RAK3272S Breakout Board User Manual

RAK3272S Breakout Board

Thank you for choosing RAK3272S Breakout Board for your IoT project! This breakout board is designed to provide easy access to the RAK3272 LoRa module, allowing you to quickly prototype and develop LoRa-based IoT applications.

Description

The RAK3272S Breakout Board is a small, compact board that allows you to easily connect to the RAK3272 LoRa module. The board features a number of connectors, including a USB port for power and programming, a UART interface for communication with the module, and an I2C interface for connecting sensors and other peripherals.

Product Features

• Easy access to the RAK3272 LoRa module
• USB port for power and programming
• UART interface for communication with the module
• I2C interface for connecting sensors and other peripherals
• Compact design for easy integration into IoT projects

Usage Instructions

To use the RAK3272S Breakout Board, follow these steps:

1. Connect the breakout board to your computer using a USB cable.
2. Install any necessary drivers for the USB-to-serial converter (if applicable).
3. Connect the RAK3272 LoRa module to the breakout board using the provided connectors.
4. Connect any sensors or peripherals to the breakout board using the I2C interface.
5. Use a terminal program (such as PuTTY) to communicate with the module via the UART interface.
6. Refer to the provided documentation for information on programming and using the RAK3272 module.

That’s it! With the RAK3272S Breakout Board, you can quickly prototype and develop your own LoRa-based IoT applications.

Thank you for choosing RAK3272S Breakout Board in your awesome IoT Project! To help you get started, we have provided you all the necessary documentation for your product.

• Quick Start Guide
• AT Command Manual
• AT Command Migration Guide of RAK3172 to RUI3 [
• DatasheetUy

Product Description

RAK3272S Breakout Board is specifically designed to allow easy access to the pins on the board in order to simplify development and testing. The breakout board footprint is based on the XBee form factor, and its main purpose is to allow the RAK3172 stamp module pins to be transferred to 2.54 mm headers.
The board itself has the RAK3172 at its core, integrating a STM32WLE5CC chip. It has Ultra-Low Power Consumption of 1.69 uA in sleep mode.
This module complies with Class A, B, & C of LoRaWAN 1.0.3 specifications. It also supports LoRa Point-to-Point (P2P) communication mode, which helps you in implementing your own customized long-range LoRa network quickly.

Features

• Based on RAK3172
• I/O ports: UART/I2C/GPIO/SPI
• Serial Wire Debug (SWD) interface
• Module size: 25.4 x 32.3 mm
• Supply Voltage: 2.0 V ~ 3.6 V
• Temperature Range: -40 °C ~ 85 °C

Last Updated: 11/17/2021, 9:05:23 AM

References

• AT Command Migration Guide of RAK3172 to RUI3 (RAKwireless Unified Interface V3) | RAKwireless Documentation Center
• RAK3272S Breakout Board AT Command Manual | RAKwireless Documentation Center
• RAK3272S Breakout Board Datasheet | RAKwireless Documentation Center
• RAK3272S Breakout Board Datasheet | RAKwireless Documentation Center
• RAK3272S Quick Start Guide | RAKwireless Documentation Center
• RAK Unified Interface V3 (RUI3) Serial Operating Modes | RAKwireless Documentation Center
• AT Command Manual | RAKwireless Documentation Center

Read User Manual Online (PDF format)

Download This Manual (PDF format)

Download this manual  >>