LG Innotek LTD-BK1100 Telematics Modem User Manual
- May 15, 2024
- LG Innotek
Table of Contents
- LG Innotek LTD-BK1100 Telematics Modem
- Product Information
- Product Usage Instructions
- Frequently Asked Questions
- Pin map
- Pin Descriptions
- Communication Specification
- Mechanical Dimensions
- Footprint (Top View)
- Information for the integrator
- FCC Statement
- Read User Manual Online (PDF format)
- Download This Manual (PDF format)
LG Innotek LTD-BK1100 Telematics Modem
Product Information
Specifications
- Brand: LG Innotek
- Model: LTD-BK1100
- Total Pins: 304
Product Usage Instructions
Antenna Interface Pads
These pads are used for connecting the RF Main Antenna and RF Diversity Antenna.
- C21 MAIN_ANT
- AC21 DIV_ANT
User Interface Pads
These pads are used for user interaction and general-purpose I/O.
-
* ACC_PWR_ON – Input- BOOT_OK – Input
Frequently Asked Questions
- Q: How do I connect the USB Interface Pads?
- A: Connect USB_HS_DM, USB_HS_DP, USB_VBUS, and USB_ID according to the provided descriptions.
- Q: What is the purpose of the SPI Interface Pads?
- A: The SPI interface pads are used for SPI communication. Connect MOSI, CLK, CS_N, MISO, and INTERRUPT accordingly.
Product Name: Telematics Modem
Model Name: LTD-BK1100
FCC ID : YZP-BK1100 / IC : Certification : 7414C-BK1100
This LTD-BK1100 is a wireless module that is installed in a vehicle’s telematics system and connects to WCDMA (HSPA+) Band 2/5, LTE Band 2/4/5/7/12/17 wireless networks to have voice and data communication functions. It can be carried on land, rivers, and other similar areas and operated while stationary or moving. As a wireless facility device for personal portable communication, it is designed with ultra-small and up-to- date parts to realize small size and lightweight. Data communication is possible at uplink 5.76Mbps, downlink 21Mbps transmission speed when operating in HSPA+ mode, and uplink 50Mbps, downlink 150Mbps transmission speed when operating LTE Cat4 mode, so large amounts of data such as video or video calls can be received. It communicates with the host system through the USB port, and receives control commands from the host system to enable data transmission and voice calls.
Pin map
LGA Pad Layout(Top view)
Pin Descriptions
| PAD. | NAME | DIRECTION | DESCRIPTION |
|---|
Antenna Interface Pads
C21| MAIN_ANT| Input/Output| RF Main Antenna
AC21| DIV_ANT| Input/Output| RF Diversity Antenna
User Interface Pads
H6| ACC_PWR_ON| Input| ACC_PWR_ON
I5| BOOT_OK| Output| BOOT_OK
H4| MSG| Output| MSG
G3| 96H_END| Output|
F20| MAIN_ANT_DTC_EN,| Output| Main ANT Detect Enable
Z20| DIV_ANT_DTC_EN| Output| Diversity ANT Detect Enable
I7| SPI_LEVEL_SHIFT_EN| Output| SPI LEVEL SHIFT Enable
AD4| ETHERNET_DCDC_ENABLE| Output| Ethernet power enable
F6| GPIO1| Output| General purpose I/O
E5| GPIO2| General purpose I/O
L6| GPIO3| Input/Output| General purpose I/O
N6| GPIO4| General purpose I/O
ADC Interface Pads**
E19| ADC1| Input| ADC Convertor input for main antenna detect
AA19| ADC2| Input| ADC Convertor input for diversity antenna
