FOXCONN NXP NPC300 Module NFC Near Field Communication User Manual
- June 15, 2024
- foxconn
Table of Contents
- FOXCONN NXP NPC300 Module NFC Near Field Communication
- Product Information
- Product Usage Instructions
- Hardware block diagram
- Electrical Characteristics
- Function timing characteristics
- NFC contactless standard conformance
- Marking Information
- Packing information
- Reliability Test plan
- Federal Communication Commission Interference Statement
- DETACHABLE ANTENNA USAGE
- References
- Read User Manual Online (PDF format)
- Download This Manual (PDF format)
FOXCONN NXP NPC300 Module NFC Near Field Communication
Product Information
Specifications
- Product Name: NFC (NXP NPC300) Module 5.0
- Manufacturer: HongFuJin Precision Industry Co., LTD
- Manufacture Site: ChongQing
- Supported RF protocols: NFC Forum, NCI, ISO/IEC 14443, ISO/IEC 15693
- Frequency : 13.56MHz
Product Usage Instructions
Introduction
The T77H747.10 is an NFC module designed for integration in computer or
portable equipment and consumer devices compliant with NFC standards (NFC
Forum, NCI, ISO/IEC 14443 and ISO/IEC 15693) etc. This module is based on NXP
NPC300 solution, which is a highly integrated transmission module for
contactless communication at 13.56MHz.
Scope
The NFC module RF protocols supported:
- NFC Forum
- NCI
- ISO/IEC 14443
- ISO/IEC 15693
Function
(Remark: Regulatory Certification is not started at this phase)
-
PCB Pattern of NFC Module
The NFC module has a specific PCB pattern for component placement. Please refer to the user manual for detailed information on PCB component placement and stack up. -
Bill of Materials (BOM) of NFC Module
The BOM provides a list of all the materials required for the NFC module. Refer to the user manual for the complete BOM. -
Marking Information
The marking information section provides details on labeling and identification of the NFC module. Refer to the user manual for the specific marking information. -
Packing Information
The packing information section provides details on how the NFC module is packaged for shipping and storage. Refer to the user manual for the specific packing information.
FAQ (Frequently Asked Questions)
-
Q: What are the supported RF protocols?
A: The NFC module supports NFC Forum, NCI, ISO/IEC 14443, and ISO/IEC -
Q: What is the frequency of the NFC module?
A: The NFC module operates at a frequency of 13.56MHz.
NFC
(Near Field Communication)
NXP NPC300 Module
Project Name | NFC (NXP NPC300) Module |
---|---|
Document Rev. | 5.0 |
FOXCONN Part No. | T77H747.10 |
Module Rev. | 005 |
FRU Part No. | 01AX745 |
Customer Part No. | SW10K97523 |
FOXCONN Label Rev | 00S0 |
Prepared by | Reviewed by |
--- | --- |
Bandy.Jiang | Wei.Liao |
Revision History
Revision | Date | Originator | Comment |
---|---|---|---|
1.0 | 2016/01/28 | Smile. Ming | Initial release |
2.0
| ****
2016/04/20
| ****
Bandy.Jiang
| 1> Add pin 1 marking for mechanical drawing.
2> Add SM bus support in addition to I2C bus. (in page 4,5)
3> Add description of pin9 (TX_PWR_REQ) signal with active high 1.8V level output. (in page 15)
4> Change the PN of antenna connector from BM05B-ACHSS-A-GAN-ETF(LF)(SN) to BM05B- ACHKS-A-GAN-ETF(HF)
5> Update material in shielding drawing.
6> Following the latest schematic, update the material description into BOM
7> Add Tray ID label, Carton label, Pallet label into label information
8> Update packing information
3.0
| ****
2016/04/26
| ****
Bandy.Jiang
| 1> Update Module picture in page 18
2> Update packing information in page 23~24
3> Update vendor PN of host interface connector in page 15
4.0
| ****
2016/06/24
| ****
Bandy.Jiang
| 1> Remove R5 from BOM.
