SIMCom SIM8262A-M2 Series Hardware Design 5G Module User Manual

: June 16, 2024
: SIMcom

Table of Contents

SIM8262A-M2 Series Hardware Design 5G Module
Product Information
Specifications
Product Usage Instructions
Chapter 1: Introduction
Chapter 2: Getting Started
Chapter 3: Hardware Design
Chapter 4: Troubleshooting
- FAQ
Q1: Can I use the SIM8262A-M2 module with any device?
Q2: How do I update the firmware of the SIM8262A-M2
Q3: What is the power consumption of the SIM8262A-M2

SIM8262A-M2 Series Hardware Design 5G Module

Product Information

Specifications

Product Name: SIM8262A-M2 Series Hardware Design
Version: V1.07
Date: 2023-05-31
Manufacturer: SIMCom Wireless Solutions Limited
Address: SIMCom Headquarters Building, Building 3, No. 289
Linhong Changning District, Shanghai P.R.China
Contact Tel: 86-21-31575100
Email: support@SIMcom.com
Website: https://www.SIMcom.com

Product Usage Instructions

Chapter 1: Introduction

The SIM8262A-M2 Series Hardware Design is a 5G module
manufactured by SIMCom Wireless Solutions Limited. It is designed
for various applications that require high-speed wireless
connectivity.

Chapter 2: Getting Started

In this chapter, you will find information on how to set up and
install the SIM8262A-M2 module. It includes step-by-step
instructions on connecting the module to your device and
configuring the necessary settings.

Chapter 3: Hardware Design

This chapter provides detailed information on the hardware
design of the SIM8262A-M2 module. It includes diagrams, pin
configurations, and guidelines for designing the module into your
product.

Chapter 4: Troubleshooting

If you encounter any issues or difficulties while using the
SIM8262A-M2 module, this chapter provides troubleshooting tips and
solutions to common problems.

FAQ

Q1: Can I use the SIM8262A-M2 module with any device?

A1: The SIM8262A-M2 module is designed to be compatible with a
wide range of devices. However, it is recommended to check the
device’s specifications and compatibility requirements before
integrating the module.

Q2: How do I update the firmware of the SIM8262A-M2

module?

A2: To update the firmware of the SIM8262A-M2 module, you can
refer to the firmware update instructions provided by SIMCom
Wireless Solutions Limited. These instructions can be found on
their official website or by contacting their technical support
team.

Q3: What is the power consumption of the SIM8262A-M2

module?

A3: The power consumption of the SIM8262A-M2 module varies
depending on its usage and operating conditions. For specific power
consumption data, please refer to Table 62 in the hardware design
document.

SIM8262A-M2 Series Hardware Design
5G Module
SIMCom Wireless Solutions Limited.
SIMCom Headquarters Building, Building 3, No. 289 Linhong Changning District, Shanghai P.R.China Tel: 86-21-31575100 support@SIMcom.com www.SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

Document title: Version: Date: Status:

SIM826XX_SIM8X80-M2 Series Hardware Design V1.07 2023-05-31 Release

GENERAL NOTES
SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS TO SUPPORT THE APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM. THE INFORMATION PROVIDED IS BASED ON THE REQUIREMENTS SPECIFICALLY FROM THE CUSTOMERS. SIMCOM HAS NOT UNDERTAKEN ANY INDEPENDENT SEARCH FOR ADDITIONAL RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN THE CUSTOMER’S POSSESSION. FURTHERMORE, THE SYSTEM VALIDATION OF THE PRODUCT DESIGNED BY SIMCOM WITHIN A LARGER ELECTRONIC SYSTEM REMAINS THE RESPONSIBILITY OF THE CUSTOMER OR THE CUSTOMER’S SYSTEM INTEGRATOR. ALL SPECIFICATIONS SUPPLIED HEREIN ARE SUBJECT TO CHANGE WITHOUT NOTICE.
COPYRIGHT
THIS DOCUMENT CONTAINS THE PROPRIETARY TECHNICAL INFORMATION WHICH IS THE PROPERTY OF SIMCOM LIMITED, COPYING OF THIS DOCUMENT, GIVING IT TO OTHERS, THE USING OR COMMUNICATION OF THE CONTENTS THEREOF ARE FORBIDDEN WITHOUT THE OFFICIAL AUTHORITY BY SIMCOM. OFFENDERS ARE LIABLE TO THE PAYMENT OF THE DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF GRANT OF A PATENT OR THE REGISTRATION OF A UTILITY MODEL OR DESIGN. ALL SPECIFICATIONS SUPPLIED HEREIN ARE SUBJECT TO CHANGE WITHOUT NOTICE.
SIMCom Wireless Solutions Limited SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R. China Tel: +86 21 31575100 Email: SIMcom@SIMcom.com
For more information, please visit: https://www.SIMcom.com/download/list-863-en.html
For technical support, or to report documentation errors, please visit: https://www.SIMcom.com/ask/ or email to: support@SIMcom.com
Copyright © 2022 SIMCom Wireless Solutions Limited All Rights Reserved.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

Version History

Date
2022-0415 2022-0530

Versio n
1.00
1.01

2022-06- 1.02 23
2022-08- 1.03 19

www.(U)SIMcom.com

Description of change
Initial Release
3 Change Table 1 and Table 59, about the WCDMA andLTE-TDD frequency bands of SIM8262A-M2 and currentconsumption 4 Change Table 46, Table 47, about recommended mmWmodule connector and the antenna port definitions of mmW 5 Change Figure31, about the connection diagram ofmodule and mmW module 8 change the frequency range of table 47, SIM8260C-M2SIM8262A-M2 and SIM8262EM2 9 change table 49, B30B32B46 module operatingfrequency
6 Change Figure 1,2,3 and Table 3, about Hardware block diagram, M2 interface pin assignment, WLAN ZIFconnector and Pin differences 7 Change Table2, add information about CPU, RAM andROM 8 Change Table7, about the definition and description ofpin 22,24,28,59,61,63 and 65 9 Change Table9, about the definition and description ofpin 65 10 Change Table42, about the definition and description ofantenna control interface 11 Change the note of Table 44 12 Change Table 45, about the the definition ofQTM_THERM_DET 13 Add Table47, about the note of mmW 14 Change Table36, about the description of LED1# pin10.Change Table1,2,3,7,47,48 ,59,61and Figure32,36,37add the information of SIM8260GM2 1. Change Table8, about the Peak current. 2. Change the Table 1, Table 49, 59, delete informationabout B75 / B76 frequency, increase about n75 / n76 / n257 / n258 / n260 / n261 spectrum information 13.Modify the antenna definition of SIM8380G-M2 as shown in Figure 1 1. Modify Table 2 to increase the data transmissionthroughput About SIM8260C-M2/SIM8280G-M2/SIM8380G-M2 data 2. Modify Table 2 and add the UL MIMO informationabout SIM8280G-M2/SIM8380G-M2 in MIMO 3. Modify Table 59 and add the flow consumptioninformation of SIM8262E/A-M2 module 4. Modify Table 60, add frequency band information, andmark PC2/PC3 5. Modify Table 61, about the Conducted RF receivingsensitivity 6. Add PCIe interface use for W82, RTL8125B

Author
shaoxu hou
Yaling.wa ng Shaoxu hou
Xueting wang Wentao tan Xin zhang Yaling wang Shaoxu houXin zhang Yao chen

SIM8262A-M2 Series Hardware Design V1.07 andIPQxxxx application content chapter
www.(U)SIMcom.com

2022-09- 1.04 23
2022-10- 1.05 20
2022-11- 1.06 22
2023-05- 1.07 31

SIM8262A-M2 Series Hardware Design V1.07

5 Modify Table 62,SIM8260G/SIM8280G/SIM8380GM2rf power consumption data update 6 Modify Table 64, SIM8260G/SIM8280G/SIM8380GM2sensitivity data update 7 Add table65
1.Add table2,table45 2. RF modify 3. Modify part of error description 4. Add figure1 5. Update table69, figure34
4 Note the signal of PIN65 VIO_1V8 add the filtercapacitor total capacity value can’t more than 1uF 5 In chapter 5.8 illustrate the post of screws and screwsused to fix the M2 module should have good electrical conductivity 6 Update PIN38 name in figure27 7 Modify logic low level description in table42 8 Delete the module internal pull up resister in figure34 9 In chapter 5.7 add thermal dissipation expose copperarea size of bottom of module 10 Update 5G ULMIMO support band i1n. tUapbdlea3te8.IUslpedeaptdeeAsnctreipntnioanpinorttadbelefi1n0it.ions i2n. tAadbdlet5e2st point of module chapter 2.1.3. 3. Add RF cable operation chapter 4.2.3. 4. Update table65, modify description and table format. 5. Delete all about SIM8280G-M2 information. 6. Update PIN60 description in table4, updateW_DISABLE1# description in table9. 7. Add table6. 8. Add mmW547 connect diagram in figure37. 9. Update MCP is JSFCCA5QHAFGA-405A in table68. 10. Modify (U)SIM chapter content. 11. Add VDD_IO power on sequence in figure14. 12. Update TVDD_IO power on sequence in table16. 13. Modify part of description errors.

Yi zheng Hao ma Yao chen Yi zheng Yao chen
Yao chenYi zheng
Yao chen

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

Contents

Contents………………………………………………………………………………………………………………………………………………………………. 5

Table Index……………………………………………………………………………………………………………………………………………………………7

Figure Index………………………………………………………………………………………………………………………………………………………….9

1. Introduction…………………………………………………………………………………………………………………………………………………….10 · Product Outline………………………………………………………………………………………………………………………………………………… 11 · Hardware Block Diagram…………………………………………………………………………………………………………………………………. 12
· Feature Overview…………………………………………………………………………………………………………………………………………….. 12

2. Package Information………………………………………………………………………………………………………………………………………14 · Pin Assignment Overview………………………………………………………………………………………………………………………………… 14 · M2 interface pin assignment………………………………………………………………………………………………………………….. 14 · WLAN ZIF Connector…………………………………………………………………………………………………………………………….. 16
· Test Point of Module……………………………………………………………………………………………………………………………….17 · Pin Description………………………………………………………………………………………………………………………………………………….19 · Mechanical Dimensions…………………………………………………………………………………………………………………………………… 25

3. Interface Application…………………………………………………………………………………………………………………………………….. 26

· Power Supply…………………………………………………………………………………………………………………………………………………… 26

· Power Supply Design Guide…………………………………………………………………………………………………………………..26

· Recommended Power Supply Circuit……………………………………………………………………………………………………..28

· Voltage Monitor……………………………………………………………………………………………………………………………………… 31

· Power On and Off Module……………………………………………………………………………………………………………………………….. 32

· Power On………………………………………………………………………………………………………………………………………………..32

· Power Off………………………………………………………………………………………………………………………………………………..33

· Reset Function………………………………………………………………………………………………………………………………………………….35

· I2C Interface……………………………………………………………………………………………………………………………………………………..37

· WoWWAN#*……………………………………………………………………………………………………………………………………………………..38

· USB Interface……………………………………………………………………………………………………………………………………………………38

· PCIe Interface………………………………………………………………………………………………………………………………………………….. 41

· USB and PCIe Modes*………………………………………………………………………………………………………………………….. 42

· PCIe for W82…………………………………………………………………………………………………………………………………………. 44

· PCIe for RTL8125B-TE…………………………………………………………………………………………………………………………..45

· PCIe for Qualcomm IPQxxxx*……………………………………………………………………………………………………………….. 46

· (U)SIM Interface………………………………………………………………………………………………………………………………………………. 47

· Always Close (U)SIM Card Design………………………………………………………………………………………………………… 48

· Always Open (U)SIM Card Design………………………………………………………………………………………………………… 48

· Without CD PIN (U)SIM Card Design……………………………………………………………………………………………………..48

· I2S Interface…………………………………………………………………………………………………………………………………………………….. 50

· I2S Timing……………………………………………………………………………………………………………………………………………… 50

· I2S Reference Circuit…………………………………………………………………………………………………………………………….. 51

3.10 DPR*……………………………………………………………………………………………………………………………………………………………….52

3.11 CONFIG Pins…………………………………………………………………………………………………………………………………………………. 53

3.12 LED1#……………………………………………………………………………………………………………………………………………………………. 54

· W_DISABLE1#………………………………………………………………………………………………………………………………………………. 55

· TDD_SYNC_PPS*…………………………………………………………………………………………………………………………………………. 57

W_DISABLE2#*…………………………………………………………………………………………………………………………………… 58

· Antenna Control Interface*…………………………………………………………………………………………………………………………….. 60

· UART Interface………………………………………………………………………………………………………………………………………………. 62

· GPIOs Interface………………………………………………………………………………………………………………………………………………63

· mmW Interface………………………………………………………………………………………………………………………………………………. 64

4. Antenna Interfaces………………………………………………………………………………………………………………………………………… 66 · Antenna Definitions………………………………………………………………………………………………………………………………………….. 66 · 3G/4G/5G/mmW Operating Frequency…………………………………………………………………………………………………. 68
· GNSS Frequency…………………………………………………………………………………………………………………………………… 70

