Surenoo STP0240C1-240320 Series TFT LCD Panel User Manual
- June 3, 2024
- Surenoo
Table of Contents
- Surenoo STP0240C1-240320 Series TFT LCD Panel
- General Description
- Mechanical Specification
- Mechanical Dimension
- Electrical Maximum Ratings
- Brightness characteristic&Power dissipation
- Module Function Description
- Response time&Contrast ratio
- Viewing Angle
- Reliability Trial
- Inspection standards
- Package Method
- References
- Read User Manual Online (PDF format)
- Download This Manual (PDF format)
Surenoo STP0240C1-240320 Series TFT LCD Panel
General Description
M ODEL NO | STP0240C1-240320 YT240L002 |
---|---|
Display Mode | Transmissive |
Display Format | Graphic 240RGB*320 Dot-matrix 240xRGBx320 |
Input Data | MCU-8bit/16bit interface MUC 8 |
Viewing Direction | 12 o’clock 12 |
Drive | ILI9341V |
Mechanical Specification
Item | Specifications | Unit |
---|---|---|
Dimensional outline | 42.72(W)60.26(H)2.55(T)(NTP) |
42.72(W)60.26(H)3.75(T)(RTP)
(FPC not include)
| ****
mm
Resolution| 240RGB320| dots
LCD Active area| 36.72(W)48.96 (H)| mm
Pixel size| 0.153(W)*0.153(H)| mm
Mechanical Dimension
Electrical Maximum Ratings
Item | Symbol | Min | Max | Unit | Note |
---|---|---|---|---|---|
Supply voltage ( VDDI ) | **** |
V
| ****
1.8
| ****
3.3
| ****
V
| ****
–
Supply voltage ( VDD )| ****
V
| ****
2.8
| ****
3.3
| ****
V
| ****
–
Operating temperature 工| ****
T OPR
| ****
– 20
| ****
70
| ℃| ****
–
Storage temperature| ****
T STR
| ****
– 30
| ****
80
| ℃| ****
–
NOTE: VDDI VDD(2.8V~3.3V)。
Brightness characteristic&Power dissipation
Item| Symbol| Min| Typical| Max| ****
Unit
---|---|---|---|---|---
LED module Forward voltage| ****
V LED
| 2 . 9| ****
3.1
| ****
3.3
| ****
V
LED module current| ****
I LED
| ****
–
| ****
60
| ****
–
| ****
mA
LCD Surface Luminance| ****
L S
| ****
250
| ****
300
| ****
–
| C d / m 2
LCM Surface brightness uniform| ****
L D
| ****
80
| ****
–
| ****
–
| %
LCD power dissipation| ****
P LCD
| ****
–
| ****
0.22
| ****
–
| W
NOTE: PLCD=VDD * (ILED+ILCD)
Module Function Description
P I N N o .| S y m b o l|
Description| N o t e s
---|---|---|---
1-4| ****
DB0- DB3
| MCU parallel interface data bus.| ****
–
5| GND| Ground| ****
–
6| VDDI| Power Supply for I/O System.| ****
–
7
| ****
CSX
| -Chip selection pin Low enable.
High disable.
| ****
–
8
| ****
DCX
| -Display data/command selection pin in parallel interface. DCX=’1’: display data or parameter.
(DCX=1: DCX=’0’: command data
(DCX=0:
| ****
–
9| WRX| -Write enable in MCU parallel interface.| ****
–
10
| ****
RDX
| -Read enable in 8080 MCU parallel interface.
-If not used, please fix this pin at VDDI or GND.
| ****
–
11| NC| No connection| ****
–
12| XL(X- )| Touch panel Logical foot| ****
–
13| YU(Y-)| Touch panel Logical foot| ****
–
14| XR(X+)| Touch panel Logical foot| ****
–
15| YD(Y+)| Touch panel Logical foot| ****
–
16| LEDA| Anode of Backlight (2.9V-3.3V Typical:3.1V)| ****
–
---|---|---|---
17| LEDK1| Cathode of Backlight| ****
–
18| LEDK2| Cathode of Backlight| ****
–
19| LEDK3| Cathode of Backlight| ****
–
20| LEDK4| Cathode of Backlight| ****
–
21| TE| Tearing effect signal is used to synchronize MCU to frame
memory
| ****
–
22| DB4| MCU parallel interface data bus.| ****
–
23-30| DB8- DB15| MCU parallel interface data bus.| ****
–
31
| ****
RESX
| -This signal will reset the device and it must be applied to properly initialize the chip.
-Signal is active low.
| ****
–
32| VDD| Power Supply for Analog, Digital System and Booster
Circuit.
| ****
–
33| VDDI| Power Supply for I/O System.| ****
–
34| GND| Ground| ****
–
35-37| DB5- DB7| MCU parallel interface data bus.| ****
–
Response time&Contrast ratio
Item | Symbol | Condition | Remark | Unit |
---|---|---|---|---|
Min. | Typ. | Max. | ||
Response time | Tr+Tf | θ=0° | – | 25 |
Contrast ratio | CR | θ=0° | 350 | 500 |
Viewing Angle
Item | Symbol | Condition | Remark | Unit |
---|---|---|---|---|
Min. | Typ. | Max. |
Viewing angle
| Top| CR≥10| 40| 50| –| ****
Deg.
Bottom| CR≥10| 55| 65| –
Left| CR≥10| 55| 65| –
Right| CR≥10| 55| 65| –
Reliability Trial
NO. | ITEM | CONDITION | CRITERION |
---|---|---|---|
1 | High Temperature Non-Operating Test | 80℃*120Hrs | No Defect Of |
Operational | |||
2 | Low Temperature Non-Operating Test | -30℃*120Hrs | Function In Room |
Temperature Are | |||
3 | High Temperature/Humidity Non Operating Test | 60℃90%RH120Hrs | Allowable |
4 | High Temperature Operating Test | 70℃*72Hrs | |
5 | Low Temperature Operating Test | -20℃*72Hrs | |
6 | Thermal Shock Test | -20 ℃ (30Min) Q70 ℃ | |
(30Min) *10CYCLES |
Inspection standards
Glass defect
NO | Defect item | Criteria | Remark |
---|
1
| Dimension Unconformity
(Major defect)
| By Engineering Drawing|
2
| Cracks
(Major defect)
| 1. Linear cracks panel
【Reject】
2. Nonlinear crack contrast by limited sample
| ****
3
| Glass extrude the conductive area
(minor defect)
| a: disregards and no influence assemblage.
1) b≤1/3Pin width(non bonding area)
【Accept】
2)bonding area≤0.5mm
【Accept】
| A: Length, b: Width
Package Method
Shenzhen Surenoo Technology Co.,Ltd.
www.surenoo.com
Skype: Surenoo365
References
Read User Manual Online (PDF format)
Read User Manual Online (PDF format) >>