NXP RD33774ADSTEVB Evaluation Board User Manual

NXP RD33774ADSTEVB Evaluation Board

Product Information

systems
Abstract| This user manual describes how to use the RD33774ADSTEVB evaluation board.

Product Usage Instructions

Finding kit resources and information on the NXP web site
To find kit resources and information about the RD33774ADSTEVB evaluation board on the NXP website, please refer to the following steps:

1. Visit the NXP website at http://www.nxp.com.
2. Search for the RD33774ADSTEVB evaluation board.
3. Access the kit resources and information available on the product page.

NXP Semiconductors provides online resources for this evaluation board and its supported device(s) on http://www.nxp.com. The information page for the RD33774ADSTEVB evaluation board is at http://www.nxp.com/RD33774ADSTEVB. The information page provides overview information, documentation, software and tools, parametrics, ordering information and a Getting Started tab. The Getting Started tab provides quick-reference information applicable to using the RD33774ADSTEVB evaluation board, including the downloadable assets referenced in this document.

Getting Ready

Kit Contents
The RD33774ADSTEVB evaluation board kit includes the following items:

• RD33774ADSTEVB evaluation board
• Assembled and tested evaluation board/module in anti-static bag
• One 32-pin battery cell cable
• One two-pin TPL cable

Required Equipment
To interface with a PC for the evaluation setup, you will need the following equipment:

• A graphical user interface, EvalGUI 7, available in Secure Files on http://www.nxp.com.

To use this kit, the following equipment is required:

• A 4-cell to 18-cell battery pack or a battery pack emulator, such as BATT-18CEMULATOR
• FRDMDUALK3664EVB (EVB for MC33664A) in combination with the S32K3X4EVB-T172 (S32K3X4 EVB) to interface with a PC. For the evaluation setup, a graphical user interface, EvalGUI 7, is available in Secure Files on http://www.nxp.com.

Getting to Know the Hardware

Kit Overview **

**

The RD33774ADSTEVB evaluation board features one MC33774A battery-cell controller integrated circuit (IC). It provides a platform for evaluating NXP products, including analog, mixed-signal, and power solutions. The board incorporates monolithic ICs and system-in-package devices that use high-volume technology. NXP products offer long battery life, a small form factor, reduced component counts, lower cost, and improved performance in powering state-of- the-art systems. The RD33774ADSTEVB serves as a hardware evaluation tool in support of NXP’s MC33774A device. The MC33774A is a battery-cell controller that monitors up to 18 lithium-ion battery cells. RD33774ADSTEVB is designed for use in automotive and industrial applications. The device performs analog- to-digital conversion on the differential cell voltages and currents. It is also capable of battery-charge coulomb counting and battery temperature measurements. The RD33774ADSTEVB can be used for rapid prototyping of MC33774A-based applications that involve voltage and temperature sensing. The information is digitally transmitted to a microcontroller for processing. The evaluation board can be used with a physical layer transformer transceiver driver (MC33664) to convert MCU SPI data bits to pulse bit information for the MC33774A and vice versa.

Board Features

The main features of the RD33774ADSTEVB evaluation board are:

• 4 cells to 18 cells NTC and other sensor
• HV CONNECTOR ESD
• CELL BALANCING
• FILTER
• Daisy-chain device connection
• LED indicator for operation mode
• Cell-balancing resistors (22 Ω per individual cell)
• Cell-sense input with RC filter
• GPIO: Digital I/O, wake-up inputs, convert trigger inputs, ratiometric analog inputs, analog inputs with absolute measurements
• EEPROM (connected to the IC with I2C interface) to store user-defined calibration parameters

Block diagram

MC33774A Features and Benefits
The MC33774A is a battery-cell controller IC designed to monitor battery characteristics such as voltage, current, and temperature. It contains all the necessary circuit blocks for battery-cell voltage measurement, cell temperature measurement, and integrated cell balancing. The MC33774A supports the following functions:

• Battery-cell voltage measurement

• Cell temperature measurement

• Integrated cell balancing

• AEC-Q100 grade 1 qualified: -40 °C to +125 °C ambient temperature range

• ISO 26262 ASIL D support for cell voltage and cell temperature measurements from the host microcontroller unit (MCU) to the cell

• Cell-voltage measurement

  • 4 cells to 18 cells per device
  • Supports bus bars voltage measurement with +5/-3 V input voltage
  • 16-bit resolution and ±1 mV typical measurement accuracy with ultra-low long-term drift
  • 136 µs synchronicity of cell-voltage measurements
  • Integrated configurable digital filter