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07 4.2 Antenna Installation…………………………………………………………………………………………………………………………………………..71
· Antenna Requirements……………………………………………………………………………………………………………………………71 · RF Plug Recommendation…………………………………………………………………………………………………………………….. 71 · RF Cable Assembly Operation………………………………………………………………………………………………………………. 73 5. Electrical Specifications………………………………………………………………………………………………………………………………..75 · Absolute Maximum Ratings……………………………………………………………………………………………………………………………… 75 · Operating Conditions……………………………………………………………………………………………………………………………………….. 76 · Operating Mode……………………………………………………………………………………………………………………………………………….. 77 · Operating Mode Definition………………………………………………………………………………………………………………………77 · Sleep Mode……………………………………………………………………………………………………………………………………………. 77 · Minimum Functionality Mode and Flight Mode………………………………………………………………………………………. 78 · Current Consumption………………………………………………………………………………………………………………………………………..79 · RF Output Power………………………………………………………………………………………………………………………………………………85 · Conducted Receive Sensitivity………………………………………………………………………………………………………………………… 86 · Thermal Design…………………………………………………………………………………………………………………………………………………91 · ESD…………………………………………………………………………………………………………………………………………………………………..92 6. Appearance……………………………………………………………………………………………………………………………………………………. 93 · Top and Bottom View of Module……………………………………………………………………………………………………………………….93 · Label Description Information………………………………………………………………………………………………………………………….. 94 7. Packaging………………………………………………………………………………………………………………………………………………………. 95 8. Appendix…………………………………………………………………………………………………………………………………………………………96 · Coding Schemes and Maximum Net Data Rates over Air Interface………………………………………………………………… 96 · Related Documents…………………………………………………………………………………………………………………………………………..98 · Terms and Abbreviations…………………………………………………………………………………………………………………………………. 98 · Safety Caution……………………………………………………………………………………………………………………………………………….. 100
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
Table Index
Table 1 : Module frequency bands………………………………………………………………………………………………………………………………………………………. 11 Table 2 : Data transmission throughput………………………………………………………………………………………………………………………………………………..11 Table 3 : Key features…………………………………………………………………………………………………………………………………………………………………………. 12 Table 4 : Pin differences of SIM826XX-M2 and SIM8X80-M2………………………………………………………………………………………………………………14 Table 5 : Recommended WLAN ZIF connector list……………………………………………………………………………………………………………………………… 17 Table 6 : Test point of module description…………………………………………………………………………………………………………………………………………… 18 Table 7 : IO parameters definition……………………………………………………………………………………………………………………………………………………….. 19 Table 8 : DC parameters definition……………………………………………………………………………………………………………………………………………………… 19 Table 9 : Pin description……………………………………………………………………………………………………………………………………………………………………… 19 Table 10 : VBAT pins electrical characteristics……………………………………………………………………………………………………………………………………. 26 Table 11 : Definition of VBAT and GND pins……………………………………………………………………………………………………………………………………….. 27 Table 12 : Recommended D1 list………………………………………………………………………………………………………………………………………………………… 27 Table 13 : PIN65 of the module recommend TVS list………………………………………………………………………………………………………………………….. 28 Table 14 : Recommended FB1 and L1 list……………………………………………………………………………………………………………………………………………30 Table 15 : Definition of FULL_CARD_POWER_OFF# pin……………………………………………………………………………………………………………………32 Table 16 : Power on timing and electrical characteristics……………………………………………………………………………………………………………………..32 Table 17 : Power off timing and electrical characteristics……………………………………………………………………………………………………………………..34 Table 18 : Recommended Q1 list………………………………………………………………………………………………………………………………………………………… 35 Table 19 : Definition of RESET# pin……………………………………………………………………………………………………………………………………………………. 35 Table 20 : RESET# pin electrical characteristics…………………………………………………………………………………………………………………………………. 36 Table 21 : Definition of I2C interface…………………………………………………………………………………………………………………………………………………….37 Table 22 : Definition of WoWWAN# pin………………………………………………………………………………………………………………………………………………..38 Table 23 : Definition of USB interface…………………………………………………………………………………………………………………………………………………..39 Table 24 : USB interface recommended CC detector, USB3.1 type-C switch and TVS diode list…………………………………………………………39 Table 25 : Definition of PCIe interface…………………………………………………………………………………………………………………………………………………. 41 Table 26 : PCIe interface recommended TVS diode list……………………………………………………………………………………………………………………….41 Table 27 : Recommended shift level list……………………………………………………………………………………………………………………………………………….44 Table 28 : Recommended RTL8125B IC list……………………………………………………………………………………………………………………………………….. 45 Table 29 : (U)SIM electrical characteristics in 1.8V mode ((U)SIM_PWR=1.8V)…………………………………………………………………………………. 47 Table 30 : (U)SIM electrical characteristics in 3.0V mode ((U)SIM_PWR=3.0V)…………………………………………………………………………………. 47 Table 31 : Definition of (U)SIM interface……………………………………………………………………………………………………………………………………………… 47 Table 32 : Recommended TVS and always close (U)SIM socket list……………………………………………………………………………………………………47 Table 33 : I2S format……………………………………………………………………………………………………………………………………………………………………………50 Table 34 : I2S timing parameters………………………………………………………………………………………………………………………………………………………… 50 Table 35 : Definition of I2S interface…………………………………………………………………………………………………………………………………………………….51 Table 36 : The PCM interface is multiplexing with I2S interface………………………………………………………………………………………………………….. 51 Table 37 : Definition of DPR# pin………………………………………………………………………………………………………………………………………………………… 52 Table 38 : CONFIG pins state of the module………………………………………………………………………………………………………………………………………. 53 Table 39 : CONFIG interface definition……………………………………………………………………………………………………………………………………………….. 53 Table 40 : Definition of LED1# pin………………………………………………………………………………………………………………………………………………………..54 Table 41 : LED1# pin status………………………………………………………………………………………………………………………………………………………………… 55 Table 42 : Definition of W_DISABLE1# pin…………………………………………………………………………………………………………………………………………..55 Table 43 : W_DISABLE1# pin status……………………………………………………………………………………………………………………………………………………55 Table 44 : Definition of TDD_SYNC_PPS pin……………………………………………………………………………………………………………………………………… 57 Table 45 : Definition of W_DISABLE2# pin…………………………………………………………………………………………………………………………………………..58 Table 46 : Recommended D1 list………………………………………………………………………………………………………………………………………………………… 58 Table 47 : W_DISABLE2# pin status…………………………………………………………………………………………………………………………………………………. 58 Table 48 : Definition of antenna control interface through GPIOs…………………………………………………………………………………………………………60 Table 49 : Definition of UART interface……………………………………………………………………………………………………………………………………………….. 62 Table 50 : GPIO list…………………………………………………………………………………………………………………………………………………………………………….. 63 Table 51 : mmW Interface…………………………………………………………………………………………………………………………………………………………………… 64 Table 52 : Recommended mmW module connector list………………………………………………………………………………………………………………………. 64 Table 53 : Antenna port definitions……………………………………………………………………………………………………………………………………………………….66 Table 54 : Frequency band and antenna ports mapping……………………………………………………………………………………………………………………… 67 Table 55 : Module operating frequency……………………………………………………………………………………………………………………………………………….. 68 Table 56 : GNSS frequency………………………………………………………………………………………………………………………………………………………………… 70 Table 57 : 3G/4G/5G/GNSS antennas………………………………………………………………………………………………………………………………………………… 71 Table 58 : GNSS antenna (for dedicated GNSS antenna only) ………………………………………………………………………………………………………….71 Table 59 : Electrical Specifications of 20449-001E-03………………………………………………………………………………………………………………………… 72 Table 60 : Absolute maximum ratings…………………………………………………………………………………………………………………………………………………..75 Table 61 : VBAT recommended operating ratings………………………………………………………………………………………………………………………………..76 Table 62 : 1.8V Digital I/O characteristics……………………………………………………………………………………………………………………………………………. 76 Table 63 : Operating temperature……………………………………………………………………………………………………………………………………………………….. 76 Table 64 : Operating mode definition……………………………………………………………………………………………………………………………………………………77 Table 65 : Module Current consumption on VBAT pins (VBAT=3.8V)…………………………………………………………………………………………………..79 Table 66 : Conducted output power……………………………………………………………………………………………………………………………………………………..85
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
Table 67 : Conducted RF receiving sensitivity……………………………………………………………………………………………………………………………………..86 Table 68 : Chip junction temperature table…………………………………………………………………………………………………………………………………………..91 Table 69 : The ESD performance measurement table (Temperature: 25, Humidity: 45%)……………………………………………………………….92 Table 70 : Label description of the module information………………………………………………………………………………………………………………………..94 Table 71 : Tray size……………………………………………………………………………………………………………………………………………………………………………..95 Table 72 : Small carton size…………………………………………………………………………………………………………………………………………………………………95 Table 73 : Big carton size…………………………………………………………………………………………………………………………………………………………………….95 Table 74 : Coding schemes and maximum net data rates over air interface………………………………………………………………………………………..96 Table 75 : Related documents……………………………………………………………………………………………………………………………………………………………..98 Table 76 : Terms and abbreviations……………………………………………………………………………………………………………………………………………………. 98 Table 77 : Safety caution………………………………………………………………………………………………………………………………………………………………….. 100
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
Figure Index
Figure 1 : SIMCom 5G module model illustrate……………………………………………………………………………………………………………………………………10 Figure 2 : Block diagram………………………………………………………………………………………………………………………………………………………………………12 Figure 3 : Pin assignment…………………………………………………………………………………………………………………………………………………………………….14 Figure 4 : Pin map of WLAN ZIF connector interface………………………………………………………………………………………………………………………….. 16 Figure 5 : Test point of SIM826XX/SIM8X80-M2 series module………………………………………………………………………………………………………….. 17 Figure 6 : Dimensions of the module (unit: mm)…………………………………………………………………………………………………………………………………..25 Figure 7 : Maximum current consumption of the module…………………………………………………………………………………………………………………….. 26 Figure 8 : Power supply reference circuit……………………………………………………………………………………………………………………………………………. 27 Figure 9 : Power supply reference circuit……………………………………………………………………………………………………………………………………………. 28 Figure 10 : Linear regulator reference circuit………………………………………………………………………………………………………………………………………. 29 Figure 11 : Switching mode power supply reference circuit………………………………………………………………………………………………………………….29 Figure 12 : Switching mode power supply reference circuit for mmW module (SIM8380G-M2)………………………………………………………….. 30 Figure 13 : Reference power on/off circuit……………………………………………………………………………………………………………………………………………32 Figure 14 : Power on sequence………………………………………………………………………………………………………………………………………………………….. 32 Figure 15 : Power off sequence………………………………………………………………………………………………………………………………………………………….. 34 Figure 16 : Reference reset circuit……………………………………………………………………………………………………………………………………………………….35 Figure 17 : The reset timing sequence of the module…………………………………………………………………………………………………………………………. 36 Figure 18 : I2C reference circuit…………………………………………………………………………………………………………………………………………………………..37 Figure 19 : WoWWAN# signal level at SMS and URC report……………………………………………………………………………………………………………….38 Figure 20 : WoWWAN# reference circuit…………………………………………………………………………………………………………………………………………….. 38 Figure 21 : USB reference circuit………………………………………………………………………………………………………………………………………………………… 39 Figure 22 : Type-C USB reference circuit with CC detector………………………………………………………………………………………………………………… 39 Figure 23 : PCIe interface reference circuit (EP Mode)………………………………………………………………………………………………………………………..41 Figure 24 : PCIe power- on sequence requirements of M.2 specification…………………………………………………………………………………………….. 42 Figure 25 : PCIe power- on sequence requirements of module…………………………………………………………………………………………………………….42 Figure 26 : The module connect W82 reference circuit (PCIe assistant signal is 3.3V version)……………………………………………………………44 Figure 27 : The module connect RTL8125B-TE reference circuit (3.3V PCIe assistant signal version)………………………………………………. 45 Figure 28 : The module connect IPQxxxx reference circuit (1.8V PCIe assistant signal version)………………………………………………………… 46 Figure29 : Always close (U)SIM card reference circuit…………………………………………………………………………………………………………………………48 Figure30 : Always open (U)SIM card reference circuit………………………………………………………………………………………………………………………… 48 Figure31 : Without CD pin (U)SIM card reference circuit……………………………………………………………………………………………………………………..49 Figure 32 : I2S timing………………………………………………………………………………………………………………………………………………………………………….. 50 Figure 33 : Audio codec diagram circuit………………………………………………………………………………………………………………………………………………. 51 Figure 34 : LED1# reference circuit…………………………………………………………………………………………………………………………………………………….. 54 Figure 35 : W_DISABLE1# pin reference circuit…………………………………………………………………………………………………………………………………..55 Figure 36 : TDD_SYNC_PPS pin reference circuit……………………………………………………………………………………………………………………………… 57 Figure 37 : W_DISABLE2# pin reference circuit…………………………………………………………………………………………………………………………………..58 Figure 38 : UART level conversion circuit…………………………………………………………………………………………………………………………………………….62 Figure 39 : The connection diagram of module and mmW module………………………………………………………………………………………………………64 Figure 40 : Antenna interfaces of Modules………………………………………………………………………………………………………………………………………….. 66 Figure 41 : 3D view of 20449-001E-03……………………………………………………………………………………………………………………………………………….. 72 Figure 42 : 3D view of MXHJD3HJ1000……………………………………………………………………………………………………………………………………………… 72 Figure 43 : RF cable correct pull and push operation………………………………………………………………………………………………………………………….. 73 Figure 44 : RF cable error pull and push operation………………………………………………………………………………………………………………………………73 Figure 45 : Use RF cable tool correct pull and push operation……………………………………………………………………………………………………………. 74 Figure 46 : Use RF cable tool error pull and push operation……………………………………………………………………………………………………………….. 74 Figure 47 : Thermal design diagram…………………………………………………………………………………………………………………………………………………….91 Figure 48 : Top and bottom view of the module……………………………………………………………………………………………………………………………………93 Figure 49 : Label description of the module………………………………………………………………………………………………………………………………………… 94 Figure 50 : Packaging procedures………………………………………………………………………………………………………………………………………………………. 95 Figure 51 : Tray view of the module……………………………………………………………………………………………………………………………………………………..95 Figure 52 : Small carton view……………………………………………………………………………………………………………………………………………………………… 95 Figure 53 : Big carton view…………………………………………………………………………………………………………………………………………………………………..95
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
1. Introduction
This document describes the electronic specifications, RF specifications, interfaces, mechanical characteristics and test results of the SIM826XX/SIM8X80-M2 module. With the help of this documentcustomers can quickly understand SIM826XX/SIM8X80-M2 Series module. Associated with other software application notes and user guides, customers can use SIM826XX/SIM8X80-M2 Series to design and develop mobile and laptop applications easily.
Figure 1: SIMCom 5G module model illustrate
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

· Product Outline
SIM826XX/SIM8X80-M2 Series is a wireless communication module focusing on 5G market, it supports multi-air access technology including 5G NR (NSA/SA), LTE- FDD, LTE-TDD, and WCDMA, can meet the 3GPP R16 NR specification, and data rate which up to 4Gps (DL). GNSS system is optional, and it includes dual bands GLONASS/Bei Dou/Galileo/QZSS. Only SIM8380G-M2 support mmW.
The module’s supported radio frequency bands are shown in the following table.
Table 1: Module frequency bands

SIM8262A-M2 5G NR
LTE-FDD LTE-TDD WCDMA GNSS1

n1/n2/n5/n7/n8/n12/n13/n14/n18/n20/n25/n26/n30/n38/n41/n48/n66/n71/n77/n78/n7 9 B1/B2/B4/B5/B7/B8/B12/B13/B14/B17/B18/B19/B20/B25/B26/B29/B30/B66/B71
B38/B41/B42/B43/B46/B48
B1/ B2/B4/B5/B8
L1+L52

The physical dimension of SIM8260C/SIM8260G/SIM8380G-M2 is 30.0mm52.0mm2.3mm and SIM8262E/A-M2 is 30.0mm42.0mm2.3mm, which all can meet PCI Express M.2 specifications, and can meet almost all space requirements in customer’s applications.
The module owns rich interfaces, includes USB3.1, PCIe3.0, (U)SIM card, digital audio 3(I2S or PCM), I2C, GPIOs, four antennas for 3G/4G/5G and GNSS. SIM8380-M2 has 4 dedicated antennas for mmW.
With all the interfaces, module can also be utilized in the handheld terminal, machine-to-machine laptop application and especially the notebook.

NOTE
3 GNSS system is optional. 4 L5 is not support by default, if customers need to support L5, hardware needs to be customized, for more detail, please contact SIMCom support teams. 5 SIM8262E-M2 has two hardware versionsthe one support digital audio interface, and the another one not support digital audio interfacefor more details, please contact the SIMCom support team.

Table 2: Data transmission throughput

Module
SIM8262A-M2

Data transmission throughput
NSA: 3.0Gbps (DL)/660Mbps (UL) SA: 2.4Gbps(DL)/900Mbps(UL) LTE: 1Gbps (DL)/150Mbps (UL) HSPA+: 42Mbps (DL)/5.76Mbps (UL)

www.(U)SIMcom.com

· Hardware Block Diagram
The block diagram of module is shown in the following figure.

