Shenzhen Dadoutek Electronics DB809S BLE 5 Module Instruction Manual

Dadoutek Electronics DB809S BLE 5 Module
Instruction Manual

| | |
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Version| Update Time| Editor
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VI.00| 2019-3-15| Alan Jiao
VI.10| 2019-4-17| Jack Wang
V1.11| 2019-4-22| Jack Wang
V1.12| 2020-6-16| Allen. Hu
VI.13| 2020-7-10| Joe.Zhou
V1.14| 2020-8-17| Allen Hu

Product Introduction

Product Overview
DB809S is made by nRF52805 which is the baseline member of the nRF52 Series SoC family. It is built around an ARM® Cortex™-M4 CPU running at 64 MHz. It meets the challenge of bringing Bluetooth 5 feature sets and protocol concurrency to applications at a price point that makes adding Bluetooth 5 connectivity to an application compelling.  It is an ideal candidate for less complex applications and also as a Bluetooth 5 connectivity processor in larger applications.
DB809S is an SMD package， and the rapid production of can be realized through the standard SMT equipment. It can give customers a high-reliability connection, especially suitable for automation, large-scale modern mode of production, low cost, convenient application in all kinds of Internet of things terminal hardware.

Detail Param

Performance
Form 1: Performance

Current
(Chip reference)| TX: 4.6 mA peak current (0 dBm)
RX: 4.6 mA peak current
0.3uA (3V VDD) in System OFF mode, no RAM retention
Working Temperature| -40°C851:
Storage Temperature| 22°C281:
Package Size| 10.5163mm

Mechanical specifications

Picture 1 is the PCB mechanical specifications of the module.

Picture 1: PCB Mechanical Specifications dimensions in millimeters

Form 2

PIN Description

PIN

| PIN On nRF52|

Description

---|---|---
1| GND| GND
2| STUDIO| Serial wire debug I/O for debugging and programming
3| SWCLK| Serial wire debug clock input for debugging and programming
4| P0.21/PRESET| Digital I/O / Configurable as pin reset
5| P0.20| Digital I/O
6| P0.18| Digital I/O
| P0. 16| ,
Digital I/O
s| P0.12| Digital I/O
| P0.14| Digital I/O
10| P0.05/AIN3| Analog input /Digital I/O
II| P0.04/AIN2| Analog input /Digital I/O
12| P0.01/XL2| General-purpose I/O Connection for 32. 768 kHz crystal (LFXO)
13| P0.00/XL1| General-purpose I/O Connection for 32. 768 kHz crystal (LFXO)
14| VDD| 1.7 V 13.6V (Recommended voltage range)
15| GND| GND

Note： Input voltage higher than VCC will destroy the module.

Soldering Reflow Guidelines

Form 4 and picture 2 are reflow conditions and profiles.

Form4: Reflow conditions

Picture 2: Reflow profile

Attentions

1. This module contains CMOS devices, that need to be protected from ESD.
2. Module needs to connect GND well, to reduce parasitic inductance.
3. If the module needs reflow, pay attention to the reflow profile.
4. The area below the ANT of this module, should not use polygon.
5. ANT of this module should be far away from another circuit.
6. The module should be placed as far as possible away from the other low-frequency circuits or digital circuits.
7. Module is plugged into a power supply for recommending the use of magnetic beads in isolation.
8. If there are other internal band wireless modules in your product, frequency should be reasonable planning, take the shielding measures, such as reducing the influence of harmonic interference and intermodulation interference.

Sales And Service Network

Headquarter
Shenzhen Headquarter
Add: Rm.1502, FIYTA Tech Building,#002 No.1 SouthernRd, Hi-Tech, Nanshan District, Shenzhen 518057, P.R.China
Tel：86-755-86018818
Fax：86-755-86018808

North China

Beijing Office
Add ：Room1006,QuantumPlaza,No.23ZhiChunRoad, Haidian District, Beijing
Tel：86-10-82358601/2/3/4
Fax：86-10-82358605

East China

Shanghai Office
Add :Rm.2005,MingshenCenterBuilding,No.3131,KaixuanRoad,XuhuiDistrict,Shanghai200030,P.
R.China
Tel：86-21-54071701
Fax：86-21-54071702

Southwest China

Chengdu Office
Add: Room1402,Bldg#2,ShuduCenter,No.138,TianfuNo.2Street,MidSection,TianfuAvenue,HighTechDistrict,ChengduCity
Tel：86-28-85355251
Fax：86-28-85350890

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception,  which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Caution: Any changes or modifications to this device not explicitly approved by the manufacturer could void your authority to operate this equipment.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
The device has been evaluated to meet general RF exposure requirements
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body.

References

• Az Allen orgonagyár (Allen Organ Company) magyarországi képviselete

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