Harman International QCC5181 Bluetooth Module Instruction Manual

Harman International QCC5181 Bluetooth Module

Product Usage Instructions

• Overview
  • The QCC5181 Bluetooth Module is designed for various applications such as stereo wireless headsets, wired stereo headsets and headphones, portable stereo speakers, analog and USB multimedia dongles, home audio systems, and Qualcomm TrueWirelessTM stereo earbuds.
• Features
  • Supports Bluetooth class 1
  • Modulation mode for reliable signal transmission
  • Wide supply voltage range
  • Supports various protocols for flexible connectivity
  • Low standby current for power efficiency
  • Compatible with Android, IOS, and Windows systems
  • Compact module size for easy integration
• Applications
  • The QCC5181 module can be used in various devices including stereo wireless headsets, wired headphones, portable speakers, multimedia dongles, home audio systems, and TrueWireless earbuds.

FAQs

• Q: What is the wireless transmission range of the QCC5181 module?
  • A: The wireless transmission range is more than 10m.
• Q: Which systems are supported by the QCC5181 module?
  • A: The module supports Android, IOS, and Windows systems.

Overview

QCC5181 Bluetooth module is an intelligent wireless audio data dual-mode transmission product independently developed by the company, which is a high- end and efficient stereo wireless transmission scheme, the module adopts QCC5181 series chips to provide the module with high-quality sound quality and compatibility with better performance. The QCC5181 Bluetooth module adopts the drive-free mode. Customers only need to connect the module to the application product, and it can fast realize the wireless transmission of music and enjoy the fun of wireless music.

Features

• Main Chipset: QCC5181
• Qualified to Bluetooth v5.4 specification
• Dual 240 MHz Qualcomm® Kalimba™ audio DSPs
• 32/80 MHz Developer Processor for applications
• Firmware Processor for system
• Flexible QSPI flash programmable platform
• High-performance 24‑bit stereo audio interface
• Digital and analog microphone interfaces
• Flexible LED controller and LED pins with PWM support
• Serial interfaces: UART, Bit Serializer (I²C/SPI), USB 2.0
• Advanced audio algorithms
• Active Noise Cancellation: Hybrid, Feedforward, and Feedback modes, using Digitalor
• Analog Mics, enabled using license keys available from Qualcomm®
• Qualcomm® aptX™ and aptX HD Audio
• aptX Adaptive enabled using the license key
• Qualcomm® cVc™ Noise Cancellation Technology, enabled using license key
• Integrated PMU: Dual SMPS for system/digital circuits, Integrated Li-ion battery charger
• 99-ball 4.930 mm x 3.936 mm x 0.57 mm, 0.4 mm pitch WLCSP
• Integrated dual switch-mode regulators, linear regulators, and battery charger
• Green (RoHS compliant and no antinomy or halogenated flame retardants)
• Size 34.1mm x 18.7mm x 3.0mm

Applications

• Stereo Wireless Headsets.
• Wired stereo headsets and headphones.
• Portable stereo speakers.
• Analog and USB Mulitmedia Dongle.
• Home Audio System.
• Qualcomm TrueWireless™ stereo earbuds

Specifications

HSP v1.2 SPP v1.2，DID v1.3，HOGP v1.0，PXP v1.0.1

FMP v1.0，BAS v1.0

Working current| ≤ 20mA
Standby current| < 500uA
Temperature range| – 40 ° C to + 85 ° C
Charger operating

temperature range

| – 10 ° C to + 85 ° C
Wireless        transmission

range

| more than 10m
Transmission power| support class 1
Sensitivity| Typ -96 DBM at 0.1% BER
Frequency range| 2.402GHz-2.480GHz
External interface| PIO, SPI, AIO, UART, USB, I2S, MIC,I2C, PCM,

SPK (L / R)

Support system| Android, IOS and Windows
Audio decoding output| APTX(QCC5181)
Audio SNR| ≥88dB
Distortion| ≤ 0.1%
Module size| 36mm x 18.5mm x3.8mm