SIM8262A-M2 Series Hardware Design V1.07

Figure 2: Block diagram
NOTE 1.SIM8262E-M2 has two hardware versionsthe one support digital audio interface, and the another one not support digital audio interfacefor more details, please contact the SIMCom support team. 2.? eans the DPR2 function can use module support interrupt GPIO configuration.

· Feature Overview

Table 3: Key features

Feature
Application processor Memory RAM Memory ROM Power supply1 Minimum power consumption mode Transmit power
Modulation system
MIMO
Antenna GNSS (optional)
SMS

Implementation
Arm Cortex-A7 up to 1.8 GHz
4Gb 16-bit LPDDR4X at 2.13 GHz
4Gb 8-bit NAND
VBAT: 3.1354.4V Typical: 3.8V Typical: 5.3mA (VBAT=3.8V, AT+CFUN=0 & AT+CSCLK=1 & USB no connect)
Power Class 3 for WCDMA/LTE/5G NRPower Class 2 for n41/n77/n78/n79 NR: DL 256QAM, UL 256QAM LTE: DL 256QAM, UL 256QAM WCDMA: 16QAM 64QAM QPSKmmW: 64QAM DL / UL DL 44MIMO (LB only support 22) UL 22MIMO (only support n41) : SIM8262E/A-M2 UL 22MIMO (only support n38/n41/n48/n77/n78/n79) : SIM8260G/SIM8380G-M2
Four antennas for 3G/4G/5G and GNSS
GNSS engine: GPS /GLONASS/Bei Dou/Galileo/QZSSProtocol: NMEA
MT, MO, CB, Text and PDU mode SMS storage: (U)SIM card or ME (default) Transmission of SMS alternatively over CS or PS

(U)SIM interface www.(U)SIMcom.com

Support (U)SIM card:1.8V/3.0V
Include (U)SIM1 and (U)SIM2 interfacesSupport dual (U)SIM single standby3

(U)SIM application toolkit

Support SAT class 3Support USAT

SIM8262A-M2 Series Hardware Design V1.07

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

Phonebook management Support phonebook types: DC, MC, RC, SM, ME, FD, ON, LD, EN

Digital audio interface
PCIe interface I2C interface USB UART interface Firmware upgrade Physical characteristics
Temperature range

One I2S interface with dedicated main-clock for primary digital audio, theI2S also can be configured as PCM4 3 MCLK frequency: 12.288MHz (default)
4 WCDMA AMR-NB
5 VoLTE AMR-WB 6 Echo Cancellation
7 Noise Suppression

1. One lane PCIe interface, support Gen 3.0 (Gen 1/2 compatible) 2. High communication data rate which up to 16Gbps

1. Meet I2C specification, version 3.0 2. Data rate up to 400Kbps

Support USB 3.1 Gen2 or USB 2.0

USB3.1: super speed, with data rate which up to 10Gbps

USB2.0: high speed interface, support USB operations at low-speed

andfull-speed, which refer to USB1.0 and USB1.1

Module hardware

a norm communicati UA (

configurescommand) by

s al

RT A

default

Firmware upgrade over USB interface

SIM8260C-M2, SIM8260G-M2, SIM8380G-M2 Size:30mm52mm2.3mm SIM8262E/A-M2 Size: 30mm42mm2.3mmSIM8260C-M2 Weight: 9.34g (typical) SIM8262E-M2 Weight: 7.00g (typical) SIM8262A-M2 Weight: 6.85g (typical) SIM8260G-M2 Weight: 8.37g (typical) SIM8380G-M2 Weight: 8.60g (typical)

Normal operation temperature: -30°C to +70°C (3GPP compliant) Extended operation temperature: -40°C to +85°C2
Storage temperature: -40°C to +90°C

NOTE
1. The recommended operating voltage of the module is 3.8V. If the voltage is lower than 3.135V, the RF performance will not meet the 3GPP specifications. 2. When Module is within the extended operation temperature range, Module is able to establish and maintain voice, data transmission, SMS and emergency call, etc. The performance may deviate slightly from the 3GPP specifications and will meet 3GPP specifications again when the temperature returns to normal operating temperature levels. It is strongly recommended that customers take heat dissipation measures to ensure that the normal operating temperature of the module can’t be exceeded, refer to thermal design section for details. 3. SIM8260G and SIM8380G-M2 module reserve eSIM inside, M2 interface without (U)SIM2 interface. 4. SIM8262E-M2 has two hardware versionsthe one support digital audio interface, and the another one not support digital audio interfacefor more details, please contact the SIMCom support team.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
2. Package Information
· Pin Assignment Overview
· M2 interface pin assignment
M2 interface has 75 pins, including 8 notch pins. Customer design should match pins functions. The following figure is the pin assignment of the module. NOTE: ALL of modules are not support hot swap; hot swap may cause permanent damage to the modules.

Figure 3: Pin assignment The pin differences of SIM826XX-M2 and SIM8X80-M2 module below. Table 4: Pin differences of SIM826XX-M2 and SIM8X80-M2

module SIM8262
A-name M2

M.2 pin number
48
46
44
42
40 28 24 22

(U)SIM2_PW R
(U)SIM2_RE S ET (U)SIM2_CL K
(U)SIM2_DA T A (U)SIM2_DE T I2S_WA
I2S_TX
I2S_RX

ANTCTL0

www.(U)SIMcom.com

I2S_MCLK

ANTCTL1

LAA/N79_TX

SIM8262A-M2 Series Hardware Design V1.07

www.(U)SIMcom.com

RESET#

I2C_SDA

I2C_SCL

SIM8262A-M2 Series Hardware Design V1.07

NOTE
1. SIM8262E-M2 has two hardware versionsthe one support digital audio interface, and the another one not support digital audio interfacefor more details, please contact the SIMCom support team. 2. About mmW function, SIM8380G-M2 only supports two group of QTMs signal; use QTM0_PON and QTM3_PON by default. 3. When the module work N79 or LAA band, PIN63 of SIM8262E-M2, SIM8260C-M2 and PIN59 of SIM8260G-M2, SIM8380G-M2 is output signal, from 5G modules output to WIFI module, the goal is turning off WIFI module RF reception to protect WIFI module. 4. When the WIFI module is working, PIN63 of the SIM8262A-M2 is input signal, from WIFI module output to 5G modules, the goal is turning off 5G module RF LAA LNA to protect 5G module. 5. PIN60 of SIM8260G-M2 (IPQxxxx version) as to module LAA band DL receive protects control.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
· WLAN ZIF Connector
SIM826XX/SIM8X80-M2 Series provide a WLAN ZIF connector for WIFI function, the connector is located bottom side of the module and it no assembly on the module by default. About this connector and WIFI function more details, please contact SIMCom support teams, the following figure is pin map of the WLAN ZIF connector.
Figure 4: Pin map of WLAN ZIF connector interface NOTE 1. Connector is no assembly on the module by default. 2. The module not supports the function of WIFI by default. 3. The WALN ZIF connector of SIM826XX_SIM8X80 M2 series module default WIFI module model is W82, other WIFI module models is not supported. If customers need other modules support, please contact the SIMCom support team.
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

Table 5: Recommended WLAN ZIF connector list

Name
Connector

Manufacturer

Part number

ACES ELECTONICS 51614-03001-002

Position number
/

· Test Point of Module
The following figure shows test point of SIM826XX/SIM8X80-M2 series module.

Figure 5: Test point of SIM826XX/SIM8X80-M2 series module

www.(U)SIMcom.com

Table 6: Test point of module description

SIM8262A-M2 Series Hardware Design V1.07

Test Point
PICE_INI_BYPASS
1.8V FORCE_USB_BOOT
DBUG_TX DBUG_RX USB_HS_DM USB_HS_DP FULL_CARD_POWER_OFF # VBAT GND

Description
For the windows version module, before powering on module short PCIE_INI_BYPASS and 1.8V, and then power on module, used to bypass PCIe initial in BIOS stage.
Module internal power VDD_EXT output.
Short FORCE_USB_BOOT and 1.8V before powering on module,and then power on module, used to enter to force download mode. If the windows version modules need to enter force download mode,need to short PCIE_INI_BYPASS, FORCE_USB_BOOT and 1.8V at the same time, and then power on module, used to enter to forcedownload mode. Debug UART TX
Debug UART RX
USB2.0 DM
USB2.0 DP
Power on signal of module
Power supply of module
GND

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

· Pin Description
Table 7: IO parameters definition

Pin type
PI PO AI AIO DIO DI DO DOH DOL PU PD OD OC

Description
Power Input Power Output Analog Input Analog Input/Output Digital Input /Output Digital Input Digital Output Digital Output with High level Digital Output with Low level Pull Up Pull Down Open Drain Open Collector

Table 8: DC parameters definition

Voltage domain

Parameter

Min

VDD_P3=1.8V

VOH

High level output

1.35V

VOL

VIH

Low level output High level input

0V 1.26V

VIL

Low level input

Pull up/down

resistor

VDD_P4/P5=1.8V

0V 20K ohm

VOH

High level output

1.44V

VOL

Low level output

VIH

High level input

1.26V

P4/P5

VIL

Low level input

Pull up/down

resistor

VDD_P4/P5=3.0V

0V 10K ohm

VOH

High level output

2.4V

VOL

Low level output

VIH

High level input

2.1V

VIL

Low level input

Pin name

P i

www.(U)SIMcom.com n

Pull up/down
Electrical descripti on

10K ohm
Description

Type
1.8V –

Max
1.8V 0.45V 2.1V 0.54V 60K ohm

–

1.8V

–

0.4V

–

1.95V

–

0.36V

–

100K ohm

–

3.0V

–

0.4V

–

3.05V

–

0.6V

100K ohm

Comment

Table 9: Pin description

72,74

VIO_1V8

GND System control

3,5,11,27, 33,39,45,51,5 7,71,73

FULL_CARD_POW ER_OFF#

DI, PD

RESET#

67 P3

W_DISABLE1#

TDD_SYNC_PPS 26 P3
W_DISABLE2#1

WoWWAN#

Configuration pins

CONFIG_0

CONFIG_1

CONFIG_2

CONFIG_3

USB2.0/USB3.1

USB_HS_DP

USB_HS_DM

USB_SS_TX_M

USB_SS_TX_P

USB_SS_RX_M

USB_SS_RX_P

PCIe interface

PETn0

PETp0

www.(U)SIMcom.com

DO
DI OD
GND GND GND NC
AIO AIO AO AO AI AI
AO AO

SIM8262A-M2 Series Hardware Design V1.07

Range3.1354.4V Typical3.8V 1.8V output voltage Ground

connected together to withstand sufficent current If need to use VIO_1V8, need to string 2.2R resister outside the module , and at the same time add TVS protect diode

High level: the module power on Low level: the module power off
System reset control input Active low
Flight mode Active low
Pulse output indication NSA and SA sub6 for the beginning frame flag of DL-UL GNSS disable control Active low Wake on the host interrupt output signal Active low

It’s 3.3V tolerant but can be driven by either 1.8V or 3.3V GPIO
SIM8260C–M2 RESET# pin needs to be pulled up to 1.8V by adding 100KR externally 3.3V tolerant but can be driven by either 1.8V or 3.3V GPIO
The hardware of module support TDD_SYNC_PPS function by default
Need pulled up to 1.8V by adding 100KR externally

Connected to ground internally Connected to ground internally Connected to ground internally
Not connected

The module is configured as the WWAN USB3.1 interface type

Differential USB bi-directional data positive Differential USB bi-directional data negative USB3.1 transmit data negative USB3.1 transmit data positive USB3.1 receive data negative USB3.1 receive data positive

Main communication interface USB3.1 data rate up to 10Gbps USB2.0 data rate up to 480Mbps

PCIe transmit data negative
PCIe transmit data positive

Support PCIe Gen 3.0, data rate up to 8Gbps one lane.

PERn0

PERp0

REFCLKN

REFCLKP

PPCERIeSaTs#sistant interfa5c0e7

CLKREQ#

PEWAKE#

(U)SIM interface2

(U)SIM1_PWR

36 P4

(U)SIM1_DATA

34 P4

(U)SIM1_CLK (U)SIM1_RESET
(U)SIM1_DET

32 P4 30 P4
66 P3

(U)SIM2_PWR VDD_1V9
(U)SIM2_CLK QTM3_PON (U)SIM2_RESET QTM2_PON

P5 48
P5 44
P3 P5 46 P3

(U)SIM2_DATA

P5 42

QTM1_PON

Antenna control interface3

ANTCTL0

59 P3

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

PCIe receive data

negative

If unused, please keep open

PCIe receive data positive

AIO

PCIe reference clock negati

AIO pPosCviteIievereference clock

DIO

PCIe reset signal Active low

PCIe reference

DIO clockrequest

signal Active low

DIO

PCIe wake up controlActive low

3.3V voltage domain, CLKREQ# and
PEWAKE# required pIfuullnuupseexdt,eprnleaal,se keep
open

Power supply for (U)SIM1card

(U)SIM1 card data,

DIO

whichhas been pulled up to SIM1_PWR via a

20KR

resistor internally

DO (U)SIM1 clock signal

DO (U)SIM1 reset control

(U)SIM1 card detect,

whichhas been pulled up to VDD_P3 via a 100KR

resistor internally

Power supply for

(U)SIM2card Power supply for

mmWQTM VDD

DO (U)SIM2 clock signal

Power on/reset 3 for mmWQTM module

DO (U)SIM2 reset control

DmOmW

Power on/reset 2 for QTM module

(U)SIM2 card data,

whichDIO has been pulled

up to

(2U0)KSRIM2_PWR via a resistor internally

DmOmW

VPDoDw_ePr3onvi/arease1t010KfoRr QTM module

Q(TUM)SmIMo2duclaerd detect, which

resistor internally

Antenna tuner control0

1.8/3.0V voltage domain, (U)SIM interfaces sahgoauinldstbEeSpDrotected If unused, please keep open
SSIM8260C/SIM8262E/ IM8262A-M2 support (U)SIM2
SIM8260G-M2 and SIM8380G -M2 not support (U)SIM2 interface, but the reserved eSIM card is connected to su(Up)pSoIrMt m2 minWside of the module
Only SIM8380G-M2
1.8V voltage domain. If unused, please keep open SIM8260C-M2, SIM8262E-M2 and SIM8262A-M2 are be defined as ANTCTL0

63 59

LAA/N79_TX_EN*

ANTCTL1

QTM_THERM_DET

ANTCTL2 (RFFE_SDATA)3
ANTCTL 3 (RFFE_SCLK)3
I2S interface4

58 P3 56 P3

I2S_CLK

20 P3

I2S_RX ANTCTL4

22 P3

I2S_TX

24 P3

VIO_1V8

I2S_WA

28 P3

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

DO
DO
DI
DO AI DO (DIO) DO

Active high Coexistence signals of n79 and WIFI signal. When the output power of N79 is too high, output high level to WIFI module to turn off the WIFI 5G LNA. Active high Coexistence signals of n79 and WIFI signal. When the output power of N79 is too high, output high level to WIFI module to turn off the WIFI 5G LNA. Active high Coexistence signals of LAA and WIFI signal. When WIFI 5G is output power too high, output high level to 5G module to turn off 5G module’s LAA LNA.
Antenna tuner control1
mmW QTM module thermal detect
Antenna tuner control2 (Antenna tuner MIPI DATA)3
Antenna tuner control3 (Antenna tuner MIPI CLK)3

