INTELLIGENT MEMORY DRAM Components Owner’s Manual

: August 16, 2024
: INTELLIGENT MEMORY

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INTELLIGENT MEMORY DRAM Components Owner’s Manual

INTELLIGENT MEMORY DRAM Components - front page

IM products are designed to meet the most excruciating requirements for industrial electronic applications, working at just about any temperatures and speeds that you can imagine. We provide a unique offering of DRAM components that exceed the standards for commercial reliability and quality.

Intelligent Memory introduced not only the first DDR3 DDP 8Gb memory IC with single chip select, but also several rare densities, configurations, features and package types across a number of different DRAM product categories.

Providing memory solutions for industrial and embedded applications for over 30 years
From standard to special, legacy to mainstream
Long product lifetimes with continued support
In-house product designs and testing capabilities
Customizable configurations and feature-rich products across a range of solutions
ECC and register feature enabled products
Reliable product change management processes

DRAM PRODUCT FAMILY

LPDDR4(x)

Low Voltage Power Supply 1.8V, 1.1V
I/O at 1.1V (LPDDR4) or 0.6V (LPDDR4x)
Densities from 4Gb up to 64Gb
Integrated ECC error correction with 4Gb and 8Gb
High speed data transfer up to 4266Mbps, available with Commercial and Industrial Grades
Mobile features for lower power
ZQ Calibration

DDR4

Double data rate clocking timing, 1.2V Power Supply
Supported:
– Data Bus Inversion (DBI)
– Write Cycle Redundancy Check (CRC)
– Dynamic ODT (On-Die Termination)
– Fine Granularity Refresh Mode
High speed data transfer up to 3200MHz
4Gb and 8Gb are available

LPDDR3

Low Voltage Power Supply 1.8V (VDD1) and 1.22V (VDD2, VDDQ)
Densities of 8Gb x32 (1 rank) and 16Gb x32 (2 ranks) are available
High speed data transfer up to 1866Mbps with Commercial Grade
Programmable driver strength
Auto Temperature Compensated Self-Refresh
Deep power-down mode
JEDEC standard package 178-ball FBGA

DDR3

Double data rate clocking timing, 1.35V or 1.5V Power Supply
Data masking per byte on write commands
Programmable burst length and CAS latency
Auto-refresh and self-refresh
Supported OCD (Off-Chip Driver impedance)
Supported ODT (On-Die Termination)
High speed data transfer up to 1866Mbps, available with Commercial and Industrial Grades
1Gb, 2Gb, 4Gb, 8Gb and 16Gb are available
Write leveling
Integrated ECC error correction available for 1Gb

DDR2

Double data rate clocking timing, 1.8V Power Supply
SSTL_18 compatible inputs
Programmable burst length and CAS latency
Auto-refresh and self-refresh
Supported OCD (Off-Chip Driver impedance)
Supported ODT (On-Die Termination)
High speed data transfer up to 1066MHz
512Mb, 1Gb and 2Gb are available
Integrated ECC error correction available for 1Gb

DDR

Double data rate clocking timing, 2.5V Power Supply
SSTL_2 compatible inputs
Programmable burst length and CAS latency
Auto-refresh and self-refresh
High speed data transfer up to 400MHz, available in Commercial, Industrial and Automotive Grades
256Mb, 512Mb & 1Gb with TSOP II and BGA packages
Integrated ECC error correction available for 1Gb

SDRAM

Full Synchronous DRAM, 3.3V Power Supply
Auto-refresh and self-refresh
Programmable burst length:
– 1, 2, 4, 8 & full page for sequential type
– 1, 2, 4, 8 for interleave type
High speed data transfer up to 200MHz, available with Commercial, Industrial and Automotive Grades
64Mb, 128Mb, 256Mb & 512Mb with TSOP II and BGA packages
Integrated ECC error correction available