Brandsound Technology M8048H Bluetooth Module SOC Application Software User Guide

: June 1, 2024
: Brandsound Technology

Table of Contents

M8048H Bluetooth Module SOC Application Software
Specifications:
Product Features:
Package Definition:
Pin Assignment:
Pin Descriptions:
- Product Usage Instructions:
- FAQ:
Q: How can I contact Brandsound Company for further
- Read User Manual Online (PDF format)
- Download This Manual (PDF format)

M8048H Bluetooth Module SOC Application Software

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Specifications:

Product Name: Brandsound Technology M8048H
Bluetooth Module/SOC Application Software Development
Version: 0.0.1
Date: 2021/05/14

Product Features:

The Brandsound Technology M8048H offers the following key
features:

CPU and Flexible IO with 32bit High performance CPU and
programmable GPIO pins
Bluetooth Radio compliant with Bluetooth 5.4 and BLE
specification
FM Tuner supporting frequency band 76~108MHz with auto search
tuning
Audio Interface with audio codec, stereo DAC, ADC, and flexible
EQ adjustments
Peripheral and Interfaces including timers, UART, SPI, IR
controller, SD Card Host controller, and more
Package: QFN48
Operating Temperature: -40 to +85 degrees Celsius

Package Definition:

Pin Assignment:

Refer to the user manual for detailed pin assignment
information.

Pin Descriptions:

Refer to the user manual for detailed pin descriptions.

Product Usage Instructions:

CPU and Flexible IO: Ensure proper power
supply and connections for the CPU and GPIO pins.
Bluetooth Radio: Follow Bluetooth pairing
instructions for connectivity.
FM Tuner: Set the desired frequency band and
utilize auto search tuning for optimal signal reception.
Audio Interface: Configure audio settings, EQ
adjustments, and sample rates as needed for audio playback.
Peripheral and Interfaces: Connect external
devices to the available interfaces according to the user
manual.
Operating Temperature: Ensure the product
operates within the specified temperature range for optimal
performance.

FAQ:

Q: How can I contact Brandsound Company for further

information?

A: For further information on technology, products, or business
terms, please contact Brandsound Company via email at Sales:
sales@Brandsound.com or Technical: project@Brandsound.com.

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Brandsound Technology
M8048H
Bluetooth module/SOC application software development
Versions: 0.0.1
2021/05/14
Declaration
Copyright © 2021, www. Brandsound.com. All Rights Reserved. No Unauthorized Distribution. Brandsound reserves the right to make changes without further notice to any products herein to improve reliability, function or design.
For further information on the technology, product and business term, please contact Brandsound Company. For sales or technical support, please send email to the address: Sales: sales@Brandsound.com Technical: project@Brandsound.com

Brandsound Technology

Revision History

Date 2021-05-14

Version 0.0.1

Comments First draft

Revised by Guo

Table of content

Table of Contents

TABLE OF CONTENTS…………………………………………………………………………………………………………………………3
1 PRODUCT FEATURES…………………………………………………………………………………………………………………..4
2 PACKAGE DEFINITION…………………………………………………………………………………………………………………5
2.1 PIN ASSIGNMENT………………………………………………………………………………………………………………………………..5 2.2 PIN DESCRIPTIONS ………………………………………………………………………………………………………………………………6
3 CHARACTERISTICS……………………………………………………………………………………………………………………11
3.1 PMU PARAMETERS……………………………………………………………………………………………………………………………11 3.2 IO PARAMETERS ……………………………………………………………………………………………………………………………….11 3.3 AUDIO DAC PARAMETERS ……………………………………………………………………………………………………………………11 3.4 AUDIO ADC PARAMETERS ……………………………………………………………………………………………………………………12 3.5 BT PARAMETERS……………………………………………………………………………………………………………………………….12 3.6 CURRENT PARAMETERS ……………………………………………………………………………………………………………………….12
4 PACKAGE INFORMATION…………………………………………………………………………………………………………..14

1Product Features
1 Product Features
CPU and Flexible IO
32bit High performance CPU with DSP instruction Program memory: internal 8M bit flash
Flexible GPIO pins with Programmable pull-up and pull-down resistors;
Support GPIO wakeup or interrupt;
Bluetooth Radio
Compliant to Bluetooth 5.4 and BLE specification (QDID: 194248); TX output power +2dBm in typical; RX Sensitivity with -90.5dBm @Basic Rate;
FM Tuner
Support frequency band 76~108MHz; Auto search tuning; Programable de- emphasis(50/75uS); Receive signal strength indicator (RSSI);
Audio Interface
Audio codec with 16bit stereo DAC and two channel 16bit ADC; Support flexible audio EQ adjust; Support Sample rate 8, 11.025, 12, 16, 22.05, 32, 44.1 and 48KHz; 4 channel Stereo Analog MUX; Two channel MIC amplifier input; High performance Stereo audio ADC with 90dB SNR; High performance Stereo audio DAC with

