Cdtech CDW-61852BE-00 Wi-Fi 11ax + BT5.2 Module User Manual
- June 27, 2024
- Cdtech
Table of Contents
- Cdtech CDW-61852BE-00 Wi-Fi 11ax + BT5.2 Module
- Product Usage Instructions
- Frequently Asked Questions
- Overview
- Features
- General Specification
- Electrical Characteristics
- Pin Description
- Warpage
- Packing information
- FCC Statement
- References
- Read User Manual Online (PDF format)
- Download This Manual (PDF format)
Cdtech CDW-61852BE-00 Wi-Fi 11ax + BT5.2 Module
Specifications
- Model: CDW-61852BE-00 WiFi 11ax + BT5.2 Module
- Major Chipset: Realtek RTL8852BE-CG
- Standard: IEEE802.11a/b/g/n/ac/ax, BT V2.1+EDR/ 4.2 /5.2
- Data Transfer Rate: Max 1201 Mbps
- Modulation Method: DSSS/DBPSK/DQPSK/16-QAM/64-QAM/256QAM/1024QAM
- Frequency Band: 2.4~2.4835GHz, 5.18~5.24GHz, 5.745~5.825GHz
- Operation Mode: IEEE 802.11b: DSSS, IEEE802.11a/g/n/ac/ax: OFDM
- Security: Secure Simple Pairing
- Operating Temperature: [Specify the operating temperature range]
- Storage Temperature: [Specify the storage temperature range]
- Humidity: [Specify the humidity range]
- Dimension: [Specify the dimensions]
Product Usage Instructions
1. Overview
The CDW-61852BE-00 is a highly integrated module supporting 2T2R 802.11ax solutions with MU-MIMO and HS-UART interface.
2. Features
WLAN:
- Compliant with IEEE 802.11 standards
- Dual-band 2T2R mode with data rate up to 1201Mbps
- Supports various modulation methods and coding rates
Bluetooth:
- Supports Bluetooth 5 system (BT5.2 Logo Compliant)
- Integrated MCU for Bluetooth protocol stack execution
- Dual Mode support for LE and BR/ED
Frequently Asked Questions
- Q: What is the maximum data rate supported by the CDW-61852BE-00 module?
- A: The module can achieve a speed of up to 1201Mbps.
- Q: Is the CDW-61852BE-00 module compatible with IEEE 802.11a/b/g/n/ac/ax standards?
- A: Yes, the module is compliant with these standards.
Software
Customer | Approve | Date |
---|
| ****
| ****
Design
|
Check
|
Approve
| Version| Date
---|---|---|---|---
| ****
| ****
| ****
V1.7
| ****
2023. 11 . 20
CHINA DRAGON TECHNOLOGY LIMITED
- (86 755) 81449957
- (86 755) 81449967
- Email: Info@cdtech.cn
- http://www.cdtech.cn
Reversion History:
Version
|
Date
|
Modification
---|---|---
1.0
| ****
2022.03.31
| ****
1.First release
1.1
| ****
2022.04.19
| 1. General Specification
2. Physical photo
1.2
| ****
2022.06.30
| ****
1. Physical photo
1.3
| ****
2022.11.08
| ****
1. Packing information
1.4
| ****
2023.05.13
| ****
1. Layout Recommendation
1.5
| ****
2023.08.01
| 1. Physical photo(Add Main and Aux antenna identification)
1.6
| ****
2023.08.23
| ****
1.Features
1.7
| ****
2023.11.20
| Update product height/ Layout Recommendation /number of packages, Add IPEX
size chart
| |
| |
Overview
The CDW 61852BE 00 is a highly integrated module that supports 2T2R 802.11ax s solutions with MU MIMO with wireless LAN (WLAN) PCI Express network interface controller and HS UART mixed interface. It combines a WLAN MAC, a 2T2R capable WLAN baseband, and RF in the module. The wireless module complies with IEEE 802.11 a/b/g/n/ac/ax 2x 2 MIMO standard and it can achieve up to a speed of 1201Mbps . The integrated module provides PCIe interface for Wi Fi, UARTinterface for Bluetooth. And it provides a complete solution for a high performance integrated wireless and Bluetooth device.
