supply terminals.
• This evaluation kit or reference design may be used with any development system or other source of I/O signals by connecting it to the host MCU or computer board via off-the-shelf cables.
• The final device in an application will be heavily dependent on proper printed circuit board layout and heat sinking design as well as attention to supply filtering, transient suppression, and I/O signal quality.
• The product provided may not be complete in terms of required design, marketing, and or manufacturing-related protective considerations, including product safety measures typically found in the end device incorporating the product.
• Due to the open construction of the product, it is the responsibility of the user to take all appropriate precautions for electric discharge.
• To minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
• For any safety concerns, contact NXP sales and technical support services.

Safety warnings

Open-framed, unenclosed PCB

• This user manual describes the operation of the TEA2376DB1604. The TEA2376DB1604 is provided as an open-framed, unenclosed printed-circuit board (PCB) assembly.
• Use of the TEA2376DB1604 is only intended for development laboratory environments. Only qualified professionals with training, expertise, and knowledge of electrical safety risks in the development and application of high-voltage electrical circuits must use the TEA2376DB1604.
• While the TEA2376DB1604 has been designed with user safety in mind, no agency has formally tested the demo board.
• The TEA2376DB1604 is not intended for and must not be used in a production unit.
• Any use beyond development and testing is strictly prohibited.

Introduction

WARNING: Lethal voltage and fire ignition hazard

• The non-insulated high voltages that are present when operating this product, constitute a risk of electric shock, personal injury, death and/or ignition of fire.
• This product is intended for evaluation purposes only.
• It shall be operated in a designated test area by personnel qualified according to local requirements and labour laws to work with non-insulated main voltages and high-voltage circuits.
• This product shall never be operated unattended.
• The TEA2376DK1011 programming kit includes the TEA2376DT interleaved PFC controller ICs and a TEA2376DB1604v3 programming board.
• The TEA2376 is a digitally configurable two-phase interleaved PFC controller for high-efficiency power supplies.
• The PFC operates in discontinuous conduction mode (DCM) or quasi-resonant mode (QRM) with valley switching to optimize efficiency. The TEA2376 is suitable for TV, computing, servers, and industrial power supplies.
• For a low-load operation with good efficiency, phase shedding and burst mode operation are included.
• The TEA2376 supports a high power factor and a low THD.
• It contains many protections, which a GUI can configure independently. The TEA2376 allows an easy-to-design, highly efficient, reliable interleaved PFC with a low external component count for power levels of up to typically 1000 W.
• Included in the box are 20 TEA2376DT IC samples and 1 TEA2376DB1604v3 programming board.
• This user manual and the information on our website get you up and running in no time. For user manuals, data sheets, application notes, software, videos, and brochures, visit the NXP TEA2376 webpage.

Kit content

Programming kit quick start guide

• Type: TEA2376DK1011 GreenChip TEA2376DT samples and TEA2376DB1604 programming board.
• 12nc: 935504681598

I2C communication pins

• In the SO14 TEA2376DT version, the SDA and SCL connections are available on separate pins for I2C communication during operation.
• This type is very suitable for development work because the settings can be modified “on the fly” in a power supply application (see the TEA2376DK1011 programming board and IC samples (Ref. 1)).
• In the SO10 TEA2376AT version, the SDA and SCL functions are shared on the GATE pins.
• For changing the settings, the IC must be set to the correct state to make the I2C function available on the GATE pins by pulling down SNSMAINS at start-up.
• The PFC operation must be interrupted and an SDA and SCL connection must be created.
• After the modifications have been done, the connection must be removed again. This procedure is automatically arranged in the setup shown in Figure 4 and Figure 5.
• To select the combined GATE-I2C pins, the channel selector on the interface must be set on the “6-pin” connector (see Figure 5).

Additional hardware

• The programming setup requires a computer with a Windows operating system, the TEA2376 Ringo software, an I2C-USB interface with cables (RDK01DB1563) and the TEA2376DB1604v3 programming board.
• The I2C-USB interface with cables (the RDK01DB1563 kit) can be used for several other recent NXP power conversion controller ICs, which have settings in MTP.

TEA2376DB1604 board functions

• The TEA2376DB1604 is an IC connection board. It connects the I2C signals to the correct pins and supplies 9 V to the IC VCC via series regulator U4..
• The SO10 IC socket can be used for the TEA2376AT version and the SO14 IC socket can be used for the TEA2376DT version.
• When exchanging IC samples, the VCC voltage can be connected or disconnected using switch S1. A red light from LED D4 indicates that the VCC voltage is applied on the pins.
• Protection diodes D1 and D2 can help to limit overvoltage on the I2C connection, for example, when connecting or disconnecting the cables.
• To measure the I2C communication signals, test points TP1 to TP4 can be used.

