EBYTE E22-900M22S SX1262 868-915MHz SPI SMD LoRa Module User Manual

EBYTE E22-900M22S SX1262 868-915MHz SPI SMD LoRa Module

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Overview

Introduction

The E22-900M22S is based on the SX1262, a new generation of LoRaTM RF chip manufactured by Semtech, USA. It is an ultra-small and self-developed 868MHz, 915MHz SMD LoRaTM wireless module.Because it adopted the original SX1262 as main core, so the anti-interference performance and communication distance have been further improved compared to the previous generation LoRaTM transceiver.Due to its new LoRaTM modulation technology, the anti-interference performance and communication distance are far superior to the current FSK and GFSK modulation products. This module is mainly for smart home, wireless meter reading, scientific and medical research, and long distance wireless communication equipment. The RF performance and components selection are all in accordance with industrial-grade standards and this products obtained FCC, CE and RoHS certification already and so users do not need to worry about the performance. Adopted industrial grade high precision 32MHz crystal, the product can cover an ultra-wide frequency range of 850~930MHz and is backward compatible with SX1278 and SX1276.
Since the module is a RF transceiver module only, users need to use the MCU driver or use a dedicated SPI debug tool.

Features

• Communication distance tested is up to 7km；
• Maximum transmission power of 160mW, software multi-level adjustable；
• Support the global license-free ISM 868/915MHz band；
• Support air date rate of 0.018-62.5kbps in the LoRaTM mode；
• Support 300kpbs in the FSK mode;
• Compatible with the transceiver of SX1278/SX1276;
• With large capacity, FIFO supports 256Byte data cache.;
• New SF5 spreading factor to support dense networks;
• Support 2.5V~3.7V power supply, more than 3.3V power supply can guarantee the best performance;
• Industrial grade standard design, support -40 ~ 85 °C for working over a long time；
• IPEX and stamp hole are optional, which is convenient for secondary development and integration.
• The E22-900M22S passes the FCC&CE&ROHS certification.

Application

• Home security alarm and remote keyless entry；
• Smart home and industrial sensors；
• Wireless alarm security system；
• Building automation solutions；
• Wireless industrial-grade remote control；
• Health care products；
• Advanced Meter Reading Architecture(AMI)；
• Automotive industry applications.

Specification and parameter

Limit parameter

Main parameter

| Performance|

Remark

---|---|---
Min.| Max.

Power supply（V）

|

0

|

3.7

| Voltage over 3.7V will cause permanent

damage to module

Blocking power（dBm）

|

–

|

10

| Chances of burn is slim when modules

are used in short distance

Operating temperature（℃）| -40| 85|

Operating parameter

Main parameter

| Performance|

Remark

---|---|---
Min.| Typ.| Max.
Operating voltage（V）| 1.8| 3.3| 3.7| It’s recommended to use 3.3V.

Communication level（V）

|  |

3.3

|  | For 5V TTL, It is recommended to add level

conversion

Operating temperature（℃）| -40| –| 85| Industrial design
Operating frequency（GHz）| 850| 868/915| 930| Support ISM band

Power consumption

| TX current（mA）|  | 119|  | Instant power consumption
RX current（mA）|  | 6.8|  |
Sleep current（nA）|  | 180|  | Software is shut down
Max Tx power（dBm）| 21.4| 21.5| 22.3|
Receiving sensitivity（dBm）| -144| -146| -147| Air data rate is 0.3kbps
---|---|---|---|---

Air data rate（bps）

| 0.6k| –| 300k| Controlled via user’s programming
0.018k|  | 62.5k| Controlled via user’s programming

Distance for reference

|

7000m

| Test condition：clear and open area, antenna gain: 5dBi，antenna

height: 2.5m，air data rate: 0.3kbps

FIFO| 256Byte| Maximum length of single transmission
Crystal frequency| 32MHz|
Modulation| LoRa(recommended)|
Package| SMD|
Connector| 1.27mm| Stamp hole
Communication interface| SPI| 0-10Mbps
Size| 20 142.8 mm|
Antenna| IPEX/IPEX| 50 ohm impedance

Size and pin definition

6

| ****

RXEN

| ****

Input

| RF switch receiving control pin, connected to external microcontroller IO,

valid in high level

7

| ****

TXEN

| ****

Input

| RF switch transmitting control pin, connected to external microcontroller IO

or DIO2, valid in high level

8| DIO2| Input/Output| Configurable universal IO port (see SX1262 manual for details)

