ANALOG DEVICES EVAL-ADPA9007 2 W Power Amplifier User Guide
- June 1, 2024
- Analog Devices
Table of Contents
ANALOG DEVICES EVAL-ADPA9007 2 W Power Amplifier
Specifications
- Frequency Range: DC to 28 GHz
- Technology: GaAs pHEMT
- Power Output: 2 W
- Evaluation Board: 2-layer Rogers 4350B with heat spreader
- Connectors: End launch 2.92 mm RF connectors
Operating the ADPA9007-EVALZ
The DC connections required to operate the EVAL-ADPA9007 areaccessed through
the J3 and J4 header pins. Refer to Table 1 for pin descriptions. Figure 3
shows the connections necessary to operate the EVAL-ADPA9007.
FAQ
Q: What equipment is needed for operating the EVAL-ADPA9007?
A: You will need an RF signal generator, RF spectrum analyzer, RF network
analyzer, 15 V, 1.0 A power supply, 0 V to -2.0 V, 10 mA power supply, 5 V,
100 mA power supply, DC block, Bias tee, 5 W] attenuator, and a 10 dB
attenuator.
Evaluating the ADPA9007 DC to 28 GHz, GaAs, pHEMT, 2 W Power Amplifier
FEATURES
- 2-layer Rogers 4350B evaluation board with heat spreader
- End launch 2.92 mm RF connectors
- Through calibration path
EVALUATION KIT CONTENTS
- 2-layer Rogers 4350B, EVAL-ADPA9007 evaluation board with heat spreader
EQUIPMENT NEEDED
- RF signal generator
- RF spectrum analyzer
- RF network analyzer
- 15 V, 1.0 A power supply
- 0 V to −2.0 V, 10 mA power supply
- 5 V, 100 mA power supply
- DC block, Marki Microwave, DCZM29F29 or equivalent
- Bias tee, Marki Microwave, BT20050 or equivalent
- 5 W attenuator ≥ 10 dB
GENERAL DESCRIPTION
- The EVAL-ADPA9007 consists of a 2-layer printed circuit board (PCB) fabricated from 10 mil thick Rogers 4350B copper clad mounted to an aluminum heat spreader. The heat spreader assists in providing thermal relief to the ADPA9007 and mechanical support to the PCB. The mounting holes on the heat spreader allow for attachment to larger heat sinks to improve thermal management.
- The RFIN and RFOUT/VDD ports are populated by 2.92 mm female coaxial connectors, and the respective RF traces are of 50 Ω characteristic impedance. The EVAL-ADPA9007 is populated with components suitable for use over the entire operating temperature range of the ADPA9007.
- The RF transmission lines are 50 Ω grounded coplanar waveguides.
- The package ground leads and the exposed pad connect directly to the ground plane. Multiple vias are used to connect the top and bottom ground planes, with particular focus on the area directly beneath the ground paddle, to provide adequate electrical conduction and thermal conduction to the heat spreader.
- The power supply decoupling capacitors shown in the Figure 5 represent the configuration used in characterizing the device.Full details about the part are available in the ADPA9007 data sheet, which must be consulted when using the EVAL-ADPA9007.
REVISION HISTORY
11/2023—Revision 0: Initial Version
OPERATING THE
ADPA9007-EVALZ
The DC connections required to operate the EVAL-ADPA9007 are accessed through
the J3 and J4 header pins (see Table 1 for pin descriptions). Figure 3 shows
the connections necessary to operate the EVAL-ADPA9007.
The on-chip temperature monitor provides a voltage that is proportional to the
temperature. To use this feature, apply +5 V to the VBTEMP pin and monitor the
corresponding voltage on the VTEMP pin. User calibration is required.
An on-chip power monitor is provided to allow for convenient monitoring of the
power present at the output of the ADPA9007. To use this feature, apply +5 V
to VDET_B and VREF_B and monitor the voltage on the VREF pin and the VDET pin.
The temperature-compensated voltage proportional to the ADPA9007 output power
is (VREF − VDET). User calibration is required when using this feature.
POWER-UP SEQUENCE
Take the following steps to power up:
- Set the VGG1 pin (Pin 10 of J4) to −2 V.