Schematic

Layout

Frequently asked questions Ringo software

• Q: Ringo.exe does not start.
  • A1: To enable Ringo software to work, the USB-I2C interface driver (FT232) must be installed on the computer.
  • A2: Ensure that you are using a compatible version: 32-bit or 64-bit.
  • A3: Ringo is made for the Windows operating system. On other operating systems, use a Windows emulator to run Ringo.
• Q: Can I work with Ringo without the interface connected?
  • A1: Yes, when the USB-I2C interface driver (FT232) is already installed.
  • A2: To get started, install the USB-I2C interface driver (FT232) on the computer to enable the Ringo software to work. For the Ringo software to work, the interface must be connected (once) to install the driver.
• Q: When I connect the USB-I2C interface, it does not work.
  • A1: To make the FT323 module operational, a driver is required. The driver is often automatically installed (plug and play). However, sometimes, a manual installation is required. Watch the video “Installing USB driver manually” on the NXP website. Consult the FTDI website for the latest driver updates.
  • A2: When you installed the driver and it still does not work: Completely remove the driver (‘delete the driver software for this device’) and visit the FTDI chip website for more information on the latest driver version.

USB-I2C interface

• Q: There is no communication with the IC.
  • A1: Check if the switch on the interface is in the correct position: 3-pin or 6-pin.
  • A2: Check if the correct cable is connected (or both cables when using the programming board).
  • A3: Check if the signal disturbance is blocking communication.
• Q: I want to modify or repair the board. Is there a circuit diagram?
  • A1: The circuit diagram is included in the “TEA2016DB1514 USB to I2C hardware interface” user manual (UM11235). This document is available in the help tab of the Ringo software.
• Q: What is the function of the LEDs on the board?
  • A1: The Ringo software can use them to indicate that the I2C connection is OK. The indication differs between Ringo versions. In general, slow blinking indicates no communication with the IC. And fast blinking indicates correct communication with the IC.
• Q: Must I buy the RDK01DB1563 kit or can I also build an interface myself?
  • A1: The RDK01DB1563 provides an easy connection with galvanic isolation. It can be used for other NXP products as well. The working of the Ringo software is based on drivers for the UM232H module.  It is also possible to use a separate UM232H module from FTDI and apply it in a comparable way as it is used on the TEA2376DB1514v2 board (circuit diagram included in the “TEA2016DB1514 USB to I2C hardware interface” user manual (UM11235)).

Programming Board

• Q: Which cable do I connect when I want to work with the programming board?
  • A1: Connect the 3-pin and the 6-pin cables and select the correct I2C channel for communication.
  • A2: For a TEA2376AT, only the 6-pin cable connection is required.
  • A3: For a TEA2376DT, the 3-pin and the 6-pin cables are required.
• Q: I want to measure signals or modify the board. Is there a circuit diagram?
  • A1: The circuit diagram is included in this document.
• Q: What is the function of the switch SW1?
  • A1: When exchanging IC samples, the VCC voltage can be connected or disconnected using switch S1. A red light from LED D4 indicates that the VCC voltage is applied on the pins.
• Q: How can I know that the IC is placed correctly in the socket? It fits in two ways.
  • A1: To ensure that the IC is placed correctly, there is a mark for pin 1 on the PCB printing.

Abbreviations

Table 1. Abbreviations

• [1] UM12002 user manual — TEA2376DK1011 programming board and IC samples; 2024, NXP Semiconductors
• [2] UM12042 user manual — TEA2376 Ringo GUI; 2024, NXP Semiconductors

Revision history

Table 2. Revision history

Legal information

Definitions

• Draft— A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of the use of such information.

Disclaimers

• Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of the use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including – without limitation – lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that the customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards the customer for the products described herein shall be limited following the Terms and conditions of the commercial sale of NXP Semiconductors.
• Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied before the publication hereof.
• Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
• Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is the customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of the customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by the customer’s third-party customer(s). The customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products to avoid a default of the applications and the products or of the application or use by the customer’s third party customer(s). NXP does not accept any liability in this respect.
• Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at https://www.nxp.com/profile/terms unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions about the purchase of NXP Semiconductors products by the customer.
• Export control — This document as well as the item(s) described hereinmay be subject to export control regulations. Export might require prior authorization from competent authorities.
• Suitability for use in non-automotive qualified products — Unless this document expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested per automotive testing or application requirements. NXP Semiconductors accepts no liability for the inclusion and/or use of non-automotive qualified products in automotive equipment or applications. If customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.
• Translations — A non-English (translated) version of a document, including the legal information in that document, is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.
• Security — Customer understands that all NXP products may be subject to unidentified vulnerabilities or may support established security standards or specifications with known limitations. Customers are responsible for the design and operation of its applications and products throughout their lifecycles to reduce the effect of these vulnerabilities on the customer’s applications and products. The customer’s responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in the customer’s applications. NXP accepts no liability for any vulnerability. Customers should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, and security-related requirements concerning its products, regardless of any information or support that may be provided by NXP.
• NXP has a Product Security Incident Response Team (PSIRT) (reachable at PSIRT@nxp.com) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products.
• NXP B.V. — NXP B.V. is not an operating company and it does not distribute or sell products.

Trademarks

• Notice: All referenced brands, product names, service names, and trademarks are the property of their respective owners.
• NXP — wordmark and logo are trademarks of NXP B.V.
• GreenChip — is a trademark of NXP B.V.

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © 2024 NXP B.V. All rights reserved. For more information, please visit: https://www.nxp.com Date of release: 6 February 2024 Document identifier: UM12004 UM12004 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Rev. 1 — 6 February 2024

Read User Manual Online (PDF format)

Read User Manual Online (PDF format)  >>

Download This Manual (PDF format)

Download this manual  >>