Features
WLAN
- IEEE 802.11a/b/g/n/ac/ax compliant WLAN
- 20MHz / 40MHz / 80MHzbandwidth transmission
- Complies with PCI Express Base Specification Revision 2.1
- Dual-band 2T2R mode with data rate up to 1201Mbps
- Supports 802.11ac/ax 2*2 Wave-2 compliant with MU-MIMO
- DSSS with DBPSK and DQPSK, CCK modulation with long and short \preamble, OFDM with BPSK, QPSK, 16QAM,64QAM and 256QAM modulation.Convolutional Coding Rate: 1/2, 2/3, 3/4,and 5/6
- Maximum data rate 54Mbps in 802.11g,300Mbps in 802.11n and 866.7Mbps in 802.11ac,1201Mbps in 802.11ax
Bluetooth
- Supports Bluetooth 5 system(BT5.2 Logo Compliant)
- Compatible with Bluetooth v2.1+EDR
- Integrated MCU to execute Bluetooth protocol stack
- Enhanced BT/WIFI Coexistence Control to improve transmission quality in different Profiles
- Dual Mode support: Simultaneous LE and BR/ED
- Supports multiple Low Energy states
- Supports Enhanced Power Control
- Supports all packet types in basic rate and enhanced data rate
- Supports Secure Simple Pairing
General Specification
Model
| ****
CDW-61852BE-00
---|---
Product Name
| ****
WIFi 11a/b/g/n/ac/ax 2T2R and BT 5.2 Module
Major Chipset
| ****
Realtek RTL8852BE-CG
Standard
| ****
IEEE802.11a/b/g/n/ac/ax, BT V2.1+EDR/ 4.2 /5.2
Data Transfer Rate
| Max:1201 Mbps
Modulation Method
| ****
DSSS/DBPSK/DQPSK/16-QAM/ 64-QAM/256QAM/1024QAM
Frequency Band
| ****
2.4~2.4835GHz , 5.18~5.24GHz, 5.745~5.825GHz
Spread Spectrum
| IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum)
IEEE802.11a/g/n/ac/ax: OFDM (Orthogonal orthogonal Frequency Division Multiplexing)
Operation Mode
| ****
Ad hoc, Infrastructure
Security
| ****
WEP, TKIP, AES, WPA, WPA2
Interface
| ****
Wi-Fi : PCI-E, Bluetooth : USB2.0
Operating Temperature
| ****
-10~ +65° C ambient temperature
Storage Temperature
| ****
-40 ~+90°C ambient temperature
---|---
Humidity
| ****
5 to 90 % maximum (non-condensing)
Dimension
| ****
16.0 x 12.0 x 2.1mm (LxWxH)±0.2mm
Electrical Characteristics
WiFi Section: 5.1 2.4GHz RF Specification
Feature | Description |
---|---|
WLAN Standard | IEEE 802.11b/g/n/ax WiFi compliant |
Frequency Range | 2.400 GHz ~ 2.4835 GHz (2.4 GHz ISM Band) |
Modulation
| 802.11b : DQPSK, DBPSK, CCK
802.11 g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK
802.11ax : OFDMA /1024-QAM、256-QAM、64-QAM、16-QAM、
Receive Sensitivity (11b,20MHz)| – 1Mbps| PER≤8% @ -98 dBm| ≤ -83 dBm
– 11Mbps| PER≤8% @ -91 dBm| ≤ -76 dBm
Receive Sensitivity (11g,20MHz)| – 6Mbps| PER≤10%@ -91 dBm| ≤ -85 dBm
– 54Mbps| PER≤10%@ -78 dBm| ≤ -68 dBm
Receive Sensitivity (11n,20MHz)| – MCS=0| PER≤10%@ -90 dBm| ≤ -85 dBm
– MCS=7| PER≤10%@ -76 dBm| ≤ -67dBm
Receive Sensitivity (11n,40MHz)| – MCS=0| PER≤10%@ -90 dBm| ≤ -82dBm
– MCS=7| PER≤10%@ -73 dBm| ≤ -64dBm
Receive Sensitivity (11ax,20MHz)| – MCS=0| PER≤10%@ -94 dBm| ≤ -82 dBm
– MCS=11| PER≤10%@ -67 dBm| ≤ -52dBm
Receive Sensitivity (11ax,40MHz)| – MCS=0| PER≤10%@ -91 dBm| ≤ -79dBm
– MCS=11| PER≤10%@ -64 dBm| ≤ -49dBm
Maximum Input Level| 802.11b : -10 dBm
802.11g/n/ax : -20 dBm
Antenna Reference|
5GHz RF Specification
Feature | Description |
---|---|
WLAN Standard | IEEE 802.11a/n/ac/ax 2×2, WiFi compliant |
Frequency Range | 5.18~5.24GHz, 5.745~5.825GHz (5.0 GHz ISM Band) |
Modulation
| 802.11a : OFDM /64-QAM,16-QAM, QPSK, BPSK
802.11n : OFDM /64-QAM,16-QAM, QPSK, BPSK
802.11ac : OFDM /256-QAM/64-QAM,16-QAM, QPSK, BPSK
802.11ax:OFDM /1024-QAM/256-QAM/64-QAM,16-QAM,QPSK, BPSK
---|---
Receive Sensitivity
(11a,20MHz)
| –| 6Mbps| PER≤10%@ -91 dBm| ≤ -85 dBm
–| 54Mbps| PER≤10%@ -75 dBm| ≤ -68 dBm
Receive Sensitivity
(11n,20MHz)
| –| MCS=0| PER≤10%@ -90 dBm| ≤ -85 dBm
–| MCS=7| PER≤10%@ -73 dBm| ≤ -67 dBm
Receive Sensitivity
(11n,40MHz)
| –| MCS=0| PER≤10%@ -90 dBm| ≤ -82 dBm
–| MCS=7| PER≤10%@ -70 dBm| ≤ -64dBm
Receive Sensitivity
(11ac,20MHz)
| –| MCS=0, NSS1| PER≤10%@ -92 dBm| ≤ -82 dBm
–| MCS=8, NSS1| PER≤10%@ -70 dBm| ≤ -60 dBm
Receive Sensitivity
(11ac,40MHz)
| –| MCS=0, NSS1| PER≤10%@ -89 dBm| ≤ -79 dBm
–| MCS=9, NSS1| PER≤10%@ -64 dBm| ≤ -55 dBm
Receive Sensitivity
(11ac,80MHz)
| –| MCS=0, NSS1| PER≤10%@ -88 dBm| ≤ -79 dBm
–| MCS=9, NSS1| PER≤10%@ -61 dBm| ≤ -54 dBm
Receive Sensitivity
(11ax,20MHz)
| –| MCS=0| PER≤10%@ -94 dBm| ≤ -82 dBm
–| MCS=11| PER≤10%@ -64 dBm| ≤ -52 dBm
Receive Sensitivity
(11ax,40MHz)
| –| MCS=0| PER≤10%@ -90 dBm| ≤ -79 dBm
–| MCS=11| PER≤10%@ -61 dBm| ≤ -49 dBm
Receive Sensitivity
(11ax,80MHz)
| –| MCS=0| PER≤10%@ -88 dBm| ≤ -73 dBm
–| MCS=11| PER≤10%@ -59 dBm| ≤ -43 dBm
Maximum Input Level| 802.11a/n/ac/ax : -20 dBm
Antenna Reference|
Bluetooth Section
Feature | Description |
---|
General Specification
Bluetooth Standard| Bluetooth V2.1+EDR /4.2/5.2
Host Interface| USB2.0
Antenna Reference|
Frequency Band| 2402 MHz ~ 2480 MHz
Number of Channels| 79 channels
Modulation| FHSS, GFSK, DPSK, DQPSK
RF Specification
| Min| Typical| Max
---|---|---|---
Output Power| 6dBm| 8dBm| 10dBm
Output Power (BLE 1M)| 4dBm| 6dBm| 8dBm
Sensitivity @ BER=0.1%
for GFSK (1Mbps)
| | ****
-88 dBm
|
Sensitivity @ BER=0.01%
for π/4-DQPSK (2Mbps)
| | ****
-86 dBm
|
Sensitivity @ BER=0.01%
for 8DPSK (3Mbps)
| | ****
-83 dBm
|
Sensitivity Sent1000 packets@ PER
≤30.8% (BLE 1M)
| | ****
-98dBm
|
Maximum Input Level
| GFSK (1Mbps):-20dBm
π/4-DQPSK (2Mbps) :-20dBm
8DPSK (3Mbps) :-20dBm
Electrical Characteristics
symbol | Parameter | Minimum | Typical | Maximum | Units |
---|---|---|---|---|---|
3.3V | 3.3V supply voltage | 3.0 | 3.3 | 3.6 | V |
Current | 3.3V rating current | — | — | 2000 | mA |
Layout Recommendation(Unit: mm)
Pin Description
NO. | Name | Type | Description | Voltage |
---|---|---|---|---|
1 | NC | — | No connect | |
2 | NC | — | No connect | |
3 | NC | — | No connect | |
4 | 3.3V | P | 3.3V INPUT | 3.3V |
5 | 3.3V | P | 3.3V INPUT | 3.3V |
6 | GND | — | Ground connections | |
7 | NC | — | No connect | |
8 | NC | — | No connect | |
9 | I2C_CLK | — | No connect (EESK) | |
10 | I2C_DATA | I/O | No connect | |
11 | COEX_RXD | I/O | GPIO6/LTE_RXD | 3.3V |
12 | COEX_TXD | I/O | GPIO12/LTE_RXD | 3.3V |
13 | COEX3 | I/O | No connect | |
14 | NC | — | No connect | |
15 | NC | — | No connect | |
16 | NC | — | No connect | |
17 | GND | — | Ground connections | |
--- | --- | --- | --- | --- |
18 | NC | — | No connect | |
19 | NC | — | No connect | |
20 | GND | — | Ground connections | |
21 | NC | — | No connect | |
22 | NC | — | No connect | |
23 | GND | — | Ground connections | |
24 | HST_WAKE_DEV | I | Host wake BT(GPIO7) | 3.3V |
25 | NC | — | No connect | |
26 | GND | — | Ground connections | |
27 | SLP_CLK | I | External 32.768KHz input | 3.3V |
28 | WL_DIS_N | I | Enable pin for WL device(GPIO9) | 3.3V |
29 | PCIE_WAKEN | I/O | PCIe wake signal(active low) | 3.3V |
30 | PCIE_CLKREQN | I/O | PCIe clock request(active low) | 3.3V |
31 | PCIE_PERSTN | I | PCIe host indication to reset the device | 3.3V |
32 | GND | — | Ground connections | |
33 | PCIE_RCLK_N | I | PCIe differential Clock input —N | |
34 | PCIE_RCLK_P | I | PCIe differential Clock input —P | |
35 | GND | — | Ground connections | |
36 | PCIE_TX_N | O | PCIe Transmit Data —N | |
37 | PCIE_TX_P | O | PCIe Transmit Data —P | |
38 | GND | — | Ground connections | |
39 | PCIE_RX_N | — | PCIe Receive Data —N | |
40 | PCIE_RX_P | — | PCIe Receive Data —P | |
41 | GND | — | Ground connections | |
42 | NC | — | No connect | |
43 | NC | — | No connect | |
44 | NC | — | No connect | |
45 | NC | — | No connect | |
46 | NC | — | No connect | |
47 | NC | — | No connect | |
48 | NC | — | No connect | |
49 | NC | — | No connect | |
50 | NC | — | No connect | |
51 | NC | — | No connect | |
52 | NC | — | No connect | |
53 | NC | — | No connect | |
54 | NC | — | No connect | |
55 | NC | — | No connect | |
56 | NC | — | No connect | |
57 | GND | — | Ground connections | |
58 | PCM_SYNC | I/O | PCM_SYNC (input/output)(GPIO2) | 3.3V |
--- | --- | --- | --- | --- |
59 | PCM_IN | I | PCM_IN (input)(GPIO0) | 3.3V |
60 | PCM_OUT | O | PCM_OUT (output)(GPIO1) | 3.3V |
61 | PCM_CLK | I | PCM_CLK (input)(GPIO3) | 3.3V |
62 | GND | — | Ground connections | |
63 | BT_DIS_N | I | Enable pin for BT device(GPIO11) | 3.3V |
64 | BT_LED | O | BT_LED | 3.3V |
65 | WL_LED | O | WL_LED | 3.3V |
66 | NC | — | No connect | |
67 | HST_WAKE_BT | — | No connect | |
68 | GND | — | Ground connections | |
69 | USB_DM | I/O | USB Serial Differential Data Minus | |
70 | USB_DP | I/O | USB Serial Differential Data Plus | |
71 | GND | — | Ground connections | |
72 | 3.3V | P | 3.3V INPUT | 3.3V |
73 | 3.3V | P | 3.3V INPUT | 3.3V |
74 | GND | — | Ground connections | |
75 | GND | — | Ground connections | |
76 | GND | — | Ground connections | |
77 | GND | — | Ground connections | |
78 | GND | — | Ground connections | |
79 | GND | — | Ground connections | |
80 | GND | — | Ground connections | |
81 | GND | — | Ground connections | |
82 | GND | — | Ground connections | |
83 | GND | — | Ground connections | |
84 | GND | — | Ground connections | |
85 | GND | — | Ground connections | |
86 | GND | — | Ground connections | |
87 | GND | — | Ground connections | |
88 | GND | — | Ground connections | |
89 | GND | — | Ground connections | |
90 | GND | — | Ground connections | |
91 | GND | — | Ground connections | |
92 | GND | — | Ground connections | |
93 | GND | — | Ground connections | |
94 | GND | — | Ground connections | |
95 | GND | — | Ground connections | |
96 | GND | — | Ground connections | |
G1 | GND | — | Ground connections | |
G2 | GND | — | Ground connections | |
G3 | GND | — | Ground connections | |
G4 | GND | — | Ground connections | |
--- | --- | --- | --- | --- |
G5 | GND | — | Ground connections | |
G6 | GND | — | Ground connections | |
G7 | GND | — | Ground connections | |
G8 | GND | — | Ground connections | |
G9 | GND | — | Ground connections | |
G10 | GND | — | Ground connections | |
G11 | GND | — | Ground connections | |
G12 | GND | — | Ground connections |
Supplier
Secondary supplier list
Material name| Supplier brand
WIFI IC| Realtek
Crystal| FK /TKD/JWT
PCBA| A, O, I,F
Diplexer| TDK/ACX/Walsin/GLEAD/Sunlord
Power inductance| Sunlord/CHILISIN/SAMWHA
Capacitance| SAMSUNG /EYANG/Murata
resistance| UniOhm /YAGEO
IPEX| 启明盛
Physical photo
Warpage
- gap≤ 0.1mm
Baking & storage temp e r a ture & Recommended Reflow Profile
Baking & storage temp e r a ture
- A. Storage life 12 months. Storage conditions:<40℃. Relative humidity:<90%R.
- B. After this bag is opened , devices that will be subjected to infrared reflow, vapor phase reflow, or equivalent processing must be
- a. Check the humidity card : stored at ≦20%RH.If :30%~40%(pink)or greater than 40%(red).The labeling module has moisture absorption.
- b. Mounted within 168 hours at factory conditions of: t≦30%°C, ≦ 60%R.H.
- c. Once opened, the workshop the preservation of life for168 hours.
- C. Module apart packing af ter 168 hours If baking is required, devices may be baked for
- a. Modules must be to remove module moisture problem.
- b. Baking temperature: 40℃±5℃, 120 hours.
- c . After baking, put proper amount of desiccant to seal packages.
Recommended Reflow Profile
Referred IPC/JEDEC standard.
- Peak Temperature: <250°C
- Number of time: ≤2 times
Packing information
ESD CAUTION
The CDW 61 8 52BE 00 is ESD (electrostatic discharge) sensitive device and may be damaged with ESD or spike voltage. Although CDW 61 8 52BE 00 is with built in ESD protection circuitry, please handle w ith care to avoid the permanent malfunction or performance degradation.
FCC Statement
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority t o operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
- This device may not cause harmful interference, and
- this device must accept any interference received, including in terference that may cause undesired operation
This device and its antenna(s) must not be co located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user. (b) For a Class B digital device or peripheral, the ins tructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual:
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment an d receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an unc ontrolled environment. This transmitter must not be co located or operating in conjunction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The final end product must be labelled in a visible area with the following: “Contains Transmitter Module 2BFLD CDW61852BE00
Requirement per KDB996 369 D03
List of applicable FCC rules
List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host manufacturers that further testing is required.3
Explanation:
This module meets the requirements of FCC part 15C(15.247) 15.247), FCC Part15 15.407
Summarize the specific operational use conditions
Describe use conditions that are applicable to the modular transmitter, including for example a NY limits on antennas, etc. For example, if point to point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, t hen instructions must state that this information also extends to the host manufacturer’s instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 G Hz DFS bands. Explanation: The EUT has FPC antenna, Yes, the module contains 2 IPEX connected antennae The maximum gain of antenna A is 3.71dBi, and the maximum gain of antenna B is 4.58dBi
Limited module procedures
If a modular transmitter is approved as a “limited module,” then the module manufacturer is responsible for approving the host environment that the limited module is used with. The manufacturer of a limited module must describe, both in the filing and in the installation instructions, the alternative means that the limited module manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions. A limited module manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as : shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This limited module procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full \compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module.
Explanation:
The module is a single module.
Trace antenna designs
For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ Modules for Micro Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements.
- a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna);
- b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered);
- c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout;
- d) Appropriate parts by manufacturer and specifications;
- e) Test procedures for design verification; and
- f) Production test procedures for ensuring compliance.
The module grantee shall provide a notice that any deviation(s) from the defined parameters of the\ antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. Expla nation: Yes, The module with FPC antenna designs, and This manual has been shown the antenna, connectors, and isolation requirements.
RF exposure considerations
It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions ( portable xx cm from a person’s body), and (2) additional text needed for the host product manufacturer to provide to end users in their end product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application). Explanation: This module complies with FCC RF radiation exposure limits set forth for an uncontrolled environment, This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body.” This module is designed to comply with the FCC statement, FCC ID is: 2BFLD CDW61852BE00
Antennas
A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an “omnidirectional antenna” is not considered to be a specific “antenna type”)). For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product. The module manufacturers shall provide a list of acceptable unique connectors.
Explanation: The EUT has FPC antenna , Yes, the module contains 2 IPEX connected antennae The maximum gain of antenna A is 3.71dBi, and the maximum gain of antenna B is 4.58dBi
Label and compliance information
Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes ad vising host product manufacturers that they need to provide a physical or e label stating “Contains FCC ID” with their finished prod uct. See Guidelines for Labeling and User Information for RF Devices KDB Publication 784748.
Explanation:
The host system using this module should have label in a visible area indicating the following texts: “Contains FCC ID: 2BFLD CDW61852BE00
Information on test modes and additional testing requirements
Additional guidance for testing host products is given in KDB Publication
996369 D04 Module Integration Guide. Test modes should take into consideration
different operational conditions for a stand alone modular transmitter in a
host, as well as for multiple simultaneously transmitting modules or other
transmitters in a host product. The grantee should provide information on how
to configure test modes for host product evaluation for different operational
conditions for a stand alone modular transmitter in a host, versus with
multiple, simultaneously transmitting modules or other transmitters in a host.
Grantees can increase the utility of their modular transmitters by providing
special means, modes, or instructions that simulates or characterize a
connection by enabling a transmitter. This can greatly simplify a host
manufacturer’s determination that a module as installed in a host complies
with FCC requirements. Explanation:
C an increase the utility of our modular transmitters by providing
instructions that simulate or characterize a connection by enabling a
transmitter.
Additional testing, Part 15 Subpart B disclaimer
The grantee should include a statement that the modular transmitter is only FCC-authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
Explanation:
The module without unintentional radiator digital circuity, so the module does not require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B.
References
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