detect
PCM Interface Pads
W3| PCM_EN| Output| PCM 3.3 Level Shifter Enable
X2| PCM_CLK*,| Input| PCM Clock
W1| PCM_SYNC| Input| PCM Frame Sync
Y3| PCM_DIN| Input| PCM Data In
Y1| PCM_DOUT| Output| PCM Data Out
JTAG Pin Description
AC7| MDM_JTAG_TMS| Input| JTAG mode select input
AD8| MDM_JTAG_PS_HOLD| input| JTAG PS HOLD detect
AD6| MDM_JTAG_TDI| Input| JTAG data input
AE7| MDM_JTAG_TRST_N| Input| JTAG reset for debug
AB6| MDM_JTAG_TDO| Output| JTAG debugging
AB8| MDM_JTAG_TCK| Input| JTAG clock input
AE9| MDM_JTAG_SRST_N| Input| JTAG reset
USB Interface Pads
N2| USB_HS_DM| Input/Output| USB high speed data (minus)
---|---|---|---
M1| USB_HS_DP| Input/Output| USB high speed data (plus)
K1| USB_VBUS| Input| USB power
L2| USB_ID| Input| USB ID
| SDIO Interface Pads
S1| SDC_CLK| Output| Secure digital controller clock
Q1| SDC_CMD| Output| Secure digital controller command
T2| SDC_DATA0| Input/Output| Secure digital controller data bit 0
R2| SDC_DATA1| Input/Output| Secure digital controller data bit 1
S3| SDC_DATA2| Input/Output| Secure digital controller data bit 2
Q3| SDC_DATA3| Input/Output| Secure digital controller data bit 3
| SGMMI Interface Pads
AA11| EPHY_RST_N or UIM2_RESET| Output| Ethernet PHY reset or UIM2 reset
AE11| EPHY_INT_N or UIM2_DETECT| Input| Ethernet PHY interrupt or UIM2 DETECT
AB10| SGMII_DATA or UIM2_CLK| Input/Output| SGMII input Output data or
UIM2_CLK
AD10| GND| | Ground
X10| SGMII_RX_P| Input| SGMII receive – plus
W11| SGMII_RX_M| Input| SGMII receive -minus
Z10| SGMII_TX_M| Output| SGMII transmit – plus
Y11| SGMII_TX_P| Output| SGMII transmit -minus
AC11| SGMII_CLK or UIM2_DATA| Input/Output| SGMII clock or UIM2_DATA
| SPI Interface Pads
S5| SPI_MOSI| Output| SPI Serial Output
T6| SPI_CLK| Output| SPI Serial Clock
R6| SPI_CS_N| Output| SPI Chip Select
U5| SPI_MISO| Input| SPI Serial input
Q5| SPI_INTERRUPT| Input| MICOM → LGA SPI interrupt
| UART Interface Pads
M5| UART2_TX| Output| UART2 Transmit data
N4| UART2_RX| Input| UART2 Receive data
K5| UART1_TX| Output| Debug UART5 Transmit Data
L4| UART1_RX| Input| Debug UART5 Receive Data
O5| UART3_TX| Output| UART6 Transmit data
P4| UART3_RX| Input| UART6 Receive data
| USIM Interface Pads
I3| UIM1_PRESENT| Input| Detection of an external UIM card
H2| UIM1_CLK| Output| Clock Output to an external UIM card
E1| UIM1_RESET| Output| Reset Output to an external UIM card
G1| UIM1_DATA| Input/Output| Data connection with an external UIM card
---|---|---|---
F2| VREG_L6_UIM1| Output| Supply Output for an external UIM card
E3| GND| | Ground
D2| GND| | Ground
A1| GND| | Ground
C1| GND| | Ground
B2| GND| | Ground
| HSIC Pin Description
AB2| HSIC_DATA| Input/Output| HSIC data
AC1| HSIC_STB| Input/Output| HSIC Strobe signal
AD2| NC| | No Connect
AE1| NC| | No Connect
| DSRC Pin Description*
Y7| COEX_UART_RX| Input| LTE receiver sync for coexistence with UART
Z6| COEX_UART_TX| Output| LTE transmitter sync for coexistence with UART
X4| RFCLK2_QCA| Output| Low noise RF clock Output
AA3| WLAN_EN_DSRC| Output| WLAN DSRC Enable
