Surenoo STP0144B-128128 Series TFT LCD Panel User Manual

Surenoo STP0144B-128128 Series TFT LCD Panel

General Description

Display Mode

| ****

Transmissive

Display Format

| ****

Graphic 128RGB*128 Dot-matrix 128xRGBx128

Input Data

| ****

SPI-4 line interface SPI-4

Viewing Direction

| ****

12 o’clock 12

Drive

| ****

ST7735S

Mechanical Specification

Dimensional outline

| 29.50(W)36.50(H)2.50(T)

(FPC not include)

| mm
Resolution

| 128RGB*128| dots
LCD Active area

| 25.50(W)*26.50 (H)| mm
Pixel size

| 0.199(W)*0.207(H)| mm

Mechanical Dimension

Electrical Maximum Ratings

Item

| Symbol

| Min

| Max

| Unit

| Note

---|---|---|---|---|---
Supply voltage （ VDDI ）

| V| 1.8| 3.3| V| –
Supply voltage （ VDD ）

| V| 2.8| 3.3| V| –
Operating temperature 工

| T OPR| -20| 70| ℃| –
Storage temperature

| T STR| -30| 80| ℃| –

Brightness characteristic &Power dissipation

Item

| Symbol

| Min

| Typical

| Max

| Unit
---|---|---|---|---|---
LED module Forward voltage

LED

| V LED| 2 ． 9| 3.1| 3.3| V
LED module current

LED

| I LED| –| 18| –| mA
LCD Surface Luminance

| L S| 160| 180| –| Cd/m 2
LCD Surface brightness uniform

LED

| L D| 80| –| –| %
LCD power dissipation

| ****

P LCD

| ****

–

| ****

0.060

| ****

–

| ****

W

Module Function Description

**PIN No.**

| | Discription| Notes

---|---|---|---

1

| ****

NC

| No connection

| ****

–

2| GND| Ground

| ****

–

3

| ****

LED-

| Cathode of Backlight

| ****

–

4| LED+| Anode of Backlight (2.9V-3.3V Typical:3.1V)

| ****

–

5

| ****

GND

| Ground

| ****

–

6

| ****

RESX

| -This signal will reset the device and it must be applied to properly initialize the chip.

-Signal is active low.

| ****

–

7

| ****

DCX

| -Display data/command selection pin in 4-line SPI interface. DCX=’1’: display data or parameter.

(DCX=1: DCX=’0’: command data

(DCX=0:

| ****

–

8

| ****

SDA

| -Serial input/output signal in 4-line SPI. (4| ****

–

9

| ****

SCL

| -4-line SPI serial interface clock.| ****

–

10| VDD| Power Supply for Analog, Digital System and Booster

Circuit.  2.8-3.3V)

| ****

–

11| VDDI| Power Supply for I/O System.

1.8-3.3V)

| ****

–

12

| ****

CSX

| -Chip selection pin Low enable.

High disable.

| ****

–

13| GND| Ground

| –
14| NC| No connection

| ****

–

Response time & Contrast ratio

Item

| Symbol

| Condition

| Remark| Unit

---|---|---|---|---
Min.

| Typ.

| Max.
Response time

| Tr+Tf| θ=0°| –| 30| 60| ms
Contrast ratio

| CR| θ=0°| 200| 300| –| –

Viewing Angle

Item

| Symbol

| Condition

| Remark| Unit

---|---|---|---|---
Min.

| Typ.

| Max.

Viewing angle

| Top

12

| CR≥10

10

| 30| 40| –| ****

Deg.

Bottom

6

| CR≥10

10

| 40| 50| –
Left

9

| CR≥10

10

| 40| 50| –
Right

3

| CR≥10

10

| 40| 50| –

Reliability Trial

NO.

| ITEM| CONDITION

| CRITERION
---|---|---|---
1| High Temperature Non-Operating Test

| 80℃*120Hrs| No Defect Of Operational Function In Room Temperature Are Allowable

2| Low Temperature Non-Operating Test

| -30℃*120Hrs
3| High Temperature/Humidity Non Operating Test

| 60℃90%RH120Hrs
4| High Temperature Operating Test

| 70℃*72Hrs|
5| Low Temperature Operating Test

| -20℃72Hrs|
6| Thermal Shock Test| -20 ℃ (30Min)| n70 ℃|
 |  | (30Min) 10CYCLES|

Inspection standards

Glass defect

1

| Dimension Unconformity

(Major defect)

| By Engineering Drawing|

2

| Cracks

(Major defect)

| 1.       Linear cracks panel

【Reject】

2.       Nonlinear crack contrast by limited sample

| ****

3

| Glass extrude the conductive area

(minor defect)

| a: disregards and no influence assemblage.

1)      b≤1/3Pin width(non bonding area)

【Accept】

2)bonding area≤0.5mm

【Accept】

| A: Length, b: Width

4

| Pin-side ,conductive area damaged

(minor defect)

| (a c: disregards)

b≤1/3of effective length for bonding electrode

【Accept】

| a: length, b: Width, c: Thickness

5

| Pin-side,non-conductive area damaged

(minor defect)

| 1) Damage area don’t touch the ITO (Inclueling contraposition mark, except scribing mark)

【Accept】

2. C<T b≦BM1/3of width

【Accept】

3. c=T

b not touch the seal glue

【Accept】

4. a disregards

| a: Length, b: Width c: Thickness

6

| Non-pin-side damage

(minor defect)

| c<T

1)b exceeds 1/3Bm

【Reject】

c=T

b not touch the seal glue

【Reject】

| c: Thickness b: width of
 |  |  | damage
---|---|---|---

LCD appearance defect(View area)

1

| ****

Fiber 、 glass cratch、polarizer scratch/folded

(minor defect)

| Specification| Allowable| note1:L: Length, W: Width note2: disregard if out of AA

W≦0.03mm| disregard
0.03mm<W≦0.05mm;

L≦3.0mm

| 2
0.05mm<W≦0.1mm;

L≦3.0mm

| 1
W>0.1mm;L>3.0mm| 0

2

| Polarizer bubble、concave and convex

(minor defect)

| φ≦0.2mm| disregard| note1: φ=(L+W)/2,L:Length, W :Width

note2:disregard if out of AA

0.2mm<φ≦0.3mm| 2
0.3mm<φ≦0.5mm| 1
0.5mm<φ| 0

3

| ****

Black dots、dirty dots、impurities、eye winker

(minor defect)

| φ≦0.15mm| disregard| note2:disregard if out of AA

0.15mm <φ≦0.25mm| 2
0.25mm<φ≦0.3mm| 1
0.3mm<φ| 0

4

| ****

Polarizer prick

(minor defect)

| φ≦0.1mm| disregard| note1: φ=(L+W)/2,L=Length, W=Width

note2:the distance between two

dots>5mm

0.1mm<φ≦0.25mm| 3
φ>0.25mm| 0

Package Method

References

• Surenoo Tech: Professional LCD Module Supplier Since 2005

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