9

| ****

VCC

|  | Power supply, 1.8~3.7V(It is recommended to add external ceramic filter

capacitor)

10| GND|  | Ground wire, connected to the power reference ground
11| GND|  | Ground wire, connected to the power reference ground
12| GND|  | Ground wire, connected to the power reference ground
---|---|---|---
13| DIO1| Input/Output| Configurable universal IO port (see SX1262 manual for details)
14| BUSY| Output| For status indication (see SX1262 manual for details)
15| NRST| Input| Chip reset trigger input pin, valid in low level
16| MISO| Output| SPI data output pin
17| MOSI| Input| SPI data output pin
18| SCK| Input| SPI data output pin
19| NSS| Input| Module chip select pin for starting an SPI communication
20| GND|  | Ground wire, connected to the power reference ground
21| ANT|  | Antenna interface, stamp hole (50 ohm characteristic impedance)
22| GND|  | Ground wire, connected to the power reference ground

Basic Operation

Hardware Design

2

| DIO1、DIO2 is the normal IO port, which can be configured to multiple function. The DIO2 can

connect with TXEN，but not with the IO port of MCU. It’s used to control RF switch, see more details in SX1262 datasheet. Also It can be floated when not in use.

3| The DIO3 is powered by a 32MHz TCXO crystal.
4| Ensure the good grounding, large area of paving, small the power supply ripple, the filter capacitor

should be increased and as close as possible to the VCC and GND pins of module.

Note:

• It is recommended to use DC stabilized power supply to supply power to the module. The power supply ripple coefficient is as small as possible, and the module needs to be reliably grounded.
• Please pay attention to the correct connection of the positive and negative poles of the power supply. If the reverse connection is connected, the module may be permanently damaged.
• Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum, the module will be permanently damaged.
• Please check the stability of the power supply, the voltage can not be significantly frequent.
• When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, and the whole machine is beneficial for long-term stable operation.
• The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other parts with large electromagnetic interference.
• High-frequency digital traces, high-frequency analog traces, and power traces must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(All copper-covered and well grounded), and must be close to the digital part of the module and routed in the Bottom Layer.
• Assuming the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees.
• Assume that there are traces with large electromagnetic interference around the module (high-frequency digital, high-frequency analog, power trace), which will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;
• If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a risk of damage).
• Try to stay away from some physical layers and also have a 2.4GHz TTL protocol, for example: USB3.0
• The antenna mounting structure has a great influence on the performance of the module. It is necessary to ensure that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna extension cable to extend the antenna to the outside of the case.
• The antenna must not be installed inside the metal case, which will greatly reduce the transmission distance.
• It is recommended to add a 200R protection resistor to the RXD/TXD of the external MCU.

Software Programming

• Its driving mode is exactly the same as SX1268/SX1262. Users can operate according to SX1268/SX1262 chip datasheet.
• DIO1 and DIO2 are general-purpose IO ports, which can be configured into multiple functions. DIO2 can be connected to TXEN and not connected to the MCU’s IO port. It can be used to control the RF switch transmission. If not used, you can hang it. For details, see the SX1262 manual.
• DIO 3 is used to supply 32 MHz TCXO crystal oscillator.

FAQ

Communication range is too short

• The communication distance will be affected when obstacle exists.
• Data lose rate will be affected by temperature, humidity and co-channel interference.
• The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
• Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
• The signal will be affected when the antenna is near metal object or put in a metal case.
• Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance).
• When the power supply at room temperature is lower than the recommended low voltage, the lower the voltage is, the lower the transmitting power is.
• Due to antenna quality or poor matching between antenna and module.

Module is easy to damage

• Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will lead to a permanent damage to the module.
  Please check the stability of power supply and ensure the voltage not to fluctuate too much.

• Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic susceptibility.

• Please ensure the humidity is within limited range for some parts are sensitive to humidity.

• Please avoid using modules under too high or too low temperature.

High bit error rate

• There are co-channel signal interference nearby, keep away from interference sources or modify frequency, channel to avoid interference.
• The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus line should not be too long.
• Unsatisfactory power supply may also cause garbled characters, and ensure the reliability of the power supply.
• If the extension cable or feeder is of poor quality or too long, the bit error rate will be high.

