EBYTE E22-900M22S SX1262 868/915MHz SPI SMD LoRa Module User Manual

: June 6, 2024
: ebyte

E22-900M22S User Manual
SX1262 868/915 MHz SPI SMD LoRa Module

Chengdu Ebyte Electronic Technology Co., LTD.

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Overview

Introduction
The E22-900M22S is based on the SX I262, a new generation of LoRa”4 RF chip manufactured by Semtech, USA. It is an ultra-small and self-developed 868MHz, 915MHz SMD LoRaTm wireless module.

Because it adopted the original SX1262 as the main core, the anti-interference performance and communication distance have been further improved compared to the previous generation LoRaTM transceiver. Due to its new LoRaTM modulation technology, the anti-interference performance and communication distance are far superior to the current FSK and GFSK modulation products. This module is mainly for smart homes, wireless meter reading, scientific and medical research, and long-distance wireless communication equipment. The RF performance and components selection are all in accordance with industrial- grade standards and this product obtained FCC, CE, and RoHS certification already so users do not need to worry about the performance. Adopted industrial grade high precision 32MHz crystal, the product can cover an ultra- wide frequency range of 850-930MHz and is backward compatible with SX 1278 and SX1276.

Since the module is an RF transceiver module only, users need to use the MCU driver or use a dedicated SPI debug tool

Features

Communication distance tested is up to 7km ;
The maximum transmission power of 160mW, software multi-level adjustable ;
Support the global license-free ISM 868/915MHz band;
Support air date rate of 0.018-62.5kbps in the Laing mode ;
Support 300kpbs in the FSK mode,
Compatible with the transceiver of SX1278/SX1276;
With large capacity, FIFO supports 256Byte data cache.;
New SF5 spreading factor to support dense networks;
Support 2.5V-3.7V power supply, more than 3.3V power supply can guarantee the best performance;
Industrial grade standard design, support -40 — 85 °C for working over a long time ;
IPEX and stamp holes are optional, which is convenient for secondary development and integration.

Application

Home security alarm and remote keyless entry;
Smart home and industrial sensors ;
Wireless alarm security system ;
Building automation solutions ;
Wireless industrial-grade remote control;
Health care products;
Advanced Meter Reading Architecture(AMI) ,
Automotive industry applications.

Specification and parameter

Limit parameter

Main parameter	Performance	Remark
Min.	Max.
Power supply (V )	0	4.

damage to module
Blocking power ( dBm)| | 10| Chances of burn is slim when modules
are used in short distance
Operating temperature (°C)| -40| 85|

Operating parameter

Main parameter	Performance	Remark
N lin.	Typ.	Max.
Operating voltage (V)	2.	3.
Communication level ( V)		3.

conversion
Operating temperature (°C)| -40| –| 85| Industrial design
Operating frequency ( GHz )| 850| 868/915| 930| Support ISM band
Power
consumption| TX current ( mA )| | 119| | Instant power consumption
RX current ( mA)| | 7.| |
Sleep current ( nA )| | 180| | Software is shut down
Max Tx Power (dBm)| 21.| 22.| 22.|
Receiving sensitivity (dBm)| -144| -146| -147| Air data rate is 0.3kbps
Air data rate (bps)| 0.6k| –| 300k| Controlled via user’s programming
0.018k| | 62.5k| Controlled via user’s programming

Main parameter	Description	Remark
Distance for reference	7000m	Test condition : clear and open area, antenna

Size and pin definition

No.	Name	Direction	Function
I	GND		Ground wire, connected to the power reference ground
GND		Ground wire, connected to the power reference ground
3	GND		Ground wire, connected to the power reference ground
4	GND		Ground wire, connected to the power reference ground
GND		Ground wire, connected to the power reference ground
6	RXEN	Input	RF switch receiving control pin, connected to external

Basic Operation

Hardware Design

SN	Brief Connection between Module and Single Chip Microcomputer
1	The MO, 101, 102, 103 in MCU means the 10 port of MCU.
2	D101, D102 is the normal I0 port, which can be configured to multiple

functions. The DIO2 can connect with TXEN. but not with the 10 ports of MCU. It’s used to control RF switch, see more details in SX1262 datasheet. Also, It can be floated when not in use.
3| The DI03 is powered by a 32MHz TCXO crystal.
4| Ensure the good grounding, large area of paving, small the power supply ripple, the filter capacitor should be increased and as close as possible to the VCC and GND pins of the module.

Note:

It is recommended to use DC stabilized power supply to supply power to the module. The power supply ripple coefficient is as small as possible, and the module needs to be reliably grounded.
Please pay attention to the correct connection of the positive and negative poles of the power supply. If the reverse connection is connected, the module may be permanently damaged.
Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum, the module will be permanently damaged.
Please check the stability of the power supply, the voltage can not be significantly frequent.
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, and the whole machine is beneficial for long-term stable operation.
The module should be as far away as possible from the power supply, transformers, high-frequency wiring, and other parts with large electromagnetic interference.
High-frequency digital traces, high-frequency analog traces, and power traces must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(All copper-covered and well-grounded), and must be close to the digital part of the module and routed in the Bottom Layer.
Assuming the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees.
Assume that there are traces with large electromagnetic interference around the module (high-frequency digital, high-frequency analog, power trace), which will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;
If the communication line uses a 5V level, an lk-5.1k resistor must be connected in series (not recommended, there is still a risk of damage).
Try to stay away from some physical layers and also have a 2.4GHz TTL protocol, for example, USB3.0
The antenna mounting structure has a great influence on the performance of the module. It is necessary to ensure that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna extension cable to extend the antenna to the outside of the case.
The antenna must not be installed inside the metal case, which will greatly reduce the transmission distance.
It is recommended to add a 200R protection resistor to the RXDITXD of the external MCU.

