HyperX HX318LS11IB/8 8GB 1G x 64-Bit DDR3L-1866 CL11 204-Pin SODIMM Memory Module User Guide

June 9, 2024
HYPERX

HyperX HX318LS11IB/8 8GB 1G x 64-Bit DDR3L-1866 CL11 204-Pin SODIMM

Memory Module

HyperX HX318LS11IB-8 8GB 1G x 64-Bit DDR3L-1866 CL11 204-Pin SODIMM Memory
Module

DESCRIPTION

HyperX HX318LS11IB/8 is a 1G x 64-bit (8GB) DDR3L-1866 CL11 SDRAM (Synchronous DRAM) 2Rx8, low voltage, memory modules, based on sixteen 512M x 8-bit DDR3 FBGA compo-nents. This module has been tested to run at DDR3L-1866 at a low latency timing of 11-11-11 at 1.35V or 1.5V. Additional timing parameters are shown in the PnP Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:

Note: The PnP feature offers a range of speed and timing options to support the widest variety of processors and chipsets. Your maximum speed will be determined by your BIOS.

PnP JEDEC TIMING PARAMETERS

  • DDR3-1866 CL11-11-11 @1.35V or 1.5V
  • DDR3-1600 CL10-10-10 @1.35V or 1.5V
  • DDR3-1333 CL8-8-8 @1.35V or 1.5V

SPECIFICATIONS

  • CL(IDD) 11 cycles
  • Row Cycle Time (tRCmin) 44.7ns (min.)
  • Refresh to Active/Refresh 260ns (min.)
  • Command Time (tRFCmin)
  • Row Active Time (tRASmin) 34ns (min.)
  • Maximum Operating Power TBD W* @1.35V
  • UL Rating 94 V – 0
  • Operating Temperature 0o C to 85o C
  • Storage Temperature -55o C to +100o C

FEATURES

  • JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V) Power Supply
  • VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
  • 933MHz fCK for 1866Mb/sec/pin
  • 8 independent internal bank
  • Programmable CAS Latency: 13, 11, 10, 9, 8, 7, 6, 5
  • Programmable Additive Latency: 0, CL – 2, or CL – 1 clock
  • 8-bit pre-fetch
  • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
  • Bi-directional Differential Data Strobe
  • Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
  • On Die Termination using ODT pin
  • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
  • Asynchronous Reset
  • PCB : Height 1.180” (30.00mm), double sided component

MODULE DIMENSIONS

HyperX HX318LS11IB-8 8GB 1G x 64-Bit DDR3L-1866 CL11 204-Pin SODIMM Memory
Module 1

FOR MORE INFORMATION, GO TOWWW.KINGSTON.COM/HYPERX

All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.

References

Read User Manual Online (PDF format)

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Download This Manual (PDF format)

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