X6| DSRC_SLP_CLK| Output| DSRC sleep clock
Y5| WLAN_3V_EN_DSRC| Output| Used for WLAN enable
Z4| DSRC_PPS| Input/Output| Pulse Per Second
X8| MDM2AP_INT_N| Output| MDM to AP interrupt
Z8| AP2MDM_INT_N| Input| AP to MDM interrupt
| Control Pin Description|
A3| LGA_PHONE_ON_N| Input| ON/OFF Control
B4| MDM_RESOUT_N| Output| Reset Output
C3| LGA_RESIN_N| Input| External Reset Input
| Power Supply Pin Description
A17| VPH_PWR for PAM| Input| power supply (4.0V)
B16| VPH_PWR for PAM| Input| power supply (4.0V)
A15| VPH_PWR for PAM| Input| power supply (4.0V)
B14| VPH_PWR for PAM| Input| power supply (4.0V)
A9| VPH_PWR for PMIC| Input| power supply (4.0V)
B8| VPH_PWR for PMIC| Input| power supply (4.0V)
A7| VPH_PWR for PMIC| Input| power supply (4.0V)
C7| VPH_PWR for PMIC| Input| power supply (4.0V)
| Voltage Reference Pin Description
C9| VREG_L11_1P8| Output| LDO out for 1.8V pull up
D8| VREG_L11_1P8| Output| LDO out for 1.8V pull up
AE3| Voltage Reference for SGMII
(VREG_L5_UIM2) – Ethernet IO level
| Output| Ethernet I/O voltage
---|---|---|---
| NC Pads
G9| NC| | No Connect
B12| NC| | No Connect
I9| NC| | No Connect
G7| NC| | No Connect
C5| NC| | No Connect
D4| NC| | No Connect
| GND Pads
A21| GND| | Ground
E21| GND| | Ground
G21| GND| | Ground
I21| GND| | Ground
K21| GND| | Ground
M21| GND| | Ground
O21| GND| | Ground
Q21| GND| | Ground
S21| GND| | Ground
U21| GND| | Ground
W21| GND| | Ground
Y21| GND| | Ground
AA21| GND| | Ground
AE21| GND| | Ground
B20| GND| | Ground
D20| GND| | Ground
H20| GND| | Ground
J20| GND| | Ground
L20| GND| | Ground
N20| GND| | Ground
P20| GND| | Ground
R20| GND| | Ground
T20| GND| | Ground
V20| GND| | Ground
X20| GND| | Ground
AB20| GND| | Ground
AD20| GND| | Ground
A19| GND| | Ground
C19| GND| | Ground
---|---|---|---
G19| GND| | Ground
I19| GND| | Ground
K19| GND| | Ground
M19| GND| | Ground
O19| GND| | Ground
Q19| GND| | Ground
S19| GND| | Ground
U19| GND| | Ground
W19| GND| | Ground
Y19| GND| | Ground
AC19| GND| | Ground
AE19| GND| | Ground
B18| GND| | Ground
D18| GND| | Ground
F18| GND| | Ground
H18| GND| | Ground
J18| GND| | Ground
L18| GND| | Ground
N18| GND| | Ground
P18| GND| | Ground
R18| GND| | Ground
T18| GND| | Ground
V18| GND| | Ground
X18| GND| | Ground
Z18| GND| | Ground
AB18| GND| | Ground
AD18| GND| | Ground
C17| GND| | Ground
E17| GND| | Ground
G17| GND| | Ground
I17| GND| | Ground
K17| GND| | Ground
M17| GND| | Ground
O17| GND| | Ground
Q17| GND| | Ground
S17| GND| | Ground
U17| GND| | Ground
W17| GND| | Ground
---|---|---|---
Y17| GND| | Ground
AA17| GND| | Ground
AC17| GND| | Ground
AE17| GND| | Ground
D16| GND| | Ground
F16| GND| | Ground
H16| GND| | Ground
J16| GND| | Ground
L16| GND| | Ground
N16| GND| | Ground
P16| GND| | Ground
R16| GND| | Ground
T16| GND| | Ground
V16| GND| | Ground
X16| GND| | Ground
Z16| GND| | Ground
AB16| GND| | Ground
AD16| GND| | Ground
C15| GND| | Ground
E15| GND| | Ground
G15| GND| | Ground
I15| GND| | Ground
W15| GND| | Ground
Y15| GND| | Ground
AA15| GND| | Ground
AC15| GND| | Ground
AE15| GND| | Ground
D14| GND| | Ground
F14| GND| | Ground