1.8V voltage domain. If unused, please keep open SIM8260G-M2 and SIM8380G-M2 are be defined as ANTCTL0
SIM8260G-M2 and SIM8380G-M2 are defined as output signal and use for protect WIFI module.
SIM8260C-M2 SIM8262E-M2 are defined as output signal and use for protect WIFI module.
SIM8262A-M2 are be defined as input signal and use for protect 5G module.
1.8V voltage domain. If unused, please keep open Only SIM8380G-M2 is defined as QTM_THERM_DET 1.8V voltage domain. If unused, please keep open 1.8V voltage domain. If unused, please keep open

DO I2S clock output

1.8V voltage domain, also can be used as PCM interface. If unused, please keep open

I2S data input

1.8V voltage domain, also can be used as PCM interface. If unused, please keep open

DO Antenna tuner control4

Only SIM8262E-M2 is defined as ANTCTL4, not support interrupt 1.8V voltage domain,

DO I2S data output

also can be used as PCM interface. If unused, please keep open

PO power for tuner

Only SIM8262E-M2 is defined as VIO_1V8

DO I2S word alignment select 1.8V voltage domain,

SIM8262A-M2 Series Hardware Design V1.07

DPR2

I2S_MCLK6

WL_TX_EN6

60 P3 DI

I2C interface5

I2C_SDA

68 P3

DIO

I2C_SCL

38 P3

COEX interface

UART_TX COEX_TX UART_RX COEX_RX

64 P3

62 P3

Other pins

LED1#

DPR*

25 P3

Notch

12, 13, 14, 15, 16, 17, 18, 19

WLAN ZIF connector interface*

WL_SLEEP_CLK Z2 P3

COEX_UART_TX Z4 P3

COEX_UART_RX Z5 P3

www.(U)SIMcom.com

(L/R)
DPR (Dynamic Power Reduction) signal is used for SAR (Specific Absorption Rate) sensor interrupt input
I2S master clock
Coexist WIFI to control LAA/N79

also can be used as PCM interface. If unused, please keep open
Only SIM8262E-M2 is defined as DPR2
1.8V voltage domain, also can be used as PCM interface. If unused, please keep open The function of I2S_MCLK is default 1.8V voltage domain, If unused, please keep open SIM8380G-M2 hardware support I2S_MCLK by default The function of I2S_MCLK and WL_TX_EN are not support at the same time Only SIM8380G-M2 support hardware configure WL_TX_EN function

I2C data signal I2C clock signal

· V voltage domain, If unused, please keep open

Module hardware configures as normal communication UART (AT command) by default

If need coexistence signal function, please contact SIMCom support teams

The module status indicator via LED devices Active low
DPR (Dynamic Power Reduction) signal is used for SAR (Specific Absorption Rate) sensor interrupt input

Notch

WLAN Sleep clock 32.768K output LTE&WLAN coexistence data transmit LTE&WLAN coexistence data receive

WL_EN_GPIO WL_GPIO WL_LAA_RX WL_PA_MUT
LAA_AS_EN
WL_SW_CTRL WL_VDD_VM WL_VDD_VL WL_VDD_VH GND

SIM8262A-M2 Series Hardware Design V1.07

Z6 P3 Z7 P3 Z8 P3
Z9 P3

DO DI(O ) DO
DO

Z10 P3

Z12 P3

Z16, Z17, Z18 PO

Z20, Z21,

Z22, Z23,

Z24, Z25

Z27, Z28, Z29 PO

Z1, Z3, Z11, Z13, Z15, Z19, Z26, Z30

Enable the WLAN Active high Reserved GPIO for WLAN

WLAN XFEM control forLAA receiver Module high band LTE andWLAN 2.4g PA control signal, pull up to turn off 2.4g chain 1 PA Allow LAA to control WLAN FEM during WLAN in sleepmode WLAN module in active and sleep mode, Smecuooxpdtnpeutlrrlyenoal1l.p3o5wVetrosWwiLtcAhN
Supply 0.95V to WLAN module
Power supply 1.95V to WLAN module

These three voltages are typical values, and the voltage varies slightly with the working status of wifi

NOTE
“” means under development. 1. W_DISABLE2# can be set through the AT command by software, hardware function not support by default, if customer need to hardware support, hardware need to be customized. 2. SIM8260G-M2 and SIM8380G-M2 module reserve eSIM inside, without (U)SIM2 interface. 3. The RFFE signals are multiplexed with ANTCTL2 and ANTCTL3. 4. SIM8262E-M2 has two hardware versionsthe one support digital audio interface, and the another one not support digital audio interfacefor more details, please contact the SIMCom support team. 5. Only SIM8260C-M2 module I2C need pulled-up to 1.8V by 2.2KR resistor externally, other modules I2C internal be pulled-up to 1.8V by 2.2K resistor already. 6. About pin60 of the module, only SIM8380G-M2 support hardware configure WL_TX_EN function, by default, SIM8380G-M2 hardware support I2S_MCLK function, if need to WL_TX_EN function, SIM8380G-M2 need to special custom version, and only supporting 4 lines I2S interface (no I2S_MCLK signal), and if need to use I2S digital audio interface, the codec can only use ALC5616. 7. SIM8262E-M2/SIM8262A-M2/SIM8260G-M2 module PCIe assistant signal has 1.8V and 3.3V two versions, for more details, please contact the SIMCom support team. 8. For more details, please contact the SIMCom support team.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
2.3 Mechanical Dimensions
The following figure shows the mechanical dimensions of SIM8262E/A-M2. Figure 6: Dimensions of the module (unit: mm)
NOTE 1. Make sure that the module can reach maximum work performance under extended temperature or extreme conditions for a long time, thermal dissipation design is very important. On customer main PCB, the size of exposed copper thermal dissipation area and exposed copper thermal dissipation area of module should be consistent.
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

3. Interface Application

· Power Supply
The recommended power supply of module is 3.8V and the voltage ranges from 3.135 V to 4.4V. Please make sure that the input voltage will never drop below 3.135V, otherwise the module will be powered off automatically. The module has 5 power pins and 11 ground pins. To ensure the module works properly, all pins should be connected.

Table 10: VBAT pins electrical characteristics
Symbol Description

VBAT Ipeak_sub6 Ipeak_sub6+mm W Im in
Ileakage

Module power supply voltage
Peak current
Peak current Current in minimum power consumption mode (VBAT=3.8V, AT+CFUN=0 & AT+CSCLK=1 & USB no connect) Current in power off mode

Min.
3.135 –
–

Typ Max. Un

3.8 4.4

–

1.8

–

5.3 –

–

128 150

· Power Supply Design Guide
For SIM826XX-M2 and SIM8260G-M2, when using 3.8V power supply, the max peak current can reach to 1.8A under the maximum transmit power of the module. Ensure that the VBAT voltage drop to minimum voltage is no less than 3.135V when the module at maximum power radio transmission, and considering the voltage drop and conversion efficiency, it is strongly recommended that the DC-DC or LDO output capacity should not be less than 3A.

NOTE

Figure 7: Maximum current consumption of the module

1. The total capacitors of VBAT net are not less than 420uF. 2. When the voltage drop on VBAT reaches its maximum value, please ensure VABT voltage drop to minimum voltage is not less than 3.135V. 3. Only SIM8380G-M2 support mmW.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07 To decrease the voltage dropping, be closely to VBAT pin add compensation capacitors capacity value no less than
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07 420uF. The following figure shows the reference circuit of power supply for the VBAT.

Figure 8: Power supply reference circuit
In this reference circuit, some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band can be used for EMI suppression. These capacitors should be put as close as possible to VBAT pins. Also, users should keep VBAT trace on circuit board wider than 3.0mm to reduce the PCB trace impedance.

Table 11: Definition of VBAT and GND pins

Pin name
VABT

Pin no.
2,4,70,72, 74

Electrical description
PI

VIO_1V8 GND

3,5,11,27, 33,39,45,5 1 ,57,71,73

description

Comment

Power supply Range3.135 4.4V Typical3.8V

These pins should be connected together to withstand sufficent current

1.8V output voltage

Ground

NOTE
1. C5 is 220 µF tantalum capacitor, ESR=0.7. 2. C1 and C2 are multi-layer ceramic chip (MLCC) capacitors from 33pF to 1uF with low ESR in high frequency band, which can Improves EMC performance. 3. D1 is used for ESD protection.

Table 12: Recommended D1 list

No. Manufacturer Part number VRWM Package

WILL

ESD56201D0 4.85V DFN1610-2L

CYGWAYON

WS4.5DPV

4.7V

DFN1610-2L

Ref. Designator
D1

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07 Power supply layout guidelines: · Both VBAT and return trace should be as short and wide as possible to minimize the voltage drop.
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07 The width of VBAT trace cannot be less than 3.0mm. · These capacitors should be placed as closely as possible with VBAT pins. · The VBAT trace should pass through TVS diode and capacitors, and then VBAT pins. The capacitor of the small value should be placed close to VBAT pins. · The PCB design must have a solid ground plane as the primary reference plane for most signals.
The following figure is reference circuit of the module’s PIN65.

Figure 9: Power supply reference circuit

NOTE
1. Recommend placing a TVS at the PIN65 pin of the module for ESD protection, recommend TVS diode as show in follows table. 2. Recommend strings a 2.2R resister at the PIN65 pin of the module for ESD protection. 3. The signal of PIN65 VIO_1V8 add the filter capacitor total capacity value can’t more than 1uF.

Table 13: PIN65 of the module recommend TVS list

No. Manufacturer Part number VRWM Package

WAYON

WE2.5DF-B

2.5V

DFN1006-2L

YAGEO

RC0402JR072R2 L

0402

Ref. Designator
D1 R1

· Recommended Power Supply Circuit
For SIM826XX-M2 and SIM8260G-M2, it is recommended to use a switching mode power supply or a linear regulator www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07 power supply. Make sure it can provide the current up to 3A at least.
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07 Figure10 shows the linear regulator reference circuit with 5V input and 3.8V output. Figure11 shows the switching mode power supply reference circuit with 5~12V input and 3.8V output. For SIM8380G-M2, it is recommended to use a switching mode power supply, make sure it can provide the current up to 16A at least. Figure12 shows the switching mode power supply reference circuit with 8.8~16V input and 3.8V output.
Figure 10: Linear regulator reference circuit NOTE 1. An extra minimum load of R3 is required, to ensure it work properly under light load in sleep mode and power off mode. For the details about minimum load, please refer to specification of MIC29502WU.
Figure 11: Switching mode power supply reference circuit
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

Figure 12: Switching mode power supply reference circuit for mmW module (SIM8380G-M2)

Table 14: Recommended FB1 and L1 list

Name
Ferrite bead Power inductor

Manufacturer
Sunlord Coilcraft

Part number
UPZ1608E300-5R0TF XAL1010-451ME

Position number
FB1 L1

NOTE
1. In order to avoid damaging the module, please do not switch off the power supply when module works normally. Only after the module is shut down by FULL_CARD_POWER_OFF# or AT command, and wait for 12s at least, then the power supply can be cut off. 2. When the module in abnormal state, make sure design should have the ability to switch off the power supply and then switch on the power to restart the module. The PWR_CTRL signal recommend connect to the host and the power of module can be controlled. 3. Only SIM8380G-M2 support mmW.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
· Voltage Monitor
To monitor the VBAT voltage, the AT command “AT+CBC” can be used. NOTE
1. For the details about voltage monitor commands, please refer to SIM826X-M2 Series_AT Command Manual in the appendix.
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
· Power On and Off Module
Driving the FULL_CARD_POWER_OFF# pin to a high level, module will be powered on. It can be driven by either 1.8V or 3.3V GPIO. The following figure shows the power on/off circuit.

Figure 13: Reference power on/off circuit

Table 15: Definition of FULL_CARD_POWER_OFF# pin

Pin name

Pin no.

FULLCARD

POWER_OF

Electrical description
DI, PD

description
High level: the modulepowers on Low level: the modulepowers off

Comment
It’s 3.3V tolerant butcan be driven by either 1.8V or 3.3V GPIO

· Power On

The power on sequence is shown in the following figure.

Figure 14: Power on sequence

Table 16: Power on timing and electrical characteristics

Symbol Parameter

Twait

The waiting time from power supply available to poweronaction

www.(U)SIMcom.com

Min. Typ. Max. Unit

100 –

–

Ton(usb)

The time from power-on action to USB port ready

SIM8262A-M2 Series Hardware Design V1.07

–

13 –

www.(U)SIMcom.com

TVDD_IO VIH VIL

SIM8262A-M2 Series Hardware Design V1.07

The time from power-on action to internal VDD_IO normal output

–

Input high level voltage on FULL_CARD_POWER_OFF#pin

–

Input low level voltage on FULL_CARD_POWER_OFF# pin

11. 12

1.8 4.5

–

0.2

NOTE
1. After the module is shut down, please wait at least 12 seconds before turning off the power, and then power on the module.
2. The test of Twait is based on SIMcom development board test. 3. Before power on module, the pin of module cannot have voltage infuse, otherwise lead to module
RF boot error.

· Power Off
The following methods can be used to power off the module. 3 Method 1: Power off the module by holding the FULL_CARD_POWER_OFF# pin to low level. 4 Method 2: Power off module by AT command “AT+CPOF”.
NOTE
1. For the details about “AT+CPOF”, please refer to SIM826X-M2 Series_AT Command Manual in the appendix. 2. When the module is powered off by AT command, if the power supply and FULL_CARD_POWER _OFF# are not shut down, the module will automatically power on again.
Above normal power-off action will make the module disconnect from the network, allow the software to enter a safe state, and save key data before the module is powered off completely. The power off sequence is shown in the following figure.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

Figure 15: Power off sequence

Table 17: Power off timing and electrical characteristics

Symbol Parameter

TVIO_1V8_off TO ff(US B)

The time from power off action to VIO_1V8 completelypower down
The time from power off action to USB port off

Time value

Ty Max

p. .

Uni t

—

NOTE
1 After the module is shut down, please wait at least 12 seconds before turning off the power, and then power on the module. 2 The test of TVIO_1V8_off is based on SIMcom development board test.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
· Reset Function
Module can be reset by driving the RESET# pin down to a low level. The RESET# signal has been internally pulled up to 1.8V, so it does not need pull up externally. Please refer to the following figure for the recommended reference circuit.

Figure 16: Reference reset circuit

Table 18: Recommended Q1 list

Name

Manufacturer

N-Channel MOSFET WILLSEMI

Part number
WNM2046-3/TR

Position number
Q1

NOTE
1. “*” means if the RESET# pin want to be used, the RESET# pin of SIM8260C-M2 need be pulled up to 1.8V by 100KR resister externally.