Block Diagram

Pin view

Pin Assignment

internal pull-up/pull-down

| Programmable I/O line 21. Alternative function:

■  PCM_DOUT[2]

10.| PIO_15| Digital: Bidirectional with programmable strength

internal pull-up/pull-down

| Programmable I/O line 15. Alternative function:

■  MCLK_OUT

11.| PIO19/PCM

_IN

| Digital: Bidirectional with programmable strength

internal pull-up/pull-down

| Programmable I/O line 19. Alternative function:

■  PCM_DIN[0]

12.| PIO16/PCM

_CLK

| Digital: Bidirectional with programmable strength

internal pull-up/pull-down

| Programmable I/O line 16. Alternative function:

■  PCM_CLK

13.| PIO17/PCM

_SYNC

| Digital: Bidirectional with programmable strength

internal pull-up/pull-down

| Programmable I/O line 17. Alternative function:

■  PCM_SYNC

14.| PIO18/PCM

_OUT

| Digital: Bidirectional with programmable strength

internal pull-up/pull-down

| Programmable I/O line 18. Alternative function:

■  PCM_DOUT[0]

15.| GND| GND| Common Ground
16.| PIO1/RST#| Digital: Bidirectional with programmable strength internal pull-up/pull-down| Automatically defaults to RESET# mode when the device is unpowered, or in off modes.

Reconfigurable as a PIO after boot. Alternative function:

■  Programmable I/O line 1

17.| PIO5/SPI_C S| Digital: Bidirectional with

programmable strength internal pull-up/pull-down

| Programmable I/O line 5. Alternative function:

■  TBR_MISO[1]

18.| PIO7/SPI_ MISO| Digital: Bidirectional with

programmable strength internal pull-up/pull-down

| Programmable I/O line 7. Alternative function:

■  TBR_MISO[0]

19.| PIO8/SPI_C LK| Digital: Bidirectional with

programmable strength internal pull-up/pull-down

| Programmable I/O line 8. Alternative function:

■  TBR_CLK

---|---|---|---
20.| PIO6/SPI_ MOSI| Digital: Bidirectional with programmable strength

internal pull-up/pull-down

| Programmable I/O line 6. Alternative function:

■  TBR_MOSI[0]

21.| GND| GND| Common Ground
22.| PIO3/RXD| Digital: Bidirectional with

programmable strength internal pull-up/pull-down

| Programmable I/O line 3. Alternative function:

■  TBR_MISO[2]

23.| PIO2/TXD| Digital: Bidirectional with programmable strength

internal pull-up/pull-down

| Programmable I/O line 2. Alternative function:

■  TBR_MISO[3]

24.| PIO4/RTS| Digital: Bidirectional with programmable strength

internal pull-up/pull-down

| Programmable I/O line 4. Alternative function:

■  TBR_MOSI[1]

25.| PIO20/CTS| Digital: Bidirectional with

programmable strength internal pull-up/pull-down

| Programmable I/O line 20. Alternative function:

■  PCM_DOUT[1]

26.| GND| GND| Common Ground
27.| LED0/AIO0| Analog or digital input/

open drain output.

| General-purpose analog/digital input

or open drain LED output.

28.| LED1/AIO1| Analog or digital input/

open drain output.

| General-purpose analog/digital input

or open drain LED output.

29.| LED2/AIO2| Analog or digital input/

open drain output.

| General-purpose analog/digital input

or open drain LED output.

30.| LED3/AIO3| Analog or digital input/

open drain output.

| General-purpose analog/digital input

or open drain LED output.

31.| NC| NC| NC
32.| NC| NC| NC
33.| NC| NC| NC
34.| GND| GND| Common Ground
35.| MIC4_N| Analog| Microphone differential 4 input, negative.

Alternative function:

■  Differential audio line input 4, negative

36.| MIC4_P| Analog| Microphone differential 4 input, positive.

