QUECTEL FCM360K Wi-Fi and Bluetooth Module User Guide

QUECTEL FCM360K Wi-Fi and Bluetooth Module

Product Information

Specifications

• Product Name: FCM360K
• Hardware Design: Wi-Fi&Bluetooth Module Series
• Version: 1.0.0
• Date: 2023-04-08
• Status: Preliminary

About Quectel

Quectel aims to provide timely and comprehensive services to customers. For assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd.

Building 5, Shanghai Business Park Phase III (Area B), No.1016
Tianlin Road, Minhang District, Shanghai 200233, China
Tel: +86 21 5108 6236
Email: info@quectel.com
You can also visit our website for more information: http://www.quectel.com/support/sales.htm

Technical Support

For technical support or reporting documentation errors, please visit: http://www.quectel.com/support/technical.htm

You can also email us at: support@quectel.com

Legal Notices

Use and Disclosure Restrictions: Documents and information provided by us shall be kept confidential and should not be accessed or used for any purpose except as expressly provided.

Copyright: Except as otherwise set forth herein, nothing in this document shall confer any rights to use any trademark, trade name, or name owned by Quectel or any third party.

Third-Party Rights: This document may refer to hardware, software, and/or documentation owned by third parties.
The use of such third-party materials shall be governed by applicable restrictions and obligations.

Privacy Policy: Certain device data may be uploaded to Quectel’s or third-party’s servers for module functionality. Data shall be retained, used, disclosed, or processed as permitted by applicable laws.

Disclaimer: a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions or from the use of the information contained herein. c) We have made every effort to ensure that the functions and features under development are safe.

Product Usage Instructions

Safety Information

The following safety precautions must be observed during all phases of operation:

• Full attention must be paid to driving at all times to reduce the risk of an accident.
• Using a mobile phone while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.

Frequently Asked Questions

1. Q: Where can I contact Quectel for assistance?

A: You can contact our headquarters at Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China. You can also reach us by phone at +86 21 5108 6236 or email at info@quectel.com.

1. Q: Where can I find technical support or report documentation errors?

A: You can visit our website at http://www.quectel.com/support/technical.htm or email us at support@quectel.com.

1. Q: What is Quectel’s privacy policy?

A: Certain device data may be uploaded to Quectel’s or third-party’s servers for module functionality. Data shall be retained, used, disclosed, or processed as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.

FCM360K
Hardware Design
Wi-Fi&Bluetooth Module Series Version: 1.0.0 Date: 2023-04-08 Status: Preliminary

Wi-Fi&Bluetooth Module Series
At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com
Or our local offices. For more information, please visit: http://www.quectel.com/support/sales.htm.
For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com.
Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an “as available” basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you.
Use and Disclosure Restrictions
License Agreements
Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein.
Copyright
Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material.

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Trademarks

Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.
Third-Party Rights
This document may refer to hardware, software and/or documentation owned by one or more third parties (“third-party materials”). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.
We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non- infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade.
Privacy Policy
To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.
Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
information contained herein. c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources.
Copyright © Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved.

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Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular or mobile terminal incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety precautions by incorporating them into all product manuals. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
Full attention must be paid to driving at all times to reduce the risk of an accident. Using a mobile phone while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
Switch off the cellular or mobile terminal before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. If emergency assistance is needed, use emergency call if the device supports it. To make or receive a call, the cellular or mobile terminal must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method since network connection cannot be guaranteed under all circumstances.
The cellular or mobile terminal contains a transceiver. When it is ON, it receives and transmits radio signals. RF interference can occur if it is used close to TV sets, radios, computers, or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phones or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders.

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About the Document

Revision History

Version Date

–

2023-04-08

1.0.0

2023-04-08

Author Sunny LV/Wesley WEI Sunny LV/Wesley WEI

Description Creation of the document Preliminary

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Introduction

QuecOpen® is a solution where the module acts as the main processor. Constant transition and evolution of both the communication technology and the market highlight its merits. It can help you to:
Realize embedded applications’ quick development and shorten product R&D cycle Simplify circuit and hardware structure design to reduce engineering costs Miniaturize products Reduce product power consumption Apply OTA technology Enhance product competitiveness and price-performance ratio
This document defines FCM360K in QuecOpen® solution and describes its air interfaces and hardware interfaces, which are connected with your applications.
With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.

1.1. Special Marks

Table 1: Special Marks

Mark * […]

Definition
Unless otherwise specified, when an asterisk () is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk () after a model indicates that the sample of the model is currently unavailable. Brackets ([…]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3.