- Set the RFOUT/VDD pin to +15 V through an external bias tee.
- Adjust the VGG1 pin between −2 V and 0 V to achieve a quiescent drain current of 500 mA.
- To operate the on-chip temperature monitor and on-chip power detectors, apply +5 V to the VREF_B, VBTEMP, and VDET_B pins (Pin 2 and 12 of J4 and Pin 2 of J3).
- Apply the RF signal to the RFIN connector of the EVAL-AD-PA9007.
POWER-DOWN SEQUENCE
Take the following steps to power down:
- Turn off the RF signal
- Set the gate voltage (VGG1) to −2 V
- Set the supply voltage (VDD) to 0 V
- Set the VREF_B, VBTEMP, and VDET_B pins to 0 V
- Increase the VGG1 pin to 0 V
Table 1. J3 and J4 Header Connections to the ADPA9007
J3|
---|---
1, 3, 5, 7, 9, 11, 13| GND
2| VDET_B
4| VDET
6, 8, 10, 12, 14| Open (do not use)
J4|
1, 3, 5, 7, 9, 11, 13| GND
2| VREF_B
4| VREF
6, 8| Open (do not use)
10| VGG1
12| VBTEMP
14| VTEMP
OPERATING THE ADPA9007-EVALZ
**THROUGH CALIBRATION PATH
**
To calibrate out board trace losses, a through calibration path is provided.
J5 and J6 must be populated with 2.92 mm RF connectors to use the through
calibration path.
Figure 4 shows the plot of the data in Table 2 of the through calibration path
(J5 to J6). See Figure 5 for the evaluation board schematic.
Table 2. Insertion Loss of Through Calibration Path
0.01 | −0.05 |
---|---|
0.5 | −0.10 |
1 | −0.17 |
2 | −0.27 |
5 | −0.35 |
10 | −0.51 |
15 | −0.74 |
20 | −1.03 |
25 | −1.19 |
28 | −1.41 |
30 | −1.44 |
EVALUATION BOARD SCHEMATIC AND ARTWORK
EVALUATION BOARD SCHEMATIC AND ARTWORK
ORDERING INFORMATION
BILL OF MATERIALS
Table 3.
C7, C10, C12| Ceramic capacitors, 4.7 μF, 50 V, 10%, X5R, 0805, low effective
series resistance| TDK Corporation| C2012X5R1H475K125AB
---|---|---|---
C6, C9, C11| Ceramic capacitors, 0.01 μF, 25 V, 10%, X7R, 0402| KEMET
Corporation| C0402C103K3RACTU
C8 ,C13| Ceramic capacitors, 100 pF, 50 V, 5%, C0G, 0402| YAGEO|
CC0402JRNPO9BN101
C3, C5| Ceramic capacitors, 10 pF, 50 V, 5%, C0G, 0402| Johanson Dielectrics|
500R07N100JV4T
J1, J2| Edge launch jack connectors| Winchester Interconnect| 25-146-1000-92
J3, J4| PCB connection header, 2 mm pitch, dual row with peg, 0.5 mm square
post and 3.8 mm long| Molex| 87759-1450
U1| GaAs, pHEMT, 2 W, DC to 28 GHz power amplifier| Analog Devices, Inc.|
ADPA9007ACGZN
C4| Ceramic capacitor, 100 pF, 50 V, 5%, C0G, 0402 (not installed)| YAGEO|
CC0402JRNPO9BN101
J5, J6| Edge launch jack connectors (not installed)| Winchester Interconnect|
25-146-1000-92
R1, R2| Resistors, 40.2 kΩ, 1%, 1/10 W 0603 AEC-Q200| Vishay| CRCW060340K2FKEA
Not applicable| Aluminum heat spreader, 2.51 in × 1.9 in| Not applicable| Not
applicable
ESD Caution
ESD (electrostatic discharge) sensitive device. Charged devices and circuit
boards can discharge without detection. Although this product features
patented or proprietary protection circuitry, damage may occur on devices
subjected to high energy ESD. Therefore, proper ESD precautions should be
taken to avoid performance degradation or loss of functionality.
Legal Terms and Conditions
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