Table 19: Definition of RESET# pin

Pin name

Pin no.

Electrical description

RESET#

description
System reset control inputActive low

www.(U)SIMcom.com

Comment
SIM8260C-M2 RESET# pin needsto be pulled up to 1.8V by adding

SIM8262A-M2 Series Hardware Design V1.07 100KR externally
The reset timing sequence of the module is shown in the following figure.

Figure 17: The reset timing sequence of the module

Table 20: RESET# pin electrical characteristics

Symbol
Treset VIH VIL

Description
Low level hold time on RESET# pin Input high level voltage Input low level voltage

Min.
280 1.2 0

Typ. Max.

–

600

–

1.9

–

0.4

Unit
ms V V

NOTE 1. Please ensure that there is no capacitance on RESET# pin.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
· I2C Interface
Module supports an I2C interface meet I2C specification version 3.0, with data rate up to 400kbps. The following figure shows the I2C interface reference circuit.

Figure 18: I2C reference circuit

Table 21: Definition of I2C interface

Pin name
I2C_SDA I2C_SCL

Pin no.
68 38

Electrical description
DIO
DO

Description
I2C data signal I2C clock signal

Comment

NOTE 1.”*” means only SIM8260C-M2 I2C need pull up to 1.8V by 2.2KR resistor externally.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
· WoWWAN#*
The WoWWAN# pin is a system wake-on signal which can be used as an interrupt signal for the host. Normally it keeps high level. And it will change to low level when certain conditions occur, such as receiving SMS, voice call (CSD, video) or URC reporting, the low-level pulse time is 1 second.
Figure 19: WoWWAN# signal level at SMS and URC report WoWWAN# recommended reference circuit is shown in the following figure.

Figure 20: WoWWAN# reference circuit

Table 22: Definition of WoWWAN# pin

Pin name
WoWWAN#

Pin no.
23

Electrical description
OD

Description
Wake on the hostActive low

Comment

NOTE 1.”*” means under developmentfor more details, please contact the SIMCom support team.

· USB Interface
Module supports one USB interface which complies with the USB3.1 and 2.0 specifications.
Customers can choose USB3.1 or USB2.0 for their needs. USB 3.1 data rate up to 10Gbps.
The USB interface is used for AT command communication, data transmission, GNSS NMEA output, firmware upgrade and software debugging. www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
The module supports USB suspend and resume mechanism which can save power consumption. If there is no data transmission on the USB bus, the module will enter suspend mode automatically. The following figure is the USB reference circuit.

Figure 21: USB reference circuit
The following figure is the type-C USB reference circuit with CC detector.
Figure 22: Type-C USB reference circuit with CC detector
NOTE 1.If use PCIe interface already, PEWAKE#, CLKREQ#, PERST# signal of the module cannot use for GPIO control, but can use other unused GPIO ports configuration. 2. Only SIM8260C-M2’s I2C need pull up to 1.8V by 2.2KR resistor externally. .

Table 23: Definition of USB interface

Pin name
USB_HS_DP USB_HS_DM USB_SS_TX_M
USB_SS_TX_P USB_SS_RX_M USB_SS_RX_P PEWAKE# CLKREQ#
PERST#*

Pin no.
7 9 29
31 35 37 54 52
50

Electrical description
AIO AIO AO
AO AI AI DI DI
DO

Description
Differential USB bidirectionaldata positive Differential USB bidirectionaldata negative
USB3.1 transmit data negative
USB3.1 transmit data positive
USB3.1 receive data negative
USB3.1 receive datapositive
For CC detector function
For indicating change in I2Cregisters interrupt signal. USB3.1 type-C switch controlsignal

Comment
USB3.1 data rateup to 10Gbps USB2.0 data rateup to 480Mbps
Need external pullup to 3.3V by 100KR resistor

NOTE

1.”*” means PEWAKE#, CLKREQ#, PERST# be used for PCIe control signal by default if need
configure type-c USB interface, and unused PCIe interface of module, recommend these three signal used for GPIO function.

Table 24: USB interface recommended CC detector, USB3.1 type-C switch and TVS diode list

No. Manufacturer

Part number

Package

www.(U)SIMcom.com

WILL

ESD5302N-3/TR

SIM8262A-M2 Series Hardware Design V1.07 DFN1006-3L

www.(U)SIMcom.com

PERICOM

PI5USB30216D PI3DBS12212A

SIM8262A-M2 Series Hardware Design V1.07
QFN12 QFN3X3

USB HS DP/DM layout guidelines: · Require differential trace impedance is 90±10% . · The intra-lane length mismatch of the differential signal lanes is less than 1mm. · Gap from other signals keeps 3xline width. · External components should be placed near the USB connector. · Trace routes away from other sensitive signals (RF, audio, and XO). · The TVS diode should be placed close to the USB pins of M.2 connector. · Maximum PCB trace length cannot exceed 100mm outside of module, the shorter the better.
USB SS TX/RX layout guidelines: · Require differential trace impedance is 85±10% . · The intra-lane length mismatch of the differential signal lanes is less than 500um. · Gap from other signals keeps 4xline width. · Gap between Rx-to-Tx keeps 4xline width. · External components should be placed near the USB connector. · Trace routes away from other sensitive signals (RF, especially 2.4 GHz). · The TVS diode should be placed close to the USB pins of M.2 connector. · Route differential pairs in the inner layers with a solid GND reference to have good impedance control and to
minimize discontinuities. · Keep isolation between the Tx pair, Rx pair, and DP/DM to avoid crosstalk. · If core vias are used, use no more than two core vias per signal line to limit stubs.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
· PCIe Interface
Module supports PCIe Gen3 one lane interfaces, which data rate up to 8Gbps, and can be used as EP or RC mode. CLKREQ# and PEWAKE# needs pull up to 3.3V by 10K resesitor in customer’s design. The following figure is the PCIe reference circuit.
Figure 23: PCIe interface reference circuit (EP Mode)
NOTE
1. “” means under development. 2. The AC capacitors of AP_PETn0 and AP_PETp0 should be closed to AP. 3. SIM8262E-M2/SIM8262A-M2/SIM8260G-M2 module PCIe assistant signal has 1.8V and 3.3V two versions, for more details, please contact the SIMCom support team. 4. If the module uses PCIe interface and USB interface in EP mode at the same time, the module low power mode current than only use PICe interface in EP mode higher. 5. If match with QPS615, please refer SIM8260G-M2 & QPS615 & W82 & RTL8211F & QEP8121 & RTL8221B Connect Pin Mapping(xxxxxx) document.

Table 25: Definition of PCIe interface

Pin name
PETn0 PETp0 PERn0 PERp0 REFCLKN REFCLKP
PERST#
CLKREQ#
PEWAKE#

Pin no.
41 43 47 49 53 55
50
52
54

Electrical descriptio n
AO AO AI AI AIO
AIO
DI
DIO
DIO

Functional description
PCIe transmit data negative
PCIe transmit data positive PCIe receive data negative
PCIe receive data positive PCIe reference clocknegative PCIe reference clock positive PERST# is a functional resetto the Add-In module active low PCIe reference clock requestsignal active low PCIe wake up signalactive low

Comment
3.3V voltage domain, CLKREQ# and PEWAKE# required pull up external, Default as EP mode.If unused, please keep open

Table 26: PCIe interface recommended TVS diode list

No. Manufacturer
www.(U)SIMcom.com

Part number

Package

WILL

ESD5302N-3/TR

SIM8262A-M2 Series Hardware Design V1.07 DFN1006-3L

www.(U)SIMcom.com

· PCIe timing

SIM8262A-M2 Series Hardware Design V1.07

Figure 24: PCIe power-on sequence requirements of M.2 specification
Figure 25: PCIe power-on sequence requirements of module PCIe interface layout guidelines: · Require differential trace impedance is 85±10% . · The intra- lane length mismatch of the differential signal lanes is less than 500um. · Gap from other signals keeps 4xline width. · Gap between Rx-to-Tx keeps 4xline width. · Should be routed away from sensitive signals. · The TVS diode should be placed close to the PCIe pins of M.2 connector. · All other sensitive/high- speed signals and circuits must be protected from PCIe corruption. · PCIe signals must be protected from noisy signals (clocks, SMPS). · Each trace needs to be adjacent to a ground plane. · Maximum PCB trace length cannot exceed 150mm outside of module, the shorter trace the better.
· USB and PCIe Modes*
Module supports communication both USB and PCIe interfaces, the followings describe USB mode, USB-AT-based PCIe mode, eFuse-based PCIe mode.
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07 USB mode · Supports USB3.1 (backward compatible USB2.0) interface feature · Supports MBIM/QMI/AT · Communication can be switched to PCIe mode by AT command USB interface is default communication interface between SIM826XX/SIM8X80-M2 module and a host. If need to use PCIe interface for the communication between a host, an AT command under USB mode can be used. For more details about the AT command, please refer to SIM826X-M2 Series_AT Command Manual. It is suggested that USB 2.0 interface be reserved for firmware upgrade.
USB-AT-based PCIe mode · Supports MBIM/QMI/AT · Communication can be switched back to USB mode by AT command When SIM826XX/SIM8X80-M2 module works at the USB-AT-based (switched from USB mode by AT command) PCIe mode, it supports MBIM/QMI/AT, and can be switched back to USB mode by AT command. But the firmware upgrade via PCIe interface is supported, so USB 2.0 interface must be reserved for the firmware upgrade.
eFuse-based PCIe mode · Supports MBIM/QMI/AT · Supports Non-X86 systems and X86(Windows and Linux) system (supports BIOS PCIe early initial) SIM826XX/SIM8X80-M2 can also be reprogrammed to PCIe mode based on eFuse. If the communication is switched to PCIe mode by burnt eFuse, the communication cannot be switched back to USB mode. If the host does not support firmware upgrade through PCIe, then SIM826XX/SIM8X80-M2 USB2.0 interface (Pin 7 and Pin 9 of SIM826XX/SIM8X80-M2 M2 interface) and two test points (VIO_1V8 and FORCE_USB_BOOT) must be used for the firmware upgrade. For more details, please contact SIMCom support teams.
NOTE 2 “” means under development, for more detail, please contact SIMCom support teams. 3 FORCE_USB_BOOT for system firmware upgrade.
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
· PCIe for W82
PCIe can connect to W82 as WLAN data interface, WLAN ZIF connector for W82 power supply and assistance control, the module as RC and W82 as EP. CLKREQ#, PEWAKE# and PERST# signals need to connect 3.3V to 1.8V shift level between the module and W82, the following figure is the PCIe reference circuit, the details design please refer to the reference circuit document.

Figure 26: The module connect W82 reference circuit (PCIe assistant signal is 3.3V version)

Table 27: Recommended shift level list

No. Manufacturer

Part number
TXS0104EYZT

Package
GXU/ZXU(BGA)

NOTE
1. SIM8262E-M2 and SIM8262A-M2 has 1.8V and 3.3V PCIe assistant signal hardware versions, for 3.3V PCIe assistant hardware version, on the module side, the PEWAKE# and CLKREQ# signals need to be pulled up to 3.3V by 10K resister, for 1.8V PCIe assistant hardware version, on the module side, the PEWAKE# and CLKREQ# signals need to be pulled up to 1.8V by 10K resister. 2. In W82 module, the PEWAKE# and CLKREQ# signals internal pull up to 1.8V already, if module is 3.3V PCIe assistant control signal version, between module and W82 need add 3.3V to 1.8V level shifter. 3. About WLAN ZIF connector pin description of the module, please refers to chapter2.1.2. 4. SIM8262E-M2/SIM8262A-M2/SIM8260G-M2* has 1.8V and 3.3V PCIe assistant signal hardware versions, Please pay attention to whether the levels match when use PCIe interface.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

· PCIe for RTL8125B-TE
PCIe can connect to RTL8125B-TE as Ethernet data interface, the module as RC and RTL8125B-TE as EP.
CLKREQ# and PEWAKE# needs pull up to 3.3V by 10K resistor in customers’ design, the details design please refers to the reference circuit document.

Figure 27: The module connect RTL8125B-TE reference circuit (3.3V PCIe assistant signal version)

Table 28: Recommended RTL8125B IC list

No. Manufacturer

REALTEK

Part number
RTL8125B-CG

Package
6mm6mm1mm

NOTE
The AC capacitors of PCIe_TXM and PCIe_TXP should be placed near the RTL8125B. RTL8125B’s PCIe_WAKE, PCIe_RST, PCIe and CLKREQ signal voltage domain is 3.3Vif module is 1.8V PCIe assistant control signal version, between module and RTL8125B need add 1.8V to 3.3V level shifter, on level shifter 1.8V side, PCIe_WAKE PCIe_RST PCIe_CLKREQ need to pull up to 1.8V, on level shifter 3.3V side, PCIe_WAKEPCIe_RSTPCIe_CLKREQ need to pull up to 3.3V. SIM8262E-M2 and SIM8262A-M2 has 1.8V and 3.3V PCIe assistant signal hardware versions, Please pay attention to whether the levels match when use PCIe interface. For more details, please contact SIMCom support teams.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
3.7.5 PCIe for Qualcomm IPQxxxx
PCIe can connect to qualcomm IPQxxxx as CPE application, the module as EP and qualcomm IPQxxxx as RC. Due to IPQxxxx’s PCIe_WAKE, PCIe_RST and PCIe_CLKREQ signal voltage domain is 1.8V, So, CLKREQ# and PEWAKE# needs pull up to 1.8V by 10K resistor in customers’ design, the following figure is the module connect to IPQxxxx connection diagram.
Figure 28: The module connect IPQxxxx reference circuit (1.8V PCIe assistant signal version)
NOTE
Qualcomm IPQxxxx’s PCIe_WAKE, PCIe_RST and PCIe_CLKREQ signal voltage domain is 1.8V if module is 3.3V PCIe assistant control signal version, between module and IPQxxxx need add 3.3V to 1.8V level shifter, on level shifter 1.8V side, PCIe_WAKEPCIe_RSTPCIe_CLKREQ need to pull up to 1.8V, on level shifter 3.3V side, PCIe_WAKEPCIe_RSTPCIe_CLKREQ need to pull up to 3.3V. SIM8262E-M2 and SIM8262A-M2 has 1.8V and 3.3V PCIe assistant signal hardware versions, Please pay attention to whether the levels match when use PCIe interface. “” means the module’s hardware and software not support this function by default, if need module coordinate IPQxxxx use, please contact SIMCom support teams.
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

3.8 (U)SIM Interface
Module supports two (U)SIM cards but single standby. Both (U)SIM1 and (U)SIM2 are dual-voltage 1.8V or 3.0V. Table 29: (U)SIM electrical characteristics in 1.8V mode ((U)SIM_PWR=1.8V)

Symbol
(U)SIM_PW R VIH
VIL
VOH
VOL

Parameter
Power supply for (U)SIM card
High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage

Min.
1.65
1.26 0 1.44 0

Typ.
1.8
–

Max.
1.95
1.95 0.36 1.8 0.4

Unit
V
V V V V

Table 30: (U)SIM electrical characteristics in 3.0V mode ((U)SIM_PWR=3.0V)

Symbol
(U)SIM_PW R VIH
VIL
VOH
VOL

Parameter
Power supply for (U)SIM card
High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage

Min.
2.7
2.1 0 2.4 0

Typ.
3.0
0 0

Max.
3.05
3.05 0.6 3.0 0.4

Unit
V
V V V V

Table 31: Definition of (U)SIM interface

Pin name
(U)SIM1_PWR
(U)SIM1_DATA (U)SIM1_CLK (U)SIM1_RESET
(U)SIM1_DET (U)SIM2_PWR (U)SIM2_CLK (U)SIM2_RESET (U)SIM2_DATA

Pin no. Electrical Description description

36 P4 34 P4

PO Power supply for (U)SIM1
card (U)SIM1 card data, which has
DIO been pulled up to SIM1_PWR
via a 20KR resistor internally

32 P4

DO (U)SIM1 clock signal

30 P4 66 P3

DO (U)SIM1 reset control

(U)SIM1 card detect, which

has

been pulled up to VDD_P3 via

a 100KR resistor internally

48 P5 44 P5

PO Power supply for (U)SIM2 card
DO (U)SIM2 clock signal

46 P5 42 P5

DO (U)SIM2 reset control
(U)SIM2 card data, which has DIO been pulled up to SIM2_PWR
via a 20KR resistor internally

(U)SIM2_DET

(U)SIM2 card detect, which

has

40 P3

been pulled up to P3 via a

Comment
1.8/3.0V voltage domain, (U)SIM interfaces should be protectedagainst ESD If unused, pleasekeep open
SIM8260C/SIM8 262E/SIM8262A -M2 support (U)SIM2
SIM8260G-M2 andSIM8380GM2 not support (U)SIM2 interface, but the reserved eSIM

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

100KR resistor internally

cardis connected to (U)SIM2 inside ofthe module

The following table shows recommended TVS of ESD protect and (U)SIM socket.