Alternative function:

■  Differential audio line input 4, positive

37.| NC| NC| NC
38.| MIC3_N| Analog| Microphone differential 3 input,
 |  |  | negative. Alternative function:

■  Differential audio line input 3,

negative

---|---|---|---
39| MIC3_P| Analog| Microphone differential 3 input, positive.

Alternative function:

■  Differential audio line input 3, positive

40| NC| NC| NC
41| NC| NC| NC
42| GND| GND| Common Ground
43| NC| NC| NC
44| NC| NC| NC
45| NC| NC| NC
46| NC| NC| NC
47| NC| NC| NC
48| PIO39/QSP I2_IO3| Digital: Bidirectional with programmable strength

internal pull-up/pull-down

| Programmable I/O line 39. Alternative function:

■  QSPI2_IO[3]

49| PIO36/QSP I2_IO2| Digital: Bidirectional with programmable strength

internal pull-up/pull-down

| Programmable I/O line 36. Alternative function:

■  QSPI2_IO[2]

50| PIO37/QSP I2_IO1| Digital: Bidirectional with programmable strength

internal pull-up/pull-down

| Programmable I/O line 37. Alternative function:

■  QSPI2_IO[1]

51| PIO34/QSP I2_IO0| Digital: Bidirectional with

programmable strength internal pull-up/pull-down

| Programmable I/O line 34. Alternative function:

■  QSPI2_IO[0]

52| GND| GND| Common Ground
53| PIO35/QSP I2_CLK| Digital: Bidirectional with programmable strength

internal pull-up/pull-down

| Programmable I/O line 35. Alternative function:

■  QSPI2_CLK

54| PIO38/QSP I2_CS| Digital: Bidirectional with

programmable strength internal pull-up/pull-down

| Programmable I/O line 38. Alternative function:

■  QSPI2_CS

55| GND| GND| Common Ground
56| USB_P| Digital| USB Full Speed device D- I/O.

IEC-61000-4-2 (device level) ESD Protection

57| USB_N| Digital| USB Full Speed device D- I/O.

IEC-61000-4-2 (device level) ESD Protection

58| GND| GND| Common Ground
59| VDDIO| Supply| Supply to VDD_PADS
---|---|---|---
60| SMPS_VBA

T

| Supply| Supply to SMPS power switch from the battery.
61| VCHG_SE N| Analog| Charger input sense pin after external mode sense- resistor. High impedance.

NOTE : If using an internal charger or no charger, connect VCHG_SENSE directly to SMPS_VCHG.

62| VBAT_SEN| Analog| Battery voltage sense input.
63| CHG_EXT| Analog| External charger transistor current control. Connect to the base of the external charger transistor as per the application schematic.
64| USB_VBUS| Supply| Supply to SMPS power switch from charger input.
65| VBAT| Supply| Supply to SMPS power switch from battery.
66| SYS_CTRL| Digital input| Typically connected to an ON/OFF push button. If power is present from the battery and/or charger, and software has placed the device in the OFF or DORMANT state, a button press boots the device. Also usable as a digital input in normal operation. No pull. Additional function:

■  PIO[0] input only

67| GND| GND| Common Ground
68| MIC2_N| Analog| Microphone differential 2 input, negative.

Alternative function:

■  Differential audio line input right, negative

69| MIC2_P| Analog| Microphone differential 2 input, positive.

Alternative function:

■  Differential audio line input right, positive

70| BIAS_B| NC| NC
71| MIC1_N| Analog| Microphone differential 1 input, negative.

Alternative function:

 |  |  | ■  Differential audio line input left,

negative

---|---|---|---
72| MIC1_P| Analog| Microphone differential 1 input, positive.

Alternative function:

■  Differential audio line input left, positive

73| BIAS_A| Analog| Mic bias output.
74| SPKR_P| Analog| Headphone/speaker differential right output, positive.

Alternative function:

■    Differential right line output, positive

75| SPKR_N| Analog| Headphone/speaker differential right output, negative.

Alternative function:

■ Differential right line output, negative

76| SPKL_N| Analog| Headphone/speaker differential left output, negative.

Alternative function:

■  Differential left line output, negative

77| SPKL_P| Analog| Headphone/speaker differential left output, positive.