H14| GND| | Ground
X14| GND| | Ground
Z14| GND| | Ground
AB14| GND| | Ground
AD14| GND| | Ground
A13| GND| | Ground
C13| GND| | Ground
E13| GND| | Ground
G13| GND| | Ground
---|---|---|---
I13| GND| | Ground
W13| GND| | Ground
Y13| GND| | Ground
AA13| GND| | Ground
AC13| GND| | Ground
AE13| GND| | Ground
D12| GND| | Ground
F12| GND| | Ground
H12| GND| | Ground
X12| GND| | Ground
Z12| GND| | Ground
AB12| GND| | Ground
AD12| GND| | Ground
A11| GND| | Ground
C11| GND| | Ground
E11| GND| | Ground
G11| GND| | Ground
I11| GND| | Ground
B10| GND| | Ground
D10| GND| | Ground
F10| GND| | Ground
H10| GND| | Ground
E9| GND| | Ground
W9| GND| | Ground
Y9| GND| | Ground
AA9| GND| | Ground
AC9| GND| | Ground
F8| GND| | Ground
H8| GND| | Ground
E7| GND| | Ground
W7| GND| | Ground
AA7| GND| | Ground
B6| GND| | Ground
D6| GND| | Ground
J6| GND| | Ground
P6| GND| | Ground
V6| GND| | Ground
A5| GND| | Ground
---|---|---|---
W5| GND| | Ground
AA5| GND| | Ground
AC5| GND| | Ground
AE5| GND| | Ground
F4| GND| | Ground
J4| GND| | Ground
R4| GND| | Ground
T4| GND| | Ground
V4| GND| | Ground
AB4| GND| | Ground
K3| GND| | Ground
M3| GND| | Ground
O3| GND| | Ground
U3| GND| | Ground
AC3| GND| | Ground
J2| GND| | Ground
P2| GND| | Ground
V2| GND| | Ground
Z2| GND| | Ground
I1| GND| | Ground
O1| GND| | Ground
U1| GND| | Ground
AA1| GND| | Ground
GND1| GND| | Ground
GND2| GND| | Ground
GND3| GND| | Ground
GND4| GND| | Ground
GND5| GND| | Ground
GND6| GND| | Ground
GND7| GND| | Ground
GND8| GND| | Ground
GND9| GND| | Ground
GND10| GND| | Ground
GND11| GND| | Ground
GND12| GND| | Ground
N14| GND| | Ground
P14| GND| | Ground
R14| GND| | Ground
---|---|---|---
M13| GND| | Ground
O13| GND| | Ground
Q13| GND| | Ground
S13| GND| | Ground
N12| GND| | Ground
P12| GND| | Ground
R12| GND| | Ground
M11| GND| | Ground
O11| GND| | Ground
Q11| GND| | Ground
S11| GND| | Ground
N10| GND| | Ground
P10| GND| | Ground
R10| GND| | Ground
M9| GND| | Ground
O9| GND| | Ground
Q9| GND| | Ground
S9| GND| | Ground
N8| GND| | Ground
P8| GND| | Ground
R8| GND| | Ground
G5| GND| | Ground
Communication Specification
WCDMA
Receiver
- Bandwidth: 5MHz
- Frequency: B2(1930 MHz –1990 MHz), B5(869 MHz – 894 MHz)
- RF to Baseband Direct conversion (Zero IF)
- Modulation method: QPSK and 16QAM
Transceiver
- Frequency: B2(1850 MHz – 1910 MHz), B5(824 MHz – 849 MHz)
- Maximum RF Output: Power class 3, 20.3dBm ~ 25.7dBm max.
- Modulation method: QPSK
- Baseband to RF Direct conversion (Zero IF)
LTE
Receiver
- Bandwidth: B2/B4/B7 (5 MHz, 10 MHz, 15 MHz, 20 MHz), B5/B12/B17 (5 MHz, 10 MHz)
- Frequency: B2 (1930 MHz – 1990 MHz), B4 (2110 MHz – 2155 MHz),
- B5 (869 MHz – 894 MHz), B7(2620 MHz – 2690 MHz)
- B12 (729 MHz – 746 MHz), B17(734 MHz – 746 MHz)
- RF to Baseband Direct conversion (Zero IF)
- Modulation method: QPSK, 16QAM and 64QAM
Transceiver
- Frequency: B2 (1850 MHz – 1910 MHz), B4 (1710 MHz – 1755 MHz),
- B5 (824 MHz – 849 MHz), B7 (2500 MHz – 2570 MHz),
- B12(699 MHz – 716 MHz), B17(704MHz – 716 MHz)
- Maximum RF Output: Power class 3, 20.3dBm ~ 25.7dBm max.