Table 32: Recommended TVS and always close (U)SIM socket list

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

Name
TVS (U)SIM socket

Manufacturer
ST MOLEX

Part number
ESDA6V1-5W6 5039600696

If the (U)SIM card hot-swap function is not used, customers can keep the (U)SIM_DET pin open.
The (U)SIM card layout guidelines: · Make sure that the (U)SIM card holder should be far away from the antenna while in PCB layout. · (U)SIM traces should keep away from RF lines, VBAT and high-speed signal lines. · The traces should be as short as possible. · Keep (U)SIM holder’s GND connect to main ground directly. · Shielding the (U)SIM card signal by ground. · Recommended to place a 33pF1uF capacitor on (U)SIM_PWR line and keep close to the holder. · The rise/fall time of (U)SIM_CLK should not be more than 40ns. · The (U)SIM_CLK trace needs to be adjacent to a ground plane three-dimensional. · The parasitic capacitance of TVS should not exceed 30pF and the TVS should be placed close to the (U)SIM
socket.

NOTE
· Always Close (U)SIM Card Design
Always close (U)SIM card reference circuit as shown in the following figure.
Figure29: Always close (U)SIM card reference circuit · When no (U)SIM card insertCD pin connect with GND(U)SIM_DET is low level; · When (U)SIM card insertCD pin disconnect with GND(U)SIM_DET is high level.
· Always Open (U)SIM Card Design
Always open (U)SIM card reference circuit as shown in the following figure.
Figure30: Always open (U)SIM card reference circuit · When no (U)SIM card insertCD pin disconnect with GND(U)SIM_DET is high level; · When (U)SIM card insertCD pin dconnect with GND(U)SIM_DET is low level. NOTE 1. The module’s (U)SIM1_DET and (U)SIM2_DET pins have been internally pulled up VDD_P3 already by 100KR resister.

3.8.3 Without CD PIN (U)SIM Card Design
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07 If needn’t (U)SIM hot swap function, please keep (U)SIM_DET pin disconnect, without CD pin (U)SIM card reference circuit as shown in the following figure.
Figure31: Without CD pin (U)SIM card reference circuit
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

· I2S Interface

Module supports one I2S interface for external codec, which follows the requirements in the Phillips I2S bus specification.

Table 33: I2S format

Characteristics
Line interface format Data length
I2S clock/sync source I2S clock frequency I2S MCLK frequency
Data ordering

Specification
Linear (Fixed) 16bits (Fixed) Master mode (Fixed) 1.536MHz (Default) 12.288MHz (Default) MSB

NOTE

1. For the details about I2S AT commands, please refer to SIM826X-M2 Series_AT Command Manualin the appendix.

· I2S Timing
The module supports I2S sampling rate of 48 KHz and 32-bit coding signal (16-bit length), the timing sequence is shown in the following figure.

Table 34: I2S timing parameters

Figure 32: I2S timing

Signal

Parameter
Frequency

I2S_MCL K

T
t(HC) t(LC)

Description
Working Frequency
Clock period
Clock high Clock low

Min.

81.380
0.45T 0.45T

Typ.
12.28 8
81.38 0

Max.
12.28 8

Unit
MHz
ns

0.55T ns 0.55T ns

www.(U)SIMcom.com

I2S_CLK Frequency

Working Frequency

SIM8262A-M2 Series Hardware Design V1.07

1.536

MHz

www.(U)SIMcom.com

T t(HC) t(LC)
Frequency
t(sr)

I2S_WA

t(hr) t(dtr)

t(htr) design circuit.

Clock period Clock high
Clock low
Working Frequency
DIN/DOUT and WA input setuptime DIN/DOUT and WA input holdtime DIN/DOUT and WA
outputdelay DIN/DOUT and WA output holdtime

SIM8262A-M2 Series Hardware Design V1.07

651

0.45T

16.276

0.55T ns

KHz

65.10 ns

I2S

Reference

Circuit

The following figure is the external
codec reference

Figure 33: Audio codec diagram circuit

Table 35: Definition of I2S interface

Pin name
I2S_CLK I2S_RX I2S_TX I2S_WA I2S_MCLK

Pin no.
20 22 24 28 60

Electrical description
DO
DI
DO
DO
DO

Description
I2S clock output I2S data input I2S data output I2S word alignment select (L/R) I2S master clock

Comment
1.8V voltage domain, also can be used as PCM interface, if unused, please keep open

NOTE
1 If use ALC5616 audio codec, the software can configuration ALC5616 internal registers, and can configuration 4 lines I2S (no I2S_MCLK signal) interface or 5 lines I2S (embrace I2S_MCLK signal) interface. 2 If use NAU8810 audio codec, the software only configure 5 lines I2S (embrace I2S_MCLK signal) interface.

The PCM interface is multiplexing with I2S interface. The default audio interface of the module is I2S.

Table 36: The PCM interface is multiplexing with I2S interface

Pin name
I2S_RX I2S_TX I2S_WA I2S_CLK I2S_MCLK

PCM interface
PCM_DIN PCM_OUT PCM_SYNC PCM_CLK –

Audio layout guidelines: Analog input
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07 · 0.2mm trace widths; 0.2mm spacing between other signals trace.
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
Pseudo differential route for MIC. · Isolate from noise sources, such as antenna, RF signals, SMPS, clocks, and other high-speed signals.
Analog output · Isolate from noise sources such as antenna, RF signals, SMPS, clocks, and other high-speed signals. · Speaker output signal route as differential pair with 0.5mm trace widths.
Audio power and GND · Recommend add magnetic bead on AVDD net reserved for debug. · VDD cannot directly use VBAT as the power supply. · AGND need add GND via to the main GND plane directly.
NOTE
1. Only SIM8260C-M2 need to add a 2.2KR resistor to 1.8V externally, other modules I2C have 2.2K pull-up inside.

· DPR*
DPR (Dynamic Power Reduction) signal is used for SAR (Specific Absorption Rate) requirements. The RF output power would reduce if this signal is triggered by sensor under some certain conditions, such as SAR sensor triggered, defined by customers.

User can activate this function with AT command.

Table 37: Definition of DPR# pin

Pin no. Pin name

DPR

Pin status
Low
High Floating

Function
Max transmitting power will be reduced by set through ATcommand
Max transmitting power will not be reduced (default)
Max transmitting power will not be reduced

NOTE 1. “*” means under development, for details please contact SIMCom support teams.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

· CONFIG Pins

These signals are provided to indicate its specific configuration that is WWAN-USB3.1 of SIM826XX/SIM8X80-M2.

Table 38: CONFIG pins state of the module

Pin no. Pin name

CONFIG_0

CONFIG_1

CONFIG_2

CONFIG_3

Description
Connected to ground internally Connected to ground internally Connected to ground internally Not connected

In the M.2 specifications, the CONFIG pins are defined as below.

Table 39: CONFIG interface definition

CONFIG_0 CCmOoamiNnFmhIGeons_tts1i(nPCtienOrf2Na1cF)eIG1 _2 C(POinN6F9IG) _3 (PMino7d5u)le type and

GND

WWAN USB 3.1

(Pin 1)
Vender defined

NOTE
1. The USB3.1 and PCIe interface can be supported at the same time of SIM826XX_SIM8X80 M2 series module.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
· LED1#
LED1# is open drain output and is used to allow module to provide network status via LED which will be provided by the host.

Figure 34: LED1# reference circuit

Table 40: Definition of LED1# pin

Pin name

Pin no.

Electrical description

LED1#

Description
The module status indicatorvia LED devices Active low

Comments

NOTE
1. The value of the resistor R1 depends on the LED characteristics. The recommend value of R1 is 2KR.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

The timing parameters are shown in the following table. Table 41: LED1# pin status

LED1# pin status
Always On 100ms ON, 100ms OFF 200ms ON, 200ms OFF 800ms ON, 800ms OFF OFF

Module status
Searching network; call connection (including 5G, VOLTE) 5G Data transmits; 5G registered network 3G/4G Data transmits; 4G registered network 3G registered network Power off: Sleep mode

· W_DISABLE1#
The W_DISABLE1# pin controls module to enter the flight mode. When the W_DISABLE1# signal is pulled to low level, RF function would be disabled. Otherwise, the RF function would be active.

Recommended reference circuit is shown in the following figure.

Figure 35: W_DISABLE1# pin reference circuit

Table 42: Definition of W_DISABLE1# pin

Pin name

Pin no.

Electrical description

Description

W_DISABLE1 8

Flight mode

Comments
3.3V tolerant but can be driven by either 1.8V or 3.3VGPIO

NOTE 1. The W_DISABLE1# signal is pulled up to 1.8V by software configure in the module.

Table 43: W_DISABLE1# pin status

W_DISABLE1# pin status
www.(U)SIMcom.com

Module operation

Input low level Input high level

SIM8262A-M2 Series Hardware Design V1.07
Flight mode: RF is disabled (SIM card function turn on) AT+CFUN=4: Flight mode(SIM card function turn on)AT+CFUN=1: RF is enabled (default) AT+CFUN=0: Minimum power mode(SIM card function turn off)

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
3.14 TDD_SYNC_PPS*
In SIM826XX/SIM8X80-M2 design, TDD_SYNC_PPS and W_DISABLE2# function coexists in PIN26 of module. Hardware support TDD_SYNC_PPS function by default.
When PIN26 configure as TDD_SYNC_PPS function, it can generate pulse use for indication NSA and SA sub6 the beginning frame flag of DL-UL, the pin level is 1.8V.
Recommended reference circuit is shown in the following figure.

Figure 36: TDD_SYNC_PPS pin reference circuit

Table 44: Definition of TDD_SYNC_PPS pin

Pin name

Pin no.

Electrical description

TDD_SYNC_PP 26

Description
It can generate pulse use for indication NSA and SA sub6 TDD the beginning frame flag of DL-UL

Comments
1.8V voltage domain

NOTE
1. “*” means under development. 2. The TDD_SYNC_PPS pin also can be configured GPS_1PPS signal output by software,
theTDD_SYNC_PPS and GPS_1PPS function can’t be used at the same time.
3. About TDD_SYNC_PPS and GPS_1PPS function more detail, please contact SIMCom
The following is TDD_SYNC_PPS signal design guidelines
· This signal trace should be treated as a data transmission line, required impedance is 50 . · This signal trace should as short as possible and cannot exceed 40mm out of the module. · This signal trace should far away from RF, power and high-speed signals. · This signal trace should be protected completely by GND. · The rising slew rate is no poor than 3ns, falling slew rate is no poor than 5ns, even with default lowest drive strength
(2mA) being selected. www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
3.14.1 W_DISABLE2#*
The W_DISABLE2# pin controls module to disable the GNSS function. When the W_DISABLE2# signal is pulled to low level, the GNSS function would be disabled. Recommended reference circuit is shown in the following figure.

Figure 37: W_DISABLE2# pin reference circuit

Table 45: Definition of W_DISABLE2# pin

Pin name

Pin no.

Electrical description

W_DISABLE2 26

Description
GNSS disable Active low

Comments
can be driven by either 1.8V or 3.3V GPIO

NOTE
4 The W_DISABLE2# signal is pulled up to 1.8V by software configure in the module. 5 If HOST side control GPIO is 1.8V voltage domain, not need to add D1, If HOST side control GPIO is 3.3V voltage domain, must need to add D1.

Table 46: Recommended D1 list

No. Manufacturer Part number

Forward current

LRC

WILL

LDSR01S30ST5 2A

WSB5557Z

Package Ref. Designator
DFN0603 D1 DFN0603

Table 47: W_DISABLE2#* pin status

W_DISABLE2# pin status
Input Low Level

Module operation
GNSS function is disabled

www.(U)SIMcom.com

Input High Level

SIM8262A-M2 Series Hardware Design V1.07
AT+CGPS=0: GNSS function is disabled AT+CGPS=1: GNSS function is enabled(default)

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07 NOTE 3 “*” means under development, for details please contact SIMCom support teams. 4 The W_DISABLE2# function can be set by software AT command, if need this function, please contact SIMCom support team.
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

3.7 Antenna Control Interface*
ANTCTL[0:4] and RFFE signals are used for tunable antenna control and should be routed to an appropriate antenna control circuitry.

The following table is the definitions for antenna control interfaces Table 48: Definition of antenna control interface through GPIOs

Pin name

Pin no.