Welding operation guidance

Reflow Soldering Temperature

Profile Feature| Curve feature| Sn-Pb Assembly| Pb-Free Assembly
---|---|---|---
Solder Paste| Solder paste| Sn63/Pb37| Sn96.5/Ag3/Cu0.5

Preheat Temperature min （Tsmin）

| Minimum preheating

temperature

|

100℃

|

150℃

Preheat temperature max (Tsmax)

| Maximum            preheating

temperature

|

150℃

|

200℃

Preheat Time (Tsmin to Tsmax)(ts)| Preheating time| 60-120 sec| 60-120 sec
Average ramp-up rate(Tsmax to Tp)| Average rising rate| 3℃/second max| 3℃/second max
Liquidous Temperature (TL)| Liquid phase temperature| 183℃| 217℃
Time（tL）Maintained Above（TL）| Time above liquidus| 60-90 sec| 30-90 sec
Peak temperature（Tp）| Peak temperature| 220-235℃| 230-250℃
Aveage ramp-down rate（Tp to Tsmax）| Average descent rate| 6℃/second max| 6℃/second max

Time 25℃ to peak temperature

| Time of 25 ° C to peak

temperature

|

6 minutes max

|

8 minutes max

Reflow Soldering Curve

Related Model

Model| Chip| Frequency

Hz

| Transmit

power dBm

| Test distance

km

| Packaging| Size

mm

| Communication

Interface

---|---|---|---|---|---|---|---
E22-900T22S| SX1262| 868M 915M| 22| 7| SMD| 1626| UART
E22-230T22S| SX1262| 230M| 22| 7| SMD| 1626| UART
E22-400T22S| SX1268| 433M 470M| 22| 7| SMD| 1626| UART
E22-400M30S| SX1268| 433M 470M| 30| 12| SMD| 2438.5| SPI
E22-900M30S| SX1262| 868M 915M| 30| 12| SMD| 2438.5| SPI
E22-900M22S| SX1262| 868M 915M| 22| 6.5| SMD| 1420| SPI
E22-400M22S| SX1268| 433M 470M| 22| 6.5| SMD| 14*20| SPI

Antenna Type

Antenna recommendation

The antenna plays an important role in the communication process. The inferior antenna often has a great impact on the communication system. Therefore, we recommend some antennas that support our wireless modules and have excellent performance and reasonable price.

Product

|

Type

| Frequenc

y Hz

|

Interface

| Gain

dBi

|

Size

|

Feeder

|

Features

---|---|---|---|---|---|---|---

TX433-NP-4310

|

Soft PCB antenna

|

433M

|

SMA-J

|

2

|

43.8*9.5mm

|

–

| Built-in flexible FPC soft

antenna

TX433-JW-5| Soft PCB antenna| 433M| SMA-J| 2| 50mm| –| Flexible, Omnidirectional
TX433-JWG-7| Soft PCB antenna| 433M| SMA-J| 2.5| 75mm| –| Flexible, Omnidirectional
TX433-JK-20| Soft PCB antenna| 433M| SMA-J| 3| 210mm| –| Flexible, Omnidirectional
TX433-JK-11| Soft PCB antenna| 433M| SMA-J| 2.5| 110mm| –| Flexible, Omnidirectional
TX433-XP-200| Sucker antenna| 433M| SMA-J| 4| 19cm| 200cm| High Gain
TX433-XP-100| Sucker antenna| 433M| SMA-J| 3.5| 18.5cm| 100cm| High Gain
TX433-XPH-300| Sucker antenna| 433M| SMA-J| 6| 96.5cm| 300cm| High Gain

TX433-JZG-6

|

Soft PCB antenna

|

433M

|

SMA-J

|

2.5

|

52mm

|

–

| Ultra short straight， Omnidirectional

TX433-JZ-5

|

Soft PCB antenna

|

433M

|

SMA-J

|

2

|

52mm

|

–

| Ultra short straight， Omnidirectional
TX490-XP-100| Sucker antenna| 490M| SMA-J| 50| 12cm| 100cm| High Gain
TX490-JZ-5| Soft PCB antenna| 490M| SMA-J| 50| 50mm| –| High Gain

Batch packaging

Revision history

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