4
95dB SNR, with headphone amplifier output;
Peripheral and Interfaces
Three 32-bit timers; Three multi-function 32-bit timers, support Capture and PWM mode; WatchDog; Three full-duplex UART; Two SPI; IR controller; SD Card Host controller; SPDIF receiver; Audio interface IIS; Full speed USB 2.0 HOST/DEVICE controller; Sixteen Channels 10-bit SARADC; Integrate IRTC; Build in PMU, such as charger/buck/LDO;
Package
QFN48;
Temperature
Operating temperature: -40 to +85; Storage temperature: -65 to +150;

2Package Definition

2 Package Definition

2.1 Pin Assignment

Figure 2-1 Pin assignment for M44
Copyright © 2021, www.Brandsound.com. All Rights Reserved
5

2Package Definition
2.2 Pin Descriptions

Table 2-1 M44 pin description

Pin No.

Name

GND

PG0

PB4

Type GND I/O
I/O

PB3

I/O

PA7

I/O

PA6

I/O

6
Function
GND PG0 SPI0WP-G1 SPI4W_DIO2 USB_DM PB4 ADC6 SDDAT0-G4/G6 SPI0CLK-G3 RX0-G3 HSTRX-G8 LPWM1-G2 USB_DP PB3 SDDAT0-G5 SDCMD-G6 SPI0DO-G3 TX0-G3 HSTRX-G3 LPWM0-G2 ADC5 AUXR0 SDDAT1 PA7 SDDAT0-G1 SPI1DO-G2 SPI1DATA-G2 TX0-G1 TX1-G1 HSTRX-G1 PWM2-T4 ADC2 AUXL0 SDCLK1 PA6 SDCLK-G1 SPI1CLK-G2 RX0-G1 RX1-G1 HSTRX-G6 FMOSC-G2 PWM1-T4 TMR3CAP_G2/IR_G2 ADC1

PA5

I/O

PA4

I/O

PA3

I/O

PA2

I/O

PA1

I/O

PA0

I/O

PF5

I/O

PF4

I/O

PF3

I/O

PF2

I/O

PF1

I/O

PF0

I/O

MICR

DACR

ADC0 SDCMD-G1 SPI1DI-G2 FMOSC-G1 PWM0-T4 TMR3CAP_G1/IR_G1 PA5
SPI1DO-G1 TX1-G2 IISMCLK-G1 PA4
SDDAT2-G1 SPI1CLK-G1 RX1-G2 LPWM3-G3 IISLRCLK-G1 PA3 SDDAT3-G1 SPI1DI-G1 LPWM2-G3 IISSCLK-G1 PA2 SPDIF1 SPI1CLK-G1 TX0-G5 HSTRX-G5 LPWM1-G3 IISDO-G1 PA1 SPDIF0 RX0-G5 HSTRX-G10 LPWM0-G3 IISDI-G1 PA0 PF5
PF4
PF3
ADC10 MICL SPDIF5 SPI1DO-G5 SPI1DATA-G5 TX0-G7 LPWM3-G2 PF2 AUXR3 SPI1CLK-G5 PF1 AUXL3 SPI1DI-G5 PF0 MICR
DACR

DACR#

DACL

DACL#

VDDDAC

PWR

AGND

GND

FM_ANT

PE7

I/O

PE6

I/O

PE5

I/O

PE4

I/O

PE3

I/O

DAC differential R# DACL DAC differential L# DAC POWER
DAC GROUND
FMRX ANT
ADC9 AUXR2 SDDAT0-G3 SPI1DO-G4 SPI1DATA-G4 TX0-G4 HSTRX-G4 LPWM3-G1 TMR4CAP_G1/IR_G8 PE7 ADC8 AUXL2 SPDIF4 SDCLK-G3 SPI1CLK-G4 RX0-G4 HSTRX-G9 FMOSC-G6 LPWM2-G1 TMR3CAP_G7/IR_G7 PE6 ADC7 SPDIF3 SDCMD-G3 SPI1DI-G4 FMOSC-G5 LPWM1-G1 TMR3CAP_G6/IR_G6 PE5 SPI0DIIN-G2 SPI1DI-G6 LPWM0-G1 IISMCLK-G2 PE4 SPI0CLK-G2 SPI1CLK-G6 TX2-G1 PWM2-T5 IISLRCLK-G2