Electrical description

Description

ANTCTL0

Antenna tuner control0

LAA/N79_TX_E N*

ANTCTL1

ANTCTL2 (RFFE_SDAT

DO (DI

www.(U)SIMcom.com

Active high Coexistence signals of n79and WIFI signal. When the output power of N79 is too high, output highlevel to WIFI module to turn off the WIFI 5G LNA. Active high Coexistence signals of n79and WIFI signal. When the output power of N79 is too high, output highlevel to WIFI module to turn off the WIFI 5G LNA.
Active high Coexistence signals of LAAand WIFI signal. When WIFI 5G is output power too high, output high level to 5G module to turn off5G module’s LAA LNA.
Antenna tuner control1
Antenna tuner control2 (Antenna tuner MIPI DATA)

Comments
1.8V voltage domain. If unused,please keep open SIM8260C-M2, SIM8262E-M2 andSIM8262AM2 are be defined as ANTCTL0 SIM8260G-M2 andSIM8380GM2 are be defined as ANTCTL0 SIM8260G-M2 andSIM8380GM2 are defined as outputsignal and use for protect WIFI module.
SIM8260C-M2 SIM8262EM2 are defined as outputsignal and use for protect WIFI module.
SIM8262A-M2 are be defined as inputsignal and use for protect 5G module.
1.8V voltage domain. If unused,please keep open 1.8V voltage domain. If unused,please keep open

ANTCTL3 (RFFE_SCL

ANTCTL4

SIM8262A-M2 Series Hardware Design V1.07

Antenna tuner control3 (Antenna tuner MIPI CLK)
Antenna tuner control4

1.8V voltage domain. If unused,please keep open
1.8V voltage domain. If unused, please keep open Only SIM8262E-M2 is defined as ant tunner control4 not
support interrupt

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07 NOTE 1. “*” means under development, for details please contact SIMCom support teams. 2. The RFFE signals are multiplexed with ANTCTL2 and ANTCTL3.
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

3.8 UART Interface

Module hardware configure as normal communication UART (AT command) by default. If need coexistence signal function, please contact SIMCom support teams.

Table 49: Definition of UART interface

Pin name
UART TX COEX1 * UART RX COEX2 *

Pin no.
64
62

Electrical description
DO
DI

Description
Module hardware configures as normal communication UART (AT command) by default

Comments
If need coexistence signalfunction, please contact SIMCom support teams

The UART level of module is 1.8V, if need communication with 3.3V serial port levelit recommends to use level shift IC. The following figure shows the reference design circuit of level shift.

Figure 38: UART level conversion circuit NOTE 1. If need coexistence signal function, please contact SIMCom support teams.
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

3.9 GPIOs Interface

There pins can be configured as GPIO function of module in following table, and it configuration by software configure according to the customer’s requirements.

Table 50: GPIO list

Module
UART_TX UART_RX I2S_WA1 I2S_RX I2S_TX I2S_CLK DPR I2C_SDA I2C_SCL TDD_SYNC_PPS* I2S_MCLK

Pin no.
64 62 28 22 24 20 25 68 38 26 60

Interrupt function
Y Y Y Y Y Y Y Y Y Y N

Pull (default options)
B-PD: nppukp B-PD: nppukp B-PD: nppukp B-PD: nppukp B-PD: nppukp B-PD: nppukp B-PD: nppukp B-PD: nppukp B-PD: nppukp B-PD: nppukp B-PD: nppukp

NOTE
“*” means under development, about TDD_SYNC_PPS function more detail, please contact SIMCom support teams. 1. SIM8262E-M2 has two hardware versionsthe one support digital audio interface, and the another one not support digital audio interface, in not support digital audio version, definition of PIN28 & PIN24 & PIN22 as follows: PIN28 define as DPR2. PIN24 define as VIO_1P8. PIN22 define as ANTCTL4, not support interrupt.

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

3.10 mmW Interface
Only SIM8380G-M2 supports mmW, and its PIN definition is designed on the following pins of the M2 interface. Table 51: mmW Interface

Pin name
QTM_THERM_DET VDD_1V9 QTM3_PON QTM2_PON QTM1_PON QTM0_PON

Pin no.
61 48 44 46 42 40

Electrical description
AI
PO
DO
DO
DO
DO

Description
mmW QTM module thermal detect Power supply for mmW QTM VDD Power on/reset 3 for mmW QTM module Power on/reset 2 for mmW QTM module Power on/reset 1 for mmW QTM module Power on/reset 0 for mmW QTM module

SIM8380G-M2 support mmW modules are QTM545 and QTM547. Recommended reference circuit is shown in the following figure.

Figure 39: The connection diagram of module and mmW module
NOTE
1. The PIN61 of SIM8380G-M2 define for QTM_THERM_DET. 2. Only QTM547 support QTM_THERM_DET. 3. QTM545 embrace IF intermediate frequency signal, FPC material requirement is high, for more details, please refer SIM83X0 Series_mmWave_QTM545_QTM547_Antenna_Module_Application_Notes_V1.xx document.

Table 52: Recommended mmW module connector list

Name

Manufacturer Part number Position number

Connector Panasonic Connector Panasonic Connector IPEX

AXG3B0612DJ 1
AXG4B0612DJ 1
20981-001E-02

Connector on customer PCB board Connector on QTM545 module IF ANT RF Connector on PCB board

Connector IPEX

20980-001R-13 IF ANT RF connectors on the coaxial cable

QTM design guidelines
Logic design · A 100PF capacitor needs to be added to the VDD_1P9 power supply of each QTM545 module · A 22PF and 4.7UF capacitor needs to be added to the VDD_1P9 power supply of each QTM547 module · 100PF capacitor needs to be added to the VCC_QTM power supply of each QTM545 module · 100PF and 10UF capacitor needs to be added to the VCC_QTM power supply of each QTM5457module · If the QTM_PON signal is not used, add a 100 resistor to GND Isolate from noise sources, such as antenna, RF
signals, SMPS, clocks, and other high speeding signals.

IF cable isolation recommendation to avoid LTE de-sense in co-existence mode.

www.(U)SIMcom.com

· 0.5 GHz 1.7 GHz: 70 dB

SIM8262A-M2 Series Hardware Design V1.07

www.(U)SIMcom.com

1.7 GHz 3.0 GHz: 60 dB · 3.0 GHz 6.0 GHz: 65 dB · 6.0 GHz 10 GHz: 65 dB · 10.0 GHz 15 GHz: 55 dB
Layout design · VCC_QTM Maximum allowed DC resistance <=90 (m) · VDD_1P9 Maximum allowed DC resistance <=150 (m)

SIM8262A-M2 Series Hardware Design V1.07

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
4. Antenna Interfaces
SIM8260C-M2 provides five antenna interfaces, SIM8262E/A-M2, SIM8260G-M2 provide four antenna interfaces, and all of them should be 50 impedance controlled for RF signal. SIM8380G-M2 has four antenna interfaces and four dedicated antennas for mmW.
· Antenna Definitions
Antenna interfaces are shown in the following figure.

Figure 40: Antenna interfaces of Modules

Table 53: Antenna port definitions

ANT item

ANT function

SIM8262A-M2

ANT0 ANT1 ANT2

3G/4G/5G LMHB TRX 4G UHB DL-MIMO1 5G n41 UL-MIMO2 5G n38/n41 DL-MIMO2 5G n48/n77/n78/79 DL-MIMO1
3G/4G/5G MHB DLMIMO1 4G UHB DL-MIMO2 5G n38/n41 DIV 5G n48/n77/n78/n79 DL- MIMO2
3G/4G/5G MHB TX1/DLMIMO24G UHB TRX 4G B42/B43/B48 TRX 5G n38/n41 TRX 5G n48/n77/n78/n79 TRX

www.(U)SIMcom.com

Frequency range Functional description

617MHz~960MHz 1710MHz~2690MHz 3300MHz~5000Mhz

3G/4G/5G signal transmit andreceive

1930MHz~2690MHz 3300MHz~5000MHz

3G/4G/5G signal receive

1710MHz~2690MHz 3G/4G/5G signal transmit 3300MHz~5000MHz andreceive

ANT3

3G/4G/5G LB TX1/DIV 3G/4G/5G MHB DIV
4G UHB DIV 5G n38/n41 DL-MIMO1

SIM8262A-M2 Series Hardware Design V1.07

663MHz~960MHz 1930MHz~2690MHz 3300MHz~5000Mhz

3G/4G/5G/GNSS signal transmitand receive

www.(U)SIMcom.com

5G n48/n77/n78/n79 DIV GNSS1 L1+L5 2

SIM8262A-M2 Series Hardware Design V1.07

NOTE 1.About mmW, the function of QTM547 is being developed, for more detail, please contact SIMCom

Table 54: Frequency band and antenna ports mapping

BANDS FUNCTIO NS

ANTENNA

AN AN

T0 T1

SIM8262A-M2

3G/4G/5 G 4G

LMHB UHB

TRX DIV

5G 5G 5G
LAA 3G/4G/5 G 4G 5G 5G
3G/4G/5 G 4G 5G 5G
3G/4G/5 G 4G 5G 5G
LAA

n41 n38/n41 n48/n77/n78/n7 9 B46 MHB
UHB n38/n41 n48/n77/n78/n7 9 MHB
UHB n38/n41 n48/n77/n78/n7 9 LMHB
UHB n38/n41 n48/n77/n78/n7 9 B46

UL-MIMO2 DL-MIMO2 DIV
PRX DL-MIMO1
DL-MIMO1 DIV DL-MIMO1
TX1/DLMIMO2 TRX TRX TRX
DIV
DL-MIMO1 DIV DL-MIMO1
DIV

GNSS1

L1+L52

ANT2 ANT3 GNSS3

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07 NOTE 1. GNSS system is optional. 2. L5 is not support by default, if customer needs to support L5, hardware needs to be customized. For more detail, please contact SIMCom support teams. 3. Only SIM8260C-M2 GNSS support separate antenna, please contact the SIMCom support team for more details. 4. ” * ” means SIM8260G-M2 and SIM8380G-M2 are under development, only SIM8380G-M2 support mmW. For more detail, please contact SIMCom support teams. 5. DIV means diversity reception, DL_MIMO1 means PRX_MIMO, DL_MIMO2 means DRX_MIMO.
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

· 3G/4G/5G/mmW Operating Frequency

Table 55: Module operating frequency

Frequency bands
WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 LTE B1 LTE B2 LTE B4 LTE B5 LTE B7 LTE B8 LTE B12 LTE B13 LTE B14 LTE B17 LTE B18 LTE B19 LTE B20 LTE B25 LTE B26 LTE B29 LTE B30 LTE B38 LTE B41 LTE B42 LTE B43 LTE B46 LTE B48 LTE B66 LTE B71 5G n1 5G n2 5G n5 5G n7 5G n8 5G n12

Uplink (UL)
1920 ~1980MHz 1850 ~1910MHz 1710~1755 MHz 824849MHz 880 ~915MHz 1920 ~1980MHz 1850 ~1910MHz 1710~1755 MHz 824849 MHz 2500~2570MHz 880 ~915MHz 698 ~716MHz 777 ~787MHz 788 ~798MHz 704 ~716MHz 815 ~830MHz 830 ~845MHz 832~862MHz 1850~1915MHz 814 ~849MHz 717~728MHz 2305~2315MHz 2570 ~2620MHz 2496 ~2690MHz
3400 ~3600MHz 3600 ~3800MHz 5150~5925MHz 3550~3700MHz 1710~1780MHz 663 ~698MHz
1920 ~1980MHz 1850 ~1910MHz 824849 MHz 2500~2570MHz 880 ~915MHz 699 ~716MHz

Downlink (DL)
2110 ~2170MHz 1930 ~1990MHz 2110~2155MHz 869894MHz 925 ~960MHz 2110 ~2170MHz 1930 ~1990MHz 2110~2155MHz 869894MHz 2620~2690MHz 925 ~960MHz 728 ~746MHz 746 ~756MHz 758 ~768MHz 734 ~746MHz 860 ~875MHz 875 ~890MHz 791~ 821MHz 1930~1995MHz 859 ~894MHz 717~728MHz 2350~2360MHz 2570 ~2620MHz 2496 ~2690MHz
3400 ~3600MHz 3600 ~3800MHz 5150~5925MHz 3550~3700MHz 2110~2180MHz 617 ~652MHz
2110 ~2170MHz 1930 ~1990MHz 869894MHz 2620~2690MHz 925 ~960MHz 729 ~746MHz

www.(U)SIMcom.com

Duplex Mode
FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD
FDD FDD FDD FDD FDD FDD FDD
FDD FDD FDD
FDD TDD TDD TDD TDD TDD TDD FDD
FDD FDD FDD FDD FDD FDD FDD

5G n13 5G n14 5G n18 5G n20 5G n25 5G n26 5G n30 5G n38 5G n41 5G n48 5G n66 5G n71 5G n77 5G n78 5G n79 GPS GLONASS Beidou Galileo

746 ~756MHz 758 ~768MHz 815 ~830MHz 832~862MHz 1850 ~1915MHz 814 ~849MHz 2305 ~2315 MHz 2570 ~2620MHz 2496~2690MHz 3550 ~3700MHz 1710~1780MHz 663 ~698 MHz 3300~4200MHz 3300~3800MHz 4400~5000MHz 1574.4 1576.44 MHz 1598~1606MHz 1559~1563MHz 1559~1610MHz

SIM8262A-M2 Series Hardware Design V1.07

777 ~787MHz 788 ~798MHz 860 ~875MHz 791~ 821MHz 1930 ~1995MHz 859 ~894MHz 2350 ~2360 MHz 2570 ~2620MHz 2496~2690MHz 3550 ~3700MHz 2110~2180MHz 617 ~652 MHz 3300~4200MHz 3300~3800MHz 4400~5000MHz

FDD FDD FDD FDD FDD FDD FDD TDD TDD FDD TDD FDD TDD TDD TDD

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

· GNSS Frequency

The following table shows frequency specifications of GNSS antenna interface.

Table 56: GNSS frequency

Type
GPS L1/Galileo/QZSS GPS L5 GLONASS BeiDou/Compass

Frequency
1575.42±1.023MHz 1176.45±10.23MHz 1597.5~1605.8MHz 1561.098±2.046MHz

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

· Antenna Installation

· Antenna Requirements
The following table shows the requirements on 3G/4G/5G antennas and GNSS antenna. Table 57: 3G/4G/5G/GNSS antennas

Parameter
Operating Frequency Direction Gain Impedance Efficiency Max. Input Power VSWR Isolation Cable Insertion Loss <1GHz Cable Insertion Loss 1GHz~2.2GHz Cable Insertion Loss 2.3GHz~2.7GHz Cable Insertion Loss 3.3GHz~6GHz

Requirement
See Table 53, 54 for each antenna Omni Directional > -3dBi (Avg) 50 > 50 % 50W <2 20dB is preferred <1dB <1.5dB <2dB <2.5dB

Table 58: GNSS antenna (for dedicated GNSS antenna only) *

Parameter
Operating Frequency
Direction Antenna Gain Impedance Efficiency Max. Input Power VSWR Polarization Noise Figure for Active Antenna Total Gain for Active Antenna Cable Insertion Loss

Requirement
L1: 1559~1609MHZ L5: 1166~1187MHz Hemisphere, face to sky > 2 dBic 50 > 50 % 50W <2 RHCP or Linear < 1.5 < 17 dB <1.5dB

NOTE 1. “*” means these recommendations are for dedicated GNSS antenna which the application need best of class GNSS tracking performance.
· RF Plug Recommendation
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

SIM826XX/SIM8X80-M2 is mounted with I-PEX’s receptacle RF connectors 20449-001E-03, which size is 2.0mm2.0mm0.6mm. The connector dimensions are shown as below.

Figure 41: 3D view of 20449-001E-03 The following table shows the RF connector’s electrical specifications. Table 59: Electrical Specifications of 20449-001E-03

Item
Voltage Rating Nominal Frequency Range Nominal Impedance Temperature Rating Insulation Resistance Withstanding Voltage Initial Contact Resistance (Without conductor resistance)
Voltage Standing Wave Ratio (V.S.W.R.)

