RENESAS RA MCU Series RA8M1 Arm Cortex-M85 Microcontrollers User Guide
- June 15, 2024
- RENESAS
Table of Contents
RENESAS RA MCU Series RA8M1 Arm Cortex-M85 Microcontrollers
Product Information
Specifications
- Product Name: Renesas RA Family
- Model : RA MCU Series
Introduction
The Renesas RA Family Design Guide for Sub-Clock Circuits provides
instructions on how to minimize the risk of erroneous operation when using a
low capacitive load (CL) resonator. The sub-clock oscillation circuit has low
gain to reduce power consumption, but it is susceptible to noise. This guide
aims to help users select the appropriate components and design their sub-
clock circuits correctly.
Target Devices
RA MCU Series
Contents
- Component Selection
- External Crystal Resonator selection
- Load Capacitor Selection
- Revision History
Product Usage Instructions
Component Selection
External Crystal Resonator selection
- An external crystal resonator can be used as the sub-clock oscillator source. It should be connected across the XCIN and XCOUT pins of the MCU. The frequency of the external crystal resonator for the sub-clock oscillator must be exactly 32.768 kHz. Please refer to the Electrical Characteristics section of the MCU Hardware User’s Manual for specific details.
- For most RA microcontrollers, an external crystal resonator can also be used as the main clock source. In this case, it should be connected across the EXTAL and XTAL pins of the MCU. The frequency of the main clock external crystal resonator must be within the frequency range specified for the main clock oscillator. Although this document focuses on the sub-clock oscillator, the selection and design guidelines mentioned here can also be applied to the design of the main clock source using an external crystal resonator.
- When selecting a crystal resonator, it is important to consider the unique board design. There are various crystal resonators available that may be suitable for use with RA MCU devices. It is recommended to carefully evaluate the electrical characteristics of the selected crystal resonator to determine the specific implementation requirements.
- Figure 1 shows a typical example of a crystal resonator connection for the sub-clock source, while Figure 2 shows its equivalent circuit.
Load Capacitor Selection
The load capacitor selection is crucial for the correct operation of the
sub-clock circuit with RA MCU devices. Please refer to the Electrical
Characteristics section of the MCU Hardware User’s Manual for specific details
and guidelines on load capacitor
selection.
FAQ
-
Q: Can I use any crystal resonator for the sub-clock oscillator?
A: No, the external crystal resonator for the sub-clock oscillator must have a frequency of exactly 32.768 kHz. Refer to the Electrical Characteristics section of the MCU Hardware User’s Manual for specific details. -
Q: Can I use the same crystal resonator for both the sub-clock oscillator and the main clock oscillator?
A: Yes, for most RA microcontrollers, you can use an external crystal resonator as both the sub-clock oscillator and the main clock oscillator. However, please make sure that the frequency of the main clock external crystal resonator falls within the specified frequency range for the main clock oscillator.
Renesas RA Family
Design Guide for Sub-Clock Circuits
Introduction
The sub-clock oscillation circuit has low gain to reduce power consumption.
Due to the low gain, there is a risk that noise may cause the MCU to operate
erroneously. This document describes how to minimize this risk when using a
low capacitive load (CL) resonator.
Target Devices
RA MCU Series
Component Selection
Component selection is critical to ensure correct operation of the sub-clock circuit with RA MCU devices. The following sections provide guidance to aid in component selection.
External Crystal Resonator selection
An external crystal resonator may be used as the sub-clock oscillator source.
The external crystal resonator is connected across the XCIN and XCOUT pins of
the MCU. The frequency of the external crystal resonator for the sub-clock
oscillator must be exactly 32.768 kHz . Refer to the Electrical
Characteristics section of the MCU Hardware User’s Manual for specific
details.
For most RA microcontrollers, an external crystal resonator may be used as the
main clock source. The external crystal resonator is connected across the
EXTAL and XTAL pins of the MCU. The frequency of the main clock external
crystal resonator must be in the frequency range of the main clock oscillator.
