QUECTEL AF31G Series Wi-Fi and Bluetooth Module User Manual

: June 15, 2024
: QUECTEL

QUECTEL AF31G Series Wi-Fi and Bluetooth Module

Product Information

Specifications

Product Name: AF31G Wi-Fi&Bluetooth Module Series
Version: 1.0.1
Date: 2022-07-19
Status: Preliminary

About Quectel

Quectel is committed to providing timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016
Tianlin Road, Minhang District, Shanghai 200233, China
Tel: +86 21 5108 6236
Email: info@quectel.com
For more information and support, please visit our website: http://www.quectel.com/support/sales.htm
For technical support or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm
Or email us at: support@quectel.com

Legal Notices

Documents and information provided by us shall be kept confidential unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein.

Copyright

Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name, or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

Third-Party Rights

This document may refer to hardware, software, and/or documentation owned by one or more third parties (third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.

Privacy Policy

To implement module functionality, certain device data are uploaded to Quectel’s or third-party servers, including carriers, chipset suppliers, or customer-designated servers. Quectel strictly abides by the relevant laws and regulations and shall retain, use, disclose, or otherwise process relevant data to perform the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.

Disclaimer

a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.
b) We shall bear no liability resulting from any inaccuracies or omissions or from the use of the information contained herein.
c) While we have made every effort to ensure that the functions and features under development are safe and reliable, we assume no liability for any errors or omissions in the product design.

Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service, or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

Full attention must be paid to driving at all times to reduce the risk of an accident.
Using a mobile while driving (even with a hands-free kit) causes distraction and can lead to an accident.
Please comply with laws and regulations restricting the use of wireless devices while driving.

FAQ

Q: Where can I find technical support?

A: For technical support, please visit our website: http://www.quectel.com/support/technical.htm.
You can also email us at support@quectel.com.

Q: How can I contact Quectel headquarters?

A: You can contact our headquarters at the following address:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China
Tel: +86 21 5108 6236
Email:info@quectel.com

Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service, or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
Full attention must be paid to driving at all times to reduce the risk of an accident. Using a mobile while driving (even with a hands-free kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled before boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics, or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular networks cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergent help is needed in such conditions, use an emergency call if the device supports it. To make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with an emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers, or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phones or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders.

About the Document

Revision History

Introduction

This document, describing AF31G and its air interface and hardware interfaces connected to your applications, informs you of the interface and RF specifications, electrical and mechanical details, as well as other related information of the module.
With the application notes and user guides provided separately, you can easily use the module to design and set up mobile applications.

Special Mark

Product Overview

AF31G is an automotive-grade Wi-Fi and Bluetooth module with low power consumption. It complies with IEEE 802.11a/b/g/n/ac 2.4 GHz & 5 GHz WLAN standards and Bluetooth 5.0 standard, which enables seamless integration of WLAN and Bluetooth Low Energy technologies.
It supports a low-power PCIe Gen2 interface for Wi-Fi and a UART/PCM interface for Bluetooth, and it also supports an LTE & Wi-Fi/Bluetooth coexistence interface.

Key Features

Functional Diagram

The following figure shows a block diagram of the module and illustrates the major functional parts.
Power management
Baseband
Radio frequency
Peripheral interfaces
To meet normal operating temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc.
Within this temperature range, the module’s related indicators can meet IEEE and Bluetooth specifications.

Pin Assignment

NOTE

Please keep all RESERVED pins open.
SDIO interface and PCIe interface exist in different hardware modules respectively. Modules supporting PCIe interface do not support SDIO interface. At this time, it is necessary to suspend the pins of all SDIO interfaces, and vice versa.

Pin Description

Operating Characteristics

Power Supply

Power Supply Pins

The following table shows the power supply pins and the ground pins of AF31G.

Reference Design for Power Supply
AF31G is powered by VDD_PA, and it is recommended to use a power supply chip with maximum output current exceeding 1.5 A. The following figure shows a reference design for VDD_PA is controlled by WLAN_PWR_EN1.

The power supply for I/O in AF31G is from VDD_IO, and it is recommended to use a power supply chip with maximum output current exceeding 300 mA. The following figure shows a reference design for VDD_IO is controlled by WLAN_PWR_EN2.

Timing of Turning on the Module

Application Interfaces

Wireless Connection Interface

AF31G supports low power PCIe Gen2 interface or SDIO 3.0 for Wi-Fi function and UART as well as PCM interfaces for Bluetooth function.

Wi-Fi Application Interface

The following figure shows the Wi-Fi application interface connection between AF31G and AG52x series modules. SDIO interface and PCIe interface exist in different hardware modules respectively. Please make sure witch AF31G module used.