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Product Overview

FCM360K is a high-performance Wi-Fi and Bluetooth module for smart-home IoT terminals supporting IEEE 802.11b/g/n/ax and Bluetooth 5.2 standards. The module, featuring built-in PMU, PA, LNA and T/R switch, provides multiple interfaces including UART, SPI, I2C, ADC AND PWM for various applications.
FCM360K is an SMD module with compact packaging. It includes:
240 MHz Cortex-M4F processor Built-in 752 KB ROM, 992 KB SRAM and 8 MB flash Support secondary development

Table 2: Basic Information
FCM360K Packaging type Pin counts Dimensions Weight

LCC 39 (25.5 ±0.15) mm × (18 ±0.15) mm × (3.15 ±0.2) mm Approx. 1.63 g

2.1. Key Features
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Table 3: Key Features

Basic Information Protocols and Standards
Power Supply
Temperature Ranges EVB Kit

Wi-Fi Protocol: IEEE 802.11a/b/g/n/ac/ax Bluetooth protocol: Bluetooth 5.2 All hardware components are fully compliant with EU RoHS directive
VBAT Power Supply: 3.0­3.6 V Typ.: 3.3 V Operating temperature 1: -40 to +85 °C Storage temperature: -45 to +95 °C
FCM360K TE-B 2

RF Antenna Interface

Antenna Interfaces

ANT_WIFI/BT (optional) PCB antenna (optional) Coaxial RF connector (optional) 50 impedance

Application Interface 3

Application Interface UART, SPI, I2C, ADC, USB, PWM

2.2. Functional Diagram
The main components of the block diagram are explained below. Main chip
1 Within the operating temperature range, the module’s related performance meets IEEE and Bluetooth specifications. 2 For more details about the EVB, see document [1]. 3 For more details about the interfaces, see Chapter 3.3 and Chapter 3.4.

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Radio frequency Peripheral interfaces

Wi-Fi&Bluetooth Module Series

NOTE
The module supports pin antenna (ANT_WIFI/BT), PCB antenna and coaxial RF connector which are all optional.

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Application Interfaces

3.1. Pin Assignment

Figure 2: Pin Assignment (Top View)
NOTE 1. Keep all RESERVED and unused pins open. 2. All GND pins should be connected to ground. 3. The module supports UART × 3, SPI × 1, I2C × 1, SDIO × 1, PWM × 6, I2S × 1 and ADC × 3
multiplexed with up to 17 GPIO pins. For more details, see Chapter 3.3 and Chapter 3.4.

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3.2. Pin Description

Wi-Fi&Bluetooth Module Series

Table 4: I/O Parameter Description

Type AIO DI DO DIO PI

Description Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input

DC characteristics include power domain and rated current, etc.

Table 5: Pin Description

Power Supply

Pin Name

Pin No. I/O Description

VBAT GND

4

PI

Power supply for the module

1, 3, 30, 31­39

DC Characteristics Vmax = 3.6 V Vmin = 3.0 V Vnom = 3.3 V

Comment
It must be provided with sufficient current more than 0.5 A.

Control Signal

Pin Name

Pin No. I/O

CHIP_EN

5

DI

Main UARTs

Pin Name

Pin No. I/O

UART1_TXD 27

DO

UART1_RXD 26

DI

Description

DC Characteristics

Enable the module VBAT

Comment
Hardware enable. Internally pulled down with a 200 k resistor. Active high.

Description UART1 transmit UART1 receive

DC Characteristics

Comment

VBAT

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UART2_TXD 20

DO UART2 transmit

UART2_RXD 19

DI UART2 receive

Debug UART

UART0_TXD 16 UART0_RXD 15

DO UART0 transmit DI UART0 receive

VBAT

Test points must be reserved.

GPIO Interfaces

Pin Name

Pin No. I/O Description

GPIOA1

14

DIO

DC Characteristics

Comment

GPIOB0

23

DIO

GPIOB1

21

DIO

GPIOB2

29

DIO

GPIOB3

22

DIO

GPIOB4

6

DIO

General-purpose input/output

VBAT

GPIOB5

7

DIO

GPIOB6

8

DIO

GPIOB7

9

DIO

GPIOB14

12

DIO

GPIOB15

11

DIO

RF Antenna Interface

Pin Name

Pin No. I/O

ANT_WIFI/BT 2

AIO

RESERVED Pins

Description
Wi-Fi/Bluetooth antenna interface (optional)

DC Characteristics

Comment 50 impedance.

Pin Name

Pin No.

Comment

RESERVED 10, 13, 17, 18, 24, 25, 28

Keep them unconnected.

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3.3. GPIO Multiplexing
The module provides up to 17 GPIO interfaces. Pins are defined as follows:

Table 6: GPIO Multiplexing

Pin Name

Pin No.