This document focuses on the sub-clock oscillator, but these selection and
design guidelines can also apply to design of the main clock source using an
external crystal resonator.
Selection of a crystal resonator will be largely dependent on each unique
board design. Due to the large selection of crystal resonators available that
may be suitable for use with RA MCU devices, carefully evaluate the electrical
characteristics of the selected crystal resonator to determine the specific
implementation requirements.
Figure 1 shows a typical example of a crystal resonator connection for the sub-clock source.
Figure 2 shows an equivalent circuit for the crystal resonator on the sub- clock circuit.
Figure 3 shows a typical
example of a crystal resonator connection for the main clock source.
Figure 4 shows an equivalent circuit for the crystal resonator on the main clock circuit.
Careful evaluation must be used
when selecting the crystal resonator and the associated capacitors. The
external feedback resistor (Rf) and damping resistor (Rd) may be added if
recommended by the crystal resonator manufacturer.
Selection of the capacitor values for CL1 and CL2 will affect the accuracy of
the internal clock. To understand the impact of the values for CL1 and CL2,
the circuit should be simulated using the equivalent circuit of the crystal
resonator in the figures above. For more accurate results, also take in to
account the stray capacitance associated with the routing between the crystal
resonator components.
Some crystal resonators may have limits on the maximum current provided by the
MCU. If the current provided to these crystal resonators is too high, the
crystal may be damaged. A damping resistor (Rd) may be added to limit the
current to the crystal resonator. Refer to the crystal resonator manufacturer
to determine the value of this resistor.
Load Capacitor Selection
Crystal resonator manufacturers will typically provide a load capacitance (CL)
rating for each crystal resonator. For proper operation of the crystal
resonator circuit, the board design must match the CL value of the crystal.
There are several methods to calculate the correct values for the load
capacitors CL1 and CL2. These calculations take into account the values of the
load capacitors and the stray capacitance (CS) of the board design, which
includes the capacitance of the copper traces and the device pins of the MCU.
One equation to calculate CL is: As an example, if the crystal manufacturer
specifies CL = 14 pF, and the board design has a CS of 5 pF, the resulting CL1
and CL2 would be 18 pF. Section 2.4 in this document provides details for some
verified resonator selections and the associated circuit constants for proper
operation.
There are other factors that will affect the performance of the crystal.
Temperature, component aging, and other environmental factors may change the
performance of a crystal over time and should be accounted for in each
specific design.
To ensure proper operation, each circuit should be tested under the expected
environmental conditions to guarantee correct performance.
Board Design
Component Placement
Placement of the crystal oscillator, load capacitors, and optional resistors
can have a significant impact on the performance of the clock circuit.
For reference within this document, “component side” refers to same side of
the PCB design as the MCU, and “solder side” refers to the opposite side of
the PCB design from the MCU.
It is recommended to place the crystal resonator circuit as close as possible
to the MCU pins on the component side of the PCB. The load capacitors and
optional resistors should also be placed on the component side, and should be
placed between the crystal resonator and the MCU. An alternative is to place
the crystal resonator between the MCU pins and the load capacitors, but
additional ground routing will need to be considered.
Low CL crystal oscillators are sensitive to fluctuations in temperature, which
can affect the stability of the sub-clock circuit. To reduce the influence of
temperature on the sub-clock circuit, keep other components which may produce
excessive heat away from the crystal oscillator. If copper areas are used as a
heat sink for other components, keep the copper heat sink away from the
crystal oscillator.
Routing – Best Practices
This section describes key points on proper layout of a crystal resonator
circuit for RA MCU devices.
XCIN and XCOUT Routing
The following list describes points on routing for XCIN and XCOUT. Figure 5,
Figure 6, and Figure 7 show examples of preferred trace routing for XCIN and
XCOUT. Figure 8 shows an alternate example of trace routing for XCIN and
XCOUT. Identification numbers in the Figures refer to this list.
- Do not cross the XCIN and XCOUT traces with other signal traces.
- Do not add an observation pin or test point to XCIN or XCOUT traces.