PCIe Interface
Table 7: Pin Definition of PCIe Interface

The following figure shows the PCIe interface connection between AF31G and AG52x series modules.

In order to ensure the integrity of PCIe signal, C1 and C2 components must be placed close to AG52x series modules. The extra stubs of traces must be as short as possible.
The following principles of PCIe interface design should be complied with, to meet PCIe Gen2 specifications.
It is important to route the PCIe signal traces (PCIE_TX/PCIE_RX/PCIE_REFCLK) as differential pairs with total grounding. And the differential impedance is 85 Ω ±10%.
For PCIe signal traces, the maximum length of each differential data pair (PCIE_TX/PCIE_RX/PCIE_REFCLK) is recommended to be less than 300 mm, and each differential data pair mat ching should be less than 0.7 mm (5 ps).
The trace space between TX differential data pair and RX differential data pair should be three times wider than PCIe trace width.
The trace space between PCIe signals and the other signals should be four times wider than PCIe trace width.
Do not route signal traces under crystals, oscillators, magnetic devices, or RF signal traces. It is important to route the PCIe differential traces in inner-layer of the PCB and surround the traces with ground on that layer and with ground planes above and below.

SDIO Interface

The following figure shows the SDIO interface connection between AF31G and AG52x series modules.

As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.0 specification, please comply with the following principles:
It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal trace is 50 Ω ±10%.
Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc.
It is recommended to keep matching length between WLAN_SDIO_CLK and WLAN_SDIO_DATA[0:3]/WLAN_SDIO_CMD less than 1 mm and total routing length less than 50 mm. AF31G has 14 mm of internal tracing and 36 mm of external tracing.
It is recommended that keep termination resistors within 15–24 Ω on clock lines near the module and keep the route distance from the module clock pins to termination resistors less than 5 mm.
Make sure the adjacent trace spacing is 2 times of the trace width and bus capacitance is less than 15 pF.

WLAN_EN

WLAN_EN is used to control the Wi-Fi function of AF31G. Wi-Fi function will be enabled when WLAN_EN is at high level.

NOTE

WLAN_EN is a sensitive signal, and it should be ground shielded and routed as close as possible to AF31G.

Bluetooth Application Interface

The following figure shows the block diagram of Bluetooth application interface connection between AF31G and AG52x series modules:

PCM Interface

AF31G provides PCM interface for Bluetooth voice application.
The following figure shows the PCM interface connection between AF31G and AG52x series modules.

BT_EN

BT_EN is used to control the Bluetooth function of AF31G. Bluetooth function will be enabled when BT_EN is at high level.

BT_UART

The following figure shows the reference design for BT_UART connection between AF31G and AG52x series modules.

Coexistence UART

The following figure shows the reference design for coexistence UART interface connection between AF31G and AG52x series modules.

WLAN_SLP_CLK
The 32.768 kHz clock can be used in low power consumption mode, such as power saving mode and sleep mode, in which basic logic operations can be maintained.

RF Specifications

RF Antenna

The characteristic impedance of the antenna ports should be controlled to 50 Ω.

Antenna Interface & Frequency Bands

Reference Design

AF31G provides an RF antenna pin for Wi-Fi/Bluetooth antenna connection. The RF trace in host PCB connected to the module’s RF antenna pin should be microstrip line or other types of RF trace, with characteristic impendence close to 50 Ω.
This module comes with grounding pins which are next to the antenna pin in order to give a better grounding.
It is recommended to reserve a π-type and LCs matching circuit for better RF performance, and add a TVS for ESD protection. The π-type matching components (C3, C4, R1), the LCs (L1, C1, L2, C2) and TVS (D1) should be placed as close to the antenna as possible. The capacitors and inductors are not mounted by default. The parasitic capacitance of TVS should be less than 0.05 pF.

RF Performances Conducted RF Performance of Wi-Fi

Conducted RF Performance of BLE

Reference Design of RF Routing

For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance.
The following are reference designs of microstrip or coplanar waveguide with different PCB structures.
In order to ensure RF performance and reliability, follow the principles below in RF layout design:
Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.
Design the GND pins adjacent to RF pins as thermal relief pads, and fully connect them to ground.
The distance between the RF pins and the RF connector should be as short as possible, and all the right-angle traces should be changed to curved ones.
Reserve clearance under the signal pin of the antenna connector or solder joint.
The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance.
The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 × W).
Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers.
For more details about RF layout, please refer to document [2].