GPIOA1

14

GPIOB0

23

GPIOB1

21

GPIOB2

29

GPIOB3

22

GPIOB4

6

GPIOB5

7

GPIOB6

8

GPIOB7

9

GPIOB14

12

Alternate Function 0 (GPIO No.) GPIOA1 GPIOB0 GPIOB1 GPIOB2 GPIOB3 GPIOB4 GPIOB5 GPIOB6 GPIOB7 GPIOB14

Alternate Function 1 Alternate Function 2 Alternate Function 3 Alternate Function 4

PCM_CLK ADC0 ADC1 ADC2 ADC3 ADC4 ADC5 ADC6 ADC7 USB_DP

I2S_BCLK_0 UART1_RXD UART1_TXD UART1_RXD UART1_TXD UART1_CTS UART1_RTS UART0_RXD UART0_TXD PWM_B4

SPI_MISO SPI_CS0 SPI_MOSI PWM_B0 PWM_B1 PWM_B2 SPI_CS1 I2C_SDA –

SPI_CLK I2C_SCL I2C_SDA I2C_SCL –

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GPIOB15

11

UART0_RXD 15

UART0_TXD

16

UART1_TXD

27

UART1_RXD 26

UART2_TXD

20

UART2_RXD 19

GPIO15 GPIOA8 GPIOA9 GPIOA5 GPIOA4 GPIOA7 GPIOA6

USB_DM UART2_CTS UART2_RTS UART0_RTS UART0_CTS I2C_SDA I2C_SCL

PWM_B5 PWM_A2 I2S_DOUT_0 UART1_RTS UART1_CTS UART1_RTS UART1_CTS

Wi-Fi&Bluetooth Module Series

I2S_LRCK_0 PWM_A1 PWM_A0

I2S_BCLK_0 –

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3.4. Application Interfaces
3.4.1. UARTs
The module serves as DCE (Data Communication Equipment) and provides 3 UARTs: the main UART1 and UART2 and the debug UART0.

Table 7: Pin Definition of UARTs

Pin Name

Pin No. I/O

UART1_TXD 27

DO

UART1_RXD 26

DI

UART2_TXD 20

DO

UART2_RXD 19

DI

UART0_TXD 16

DO

UART0_RXD 15

DI

Description UART1 transmit UART1 receive UART2 transmit UART2 transmit UART0 transmit UART0 receive

Comment Test points must be reserved.

UART1 and UART2 can be used for data transmission. The default baud rate is 115200 bps, and the maximum baud rate can reach 6 Mbps.
The main UART connection between the module and the host is illustrated below.

Figure 3: Main UART1 Connection FCM360K_Hardware_Design

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Figure 4: Main UART2 Connection The debug UART0 supports 115200 bps baud rate by default, and is used for outputting partial logs with debugging tools. The following is a reference design of debug UART0. UART0 is also available for firmware upgrade and supports a default baud rate of 921600 bps.

Figure 5: Debug UART0 Reference Design
3.4.2. SPI*
The module provides a SPI which only supports master mode with a maximum clock frequency of up to 20 MHz. The following figure shows the connection between the host and the slave:

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Figure 6: SPI Connection

Table 8: Pin Definition of SPI

Pin Name GPIOB1 GPIOB6 GPIOB3 GPIOB0 GPIOB2

Pin No. Multiplexing Function I/O

21

SPI_CS0

DO

8

SPI_CS1

DO

22

SPI_CLK

DO

23

SPI_MISO

DI

29

SPI_MOSI

DO

Description SPI chip select (High power consumption) SPI chip select (Low power consumption) SPI clock SPI master-in slave-out SPI master-out slave-in

3.4.3. I2C Interfaces
The module provides 3 I2C interfaces that support master mode only.

Table 9: Pin Definition of I2C Interfaces

Pin Name GPIOB4 GPIOB5 GPIOB6 GPIOB7

Pin No. Multiplexing Function I/O

6

I2C_SCL

OD

7

I2C_SDA

OD

8

I2C_SCL

OD

9

I2C_SDA

OD

Description I2C serial clock I2C serial data I2C serial clock I2C serial data

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UART2_RXD 19 UART2_TXD 20

I2C_SCL I2C_SDA

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OD

I2C serial clock

OD

I2C serial data

3.4.4. PWM Interfaces*
The module supports 8 PWM channels.

Table 10: Pin Definition of PWM Interfaces

Pin Name

Pin No. Multiplexing Function I/O

GPIOB3

22

PWM_B0

DO

GPIOB4

6

PWM_B1

DO

GPIOB5

7

PWM_B2

DO

GPIOB14

12

PWM_B4

DO

GPIOB15

11

PWM_B5

DO

UART0_RXD 15

PWM_A2

DO

UART2_TXD 20

PWM_A1

DO

UART2_RXD 19

PWM_A0

DO

Description PWM out PWM out PWM out PWM out PWM out PWM out PWM out PWM out

3.4.5. ADC Interfaces
The module supports 8 ADC interfaces, whose voltage range is 0­1.1 V. To improve ADC accuracy, surround ADC trace with ground.