2Package Definition

PG3

PE2

PE1

PE0

VBAT

VDDIO

GND

PB2

I/O I/O
I/O
I/O
PWR PWR GND I/O

PB1

I/O

79
SPI0HOLD-G1 SPI4W_DIO3 PG3 PE2 SPI0DO-G2 SPI1DO-G6 RX2-G1 PWM1-T5 IISSCLK-G2 SPIOCS-G2 RX0-G6 PWM0-T5 IISDO-G2 PE1 MUTE SPI0DI-G3 TX0-G6 LPWM2-G2 IISDI-G2 TMR3CAP_G5/IR_G5 PE0 VBAT power input
VDDIO power output
GND
ADC4 AUXR1 SDDAT0-G2 SPI1DO-G3 SPI1DATA-G3 TX0-G2 TX2-G2 HSTRX-G2 PWM2-T3 PB2 ADC3 FM/AM-CH1 AUXL1 SDCLK-G2 SPI1CLK-G3 RX0-G2 RX2-G2 HSTRX-G7 FMOSC-G4 PWM1-T3 TMR3CAP_G4/IR_G4 PB1

PB0

I/O

FM/AM-CH0

SPDIF2

SDCMD-G2

SPI1DI-G3

FMOSC-G3

PWM0-T3

TMR3CAP_G3/IR_G3

PB0

PWRKEY

Power key input

OSC32KO

32K OSC output

OSC32KI

32K OSC input

Note: I/O: Digital input/output; I : Digital input; A : Analog Pin; PWR: Power Pin; GND: Ground.

3Characteristics

3 Characteristics

3.1 PMU Parameters

Sym VUSB VBAT
Sym VDDIO VVDDIO ILOAD ISC
Sym VDDBT VVDDBT ILOAD ISC

Table 3-1 PMU voltage input Parameters

Characteristics Charger Voltage input Voltage input

Min

Typ

Max

Unit

3.0

5.0

5.5

3.0

3.7

5.0

Characteristics
3.3V LDO voltage output Output Mismatch 1-sigma Maximum output current Short Circuit Current Limit

Table 3-2 3.3V LDO Parameters

Min

Typ

Max

Unit

–

3.3

–

150

–

300

Characteristics
1.6V LDO voltage output Output Mismatch 1-sigma Maximum output current Short Circuit Current Limit

Table 3-3 1.6V LDO Parameters

Min

Typ

Max

Unit

–

1.6

–

100

–

200

Conditions
Conditions Light Loading condition VDDIO=3.3v @VBAT=3.6v @VBAT=3.8v
Conditions Light Loading condition VDDBT=1.6v @VBAT=3.0v @VBAT=3.8v

3.2 IO Parameters

GPIO–Electrical Characteristics

Symbol

Description

VIL

Low-level input voltage

VIH
Driver Ability 1 Driver Ability 0 RPUP0 RPUP1 RPUP2 RPDN0 RPDN1 RPDN2

High-level input voltage
Output Driver Ability 1 Output Driver Ability 0 Internal pull-up resister 0 Internal pull-up resister 1 Internal pull-up resister 2 Internal pull-down resister 0 Internal pull-down resister 1 Internal pull-down resister 2

Table 3-4 I/O Parameters

Related GPIO

Min -0.3 2.03
8 0.24 160
8 0.24 160

Typical
32 8 10 0.3 200 10 0.3 200

Max 1.27 3.6
12 0.36 240 12 0.36 240

Units

Conditions

V VDDIO=3.3V

mA VDDIO=3.3V mA VDDIO=3.3V K K K K K K

3.3 Audio DAC Parameters

Table 3-5 Audio DAC Parameters

Sym SNR

Characteristics

Min

Typ

Max

–

Unit Conditions

VCM cap=1uF

3Characteristics

Sym

Characteristics

THD+N Output Range Maximum output voltage

Min

Typ

Max

Unit Conditions

VDDDAC cap=1uF

with A-wt filter

Output -3dBV

Fin=1KHz

VCM cap=1uF

VDDDAC cap=1uF

–

-86

–

with A-wt filter

Output -3dBV with 10K loading

–

2.6

Fin=1KHz Vpeak-peak 32ohm Loading

3.4 Audio ADC Parameters

Table 3-6 Audio ADC Parameters

Sym

Characteristics

Min

Typ

Max

Unit

SNR

–

THD+N

–

-87

–

Input Range

Input sine wave peak amplitude 0

VCM

Conditions VCM cap=1uF
VDDDAC cap=1uF
with A-wt filter
Input sine amplitude, 850mV RMS
Fin=1KHz VCM cap=1uF
VDDDAC cap=1uF
with A-wt filter
Input sine amplitude, 850mV RMS
Fin=1KHz. From aux input, aux 0db gain, VCM represent VCM voltage.