- Make the XCIN and XCOUT trace width between 0.1 mm and 0.3 mm. The trace length from the MCU pins to the crystal resonator pins should be less than 10 mm. If 10 mm is not possible, make the trace length as short as possible.
- The trace connected to the XCIN pin and the trace connected to the XCOUT pin should have as much space between them (at least 0.3 mm) as possible.
- Connect external capacitors as close together as possible. Connect the traces for the capacitors to the ground trace (hereinafter referred to as the “ground shield”) on the component side. For details on the ground shield, refer to section 2.2.2. When the capacitors cannot be placed using the preferred placement, use the placement shown in Figure 8.
- In order to decrease the parasitic capacitance between XCIN and XCOUT, include a ground trace between the resonator and the MCU.
Figure 5. Example of Preferred
Placement and Routing for XCIN and XCOUT, LQFP Packages
Figure 6. Example of Preferred Placement and Routing for XCIN and XCOUT, LGA Packages
Figure 7. Example of Preferred Placement and Routing for XCIN and XCOUT, BGA Packages
Figure 8. Example of Alternate Placement and Routing for XCIN and XCOUT
Ground Shield
Shield the crystal resonator with a ground trace. The following list describes
the points regarding the ground shield. Figure 9, Figure 10, and Figure 11
show routing examples for each package. Identification numbers in each figure
refer to this list.
- Lay out the ground shield on the same layer as the crystal resonator trace routing.
- Make the ground shield trace width at least 0.3 mm and leave a 0.3 to 2.0 mm gap between the ground shield and other traces.
- Route the ground shield as close to the VSS pin on the MCU as possible and ensure that the trace width is at least 0.3 mm.
- To prevent current through the ground shield, branch the ground shield and the ground on the board near the VSS pin on the board.
Figure 9. Trace Example for the Ground Shield, LQFP Packages
Figure 10. Trace Example for the Ground Shield, LGA Packages
Figure 11. Trace Example for the Ground Shield, BGA Packages
Bottom Ground
Multilayered Boards at Least 1.2 mm Thick
For boards that are at least 1.2 mm thick, lay out a ground trace on the
solder side (hereinafter referred to as bottom ground) of the crystal
resonator area.
The following list describes points when making a multilayered board that is
at least 1.2 mm thick. Figure 12, Figure 13, and Figure 14 show routing
examples for each package type. Identification numbers in each figure refer to
this list.
- Do not lay out any traces in the middle layers of the crystal resonator area. Do not lay out power supply or ground traces in this area. Do not pass signal traces through this area.
- Make the bottom ground at least 0.1 mm bigger than the ground shield.
- Connect the bottom ground on the solder side only to the ground shield on the component side before connecting it to the VSS pin.
Additional notes
- For LQFP and TFLGA packages, only connect the ground shield to the bottom ground of the component side of the board. Connect the bottom ground to the VSS pin through the ground shield. Do not connect the bottom ground or the ground shield to a ground other than the VSS pin.
- For LFBGA packages, connect the bottom ground directly to the VSS pin. Do not connect the bottom ground or the ground shield to a ground other than the VSS pin.
Figure 12. Routing Example When a Multilayered Board is at Least 1.2 mm Thick, LQFP Packages
Figure 13. Routing Example When a Multilayered Board is at Least 1.2 mm Thick, LGA Packages
Figure 14. Routing Example When a Multilayered Board is at Least 1.2 mm Thick, BGA Packages
Multilayered Boards Less than 1.2 mm Thick
The following describes points when making a multilayered board that is less
than 1.2 mm thick. Figure 15 shows a routing example.
Do not lay out any traces to layers other than the component side for the crystal resonator area. Do not lay out power supply and ground traces in this area. Do not pass signal traces through this area.
Figure 15. Routing Example When a Multilayered Board is Less Than 1.2 mm Thick, LQFP Packages
Other Points
The following list describes other points to consider, and Figure 16 shows a
routing example when using an LQFP package. The same points apply to any
package type. Identification numbers in the figure refer to this list.
- Do not place the XCIN and XCOUT traces near traces that have big changes in current.
- Do not route the XCIN and XCOUT traces parallel to other signal traces, such as those for adjacent pins.
- Traces for pins that are adjacent to the XCIN and XCOUT pins should be routed away from the XCIN and XCOUT pins. Route the traces toward the center of the MCU first, then route the traces away from the XCIN and XCOUT pins. This is recommended to avoid routing of traces parallel to the XCIN and XCOUT traces.
- Lay out as much of the ground trace on the bottom side of the MCU as possible.
Figure 16. Routing Example for Other Points, LQFP Package Example
Main Clock Resonator
This section describes points on routing the main clock resonator. Figure 17
shows a routing example.
- Shield the main clock resonator with a ground.
- Do not connect the ground shield for the main clock resonator to the ground shield for the sub-clock. If the main clock ground shield is connected directly to the sub-clock ground shield, there is a possibility that noise from the main clock resonator may transfer through and affect the sub-clock.
- When placing and routing the main clock resonator, follow the same guidelines as explained for the sub-clock oscillator.
Figure 17. Routing Example When Shielding the Main Clock Resonator with a Ground Shield
Routing – Errors to Avoid
When routing the sub-clock circuit, be cautious to avoid any of the following
points. Routing the traces with any of these issues may cause the low CL
resonator to not oscillate correctly. Figure 18 shows a routing example and
points out the routing errors. Identification numbers in the figure refer to
this list.
- XCIN and XCOUT traces cross other signal traces. (Risk of erroneous operation.)
- Observation pins (test points) are attached to XCIN and XCOUT. (Risk of oscillation stopping.)
- XCIN and XCOUT wires are long. (Risk of erroneous operation or decreased accuracy.)
- The ground shield does not cover the entire area, and where there is a ground shield, the routing is long and narrow. (Easily affected by noise, and there is a risk that accuracy will decrease from the ground potential difference generated by the MCU and external capacitor.)
- Ground shield has multiple VSS connections in addition to the VSS pin. (Risk of erroneous operation from MCU current flowing through the ground shield.)
- Power supply or ground traces are under the XCIN and XCOUT traces. (Risk of losing the clock or oscillation stopping.)
- A trace with a large current is routed nearby. (Risk of erroneous operation.)
- Parallel traces for adjacent pins are close and long. (Risk of losing the clock or oscillation stopping.)
- The middle layers are used for routing. (Risk of oscillation characteristics decreasing or signals operating erroneously.)
Figure 18. Routing Example Showing a High Risk of Erroneous Operation Due to Noise
Reference Oscillation Circuit Constants and Verified Resonator Operation
Table 1 lists the reference oscillation circuit constants for the verified
crystal resonator operation. Figure 1 at the beginning of this document shows
an example circuit for the verified resonator operation.
Table 1. Reference Oscillation Circuit Constants for Verified Resonator Operation
Manufacturer| Series| SMD/ Leaded| Frequency (kHz)| C
L (pF)| C L1 (pF)| C L2 (pF)| R d
(kΩ)
---|---|---|---|---|---|---|---
Kyocera| ST3215S B| SMD| 32.768| 12.5| 22| 22| 0
9| 15| 15| 0
6| 9| 9| 0
7| 10| 10| 0
4| 1.8| 1.8| 0
Note that not all RA MCU devices are listed on the Kyocera website, and sub- clock oscillator recommendations are not listed for most RA MCU devices. Data in this table includes recommendations for other comparable Renesas MCU devices.
The verified resonator operation and reference oscillation circuit constants
listed here are based on information from the resonator manufacturer and are
not guaranteed. As reference oscillation circuit constants are measurements
surveyed under fixed conditions by the manufacturer, values measured in the
user system may vary. To achieve optimum reference oscillation circuit
constants for use in the actual user system, inquire with the resonator
manufacturer to perform an evaluation on the actual circuit.