Table 11: Pin Definition of ADC Interfaces

Pin Name GPIOB0 GPIOB1 GPIOB2 GPIOB3

Pin No. Multiplexing Function I/O

45

ADC0

AI

46

ADC1

AI

47

ADC2

AI

48

ADC3

AI

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Description General-purpose ADC interface General-purpose ADC interface General-purpose ADC interface General-purpose ADC interface
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GPIOB4 GPIOB5 GPIOB6 GPIOB7

13

ADC4

14

ADC5

15

ADC6

16

ADC7

Wi-Fi&Bluetooth Module Series

AI

General-purpose ADC interface

AI

General-purpose ADC interface

AI

General-purpose ADC interface

AI

General-purpose ADC interface

Table 12: ADC Features

Parameter

Min.

Typ.

Max.

Unit

ADC Voltage Range

0

–

1.1

V

ADC Resolution Rate

–

TBD

–

bit

3.4.6. USB Interface
The module provides a integrated Universal Serial Bus (USB) interface as device which complies with the USB 2.0 specification and supports high-speed (480 Mbps) mode and is backward-compatible with full-speed (12 Mbps) mode.

Table 13: Pin Definition of USB Interface

Pin Name

Pin No.

Multiplexing Function

I/O

GPIOB14 12

USB_DP

DIO

GPIOB15 11

USB_DM

DIO

Description USB differential data (+) USB differential data (-)

Comment
Requires differential impedance of 90 . USB 2.0 compliant.

3.5. RF Antenna Interfaces
Appropriate antenna type and design should be used with matched antenna parameters according to

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specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products.
The module supports pin antenna (ANT_WIFI/BT), PCB antenna, coaxial RF connector, which are all optional. The coaxial RF connector is not mounted on the module when using pin antenna or PCB antenna.

3.5.1. Operating Frequencies

Table 14: Operating Frequencies (Unit: GHz)

Feature 2.4 GHz Wi-Fi 5 GHz Wi-Fi Bluetooth

Frequency 2.400­2.4835 5.150­5.855 2.400­2.4835

3.5.2. Pin Antenna (Optional)

Table 15: ANT_WIFI/BT Pin Definition

Pin Name ANT_WIFI/BT

Pin No.

I/O

2

AIO

Description
Wi-Fi/Bluetooth antenna interface

Comment 50 impedance.

3.5.2.1. Reference Design
The circuit of RF antenna interface is shown below. For better RF performance, it is necessary to reserve a matching circuit and add ESD protection components. Reserved matching components such as R1, C1, C2, and D1 should be placed as close to the antenna as possible. C1, C2, and D1 are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF and R1 is recommended to be 0 .

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Figure 4: RF Antenna Reference Design
Note: Pin antenna does not have an antenna connector, the antenna directly enters the chip pins through the matching circuit

3.5.2.2. Antenna Design Requirements

Table 16: Antenna Design Requirements

Parameter Frequency Range (GHz) Cable Insertion Loss (dB) VSWR Gain (dBi) Max. input power (W) Input impedance () Polarization type

Requirement 2.4 GHz: 2.400~2.4835 5 GHz: 5.150~5.850 <1
2 (Typ.) 2.4G Max Gain :2 5G Max Gain:0.9 50
50
Vertical

3.5.2.3. RF Routing Guidelines
For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures.

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Wi-Fi&Bluetooth Module Series Figure 5: Microstrip Design on a 2-layer PCB Figure 6: Coplanar Waveguide Design on a 2-layer PCB

Figure 7: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)

Figure 8: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)

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To ensure RF performance and reliability, follow the principles below in RF layout design:
Use an impedance simulation tool to control the characteristic impedance of RF traces to 50 . GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully
connected to the ground. The distance between the RF pins and the RF connector should be as short as possible and all
right-angle traces should be changed to curved ones. The recommended trace angle is 135°. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. In addition, adding some ground vias
around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be at least twice the width of RF signal traces (2 × W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers.
For more details about RF layout, see document [2].

3.5.3. PCB Antenna (Optional)

Table 17: PCB Antenna Specifications

Parameter Frequency Range (GHz) Input Impedance () VSWR Gain (dBi) Efficiency

Requirement 2.400­2.500 5.150­5.850
50
3
2.4G Max Gain :2 5G Max Gain:0.9 26 % (Typ.)

When using the PCB antenna on the module, the module should be placed at the side of the motherboard. The distance between the PCB antenna and connectors, vias, traces, ethernet port and any other metal components on the motherboard should be at least 16 mm. All layers in the PCB of the motherboard under the PCB antenna should be designed as a keepout area.