Alternative function:

■  Differential left line output, positive

78| GND| GND| Common Ground

Interfaces

USB Interface

• QCC5181 WLCSP has a USB interface, device port, and charger detection.

USB interface

• QCC5181 WLCSP has a USB device interface: An upstream port, for connection to a host Phone/PC or battery charging adaptor.
• For details on software support for USB features, see ADK documentation.

USB device port

• The device port is a USB 2.0 Full Speed (12 Mb/s) port. Typically QCC5181 WLCSP enumerates as a compound device with a hub. The enabled audio source/sink / HID/mass storage device appears behind that hub.
• The DP 1.5 k pull-up is integrated into QCC5181 WLCSP. No series resistors are required on the USB data lines.
• QCC5181 WLCSP contains integrated ESD protection on the data lines to IEC 61000-4-2 (device level). In normal applications, no external ESD protection is required.
• Extra ESD protection is not required on VCHG (VBUS) because QCC5181 WLCSP meets the USB certification requirements of a minimum of 1uF, and a maximum of 10 μF being present on VCHG (VBUS).
• The VCHG input of QCC5181 WLCSP is tolerant of a constant 6.5 V and transients up to 7.0 V. Use an external clamping protection device if extra overvoltage protection is required.

USB charger detection

• QCC5181 WLCSP supports charger detection to the USB BC 1.2specification. It provides Data Contact Detection (DCD) using an internal current source, and provides:
  • Detection of Standard Downstream Ports (SDP)
  • Charging Downstream Ports (CDP)
  • Dedicated Downstream Ports (DCP)
• The 10‑bit auxiliary ADC reads the voltage on the USB data lines.
• This enables the detection of proprietary chargers that bias the voltage on the USB data lines. For USB Type-C® connectors, use the LED pins to detect the voltage on the USB Configuration Channel (CC) line pins (CC1 and CC2) to detect the charge current capabilities of the upstream device.

PIO

• QCC5181 WLCSP has the following digital input/output (I/O) pads: 21 PIO pads:
• Including 1 x Reset (active low) pad: PIO[1]
  • 6 x pads for the Applications subsystem QSPI interface
  • 6 x pads intended for LED operation: LED[5:0]
  • 1 x power-on signaling: SYS_CTRL, available for use as an input after boot.

PIO pad allocation

• The following QCC5181 WLCSP functions have specific pad allocations:
  • QSPI (Applications subsystem)
  • QSPI interface for optional support of external Audio buffer RAM
  • LED pads
  • Transaction bridge
  • Audio I²S/PCM
• NOTE: Any PIO is usable for:
  • Digital microphones
  • SPDIF
  • UART
  • Bit Serializer (I²C/SPI)
  • LED PWM controllers

Standard I/O

• The standard digital I/O pins (PIO) on QCC5181 WLCSP are split into separate pad domains. Each VDD_PADS domain can be separately powered, from 1.7 V to 3.6 V.

• NOTE: When PIOs in a supply domain are used for a high-speed interface, decoupling the respective VDD_PADS pin with a 100 nF decoupling capacitor may be beneficial. The VDD_PADS of a particular pin should be powered before voltages are applied to any PIO powered by that domain, otherwise, back powering can occur through the electrostatic discharge (ESD) protection in the pad.

• PIOs are programmed to have a pull-up or pull-down with two strengths (weak and strong). Program PIO with a sticky function where they are strongly pulled to their current input state. PIO has a reset pull state. After resetting, pulls are
  reconfigurable using software.

• PIO also has a programmable drive strength capability of 2, 4, 8, or 12 mA.

• All subsystems can read all PIO. Use software to assign PIO write access to particular subsystem control. To make PIO inputs available use Schmitt triggers.