Antenna Requirements

Polarization Type: Vertical

RF Connector Recommendation

If the RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connectors provided by Hirose.
U.FL-LP series connectors listed in the following figure can be used to match the U.FL-R-SMT.
The following figure describes the space factor of the mated connector.
For more details, visit http://www.hirose.com.

Reliability

Absolute Maximum Ratings

NOTE

VDDIO is the supply voltage associated with the input pin to which the test voltage is applied.

The following table shows the recommended operating conditions of AF31G.

Digital I/O Characteristic

Power Consumption

Wi-Fi Power Consumption
Under the maximum transmit power, the Wi-Fi power consumption test results are as follows:

BLE Power Consumption
BLE power consumption during non-signaling is here as follows:

NOTE

For more details about current consumption, please contact Quectel Technical Supports for the power consumption test report of the module.

ESD Protection

Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative.
For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

Thermal Dissipation

The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range.

The following principles for thermal consideration are provided for reference:

Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply.
Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible.
Follow the principles below when the heatsink is necessary:
Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.
Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;
Choose the heatsink with adequate fins to dissipate heat;
Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;
Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation.

Operating and Storage Temperatures

To meet normal operating temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc.
Within this temperature range, the module’s related indicators can meet IEEE and Bluetooth specifications.

Mechanical Information

This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), All dimensions are measured in millimeter (mm), and the dimensional tolerances are±0.2 mm unless otherwise specified.

Mechanical Dimensions

NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard.

Recommended Footprint

NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience.

Top and Bottom Views

NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel.

Storage, Manufacturing and Packaging

Storage Conditions

The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below.

Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35–60 %.
Shelf life (in vacuum-sealed packaging ): 12 months in Recommended Storage Condition.
Floor life: 168 hours 3 in a factory where the temperature is 23 ±5 °C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).
The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
- The module is not stored in the Recommended Storage Condition;
- Violation of the third requirement mentioned above;
- Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
- Before module repairing.
If needed, the pre-baking should follow the requirements below:
- The module should be baked for 8 hours at 120 ±5 °C;
- The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet.
This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering.

note

To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden.
Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.

Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be TBD mm. For more details, please refer to document [1].
The peak reflow temperature should be 235–246 ºC, with 246 ºC as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below.

If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.
Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [1][2].

Packaging Specifications

This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery.

The module adopts carrier tape packaging and details are as follows:

Carrier Tape

Dimension details are as follows:

Plastic Reel

Packaging Process

Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules.
Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it.
Place the vacuum-packed plastic reel into the pizza box.
Put 4 packaged pizza boxes into 1 cartoon box and seal it. 1 cartoon box can pack 1000 modules.

Appendix References

FCC Certification Requirements

According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device.
And the following conditions must be met:

This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091.
The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body and must not transmit simultaneously with any other antenna or transmitter.
A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR202302AF31G.
To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:
- Buletooth: ≤3.67dBi
- Buletooth (LE): ≤3.67dBi
- Wi-Fi 2.4G:≤4.35dBi
- Wi-Fi 5G:≤5.4dBi
This module must not transmit simultaneously with any other antenna or transmitter.
The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.

For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment separate approval is required for all other operating configurations, including portable configurations concerning 2.1093 and different antenna configurations.
For this device, OEM integrators must be provided with labelling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label or an electronic label. For a permanently affixed label, the module must be labelled with an FCC ID -Section 2.926 (see 2.2 Certification (labelling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labelling requirements, options and OEM user manual instructions that are required (see next paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module:“Contains Transmitter Module FCC ID: XMR202302AF31G.” or “Contains FCC ID: XMR202302AF31G.” must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID.
The final host/module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators to be properly authorized for operation as a Part 15 digital device.
The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

This device may not cause harmful interference,
this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment.

At Quectel, we aim to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China

Tel: +86 21 5108 6236
Email: info@quectel.com
Or our local offices. For more information, please visit: http://www.quectel.com/support/sales.htm.
For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm.
Or email us at: support@quectel.com.
Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an “as available” basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you.

Use and Disclosure Restrictions

License Agreements
Documents and information provided by us shall be kept confidential unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein.
Copyright
Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with the abovementioned requirements, unauthorized use, or other illegal or malicious use of the material.
Trademarks
Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.
Third-Party Rights
This document may refer to hardware, software and/or documentation owned by one or more third parties (“third-party materials”). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto.
We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non- infringement of any third-party intellectual property rights about the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any warranties arising from the course of dealing or usage of trade.
Privacy Policy
To implement module functionality, certain device data are uploaded to Quectel’s or third-party servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data to perform the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy.

Disclaimer

a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.
b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein.
c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable.
d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources.