Linkplay 2BABF-S28 AIOT Wi-Fi-Bluetooth Combo Module Owner’s Manual

June 12, 2024
Linkplay

Linkplay 2BABF-S28 AIOT Wi-Fi-Bluetooth Combo Module

Product Information

Specifications

  • Manufacturer: Linkplay Technology Inc.
  • Model: S28 Module
  • Revision: 1.6
  • Module Type: AIOT Wi-Fi/Bluetooth Combo Module
  • Version: V1.6

Product Usage Instructions

General Description
The S28 Module is a versatile AIOT Wi-Fi/Bluetooth Combo Module designed for seamless connectivity in various applications.

Introduction
The module provides reliable Wi-Fi and Bluetooth connectivity for IoT devices, smart home systems, and other wireless applications.

Description
Compact in size, the S28 Module offers advanced features to enhance wireless communication capabilities.

EVB Information
The module is compatible with Evaluation Boards (EVBs) for testing and development purposes.

Features

  • Wi-Fi 2.4GHz and 5GHz support
  • Bluetooth connectivity
  • Compact design
  • Low power consumption

General Specification

Wi-Fi 2.4GHz Specification

  • Frequency: 2.4GHz
  • Protocol: IEEE 802.11 b/g/n

Wi-Fi 5GHz Specification

  • Frequency: 5GHz
  • Protocol: IEEE 802.11 ac/n

Bluetooth Specification
Bluetooth Version: Bluetooth 4.2 or higher

FAQ

  • Q: Can the S28 Module be used in outdoor environments?
    A: The S28 Module is designed for indoor use. It is not recommended for outdoor environments as it may affect performance.

  • Q: How do I update the firmware of the S28 Module?
    A: Firmware updates can be done using the provided software tools and following the instructions in the user manual.

S28 Module Datasheet
AIOT Wi-Fi/Bluetooth Combo Module
Version: V1.6

General Description

Introduction
S28 is a highly integrated wireless module with voice & audio functions. It is based on BES2600 solution which features a Cortex-M33 Star dual-core MCU subsystem and a Cortex-A7 dual-core
AP subsystem. Both MCU and AP subsystem are able to run RTOS and user applications, and the crystal of X1(24MHz) provides the clock.
The module supports low power Wi-Fi 4 ( 1×1 802. 11a/b/g/n dual-band) and Bluetooth 5.3). Besides, it provides a high-performance on-board printing antenna to reduce the complexity of hardware design. S28 also provides a voice & audio CODEC subsystem and a display subsystem with 2D graphics engine. It supports MIPI DSI HD display up to HD (720P60), supports MIPI CSI Camera up to 2MPixel, and supports microphone arrays with up to three analog microphones or six digital microphones for far- field voice application. MCU subsystem runs Bluetooth upper protocol stack, and AP subsystem and 2 D hardware Graphics Engine can accelerate GUI & VUI, voice & audio processing and AI tasks.
This compact module is a perfect choice for smart appliance, smart panel, entrance guard and other smart home applications.

Description

Model Name S28
Product Description Support Wi-Fi & Bluetooth, voice & audio, LCD & camera
Dimension L x W x H: 28 x 20 x2.55 mm
Interface USB2.0, UART, I2C, I2S, SDIO device, MIPI, PWM, GPIO
OS RTOS, OpenHarmony

Operating temperature

| Commercial: -20°C to 80°C
Storage temperature| -55°C to 125°C

EVB information
Linkplay provides a evaluation suite for the development and test of S28 module.
Please contact Linkplay sales for EVB documentation and ordering.

Features

CPU

  • CMOS single-chip fully-integrated PMU, CODEC, RF, BB, MCU and AP subsystem
  • 300MHz ARM Cortex-M33 Star dual-core MCU subsystem
  • 1GHz ARM Cortex-A7 dual-core AP subsystem with NEON.
  • Shared 2MB SRAM, on-chip PSRAM and on-chip NOR flashNote1
  • Support TrustZone and secure boot

Wi-Fi / BT

  • 2.4GHz & 5GHz dual-band Wi-Fi, 1T1R, compliant to IEEE 802. 11a/b/g/n
  • Support 20MHz and 40MHz bandwidth
  • Bluetooth 5.3
  • Support BLE Mesh and LE audio
  • A2DP v1.3/AVRCP v1.5/HFP v1.6
  • Wi-Fi and Bluetooth co-existence

Audio

  • Hi-Fi Stereo Audio DAC and ADC
  • Far-field voice wake up
  • 24bit audio processing
  • Support Acoustic Echo Cancellation
  • Support DSD-64/ 128/256 decode

Peripheral interfaces

  • MIPI Tx DSI and MIPI Rx CSI interface
  • USB2.0 HS Host or Device
  • 4 x UART interface, with flow control and configurable baud rate
  • 50Mbps SPIx2, with serial LCD support
  • 1.4Mbps I2C master x3
  • I2S/TDM
  • PWMx8
  • 10-bit GPADC, 3 channels

Note 1: Please refer to ordering information for detailed memory size.

General Specification

Wi-Fi 2.4GHz Specification

Feature Description
WLAN Standard IEEE 802. 11 b/g/n Wi-Fi compliant
Frequency Range 2.400GHz ~ 2.4835GHz (2.4GHz ISM Band)
Number of Channels 2.4GHz:Ch 1 ~ Ch 14
Test Items Typical Value
**** Output Power 802. 11b /11Mbps : 17 ± 2 dBm
802. 11g /54Mbps : 16 ± 2 dBm EVM
802. 11n /MCS7 : 15 ± 2 dBm
Spectrum Mask Meet with IEEE standard
Freq. Tolerance ±20ppm
SISO Receive  Sensitivity ( 11b) @8% PER –       1Mbps
–     11Mbps PER @ -86 dBm
SISO Receive  Sensitivity ( 11g) @10% PER –       6Mbps
–     54Mbps PER @ -73 dBm

SISO Receive Sensitivity

( 11n,20MHz) @10% PER

| –     MCS=0| PER @ -88 dBm| |
–     MCS=7| PER @ -70 dBm| |
SISO Receive Sensitivity

( 11n,40MHz) @10% PER

| –     MCS=0| PER @ -85 dBm| |
–     MCS=7| PER @ -66 dBm| |


Maximum Input Level

| 802. 11b : -8 dBm
802. 11g/n : -20 dBm

Wi-Fi 5GHz Specification

Feature Description
WLAN Standard IEEE 802. 11 a/n Wi-Fi compliant
Frequency Range 5. 18GHz ~ 5.825GHz
Number of Channels Please refer to table1
Test Items Typical Value
802. 11a /54Mbps : 15 ± 2 dBm EVM     -25dB
802. 11n /MCS7 : 14 ± 2 dBm EVM     -28dB
Spectrum Mask Meet with IEEE standard
Freq. Tolerance ±20ppm
SISO Receive  Sensitivity ( 11a) @10% PER –       6Mbps                 PER @

-87 dBm
–     54Mbps                  PER @ -70 dBm
SISO Receive Sensitivity

( 11n,20MHz) @10% PER

| –     MCS=0                 PER @ -86 dBm
–     MCS=7                 PER @ -68 dBm
SISO Receive Sensitivity

( 11n,40MHz) @10% PER

| –     MCS=0                  PER @ -83 dBm
–     MCS=7                  PER @ -65 dBm


Maximum Input Level

| 802. 11a : -20 dBm
802. 11n : -20 dBm

5GHz(20MHz) Channel table

Band range| Operating Channel| Channel center frequency

(MHz)

---|---|---


**** 5180MHz~5240MHz

| 36| 5180
40| 5200
44| 5220
48| 5240
**** 5260MHz~5320MHz| 52| 5260
56| 5280
60| 5300
64| 5320





**** 5550MHz~5700MHz

| 100| 5500
104| 5520
108| 5540
112| 5560
116| 5580
| 120| 5600
---|---|---
124| 5620
128| 5640
132| 5660
136| 5680
140| 5700


5745MHz~5825MHz

| 149| 5745
153| 5765
| 157| 5785
161| 5805
165| 5825

Bluetooth Specification

Feature Description

General Specification
Bluetooth Standard| Bluetooth V5.3
Frequency Band| 2402 MHz ~ 2480 MHz
Number of Channels| 40 channels for BLE
Modulation| GFSK
RF Specification
| Min.| Typical.| Max.
Output Power – BLE| | 8dBm|
Sensitivity @ BER=0. 1%

for GFSK ( 1Mbps)

| | ****

-91dBm

|
Sensitivity @ PER < 30.8%

for BLE

| | ****

-90dBm

|
Maximum Input Level| GFSK ( 1Mbps):-20dBm

Block Diagram

ID setting information
TBD.

Pin Definition
Linkplay Technology Inc. 乐韵瑞信息技术有限公司机密

Pin Outline

Pin Definition details

NO Name Type Description Voltage
1 GND Ground connections
2 ANT1 Note2 Analog Optional Wi- Fi& BT Antenna port, for external antenna
--- --- --- --- ---
3 GND Ground connections

4

| ****

VMIC1

| ****

Analog

| Bias voltage output for external MIC devices. Output range 1 .5 ~3 .3V. Suggest 1 uF decoupling capacitor and RC filter.|


5

| ****

MIC1 _P

| ****

Analog

| MIC1 P port, maximum input voltage 1 .8V ( P to GND), pin requires blocking capacitor.|


6

| ****

MIC1 _ N

| ****

Analog

| MIC1 N port, maximum input voltage 1 .8 V ( P to GND), pin requires blocking capacitor.|
7| GND| –| Ground connections|
8| MIC2 _ N| Analog| MIC2 N port, please refer to the description of MIC1|
9| MIC2 _P| Analog| MIC2 P port, please refer to the description of MIC1|
10| GND| –| Ground connections|
11| MIC3 P| Analog| MIC3 P port, please refer to the description of MIC1|
12| MIC3
N| Analog| MIC3 N port, please refer to the description of MIC1|
13| GND| –| Ground connections|
14| DM| Analog| USB2 .0 D-, support high speed and full speed|
15| DP| Analog| USB2 .0 D+, support high speed and full speed|
16| GND| –| Ground connections|
17| SCLK| I/O| External Flash serial clock| 1.8V
18| HOLD| I/O| External Flash Hold| 1.8V
19| SI| I/O| External Flash serial input| 1.8V
20| SO| I/O| External Flash serial output| 1.8V
21| CE| I/O| External Flash Chip Enable| 1.8V
22| WP| I/O| External Flash Write Protect| 1.8V
23| GND| –| Ground connections|


24

| ****

VBAT

| ****

Analog

| VBAT power supply input, range 3 . 1 ~ 5 . 5 V, typically 3 . 8 V. This pin requires external filter capacitor.|
25| GND| –| Ground connections|


26

| ****

LED1

| ****

O

| LED pin, PMU peripheral IO. Suggest cathode drive mode. Maximum sink current 5 mA. Internally PU by default,|
27| LED2| O| LED pin, please refer to the description of LED1 .|


28

| ****

KEY_ SENSE

| ****

I/O

| Keypad sense pin, 10 – bit ADC input with interrupt function. Max. measurable voltage 1 .7 V. Max. input voltage 2 . 5V.|
29| GPIO 14| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIONote3
30| GPIO
15| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
31| GPIO_32| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
32| GPIO_33| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
---|---|---|---|---
33| GPIO_03| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
34| GPIO_07| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
35| GPIO_27| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
36| GPIO_26| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
37| GPIO_21| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
38| GPIO_05| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
39| GPIO_36| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO


40

| ****

GPIO_37

| ****

I/O

| GPIO, please refer to GPIO MUX Mapping for details,


low- level cathode drive is not recommended,

| VDDIO
41| GPIO_34| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
42| GPIO_23| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
43| GPIO_24| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
44| GPIO30| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
45| GPIO
12| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
46| GPIO_ 13| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
47| GPIO31| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
48| GND| –| Ground connections|
49| CSI
DN1| I/O| CMOS sensor interface , Channel 1 DATA Negative|
50| CSI DP1| I/O| CMOS sensor interface , Channel 1 DATA Positive|
51| CSI
DN0| I/O| CMOS sensor interface , Channel0 DATA Negative|
52| CSI DP0| I/O| CMOS sensor interface , Channel0 DATA Positive|
53| CSI
CLKN| I/O| CMOS sensor interface , Channel Clock Negative|
54| CSI CLKP| I/O| CMOS sensor interface , Channel Clock Positive|
55| GND| –| Ground connections|
56| DSI
CLKP| I/O| Display sensor interface , Channel Clock Positive|
57| DSI CLKN| I/O| Display sensor interface , Channel Clock Negative|
58| DSI
DN0| I/O| Display sensor interface , Channel0 DATA Negative|
59| DSI DP0| I/O| Display sensor interface , Channel0 DATA Positive|
60| DSI
DN1| I/O| Display sensor interface , Channel 1 DATA Negative|
61| DSI DP1| I/O| Display sensor interface , Channel 1 DATA_ Positive|
62| GND| –| Ground connections|
63| GPIO_00| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
64| GPIO01| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
65| GPIO
11| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
66| GPIO_02| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
67| GPIO_06| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
---|---|---|---|---


68

| ****

RESET

| ****

I

| Hardware reset input, active high. Keep it > 2 /3 *VBAT for more than 250ms to achieve a reset.| ****

VBAT



69

| ****


POWKEY

| ****


I

| Hardware power on input, active high. Keep it > 2 / 3 *VBAT for more than 1 ms ( software configurable). Pull up to VBAT with 100 Kohm if not use.| ****


VBAT

70| ADC0| Analog| ADC channel 0 input, 10 – bit, does not support interrupt function. Max. measurable voltage 1 .7 V. Max. input voltage 2 .5V.|
71| ADC2| Analog| ADC channel 2 input, 10 – bit, does not support interrupt function. Max. measurable voltage 1 .7 V. Max. input voltage 2 .5V.|
72| ADC1| Analog| ADC channel 1 input, 10 – bit, does not support interrupt function. Max.

measurable voltage 1 .7 V. Max. input voltage 2 .5V.

|
73| GPIO_ 10| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
74| GPIO_35| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
75| NC| | Please keep it floating|
76| GPIO_25| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
77| GPIO22| I/O| GPIO, please refer to GPIO MUX Mapping for details| VDDIO
78| NC| | Please keep it floating|
79| UART
RX| I| UART0 input, for FW download and debug| VDDIO
80| UART_ TX| O| UART0 output, for FW download and debug| VDDIO


81

| ****

LOUT_ RP

| ****

Analog

| Channel right differential drive output p port. It is recommended to reserve filter circuit and ESD protector.|


82

| ****

LOUT_ RN

| ****

Analog

| Channel right differential drive output n port. It is recommended to reserve filter circuit and ESD protector.|


83

| ****

LOUT_ LN

| ****

Analog

| Channel left differential drive output n port. It is recommended to reserve filter circuit and ESD protector.|


84

| ****

LOUT_ LP

| ****

Analog

| Channel left differential drive output p port. It is recommended to reserve filter circuit and ESD protector.|
85| GND| –| Ground connections|

Electrical Specifications

Absolute Maximum RatingsNote4

Symbol Description Min. Typ. Max. Unit
TA Ambient Temperature -20 80 C
VBAT Supply Voltage 5.5 V
VIN IO Input Voltage -0.3 VDDIO+0.3 V
IIN IO Input Current – 10 10 mA
VLNA LNA Input Level 0 Bm

Note4 : Stresses beyond those listed absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Operating Conditions

Symbol Description Min. Typ. Max. Unit

TA

| Ambient Temperature| -20| 25| 80| C
VBAT| Supply Voltage| 3.1| 3.8| 5.5| V
VIL| CMOS Low Level Input Voltage| 0| | 0.3 VDDIONote5| V
VIH| CMOS High Level Input Voltage| 0.7
VDDIO| | VDDIO| V
VOL| IO Low level Output Voltage| | | 0. 1VDDIO| V
VOH| IO High level Output Voltage| 0.9
VDDIO| | | V
VTH| CMOS Threshold Voltage| | 0.5*VDDIO| | V

Note5: VDDIO=3.3V by default.

Power consumption

**** Test Condition **** State Consumption Avg. (mA)
Throughput Tx Throughput Rx
Standby 92
2.4G 11b 11M 375 172


Throughput state VBAT=3.8V

| 2.4G 11g 54M| 298| 173
---|---|---|---
2.4G 11n HT20| 275| 160
2.4G 11n HT40| 226| 165
5.8G 11a 54M| 279| 173
5.8G 11n HT20| 271| 170
5.8G 11n HT40| 222| 172

Note6 :Above consumption data are tested at Wi- Fi ( STA mode) throughput state with BT on. Moreover, a much higher current spike may occur while module initializing, so please make sure IPEAK of VBAT supply is more than 1.5A.

Size reference

Module Picture

Marking Description

Physical Dimensions

unit:mm

Layout Recommendation

Recommended Reflow Profile

  • Referred to IPC/ JEDEC standard.
  • Peak Temperature : <260°C
  • Number of Times : 2 times

FCC/IC Warning

FCC Warning
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

  1. This device may not cause harmful interference, and (
  2. This device must accept any interference received, including interference that may cause undesired operation.

Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

FCC RF exposure statement
The equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance between 20cm the radiator your body.

IC Caution
Radio Standards Specification RSS-Gen, issue 5
This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions:

  1. This device may not cause interference.
  2. This device must accept any interference, including interference that may cause undesired operation of the device.

RF exposure statement:
The equipment complies with IC Radiation exposure limit set forth for uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body.

When the 5G WIFI function operating in the 5150 to 5250 MHz frequency range, this device restricted to indoor use only.

OEM integration instructions
This device is intended only for OEM integrators under the following conditions:

The transmitter module may not be co-located with any other transmitter or antenna. The module shall be only used with the external antenna(s) that has been originally tested and certified with this module.
As long as the conditions above are met, further transmitter test will not be required.
However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

Validity of using the module certification
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID/IC of the module cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.

End product labeling
The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2BABF-S28. Contains IC: 30828-S28.”