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Figure 9: Keepout Area on Motherboard During PCB design, do not route traces across the RF test point at the bottom of the module to ensure the module performance.

Figure 10: Prohibited Area for Routing FCM360K_Hardware_Design

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3.5.4. Coaxial RF Connector (Optional)
The mechanical dimensions of the receptacle supported by the module are as follows.

Figure 11: Dimensions of the Receptacle (Unit: mm)

Table 18: Major Specifications of the RF Connector

Item Nominal Frequency Range Nominal Impedance Temperature Rating
Voltage Standing Wave Ratio (VSWR)

Specification
DC to 6 GHz
50
-40 °C to +85 °C Meet the requirements of: Max. 1.3 (DC­3 GHz) Max. 1.45 (3­6 GHz)

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Wi-Fi&Bluetooth Module Series The mated plug listed in the following figure can be used to match the connector.
Figure 12: Specifications of Mated Plugs (Unit: mm) The following figure describes the space factor of the mated connectors.

Figure 13: Space Factor of the Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com.
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3.5.4.1. Assemble Coaxial Cable Plug Manually The pictures for plugging in a coaxial cable plug is shown below, = 90° is acceptable, while 90° is not.

Figure 14: Plug in a Coaxial Cable Plug
The pictures of pulling out the coaxial cable plug is shown below, = 90° is acceptable, while 90° is not.

Figure 15: Pull out a Coaxial Cable Plug FCM360K_Hardware_Design

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3.5.4.2. Assemble Coaxial Cable Plug with Jig The pictures of installing the coaxial cable plug with a jig is shown below, = 90° is acceptable, while 90° is not.

Figure 16: Install the Coaxial Cable Plug with Jig
3.5.4.3. Recommended Manufacturers of RF Connector and Cable RF connectors and cables by I-PEX are recommended. For more details, visit https://www.i-pex.com.

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Operating Characteristics

4.1. Power Supply
Power supply pin and ground pins of the module are defined in the following table.

Table 19: Pin Definition of Power Supply and GND Pins

Pin Name VBAT GND

Pin No. I/O

4

PI

1, 3, 30, 31­39

Description

Min.

Power supply for the module 3.0

Typ. Max. Unit

3.3

3.6

V

4.1.1. Reference Design for Power Supply
The module is powered by VBAT, and it is recommended to use a power supply chip that can provide more than 0.5 A output current. For better power supply performance, it is recommended to parallel a 22 F decoupling capacitor, and two filter capacitors (1 F and 100 nF) near the module’s VBAT pin. In addition, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace is, the wider it should be.
VBAT reference circuit is shown below:

Figure 17: VBAT Reference Circuit FCM360K_Hardware_Design

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4.2. Turn On

After the VBAT is powered up, pull the CHIP_EN up for 6 ms when turn on the module for the first time. After the module is turned on, the pin CHIP_EN monitors the real-time level changes to realize turn-on/off of the module. When the module is completely powered off, the CHIP_EN must be pulled up for 6 ms to start the module again.
Table 20: Pin Definition of CHIP_EN

Pin Name

Pin No.

I/O

CHIP_EN

5

DI

Description Enable the module

Comment
Hardware enable. Internally pulled down with a 200 k resistor. Active high.

The turn-on timing is shown below:

Figure 18: Turn-on Timing

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4.3. Download Mode
After the module is powered on, keep the pin input of GPIOB6 and GPIOB7 at low level and press CHIP_EN to start the module, and the module will enter the download mode. Firmware can be downloaded through UART0 in download mode.
Figure 19: Reference Design for Download Mode

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RF Performances

5.1. Wi-Fi Performances

Table 21: Wi-Fi Performances

Operating Frequency
2.4 GHz: 2.400­2.4835 GHz 5 GHz: 5.150­5.850 GHz Modulation

BPSK, QPSK, CCK, 16QAM, 64QAM256QAM, 1024QAM

Operating Mode

AP STA

Transmission Data Rate
802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps 802.11a/g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48 Mbps, 54 Mbps 802.11n: HT20 (MCS 0­7), HT40 (MCS 0­7) 802.11ac: VHT20MCS 0­8,VHT40(MCS 0­9) 802.11ax: HE20 (MCS 0­11), HE40 (MCS 0­11)

Condition

EVM

Unit: dBm, Tolerance: ±2 dB

Transmitting Power Receiving Sensitivity

@ Typ.

@ Typ.