• External temperature and auxiliary voltage measurements

  • One analog input for absolute measurement, 5 V input range

  • Eight analog inputs configurable as absolute or ratiometric, 5 V input range

  • 16 bit resolution and ±5 mV typical measurement accuracy

  • Integrated configurable digital filter
    • Internal measurement

  • Two redundant internal temperature sensors

  • Supply voltages

  •  External transistor current

• Cell voltage balancing

  • 18 internal balancing field effect transistors (FET), up to 150 mA average with 0.5 Ω RDSon per channel (typ.)
  • Support for simultaneous passive balancing of all channels with automatic odd/even sequence
  • Global balancing timeout timer
  •  Timer-controlled balancing with individual timers with 10 s resolution and up to 45 hours duration
  • Voltage-controlled balancing with global and individual undervoltage thresholds
  • Temperature-controlled balancing; if balancing resistors are in overtemperature, balancing is interrupted
  • Configurable pulse width modulation (PWM) duty cycle balancing
  • Automatic pausing of balancing during measurement with configurable filter settling time
  • Configurable delay of the start of balancing after transition to sleep
  • Automatic discharge of the battery pack (emergency discharge)
  • Constant current cell balancing to compensate the balancing current variation because of cell voltage variation

• I2C-bus master interface to control external devices, for example, EEPROMs and security ICs

• Configurable alarm output

• Cyclic wake-up to monitor the pack and the balancing function during sleep.

• Capability to wake up the host MCU via daisy chain in case of a fault event.

•  Host interface supporting SPI or isolated daisy chain communication (TPL3)

  • 2 Mbit/s data rate for TPL interface
  •  4 Mbit/s data rate for SPI interface

•  TPL3 daisy chain communication supports

  • Two wire daisy chain with capacitive or inductive isolation
  • Protocol supporting up to six daisy chains and 62 nodes per chain

• Unique device ID with dynamic adressing

• Operation modes

  • Active mode (12 mA typ.)
  • Sleep mode (60 µA typ.)
  • Deep Sleep mode (15 µA typ.)

Board description

The RD33774ADSTEVB allows the user to exercise all the functions of the MC33774A battery controller cell.

Board description

cell-balancing current @4.5 V
2| Cell terminal low-pass filters| LPF: 10 KΩ resistor/0.047 µF capacitor to GND
3| GPIO low-pass filters| For NTC connections and temperature measurement
4| MC33774A (U2)| 18-cell battery-cell controller IC
5| NV24C64DWVLT3G (U1)| High-speed 64 Kb I2C EEPROM
6| NSS1C201MZ4T1G (Q1)| NPN supply bipolar transistor
7| HM2118NL or HM2168NL(T2) or capacitive coupling| Default BOM: High-voltage dual-channel transformer
8| JAE-MX34032NF2 (J1)| 32-pin connector for cell connections and NTC connections
9| MOLEX-43650-0213 (J2)| TPL connector to higher node
10| MOLEX-43650-0213 (J3)| TPL connector to lower node
11| LED| VAUX status

Connectors

• Battery pack connector J1

The cells and NTCs connections are available on J1.

Cell-connector schematic
Cell0 is connected between C0M(cell0M) and C1M(cell0P); Cell1 is connected between C1M(cell1M) and C2M(cell1P), etc… Cell17 is connected between C17M (cell17M) and C17P (cell17P) C17P-PWR and GND (pin21) are used to supply the RD33774ADSTEVB and are separated from C17P and C0M respectively to avoid any voltage drop because of the EVB current consumption. Optional external 10 KΩ NTCs can be connected between each NTCx terminal and one GND terminal.
Board connector reference: MX34032NF2 (32 pins/right angle version) – Manufacturer : JAE
Corresponding mate connector reference: MX34032SF1
Crimp reference for the mate connector: M34S75C4F1 (applicable cable 0.22 mm2 to 0.35 mm2)

TPL connectors
Isolated connections to upper and lower nodes can be done through J2 and J3, respectively. As the TPL communications are bidirectional, the connections can be reversed.

Board connector reference: Micro-fit 3.0 43650-0213 (two pins/right angle version) – Manufacturer: Molex
Corresponding mate connector reference: 0436450200
Crimp reference for the mate connector: 0436450201

Twisted cable: 64920108 – Manufacturer: Kromberg & Schubert

TPL configuration
The RD33774ADSTEVB can be configured for capacitive TPL communications instead of the default BOM with inductive TPL communication (transformer). See Table 2 for configuration instructions.

Configuration

Test points

Test points are provided to access various signals on the board. Main test points are detailed in Table 3. Table 3. Test points

 GPIO configurations

The MC33774A has nine GPIO pins (GPIO0 to GPIO7 and AINA) available for temperature measurements (excepted AINA), absolute analog measurements, and other functions. The RD33774ADSTEVB makes available the GPIO measurements and functions as described in Table 4.

GPIO connections

be connected to an external 10 KΩ NTC (that is, NCP15 XV103J03RC)
J1-19| NTC2| GPIO1/AIN1 pin through low-pass filter for NTC acquisition – to be connected to an external 10 KΩ NTC (that is, NCP15 XV103J03RC)
J1-18| NTC7| GPIO6/AIN6 pin through low-pass filter for NTC acquisition – to be connected to an external 10 KΩ NTC (that is, NCP15 XV103J03RC)
J1-17| NTC8| GPIO7/AIN7 pin through low-pass filter for NTC acquisition – to be connected to an external 10 KΩ NTC (that is, NCP15 XV103J03RC)
Onboard NTC NCP15XV103J03RC – TP38| NTC3| GPIO2/AIN2 pin through low-pass filter for NTC acquisition
Not connected – TP31| NTC4| GPIO3/AIN3 pin through low-pass filter for NTC acquisition
Onboard I2Ceeprom – SCL| GPIO4| GPIO4 pin
Onboard I2Ceeprom – SDA| GPIO5| GPIO5 pin
Not connected – TP61| AINA| AINA pin

Document information

systems
Abstract| This user manual describes how to use the RD33774ADSTEVB evaluation board

Revision history

IMPORTANT NOTICE
For engineering development or evaluation purposes only
NXP provides the product under the following conditions:
This evaluation kit is for use of ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered to a printed-circuit board to make it easier to access inputs, outputs and supply terminals. This evaluation board may be used with any development system or other source of I/O signals by connecting it to the host MCU computer board via off-the-shelf cables. This evaluation board is not a Reference Design and is not intended to represent a final design recommendation for any particular application. Final device in an application heavily depends on proper printed-circuit board layout and heat sinking design as well as attention to supply filtering, transient suppression, and I/O signal quality. The product provided may not be complete in terms of required design, marketing, and or manufacturing related protective considerations, including product safety measures typically found in the end device incorporating the product. Due to the open construction of the product, it is the responsibility of the user to take all appropriate precautions for electric discharge. In order to minimize risks associated with the customers’ applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. For any safety concerns, contact NXP sales and technical support services.

Introduction
This user manual describes the RD33774ADSTEVB. The RD33774ADSTEVB features one MC33774A battery-cell controller integrated circuit (IC). The NXP analog product development board provides a platform for evaluating NXP products. These development boards support a range of analog, mixed-signal, and power solutions. These boards incorporate monolithic ICs and system-in-package devices that use high-volume technology. NXP products offer long battery life, a small form factor, reduced component counts, lower cost, and improved performance in powering state-of-the-art systems.

Configuring the hardware

The RD33774ADSTEVB kit is designed for use with the FRDMDUALK3664EVB in high- voltage isolated applications that provide an SPI-to-high-speed isolated communication interface. The FRDMDUALK3664EVB includes two MC33664 isolated- network high-speed transceivers allowing loopback connection. MCU SPI data bits are directly converted to pulse bit information.

FRDMDUALK3664EVB transceiver board

Battery emulator connection
The RD33774ADSTEVB supports the use of a battery-cell emulator, such as the BATT-18EMULATOR board. The BATT-18EMULATOR is an 18-cell battery-emulator board that provides an intuitive way to change the voltage across any of the 18 cells and four voltage outputs in order to emulate four external NTCs. The emulator board can be connected to the RD33774ADSTEVB J1 connector using the provided cell connection cable. Up to three RD33774ADSTEVB can be connected to one BATT-18EMULATOR.

RD33774ADSTEVBs connection to a BATT-18EMULATOR

TPL communication connection
In a high-voltage isolated application with a daisy-chain configuration, up to 62 RD33774ADSTEVB boards may be connected. The TPL connections use the connectors J2 and J3.

Legal information

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Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

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© 2023 NXP B.V.
For more information, please visit: http://www.nxp.com

All rights reserved.
Date of release: 16 June 2023
Document identifier: UM11816

References

• MC33774A Evaluation Board | NXP Semiconductors

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