- Modulation method: QPSK and 16QAM
- Baseband to RF Direct conversion (Zero IF)
Mechanical and Environmental Specification
Mechanical Dimensions
Dimensions| 34.0 x 40.0 x 3.5 mm (L x W x T)
(Tolerance – width, length: ±0.15 / height: ±0.2)
---|---
Weight| Max. 10.6 grams
Flatness| Max. 100 um
The Modem provides the RF shielding.
Footprint (Top View)
Environmental Specification
- Storage temperature : -40℃ ~ +85℃
- Operation temperature :
Class A*| -20℃ ~ +70℃
---|---
Class B**| -30℃ ~ -20℃, +70℃ ~ +85℃
-
Function(Voice call, data call, SMS) and 3GPP specification. (in normal operation.)
** Some performance of 3GPP specification may be degraded.- Operating humidity: 80% (60℃)
- RoHS compliant
RFx Information
The strength of the RF field produced by the wireless module or modules
embedded in the TCU is well within all international RF exposure limits known
at this time.
Because the wireless modules embedded in the TCU emit less than the maximum
amount of energy permitted in radio frequency safety standards and
recommendations, the manufacturer believes these modules are safe for use.
Regardless of the power levels, care should be taken to minimize human contact
during normal operation. This module should be remain more than 20 cm (8
inches) from the body when wireless devices are on and transmitting.
This transmitter must not be collocated or operated in conjunction with any
other antenna or transmitter. Operation is subject to the following two
conditions: (1) this module does not cause interference , (2) this module
accepts any interference that may cause undesired operation.
Information for the integrator
The integrator must not provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual that is provided by the integrator for end users must include the following information in a prominent location. To comply with FCC RF exposure requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operated in conjunction with any other antenna or transmitter. The label for the end product must include FCC ID: YZP-BK1100 or A RF transmitter inside, IC ID: 7414C-BK1100
FCC Statement
Integration Guide
This module complies with FCC/IC rules.
- FCC: Part 22, Part 24, Part 27
- ISED : RSS-130, RSS-132, RSS-133, RSS-139, RSS-199
Furthermore, this device complies with FCC/IC radiation exposure limits set forth for uncontrolled environments. This module must be installed and operated with a minimum distance of 20 cm between the radiating element and the user. This module must not be co-located with any other transmitters or antennas. To comply with FCC/IC regulations limiting both the maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed the values listed in the following table.
LTD-BK1100
Ant. Gain
| Original| Additional| Maximum
---|---|---|---
Antenna 1| Antenna 2
WCDMA Band 2| 2.0 dBi| 5.97 dBi| 5.97 dBi
WCDMA Band 5| 4.5 dBi| 2.18 dBi| 4.5 dBi
LTE Band 2| 2.0 dBi| 5.97 dBi| 5.97 dBi
LTE Band 4| 2.0 dBi| 4.13 dBi| 4.13 dBi
LTE Band 5| 4.5 dBi| 2.18 dBi| 4.5 dBi
LTE Band 12| 4.5 dBi| 3.97 dBi| 4.5 dBi
LTE Band 17| 4.5 dBi| -1.74 dBi| 4.5 dBi
To satisfy the labelling requirements, the following text must appear on the exterior of the end product.
- Contains transmitter module FCC ID: YZP-BK1100
- Contains transmitter module IC ID: 7414C-BK1100
Changes or modifications to this equipment may cause harmful interference unless the modifications are expressly approved in the instruction manual. Users may lose the authority to operate this equipment if an unauthorized change or modification is made.
Note: If this module is intended for use in a portable device, additional testing will be required to satisfy the RF exposure and SAR requirements of FCC Part 2.1093 and RSS-102.