3.5 BT Parameters

Characteristics
Maximum Transmit Power
RMS DEVM Peak DEVM EDR Relative Transmit Power Sensitivity @ Basic Rate Sensitivity @ EDR

Table 3-7 BT Parameters

Min

Typical

Max

–

5.5

–

12.5

-0.2

-90.5

-89.5

Unit
dBm
% % dB dBm dBm

Conditions
Maximum TX power 2-DH5 packet BER=0.1%, using DH5 packet BER=0.01%, using 2-DH5 packet

3.6 Current Parameters

3Characteristics

Sym IRTC Sleep

Characteristics RTC mode current Sleep current

Min

Typ

Max

Unit

Conditions

–

4.2V input, room temp.

–

500

2000

3.3V input, room temp

4Package Information

4 Package Information

Requirement per KDB996369 D03 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host manufacturers that further testing is required.3 Explanation: This module meets the requirements of FCC part 15C(15.247).it specifically establish the 6dB Bandwidth, Peak Output Power, Radiated Spurious Emission, Power Spectral Density, Restricted Band of Operation and Band Edge (Out of Band Emissions)
2.3 Summarize the specific operational use conditions Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-to-point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturer’s instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands. Explanation: The module has one PCB antenna, the antenna cannot be removed.
2.4 Limited module procedures If a modular transmitter is approved as a “limited module,” then the module manufacturer is responsible for approving the host environment that the limited module is used with. The manufacturer of a limited module must describe, both in the filing and in the installation instructions, the alternative means that the limited module manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions. A limited module manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as: shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This limited module procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module. Explanation: The module is a limited single module. But there is no shield shell, it can be tested independently.

2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements. a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna); b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered); c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout; d) Appropriate parts by manufacturer and specifications; e) Test procedures for design verification; and f) Production test procedures for ensuring compliance. The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. Explanation: Yes, The module is PCB antenna designs, the antenna cannot be removed. See antenna report for antenna details.
2.6 RF exposure considerations It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions (mobile, portable xx cm from a person’s body); and (2) additional text needed for the host product manufacturer to provide to end users in their end-product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application). Explanation: This module complies with FCC RF radiation exposure limits set forth for an uncontrolled environment, this equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body.” This module is designed to comply with the FCC statement, FCC ID: 2BFB8-M8048H.
2.7 Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an “omni-directional antenna” is not considered to be a specific “antenna type”)). For situations where the host product manufacturer is responsible for an external connector, for example

with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product. The module manufacturers shall provide a list of acceptable unique connectors. Explanation: The EUT has one PCB Antenna, the antenna cannot be removed.
2.8 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating “Contains FCC ID” with their finished product. See Guidelines for Labeling and User Information for RF Devices KDB Publication 784748. Explanation: The host system using this module, should have label in a visible area indicated the following texts: Contains FCC ID: 2BFB8-M8048H
2.9 Information on test modes and additional testing requirements5 Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host. Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturer’s determination that a module as installed in a host complies with FCC requirements. Explanation: BT Module can increase the utility of our modular transmitters by providing instructions that simulates or characterizes a connection by enabling a transmitter.
2.10 Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Explanation: The module without unintentional-radiator digital circuity, so the module does not require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B.

Module with no shield Class II Permissive Change (C2PC) Test plan: (1) Conducted Emission (2) Radiated Spurious Emission. (3) Output Power. (4) Restricted Band of Operation
Note: These tests be based on C63.10 and FCC Part15.247 as guidance, according to the operating frequency High, medium and low channel test.
OEM integration instructions: This device is intended only for OEM integrators under the following conditions: The transmitter module may not be co-located with any other transmitter or antenna. This module can only use the PCB antenna designed by ourselves. As long as the conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Validity of using the module certification: In the event that these conditions cannot be met (for example certain laptop configurations or colocation with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End product labeling: The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2BFB8-M8048H”.
Information that must be placed in the end user manual: The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

FCC Caution This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help.
The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction.

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M8048H Bluetooth Module SOC Application Software

Specifications:

Product Features:

Package Definition:

Pin Assignment:

Pin Descriptions:

Product Usage Instructions:

FAQ:

Q: How can I contact Brandsound Company for further

Read User Manual Online (PDF format)

Download This Manual (PDF format)

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