FUJIFILM Corporation BM-8753BFR-F FDR Smart f Fixed DR System User Manual

FUJIFILM Corporation BM-8753BFR-F FDR Smart f Fixed DR System

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Description

The BM-8753BFR-F is a highly integrated single-chip Bluetooth 2.1/3.0/4.0/5.1 module with a UART interface. It combines a BT Protocol Stack (LM, LL, L2CAP, GATT, RFCOMM, SPP, and LE), BT Baseband, mo-dem, and BT RF in a module. The BM-8753BFR-F Bluetooth module complies with Bluetooth core specification v4.0/v5.1, and support dual mode (BR/EDR+Low Energy Controllers). It is compatible with previous versions, includ-ing v2.1+EDR. For BR/EDR, it allows one active link in either slave mode or master mode. For Low Energy, it supports multiple states and allows one active link a slave mode. A BR/EDR link and a LE link can be active at the same time. The system-on-chip architecture design of the module makes a much smaller space and minimal cost and simplifies the whole system design.

Features

• 16x10x1.95mm 18-pin
• Complies with HS-UART with configu-rable baud rate for Bluetooth
• Compatible with Bluetooth v2.1 and v3.0 systems
• Supports Bluetooth 5.1 Low Energy (BLE)
• HS-UART interface for Bluetooth data transmission compliant with H4 speci-fication
• Integrated MCU to execute Bluetooth protocol stack
• Supports all packet types in basic rate and enhanced data rate
• Supports legacy pairing and secure simple pairing in BR/EDR and BLE
• Supports Low Power Mode (Sniff mode)
• Bluetooth 5.1 Dual Mode support: Simultaneous BLE and BR/EDR
• Supports multiple Low Energy states
• Supports SPP Profile
• Supports GATT Profile
• RoHS compliant

Application

• Data Transparency

Revision History

Change dimension tolerance to +- 0.15mm

1.3| 06/12/2023| 1.  Change transmitter power to 7.5dBm

2. In Addition recommend layout footprint

Note： All electrical and mechanical specifications may be changed by CC&C Technologies, Inc. without notice.

Factory options

• RF output by PCB Antenna(RF type-1)

Functional Block Diagram

• Block Diagram

Pin Assignment (Top view)

Pin Definition

3

| ****

P1_0

| ****

IO PU

| Programmable GPIO

•      Configurable pull high/low state

•      LDO_HV33 power domain

4

| ****

P1_1

| ****

IO PU

| Programmable GPIO

•      Configurable pull high/low state

•      LDO_HV33 power domain

5

| ****

P3_0/RX

| ****

IO PU

| Programmable GPIO

•      Configurable pull high/low state

•      LDO_HV33 power domain

•      UART_RX for flash memory programming

6

| ****

P3_1/TX

| ****

IO PU

| Programmable GPIO

•      Configurable pull high/low state

•      LDO_HV33 power domain

•      UART_TX for flash memory programming

7

| ****

MFB

| ****

I_PU

| Multi-function button input with internal pull high, low

active with at least 3ms low

8| VD33| PI| Supply input 3.3V power
9| GND| Ground|
10| GND| Ground|

11

| ****

HW_RST_N

| ****

I_PU

| System reset input with internal pull high, low active

with a least 8ms low to trigger system reset

12| LDO_AUX| PO| Programmable linear regulator output for I/O

13

| ****

MODE

| ****

IO PU

| Programmable GPIO

•      Configurable pull high/low state

•      LDO_AUX power domain HCI mode selection

H: APP mode

L: HCI mode

14

| ****

P2_1

| ****

IO

| Programmable GPIO

•      Configurable pull high/low state

•      LDO_AUX power domain

15| P2_2| IO| Programmable GPIO
 |  |  |  | •      Configurable pull high/low state|
---|---|---|---|---|---
•      LDO_AUX power domain
 |  |  | Programmable GPIO

16

| ****

P0_0/ADC_0

| IO

IO A

| •      Programmable as ADC input pin

•      Configurable pull high/low state

 |  |  | •      LDO_AUX power domain
 |  |  | Programmable GPIO

17

| ****

P0_1/ADC_1

| IO

IO A

| •      Programmable as ADC input pin

•      Configurable pull high/low state

 |  |  | •      LDO_AUX power domain
18| GND| Ground|
Pad Type| Definition
---|---
A| Analog
IO| Bidirectional digital pad
IO PU| Bidirectional digital pad with pull high resistor inside when input mode
IO A| Bidirectional digital pad and pro- grammable ADC
PO| Power output
PI| Power input
I_PU| Input with internal pull high inside

SPECIFICATION

Power Voltage Range

Digital logic characteristics

VDDIO is LDO_AUX or LDO_HV33, GPIO power domain, check the pin description. Internal Low Drop Linear Regulator – LDO_AUX

Module dimension

Recommend layout footprint

Placement Guideline

• It is recommended that the module be placed on the corner of the main board or near the edge as shown below.

Reference – Temperature Reflow Chart

Reflow Notice:

1. If the system PCBA is double side design, please reflow the side without this module first.
2. Don’t let the solder machine temperature over 250 oC or follow the solder paste vendors’s recommended temperature.
3. The Ramp-up temperature speed is 1-4 oC per second, the Ramp-down temperature speed is 1-4 °C per second.
4. This temperature reflow chart is for reference only, it depends on the manufacturing machine’s characters requirement.

This module is a surface mount device; please refer below conditions for drying before the solder reflow processes. (extracted from IPC/JEDEC J-STD- 033B.1)

By ≤ 72h**

9 hours

| ****

7 hours

| ****

33 hours

| ****

23 hours

| ****

13 days

| ****

9 days

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, under Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used under the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body.

This device is intended only for OEM integrators under the following conditions:

1. The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed.

IMPORTANT NOTE: If these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

End Product Labeling
The product can be kept as far as possible from the user body or set the device to lower output power if such a function is available. The end product must be labeled in a visible area with the following: “Contains FCC ID: W2Z-03000015”. The grantee’s FCC ID can be used only when all FCC compliance requirements are met.

Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product that integrates this module. The end user manual shall include all required regulatory information/warnings as shown in this manual.

Canada – Innovation, Science and Economic Development (ISED)
This device complies with ISED’s license-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Radiation Exposure Statement
This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body.

This device is intended only for OEM integrators under the following conditions: (For module device use)

1. The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed.

IMPORTANT NOTE
In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.

End Product Labeling
The product can be kept as far as possible from the user body or set the device to lower output power if such a function is available. The end product must be labeled in a visible area with the following: “Contains IC: 7736B-03000014”.

Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product that integrates this module. The end user manual shall include all required regulatory information/warnings as shown in this manual.

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