802.11b @ 1 Mbps 802.11b @ 11 Mbps

35 %

TBD TBD

TBD TBD

2.4 GHz

802.11g @ 6 Mbps 802.11g @ 54 Mbps

-5 dB TBD -25 dB TBD

TBD TBD

802.11n, HT20 @ MCS 0 -5 dB TBD

TBD

802.11n, HT20 @ MCS 7 -27 dB TBD

TBD

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5 GHz

802.11n, HT40 @ MCS 0 -5 dB TBD

802.11n, HT40 @ MCS 7 -27 dB TBD

802.11ax, HE20 @ MCS 0 -5 dB TBD

802.11ax, HE20 @ MCS 11 -35 dB TBD

802.11ax, HE40 @ MCS 0 -5 dB TBD

802.11ax, HE40 @ MCS 11 -35 dB TBD

802.11a @ 6 Mbps

-5 dB TBD

802.11a @ 54 Mbps

-25 dB TBD

802.11n, HT20 @ MCS 0 -5 dB TBD

802.11n, HT20 @ MCS 7 -27 dB TBD

802.11n, HT40 @ MCS 0 -5 dB TBD

802.11n, HT40 @ MCS 7 -27 dB TBD

802.11ac, VHT20 @ MCS 0 -5 dB TBD

802.11ac, VHT20 @ MCS 8 -27 dB TBD

802.11ac, VHT40 @ MCS 0 -5 dB TBD

802.11ac, VHT40 @ MCS 9 -32 dB TBD

802.11ax, HE20 @ MCS 0 -5 dB TBD

802.11ax, HE20 @ MCS 9 -32 dB TBD

802.11ax, HE40 @ MCS 0 -5 dB TBD

802.11ax, HE40 @ MCS 9 -30 dB TBD

Wi-Fi&Bluetooth Module Series
TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

5.2. Bluetooth Performances
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Table 22: Bluetooth Performances
Operating Frequency 2.400~2.4835 GHz Modulation GFSK, /4-DQPSK, 8-DPSK Operating Mode Classic Bluetooth (BR + EDR) Bluetooth Low Energy (BLE)
Condition
BR EDR (/4-DQPSK) EDR (8-DPSK) BLE

Unit: dBm, Tolerance: ±3 dB

Transmitting Power @ Typ. Receiving Sensitivity @ Typ.

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

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Electrical Characteristics & Reliability

6.1. Absolute Maximum Ratings
Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table.

Table 23: Absolute Maximum Ratings (Unit: V)

Parameter VBAT Voltage at Digital Pins Voltage at ADC[0:7]

Min. -0.3 -0.3 0

Max. 3.6 3.6 1.1

6.2. Power Supply Ratings

Table 24: Module Power Supply Ratings (Unit: V)

Parameter VBAT

Description
Power supply for the module

Condition

Min.

The actual input voltages must be kept between the minimum and maximum 3.0 values.

Typ. 3.3

Max. 3.6

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6.3. Wi-Fi Power Consumption

Wi-Fi&Bluetooth Module Series

Table 25: Power Consumption in Low Power Modes

Mode

Typ.

Unit

Light sleep

TBD

A

Deep sleep

TBD

A

DTIM1

TBD

mA

DTIM3

TBD

mA

OFF

TBD

A

Table 26: Power Consumption in Non-signaling Modes

Condition

Typ.

Unit

802.11b, Tx 1 Mbps @ TBD

TBD

mA

802.11b, Tx 11 Mbps @ TBD

TBD

mA

802.11g, Tx 6 Mbps @ TBD

TBD

mA

802.11g, Tx 54 Mbps @ TBD

TBD

mA

802.11n, HT20 Tx MCS 0 @ TBD

TBD

mA

802.11n, HT20 Tx MCS 7 @ TBD

TBD

mA

2.4 GHz

802.11n, HT40 Tx MCS 0 @ TBD

TBD

mA

802.11n, HT40 Tx MCS 7 @ TBD

TBD

mA

802.11ax, HE20 Tx MCS 0 @ TBD

TBD

mA

802.11ax, HE20 Tx MCS 11 @ TBD

TBD

mA

802.11ax, HE40 Tx MCS 0 @ TBD

TBD

mA

802.11ax, HE40 Tx MCS 11 @ TBD

TBD

mA

5 GHz

802.11a, Tx 6 Mbps @ TBD

TBD

mA

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802.11a, Tx 54 Mbps @ TBD 802.11n, HT20 Tx MCS 0 @ TBD 802.11n, HT20 Tx MCS 7 @ TBD 802.11n, HT40 Tx MCS 0 @ TBD 802.11n, HT40 Tx MCS 7 @ TBD 802.11ac, VHT20 Tx MCS 0 @ TBD 802.11ac, VHT20 Tx MCS 8 @ TBD 802.11ac, VHT40 Tx MCS 0 @ TBD 802.11ac, VHT40 Tx MCS 9 @ TBD 802.11ax, HE20 Tx MCS 0 @ TBD 802.11ax, HE20 Tx MCS 9 @ TBD 802.11ax, HE40 Tx MCS 0 @ TBD 802.11ax, HE40 Tx MCS 9 @ TBD

Wi-Fi&Bluetooth Module Series

TBD

mA

TBD

mA

TBD

mA

TBD

mA

TBD

mA

TBD

mA

TBD

mA

TBD

mA

TBD

mA

TBD

mA

TBD

mA

TBD

mA

TBD

mA

6.4. Digital I/O Characteristics

Table 27: VBAT I/O Characteristics (Unit: V)

Parameter VIH VIL VOH VOL

Description High-level Input Voltage Low-level Input Voltage High-level Output Voltage Low-level Output Voltage

Min. 0.7 × VBAT 0 0.9 × VBAT -0

Max. VBAT 0.3 × VBAT VBAT 0.1 × VBAT

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6.5. ESD Protection
Static electricity occurs naturally and may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

Table 28: ESD Characteristics (Unit: kV)

Model Human Body Model (HBM) Charged Device Model (CDM)

Test Result ±3 ±0.35

Standard ANSI/ESDA/JEDEC JS-001-2017 ANSI/ESDA/JEDEC JS-002-2018

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Mechanical Information

This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeters (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified.
7.1. Mechanical Dimensions

Figure 20: Top and Side Dimensions

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Figure 21: Bottom Dimensions (Bottom View)
NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard.

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7.2. Recommended Footprint

Wi-Fi&Bluetooth Module Series

Figure 22: Recommended Footprint
NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience.

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7.3. Top and Bottom Views

Wi-Fi&Bluetooth Module Series

Figure 23: Top and Bottom Views (Pin Antenna)

Figure 24: Top and Bottom Views (PCB Antenna) FCM360K_Hardware_Design

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Figure 25: Top and Bottom Views (Coaxial RF Connector)
NOTE 1. Images above are for illustrative purposes only and may differ from the actual module. For authentic
appearance and label, please refer to the module received from Quectel. 2. The coaxial RF connector is not mounted on the module when using PCB antenna or pin antenna
(ANT_WIFI/BT).

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Storage, Manufacturing & Packaging

8.1. Storage Conditions
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below.
1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35­60 %.
2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition.
3. Floor life: 168 hours 4 in a factory where the temperature is 23 ±5 °C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
The module is not stored in Recommended Storage Condition; Violation of the third requirement mentioned above; Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours; Before module repairing.
5. If needed, the pre-baking should follow the requirements below:
The module should be baked for 8 hours at 120 ±5 °C; The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put
in a dry environment such as in a dry cabinet.

4 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not unpack the modules in large quantities until they are ready for soldering.

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NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module
to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before
baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti- static gloves, when touching the modules.
8.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.15­0.18 mm. For more details, see document [3].
The recommended peak reflow temperature should be 235­246 ºC, with 246 ºC as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below.

Figure 26: Recommended Reflow Soldering Thermal Profile

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Table 29: Recommended Thermal Profile Parameters

Factor Soak Zone Ramp-to-soak slope Soak time (between A and B: 150 °C and 200 °C) Reflow Zone Ramp-up slope Reflow time (D: over 217 °C) Max. temperature Cool-down slope Reflow Cycle Max. reflow cycle

Recommended Value
0­3 °C/s 70­120 s
0­3 °C/s 40­70 s 235­246 °C -3­0 °C/s
1

NOTE
1. The above profile parameter requirements are for the measured temperature of solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements.
2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found.
4. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.
6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3].

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8.3. Packaging Specifications
This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery.
8.3.1. Carrier Tape
Carrier tape dimensions are detailed below:

Figure 27: Tape Specifications

Table 30: Carrier Tape Dimension Table (Unit: mm)

W

P

T

A0

B0

K0

K1

F

E

44

32

0.4

18.4

25.9

3.7

6.8

20.2

1.75

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8.3.2. Plastic Reel

Wi-Fi&Bluetooth Module Series

Figure 28: Reel Specifications

Table 31: Reel Dimensions (Unit: mm)

øD1

øD2

W

330

100

44.5

8.3.3. Mounting Direction

Figure 29: Mounting Direction

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8.3.4. Packaging Process

Wi-Fi&Bluetooth Module Series
Place the modules into the carrier tape and use the cover tape to cover them; then wind the heat-sealed carrier tape on the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules.

Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, then vacuumize it.

Place the vacuum-packed plastic reel inside the pizza box.
Place 4 packaged pizza boxes inside 1 carton box and seal it. 1 carton box can pack 1000 modules.
Figure 30: Packaging Process

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Appendix References

Table 32: Reference Documents
Document Name [1] Quectel_FCM360W_TE-B_User_Guide [2] Quectel_RF_Layout_Application_Note [3] Quectel_Module_SMT_Application_Note

Table 33: Terms and Abbreviations

Abbreviation ADC AP BLE BPSK CCK CDM CS DCE DPSK DQPSK DTE DTIM ESD

Description Analog-to-Digital Converter Access Point Bluetooth Low Energy Binary Phase Shift Keying Complementary Code Keying Charged Device Model Chip Select Data Communications Equipment Differential Phase Shift Keying Differential Quadrature Reference Phase Shift Keying Data Terminal Equipment Delivery Traffic Indication Message Electrostatic Discharge

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EVM GFSK GND GPIO HT I/O I2C I2S IEEE IoT LCC LNA Mbps MISO MOSI OTA PA PCB PMU PWM QAM QPSK RF RoHS ROM SCLK SDIO

Wi-Fi&Bluetooth Module Series
Error Vector Magnitude Gauss frequency Shift Keying Ground General-Purpose Input/Output High Throughput Input/Output Inter-Integrated Circuit Inter-IC Sound Institute of Electrical and Electronics Engineers Internet of Things Leadless Chip Carrier (package) Low Noise Amplifier Million Bits Per Second Master In Slave Out Master Out Slave In Over-the-Air Power Amplifier Printed Circuit Board Power Management Unit Pulse Width Modulation Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Restriction of Hazardous Substances Read Only Memory Serial Clock Secure Digital Input/Output

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SPI

Serial Peripheral Interface

SRAM

Static Random-Access Memory

STA

Station

TBD

To Be Determined

UART

Universal Asynchronous Receiver/Transmitter

USB

Universal Serial Bus

VIH

High-level Input Voltage

VIL

Low-level Input Voltage

Vmax

Maximum Voltage

Vmin

Minimum Voltage

Vnom

Normal Voltage Value

VOH

High-level Output Voltage

VOL

Low-level Output Voltage

VSWR

Voltage Standing Wave Ratio

Wi-Fi

Wireless Fidelity

Warning

10.1. Important Notice to OEM integrators Product Marketing NameQuectel FCM360K
1.This module is limited to OEM installation ONLY. 2.This module is limited to installation in fixed applications, according to Part 2.1091(b). 3.This module has been tested and found to comply with the limits for Part 15.247 & 15.407 of the FCC Rules. 4.The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module’s intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel Wireless Solutions Co., Ltd.. that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. End Product LabelingWhen the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re- moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: XMR2023FCM360K” The FCC ID can be used only when all FCC mpliance requirements are met.

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Antenna Installation
(1)The antenna must be installed such that 20 cm is maintained between the antenna and users, (2)The transmitter module may not be co-located with any other transmitter or antenna. (3)Only antennas of the same type and with equal or less gains as shown below may be used with thismodule.
Other types of antennas and/or higher gain antennas may require additional authorization for operation.
(4)The max allowed antenna gain is 1 dBi for external monopole antenna.
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
10.2. FCC Statement
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
-Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This device is intended only for OEM integrators under the following conditions:
(For module device use)
1)The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2)The transmitter module may not be co-located with any other transmitter or antenna. As long as 2conditions
above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.
10.3. IC Statement
IRSS-GEN “This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device.” or “Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux
deux conditions suivantes :

1. l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.” Déclaration sur l’exposition aux rayonnements RF L’autre utilisé pour l’émetteur doit être installé pour fournir une distance de séparation d’au moins 20 cm de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur.

Radio frequency radiation exposure statement The other one used for the transmitter must be installed at a distance of at least 20 cm from all personnel and must not be shared or operated together with any other antenna or transmitter. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows: “Contains IC: 10224A- 2023FCM360K” or “where: 10224A-2023FCM360K is the module’s certification number”. Le produit hôte doit être correctement étiqueté pour identifier les modules dans le produit hôte. L’étiquette de certification d’Innovation, Sciences et Développement économique Canada d’un module doit être clairement visible en tout temps lorsqu’il est installédans le produit hôte; sinon, le produit hôte doit porter une étiquette indiquant le numéro de certification d’Innovation, Sciences et Développement économique Canada pour le module, précédé du mot «Contient» ou d’un libellé semblable exprimant la même signification, comme suit: “Contient IC: 10224A-2023FCM360K” ou “où: 10224A- 2023FCM360K est le numéro de certification du module”. i.the device for operation in the band 5150­5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems; ii.for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit; iii.for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate; iv.Omnidirectional antenna is recommended

References

• Electrical and Electronic Connectors - HIROSE Electric Group [Connector]
• Contact | Quectel
• Connectors Home | I-PEX

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