The conditions in the figure are conditions for oscillating the resonator
connected to the MCU and are not operating conditions for the MCU itself.
Refer to the specifications in the electrical characteristics for details on
the MCU operating conditions.
Clock Crystal Accuracy Measurement
- As recommended by both clock crystal manufacturers and Renesas (in each MCU Hardware User’s Manual), the correct implementation of the clock crystal circuit includes 2 loading capacitors (CL1 and CL2 in the diagram). Previous sections of this document cover capacitor selection. These capacitors directly influence the accuracy of the clock frequency. Loading capacitor values that are too high or too low can have a significant impact on the long-term accuracy of the clock, making the clock less reliable. The value of these capacitors is determined by a combination of the crystal device specification and the board layout, taking into account the stray capacitance of the PCB and the components in the clock path.
- However, to correctly determine the accuracy of a clock circuit, the clock frequency must be measured on real hardware. Direct measurement of the clock circuit will almost definitely result in incorrect measurements. The typical value for the loading capacitors is in the range of 5 pF to 30 pF, and typical oscilloscope probe capacitance values are typically in the range of 5 pF to 15 pF. The additional capacitance of the probe is significant compared to the loading capacitor values and will skew the measurement, leading to incorrect results. The lowest value capacitance oscilloscope probes are still around 1.5 pF capacitance for very high precision probes, which would still potentially skew the measurement results.
- The following is a suggested method for measuring clock frequency accuracy on MCU board products. This procedure eliminates potential measurement error due to capacitive loading added by the measurement probe.
Recommended Test Procedure
Renesas RA microcontrollers include at least one CLKOUT pin. To eliminate the
capacitive loading of the probe on the clock crystal signals, the
microcontroller can be programmed to pass the clock crystal input to the
CLKOUT pin. The MCU board to be tested must include a provision to access this
pin for measurement.
Required Components
- One or more MCU boards for the device to be measured.
- Programming and emulation tools for the device to be measured.
- A frequency counter with at least 6 digit accuracy, with proper calibration.
Test Method
- Program the MCU to connect the clock crystal input for the sub-clock circuit to the CLKOUT pin of the MCU.
- Connect the frequency counter to the CLKOUT pin of the MCU and an appropriate ground. DO NOT connect the frequency counter directly to the clock crystal circuit.
- Configure the frequency counter to measure the frequency on the CLKOUT pin.
- Allow the frequency counter to measure the frequency for several minutes. Record the measured frequency.
This procedure may be used for both sub-clock and main clock crystal
oscillators. To see the effect of the loading capacitor values on clock
crystal accuracy, the test can be repeated with different values for the
loading capacitors. Select the values that provide the most accurate clock
frequency for each clock.
It is also recommended to repeat the procedure on multiple boards of the same
type to improve the validity of the measurements.
Frequency Accuracy Calculations
Frequency accuracy can be calculated using the following formulas.
- fm = measured frequency
- fs = ideal signal frequency
- fe = frequency error
- fa = frequency accuracy, typically expressed in parts per billion (ppb)
Frequency error can be expressed as
Frequency accuracy can be
expressed as 
Frequency accuracy can also be
expressed in deviation from actual time. Deviation, in seconds per year, can
be expressed as
Website and Support
Visit the following URLs to learn about key elements of the RA family,
download components and related documentation, and get support.
- RA Product Information www.renesas.com/ra
- RA Product Support Forum www.renesas.com/ra/forum
- RA Flexible Software Package www.renesas.com/FSP
- Renesas Support www.renesas.com/support
Revision History
| **Rev.** | **Date** | Description |
|---|---|---|
| Page | Summary | |
| 1.00 | Jan.07.22 | — |
| 2.00 | Dec.01.23 | 18 |
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References
- Renesas Electronics Corporation
- Sales & Distributor Directory | Renesas
- Flexible Software Package (FSP) | Renesas
- RA ARM Cortex-M 32-bit MCUs, Cortex-M33, M23 and M4 | Renesas
- Renesas Engineering Community
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