Pad multiplexing

• A QCC5181 WLCSP pad function is chosen at runtime from multiple potential functions, using multiplexing.
• In the input direction, signals are driven into the chip, and all PIOs are distributed to each subsystem and visible on the PIO status bus. The subsystem selects I/Os of interest for a particular application.
• In the output direction, the System Manager has overall control of PIO allocation and control. When a PIO is allocated to a particular subsystem, the output is connected from the subsystem to the pad. There are no registers between the subsystem and the pad.
• The LED pins and some other peripheral I/O states are read as virtual PIOs, see Table 8-1.

RESET# reset pin

• The QCC5181 WLCSP digital reset pin (RESET#) is an active low reset signal. PIO[1] defaults to RESET# on boot.

• When the pin is active low, on-chip glitch filtering avoids unintended resets by filtering out spurious noise. The RESET# pin has a fixed strong pull-up to VDD_PADS_1 and can be left unconnected. The input is asynchronous
  and is pulse extended within QCC5181 WLCSP to ensure a full reset.

• QCC5181 WLCSP contains internal Reset Protection functionality to automatically keep the power rails enabled and enable the system to restart after an unintended reset (such as a severe ESD event). Assertion of RESET# beyond the

• Reset Protection timeout (typically greater than~1.8 s) causes the device to power down if VCHG is not present and SYS_CTRL is low. QCC5181 WLCSP then requires a SYS_CTRL assertion or VCHG attached to restart.

• NOTE: QCC5181 WLCSP is always powered if VCHG is present. It does not power down if RESET# is asserted while VCHG remains present.

• QTIL recommends that QCC5181 WLCSP is powered down using software control rather than the external assertion of RESET#.

• Holding RESET# low continuously is not the lowest QCC5181 WLCSP power state, because pull-downs are enabled on VCHG and VDD_BYP in this state.

• RESET# is guaranteed to work if held low for 120 μs.

• After boot, PIO[1] is configurable as a digital PIO.

SYS_CTRL pin

SYS_CTRL is an input pin that acts as a power-on signal for the internal regulators. Use it as an input (virtual PIO[0]-available using software) or as a multifunction button. From the OFF state, SYS_CTRL must be asserted for >20 ms to start power up. SYS_CTRL is VBAT tolerant (4.8 V max), and typically connected using a button to VBAT. SYS_CTRL has no internal pull resistor and requires an external pull-down if left undriven. Use software to logically disconnect SYS_CTRL from the power-on signal for internal regulators. For example, when booted, the software takes control.

LED

• QCC5181 WLCSP has LED pads and controllers.

LED pads

• Table 8-2 lists QCC5181 WLCSP LED pad operating modes.
• Table 8-2 QCC5181 WLCSP LED pad operating modes.

NOTE: LED pins might be driven to ground level for up to 300μs within 50 ms of the chip powering up from off- stage.

LED controllers

• QCC5181 WLCSP has six PWM-based LED controllers controlled by the Applications subsystem. Use them for driving either the LED pads (through virtual PIOs) or other available PIOs.

• An application may configure the LED flash rate and ramp time using a dedicated API.

• Once configured, the LED flash and ramp rate are fully hardware-controlled within the LED/PWM module. It is possible to synchronize any number of the LED drivers together. Use the flash/ramp rate configuration to generate
  color change sequences on RGB LEDs.

• LED outputs can operate in the Deep Sleep state, but not in the Dormant state. Table 8-3 lists the LED controller pattern for QCC5181 WLCSP. Each PWM block can make use of the PIOs and LED pads (virtual PIOs).

Table 8-3 LED controller pattern

• NOTE: The configuration of the PWM controller is the same whether it drives a PIO or LED pad.
• If an OEM assigns other functions, not all PIOs may be available for use with the PWM generator.
• Table 8-4 shows how each LED_PWM maps to a specific virtual PIO and LED_PAD on QCC5181 WLCSP.

Table 8-4 LED_PWM to PIO to LED_PAD mapping

Boot Manager

Figure 9-1 shows the Boot Manager.

The Boot Manager:

• Performs all low-level housekeeping functions
• Manages chip boot
• Manages the lowest level stages of Deep Sleep and Dormant state entry/exit

OTP memory

• QCC5181 WLCSP contains one-time programmable memory areas, used to hold a customer programmable security key.