Specification
60V r.m.s. maximum
DC to 6GHz 50
-40°C to +90°C
500 M minimum
No evidence of breakdown Center contact 20.0mmax.Outer contact 20.0mmax. Meet the requirements of1.3max. (DC3GHz) 1.45max.(3GHz6GHz)

To get best RF performance, the RF plug connector should be designed to match the receptacle 20449-001E-03, and the parts come from I-PEX is the recommended. The following is the mechanical information of the Murata’s RF coaxial cable MXHJD3HJ1000 for reference. For further technical support, the customer could visit the Murata’s websitewww.murata.comor contact the local sales
team.

Figure 42: 3D view of MXHJD3HJ1000

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07
4.2.3 RF Cable Assembly Operation
RF cables correct pull and push operation as shown in the following figure. Figure 43: RF cable correct pull and push operation
RF cables error pull and push operation as shown in the following figure.
Figure 44: RF cable error pull and push operation
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07 Use RF cable tool correct pull and push operation as shown in the following figure, for more details, please visit https://www.i-pex.com.
Figure 45: Use RF cable tool correct pull and push operation Use RF cable tool correct pull and push operation as shown in the following figure, for more details, please visit https://www.i-pex.com.
Figure 46: Use RF cable tool error pull and push operation www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

5. Electrical Specifications

· Absolute Maximum Ratings

Absolute maximum rating for digital and analog pins of module are listed in the following table.

Table 60: Absolute maximum ratings

Parameter
Voltage at VBAT pins Voltage at digital pins (GPIO, I2C, UART, I2S) Voltage at digital pins ((U)SIM) Voltage at FULL_CARD_POWER_OFF# Voltage at RESET#

Min.
–

Typ.
–

Max.
4.8 2.1 3.05 4.5 1.9

Unit
V V V V V

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

· Operating Conditions
Table 61: VBAT recommended operating ratings

Parameter
Voltage at VBAT

Min.
3.135

Table 62: 1.8V Digital I/O characteristics

Parameter Description

VIH

High-level input voltage

VIL

Low-level input voltage

VOH

High-level output voltage

VOL

Low-level output voltage

IOZH

High-level, tri-state leakage current (No pull-down

resistor)

IOZL

Low-level, tri-state leakagecurrent (No pull-

up resistor)

IIH

Input high leakage current(No pull-down

resistor)

Input low leakage

IIL

current(No pull-up

resistor)

Min.
1.17 0 1.35 0 –
-1
–
-1

Table 63: Operating temperature
Parameter
Normal operation temperature (3GPP compliant) Extended operation temperature* Storage temperature

Min.
-30 -40 -40

Typ.
3.8
Typ.
–
–
–
–
Typ.
–

Max.
4.4

Unit
V

Max.
2.1 0.63 1.8 0.45 1
–
1

Unit
V V V V uA
uA
uA

–

Max.
70 85 90

Unit

NOTE
1.”*”means the module is able to establish and maintain voice, data transmission, SMS and emergency call, etc. The performance may deviate slightly from the 3GPP specifications and will meet 3GPP specifications again when the temperature returns to normal operating temperature levels. If the module works at an environment higher than 70 , thermal dissipation measure must be taken, and ensure that the temperature of the module CPU is not higher than 100 .

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

· Operating Mode
· Operating Mode Definition

The table below summarizes the various operating modes of SIM826XX/SIM8X80-M2.

Table 64: Operating mode definition

Mode

Function

UMTS/LTE/5G Sleep

Normal operati on

UMTS/LTE/5G Idle
UMTS/LTE/5G Talk

UMTS/LTE/5G Standby
UMTS/LTE/5G Data transmission

Minimum functionality mode

Flight mode
Minimum power consumptionmode Power off

AT command “AT+CSCLK=1” can be used to set the module to a sleepmode. In this case, the current consumption of module will be reducedto a very low level and the module can still receive paging message and SMS
Software is active. Module is registered to the network, and ready tocommunicate Connection between two subscribers is in progress. In this case, thepower consumption depends on network settings such as DTX off/on, FR/EFR/HR, hopping sequences, and antennas Module is ready for data transmission, but no data is currently sent orreceived. In this case, power consumption depends on network settings.
There is data transmission in progress. In this case, power consumption is related to network settings (e.g., power control level); uplink/downlink data rates, etc.
AT command “AT+CFUN=0” can be used to set the module to a minimum functionality mode without removing the power supply. In this mode, the RF part of the module will not work and the (U)SIM card will not be accessible, but USB port are still accessible. The power consumption in this mode is lower than normal mode AT command “AT+CFUN=4” or pulling down the W_DISABLE1# pin can be used to set the module to flight mode without removing the power supply. In this case, the RF part of the module will not work, but the serial port and USB are still available. The power consumption is lower than normal mode In AT+CFUN=0 condition, send AT+CSCLK=1, the module enter minimum power consumption mode. Normally module will go into power off mode by sending the AT command “AT+CPOF” or pull down the FULL_CARD_POWER_OFF#pin. In this mode the power management unit shuts down the power supply, and software is not active. The serial port and USB are notavailable

· Sleep Mode
In sleep mode, the current consumption of the module will be reduced to a very low level.
Several hardware and software conditions must be satisfied in order to let module enter into sleep mode: 14. UART condition www.(U)SIMcom.com

15. USB condition 16. Software condition

SIM8262A-M2 Series Hardware Design V1.07

www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07 NOTE 1. Before designing, pay attention to how to realize sleeping/waking function.
· Minimum Functionality Mode and Flight Mode
Minimum functionality mode ceases a majority of functions of the module, in order to minimize the power consumption. This mode is set by the AT command which provides a choice of 3 different functionality levels. 5 AT+CFUN=0: Minimum functionality 6 AT+CFUN=1: Full functionality (Default) 7 AT+CFUN=4: Flight mode If module has been set to minimum functionality mode, the RF (U)SIM card functions will be closed while USB are still available. If module has been set to flight mode, the RF function will be closed while the (U)SIM card, the serial port and USB are still available. When module is in minimum functionality or flight mode, it can return to full functionality by the AT command “AT+CFUN=1”.
www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

· Current Consumption
The current consumptions are listed in the table below.

Table 65: Module Current consumption on VBAT pins (VBAT=3.8V)

Description
Power off mode GNSS mode (AT+CSCLK=1 & AT+CFUN=0 & Without USB connection) Minimum power consumptionmode (GNSS off & AT+CSCLK = 1 & Without USB connection)
Sleep mode (GNSS off & AT+CSCLK = 1 & Without USB connection)
Idle mode (GNSS off & connection USB)
Idle mode (GNSS off & Without connectionUSB)

Condition
Power off
AT+CGPS=1(DPO mode)
AT+CFUN=0
WCDMA DRX=1.28s WCDMA DRX=2.56s LTE-FDD DRX=0.32s LTE-FDD DRX=0.64s LTE-FDD DRX=1.28s LTE-FDD DRX=2.56s LTE-TDD DRX=0.32s LTE-TDD DRX=0.64s LTE-TDD DRX=1.28s LTE-TDD DRX=2.56s 5G-N78 DRX=0.64s 5G-N78 DRX=1.28s WCDMA LTE FDD LTE TDD 5G NR SA WCDMA LTE FDD LTE TDD 5G NR SA

Typical
128uA
22 mA
3.6mA
4.7mA 4.6mA 7.1mA 5.5mA 4.7mA 4.2mA 7.1mA 5.6mA 4.6mA 4.3mA 7mA 5.5mA 44.62 mA 45.22 mA 45.29 mA 46.07 mA 5.1mA 5.7mA 5.7mA 8mA

SIM8262A-M2 RF Current consumption

HSDPA data
WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8
LTE data
LTE-FDD B1 www.(U)SIMcom.com

@Power 24.08dBm Typical: 837mA @Power 23.93dBm Typical: 861mA @Power 23.98dBm Typical: 811mA @Power 23.78dBm Typical: 809mA @Power 24.08dBm Typical: 808mA
@5MHz 21.3dBm Typical : 812mA

Max
150 uA
25 mA
5.3 mA
6.5 mA 6 mA 12.2 mA 8.5 mA 6.7 mA 6.1 mA 12.2 mA 8.5 mA 6.4 mA 6.1 mA 13.5 mA 9 mA 50 mA 50 mA 50 mA 50 mA 28 mA 28 mA 28 mA 28 mA

LTE-FDD B2
LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19
LTE-FDD B20 www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

@ Hz10M @20M Hz @5MHz
@10M Hz @20M Hz @5MHz
@10M Hz @20M Hz @5MHz
@10M Hz @5MHz @10M Hz @20M Hz @5MHz
@10M Hz @5MHz
@10M Hz @5MHz
@10M Hz @5MHz
@10M Hz @5MHz @10M Hz @5MHz
@10M Hz @5MHz
@10M Hz @5MHz
@10M Hz @20M Hz

21dBm
21dBm
23.1dB m 23.2dB m 23.1dB m 23.3dB m 23.2dB m 23.1dB m 22.2dB m 22.1dB m 22dBm
22dBm
21.8dBm
21.6dB m
21.6dBm
21.9dB m
21.8dBm
22.4dB m
22.3dBm
22.2dB m
22.2dBm
22dBm 21.8dBm
22.2dB m
22.2dBm
22.2dB m
22dBm
21.8dB m
21.9dBm
22.1dBm

Typical : 908mA Typical : 914mA Typical : 838mA Typical : 854mA Typical : 857mA Typical : 809mA Typical : 808mA Typical : 825mA Typical : 458mA Typical : 459mA Typical : 958mA
Typical : 967mA Typical : 946mA Typical : 502mA Typical : 490mA Typical : 502mA Typical : 452mA Typical : 585mA Typical : 590mA Typical : 503mA Typical : 448mA Typical : 458mA Typical : 398mA Typical : 474mA Typical : 489mA Typical : 427mA Typical : 425mA Typical : 491mA Typical : 483mA Typical : 466mA

LTE-FDD B25 LTE-FDD B26 LTE-FDD B30 LTE-TDD B38 LTE-TDD B41 LTE-TDD B42 LTE- TDD B43

@5MHz
@10M Hz @20M Hz @5MHz
@10M Hz @15M Hz @5MHz
@10M Hz @5MHz
@10M Hz @20M Hz @5MHz
@10M Hz @20M Hz @5MHz
@10M Hz @15M Hz @5MHz
@10M Hz

23.1dB m
23.2dBm
23.1dBm
22.1dB m
22.1dBm
21.9dBm
22.2dB m
22.2dBm
23.3dB m
23.3dBm
23.2dBm
22.3dB m
22.1dBm
23dBm
22.1dB m
22.1dBm
21.9dBm
23.2dB m
23.1dBm

SIM8262A-M2 Series Hardware Design V1.07 Typical : 867mA Typical : 856mA Typical : 853mA Typical : 419mA Typical : 458mA Typical : 451mA Typical : 729mA Typical : 730mA Typical : 855mA Typical : 858mA Typical : 842mA Typical : 1025mA Typical : 914mA Typical : 1001mA Typical : 419mA Typical : 458mA Typical : 451mA Typical : 1932mA Typical : 1945mA

www.(U)SIMcom.com

LTE-TDD B46 LTE-TDD B48 LTE-FDD B66 LTE-FDD B71
5G NR data
5G n1 5G n2 5G n5 5G n7 5G n8 5G n12 5G n13 5G n14 5G n18 5G n20 5G n25 5G n26 5G n30 www.(U)SIMcom.com

SIM8262A-M2 Series Hardware Design V1.07

@20MHz
@5MHz @10MHz @20MHz @5MHz @10MHz @20MHz @5MHz @10MHz @20MHz @5MHz @10MHz @20MHz

22.8dBm
23.8dBm 23.8dBm 23.8dBm 23.7dBm 23.8dBm 23.6dBm 21.8dBm 21.6dBm 21.5dBm 21.9dBm 21.9dBm 21.8dBm

Typical : 1936mA
Typical : 673mA Typical : 683mA Typical : 649mA Typical : 1186mA Typical : 1157mA Typical : 1211mA Typical : 854mA Typical : 861mA Typical : 864mA Typical : 543mA Typical : 590mA Typical : 527mA

@5MHz 21.2dBm @20MHz 21.5dBm @40MHz 21.3dBm @5MHz 21.5dBm @15MHz 22.0dBm @20MHz 21.8dBm @5MHz 22.0dBm @10MHz 22.3dBm @20MHz 22.4dBm @5MHz 21.8dBm @10MHz 21.5dBm @20MHz 21.6dBm @5MHz 21.5dBm @10MHz 21.8dBm @20MHz 21.6dBm @5MHz 21.2dBm @15MHz 21.5dBm @5MHz 21.3dBm @10MHz 21.6dBm @5MHz 21.5dBm @10MHz 21.3dBm @5MHz 22.0dBm @10MHz 21.8dBm @20MHz 21.9dBm @5MHz 22.2dBm @10MHz 22.1dBm @20MHz 22.3dBm @5MHz 22.2dBm @10MHz 22.1dBm @20MHz 22.3dBm @5MHz 21.8dBm @10MHz 21.7dBm @20MHz 21.6dBm @5MHz 21.9dBm @10MHz 21.5dBm

Typical: 753mA Typical :770mA Typical :825mA Typical: 866mA Typical: 856mA Typical: 868mA Typical :3861mA Typical :394mA Typical :404mA Typical :689mA Typical :690mA Typical :704mA Typical :502mA Typical :504mA Typical :515mA Typical: 501mA Typical: 532mA Typical: 445mA Typical: 479mA Typical: 447mA Typical: 456mA Typical :420mA Typical :431mA Typical :443mA Typical :406mA Typical :412mA Typical :421mA Typical :698mA Typical :703mA Typical :712mA Typical :466mA Typical :476mA Typical :477mA Typical :625mA Typical :636mA

SIM8262A-M2 Series Hardware Design V1.07

5G n41 5G n48 5G n66 5G n71 5G n77 5G n78 5G n79

@10MHz 22.0dBm Typical :613mA @20MHz 22.1dBm Typical :634mA @40MHz 22.2dBm Typical :645mA @20MHz 25.1dBm Typical :1345mA @60MHz 25.5dBm Typical :1401mA @100MHz 25.2dBm Typical :1491mA @10MHz 22.7dBm Typical :916mA @20MHz 22.5dBm Typical :921mA @40MHz 22.8dBm Typical :933mA @5MH

SIMCom SIM8262A-M2 Series Hardware Design 5G Module User Manual

SIM8262A-M2 Series Hardware Design 5G Module

Product Information

Specifications

Product Usage Instructions

Chapter 1: Introduction

Chapter 2: Getting Started

Chapter 3: Hardware Design

Chapter 4: Troubleshooting

FAQ

Q1: Can I use the SIM8262A-M2 module with any device?

Q2: How do I update the firmware of the SIM8262A-M2

Q3: What is the power consumption of the SIM8262A-M2

References

Read User Manual Online (PDF format)

Download This Manual (PDF format)

SIMcom User Manuals

Related Manuals