Software Programming

Its driving mode is exactly the same as SX1268/SX1262. Users can operate according to SX1268/SX1262 chip datasheet.
D101 and DIO2 are general-purpose 10 ports, which can be configured into multiple functions. D102 can be connected to TXEN and not connected to the MCU’s 10 port. It can be used to control the RF switch transmission. If not used, you can hang it. For details, see the SXI262 manual.
DIO 3 is used to supply 32 MHz TCXO crystal oscillators.

FAQ

The communication range is too short

The communication distance will be affected when an obstacle exists.
Data loss rate will be affected by temperature, humidity, and co-channel interference.
The ground will absorb and reflect wireless radio waves, so the performance will be poor when testing near the ground.
Seawater has a great ability in absorbing wireless radio waves, so performance will be poor when testing near the sea.
The signal will be affected when the antenna is near a metal object or put in a metal case.
The power register was set incorrectly, the air data rate is set as too high (the higher the air data rate, the shorter the distance).
When the power supply at room temperature is lower than the recommended low voltage, the lower the voltage is, the lower the transmitting power is.
Due to antenna quality or poor matching between antenna and module.

The module is easy to damage

Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will lead to permanent damage to the module.
Please check the stability of the power supply and ensure the voltage does not fluctuate too much.
Please make sure anti-static measures are taken when installing and using, high-frequency devices that have electrostatic susceptibility.
Please ensure the humidity is within a limited range for some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperatures.

The high bit error rate

There is co-channel signal interference nearby, keep away from interference sources or modify the frequency, channels to avoid interference.
The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus line should not be too long.
The unsatisfactory power supply may also cause garbled characters, and ensure the reliability of the power supply.
If the extension cable or feeder is of poor quality or too long, the bit error rate will be high.

Welding operation guidance

Reflow Soldering Temperature

Profile Feature	Curve feature	Sn-Pb Assembly	Pb-Free Assembly
Solder Paste	Solder paste	Sn63/Pb37	Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin) )	Minimum preheating temperature	100°C

Reflow Soldering Curve

Model| Chip| Frequency Hz| Transmit power dBm| Test distance km| Packaging| Size mm| Communication Interface
---|---|---|---|---|---|---|---
E22- 900T22S| SX1262| 868M 915M| 22| 7| SMD| 1626| UART
E22- 230T22S| SX1262| 230M| 22| 7| SMD| 1626| UART
E22- 400T22S| SX1268| 433M 470M| 22| 7| SMD| 1626| UART
E22- 400M30S| SX1268| 433M 470M| 30| 12| SMD| 2438.5| SPI
E22- 900M30S| SX1262| 868M 915M| 30| 12| SMD| 2438.5| SPI
E22- 900M22S| SX1262| 868M 915M| 22| 6.5| SMD| 1420| SPI
E22- 400M22S| SX1268| 433M 470M| 22| 6.5| SMD| 14*20| SPI

Antenna Type

Antenna recommendation

The antenna plays an important role in the communication process. The inferior antenna often has a great impact on the communication system. Therefore, we recommend some antennas that support our wireless modules and have excellent performance and reasonable prices.

Product| Type| Frequent
y Hz| Interface| Gain
dBi| Size| Feeder| Features
---|---|---|---|---|---|---|---
TX433-NP-4310| Soft PCB antenna| 433M| SMA-J| 2| 43.8*9.5mm| –| Built-in flexible FPC son
antenna
TX433-JW-5| Soft PCB antenna| 433M| SMA-J| 2| 50mm| –| Flexible, Omnidirectional
TX411-JWCi-7| Soft PCB antenna| 433M| SMA-J| 3.| 75mm| –| Flexible, Omnidirectional
TX433-JK-20| Soft PCB antenna| 433M| SMA-J| 3| 210mm| –| Flexible, Omnidirectional
TX433-JK-I 1| Soft PCB antenna| 433M| SMA-J| 3.| 110mm| –| Flexible, Omnidirectional
TX433-XP-200| Sucker antenna| 433M| SMA-J| 4| 19cm| 200cm| High Gain
TX433-XP-I00| Sucker antenna| 433M| SMA-J| 4.| 18.5cm| 100cm| High Gain
rX413-XPH-100| Sucker antenna| 433M| SMA-J| 6| 96.5cm| 300cm| High Gain
TX413-.17.6-6| Soft PCB antenna| 433M| SMA-J| 3.| 52mm| –| Ultra short straight,
Omnidirectional
TX433-JZ-5| Soft PCB antenna| 433M| SMA-J| 2| 52mm| –| Ultra short straight,
Omnidirectional
1X490-XP-100| Sucker antenna| 490M| SMA-J| 50| 12cm| 100cm| High Gain
TX490-JZ-5| Soft PCB antenna| 490M| SMA-J| 50| 50mm| –| High Gain

Batch packaging

Revision history

Version	Date	Description	Issued by
1.0	2018-09-25	Original version	huaa
1.1	2019-02-17	Content added	Ray
1.2	2019-04-03	Content updated	Ray
1.3	2019-11-14		Ren
1.4	2020-11-26	Error correction	Linson

About history

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