Information that must be placed in the end user manual
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
Integration instructions for host product manufacturers according to KDB 996369 D03
OEM Manual v01

List of applicable FCC/IC rules
FCC Part 15 Subpart C 15.247 & 15.207 & 15.209 & 15.407& RSS GEN&RSS 247

Specific operational use conditions
The module is a Linkplay S28 with Bluetooth&2.4G
WLAN&5G WIFI function.
BLE Specification:

  • Operation Frequency: 2402-2480MHz
  • Number of Channel: 40
  • Modulation: GFSK
  • Type: PCB Antenna
  • Gain: 1.5dBi
  • 2.4g WIFI Specification:
  • Operation Frequency: 2412-2462MHz
  • Number of Channel: 11
  • Modulation: CCK,DBPSK,DQPSK,BPSK,QPSK,16QAM,64QAM
  • Type: PCB Antenna
  • Gain: 1.5dBi
  • 5g WIFI Specification:
  • Operation Frequency: 5.18GHz~5.825GHz
  • Number of Channel: 36~48 52~64,100~140,149~165
  • Modulation: BPSK,QPSK,16QAM,64QAM
  • Type: PCB Antenna
  • Gain: 3.32dBi
  • Linkplay Technology Inc. 乐韵瑞信息技术有限公司机密

The module can be used for mobile or applications with a maximum 1.5dBi antenna. The host manufacturer installing this module into their product must ensure that the final composit product complies with the FCC/IC requirements by a technical assessment or evaluation to the FCC/IC rules, including the transmitter operation.
The host manufacturer has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

Limited module procedures
Not applicable. The module is a Single module and complies with the requirement of FCC Part 15.212.

Trace antenna designs
Not applicable. The module has its own antenna, and doesn’t need a host’ s printed board microstrip trace antenna etc.

RF exposure considerations
The module must be installed in the host equipment such that at least 20cm is maintained between the antenna and users’ body; and if RF exposure statement or module layout is changed, then the host product manufacturer required to take responsibility of the module through a change in FCC ID/IC or new application.
The FCC ID/IC of the module cannot be used on the final product. In these circumstances, the host manufacturer will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate

FCC/IC authorization

Antennas

  • PCB Antenna
  • Gain:
  • 2.4GHZ:1.5dBi
  • 5GHZ:3.32dBi

This device is intended only for host manufacturers under the following conditions: The transmitter module may not be co-located with any other transmitter or antenna; The module shall be only used with the internal antenna(s) that has been originally tested and certified with this module. The antenna must be either permanently attached or employ a ‘unique’ antenna coupler.
As long as the conditions above are met, further transmitter test will not be required. However, the host manufacturer is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).

Label and compliance information
Host product manufacturers need to provide a physical or e-label stating “Contains FCC ID: 2BABF-S28. Contains IC: 30828-S28.” with their finished product.

Information on test modes and additional testingrequirements
BLE:

  • Operation Frequency: 2402~2480MHz
  • Number of Channel: 40
  • Modulation: GFSK
  • 2.4g wifi:
  • Operation Frequency: 2412-2462MHz
  • Number of Channel: 11
  • Modulation: CCK,DBPSK,DQPSK,BPSK,QPSK,16QAM,64QAM
  • 2.4GHZ:1.5dBi
  • 5G WIFI:
  • Operation Frequency: 5150MHZ~5250MHZ,5250MHZ~5325MHZ,5470MHZ~5725MHZ,5725MHZ~5825MHZ Number of Channel: 36~48 52~64,100~140,149~165
  • Modulation: BPSK,QPSK,16QAM,64QAM
  • 5GHZ:3.32dBi

Host manufacturer must perfom test of radiated & conducted emission and spurious emission, etc. according to the actual test modes for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. Only when all the test results of test modes comply with FCC requirements, then the end product can be sold legally.

Additional testing, Part 15 Subpart B disclaimer
The modular transmitter is only FCC/IC authorized for FCC Part 15 Subpart C 15.247 & 15.207 & 15.209 & RSS GEN&RSS 247 and that the host product manufacturer is responsible for compliance to any other FCC/IC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B/RSS GEN compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B/ RSS GEN compliance testing with the modular transmitter installed.

Revision History

Revision Date Originator Comments
V1.2 05/12/2023 Yahui Zhou
--- --- --- ---
V1.3 11/21/2023 Yahui Zhou Add Marking Description
V1.4 01/22/2024 Yahui Zhou Update Bluetooth Version
V1.5 4/10/2024 Shengwei Yang Add FCC Warning
V1.6 5/8/2024 Shengwei Yang Add IC Caution

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