System Manager

Figure 10-1 shows the System Manager.

The System Manager:

• Executes from ROM
• Controls the allocation of the resources in the system
• Coordinates firmware operation using message-passing and interaction with the other subsystems
• Chip-level sleep modes are coordinated by the System Manager. Each subsystem indicates to the System Manager that they are asleep. The System Manager can individually disable clocks and/or power to subsystems in turn to minimize device power.

System timer

The System Manager maintains a 1 MHz system timer, which is distributed to the subsystems in the hardware using the transaction bus. The system time has 20 ppm, 250 ppm, and 20% modes to optimize current in low-power states.

Charging system

Lion charger overview and configurations

• The QCC5181 WLCSP integrated Li-ion charger is designed to support single Li-ion cells with a wide range of cell capacities and variable VFLOAT voltages.

It has two circuit configurations with different charge current capabilities:

• Internal configuration: Supports charge rates of 2 mA to 200 mA with no additional external components required.
• External configuration: Supports fast charge rates of 200 mA to 1800 mA with the addition of one PNP pass device and external resistor. Lower trickle and pre-charge charge currents are still available in external configurations. Operating configuration is set in firmware using CHARGER_ENABLE_HIGH_CURRENT_EXTERNAL_MODE.

Charger connections

Internal configuration connections

Figure 11-2 shows that in internal configuration, connect the VCHG_SENSE pin to VCHG and leave CHG_EXT unconnected. The charge current passes through QCC5181 WLCSP internally in all charging phases. Charge current enters through the VCHG pin, which should be locally decoupled with a 2.2 μF ceramic capacitor. The charger output current exits via the VBAT pin to the battery. The VBAT_SENSE pin is used to sense the voltage on the battery and must be routed as a Kelvin connection (separately) to the battery connector to avoid IR drop in the battery PCB traces from affecting the charging process, which can lead to early termination.

Transmission power

Nameplate style

• As shown in the following figure

FCC

FCC ISED Statement Important Notice to OEM integrators

1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
3. Separate approval is required for all other operating configurations, including portable configurations for Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 1 5 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module’s intentional emissions are compliant (i.e. fundamental and out-of-band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or that emissions are compliant with the transmitter (s) rule(s). The Grantee will guide the host manufacturer for Part 15 Su part B requirements if needed. notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer notify to Harman International Industries, Incorporated that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door, or cover is easily removed. If not, a second label must be placed on the outside of the final device that contains the following text:
5. “ Contains FCC ID: ID:”. The FCC ID can be used only when all FCC compliance requirements are met.
6. The antenna must be installed such that 20 cm is maintained between the antenna and users,
7. The transmitter module may not be co-located with any other transmitter or antenna.

If these conditions cannot be met (for example certain laptop configurations or colocation with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC au thorization. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exc eed below. Only the Dipole antenna (RP SMA ) is used for the certification, the PCB an tenna is not applicable.

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product that integrates this module. The end user manual shall include all required regulatory information/warnings as shown in this manual

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and
2. this device must accept any interference received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, according to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the  interference by one of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver
• Connect the equipment to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Caution: Any changes or modifications not expressly approved by Harman International Industries, Incorporated for compliance could void the user’s authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

This module has been tested and found to comply with FCC Part 15C requirements for Modular Approval. The modular transmitter is only FCC-authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and the host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2. The transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed. This equipment complies with FCC /IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator & your body.

This device contains licence exempt transmitter(s)/receiver (s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s).

Operation is subject to the following two conditions:

1. This device may not cause interference.
2. This device must accept any interference, including interference that may cause undesired operation of the device

ICES
The host product shall be properly labeled to identify the modules within the host product. The ISED certification label of a module shall be visible at all times when installed in the host product; otherwise, the host product must be labelled to display the ISED certification number for the module, preceded by the word “contains” or similar wording expressing the same meaning, as follows:

Contains IC: Version1.0– July. 10th

References

• ECHO - Events in Luxembourg

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