2> Change Foxconn project name from T77H747.00 to T77H747.10
3> Change FRU part No. from 00JT548 to 01AX745.
4> Based on above change list, update module picture, BOM, label contents and packing
information.
5.0| 2016/06/28| Bandy. Jiang| 1> Change Host JST part number from ACHR-05V-
A-S to ACHR-05V-A-K(HF) in page 14
| | |
- T77H747.10 is made in China,
- Manufactured by HongFuJin Precision Industry Co., LTD Manufacture Site: ChongQing
- http://www.foxconn.com
Introduction
The T77H747.10 is an NFC module designed for integration in computer or
portable equipment and consumer devices compliant with NFC standards (NFC
Forum, NCI, ISO/IEC 14443 and ISO/IEC 15693) etc. This module is based on NXP
NPC300 solution, which is a highly integrated transmission module for
contactless communication at 13.56MHz.
Scope
The NFC module RF protocols supported
- NFCIP-1, NFCIP-2 protocol
- NFC Forum device 1.3
- ISO/IEC 14443A, ISO/IEC 14443B
- ISO/IEC 15693/ICODE VCD mode
- FeliCa PCD mode/PICC mode
- MIFARE PCD encryption mechanism(MIFARE 1K/4K)
- MIFARE PICC mode
- NFC Forum tag (type 1/type 2/type 3/type 4/type V)
Function
- NFC Features
- Reader & Writer mode
- Peer-to-Peer Communication mode
- Card emulation mode
- • I2C-bus and SM-bus compatible for host Interface
- • Windows 8 Logo Device Requirement compliant
- NFC Forum Wave1 Certification
- LLCP
- SNEP
- • Windows 10 Logo system Requirement compliant
- Peer to Peer Communication over 2cm distance less than 10cm
- • Modular certification
- FCC
- CE
- UL/CB
- meet other regulatory requirements (as defined by 108 countries)
- (Remark: Regulatory Certification is not started at this phase)
- Support Intel Windows 7/8.x/10 platform
- RoHS and Green Compliant
Hardware block diagram
- The T77H747.10 NFC module is based on NXP NPC300 solution with includes ARM microcontroller core, EEPROM, demodulator and decoder, power management unit, host
- interface. This module is powered from the host (5V) and interfaces to the host with I2C -bus compatible signals, on-board 27.12 MHz XTAL. Also includes on board low profile FPC/FFC 12pin connector for host interface and 5pin WTB antenna connector for antenna interface. Form factor: 20.0mm x13.0mm x 2.1mm (typical) NFC module
- Host Interface: I C and SM bus compatible interface with 12-pin FPC connector
- PCB: 4-layers HDI design
- The functional block diagram is shown as below
Electrical Characteristics
- operating conditions
- Absolute Maximum Rating
Symbol | Condition | Min. | Typ. | Max | Unit |
---|---|---|---|---|---|
VBAT | Respect to GND | — | 5.0 | 6.0 | V |
PVDD | Respect to GND | — | 3.3 | 4.35 | V |
ESD Limit Level | HBM | — | — | +/-1.0 | KV |
CDM | — | — | +/-500 | V | |
Operating Temperature | — | 0 | +25 | +70 | ℃ |
Storage Temperature | — | -20 | +25 | +85 | ℃ |
Storage Humidity | — | 0 | — | +85 | % |
Recommended Operating Condition
Symbol | Condition | Min. | Typ. | Max | Unit |
---|---|---|---|---|---|
VBAT | Respect to GND | 4.5 | 5.0 | 5.5 | V |
PVDD | Respect to GND | 3.0 | 3.3 | 3.6 | V |
PMUVCC | Respect to GND | 1.62 | 1.8 | 1.98 | V |
VDD | Respect to GND | 1.65 | 1.8 | 1.95 | V |
VDD(SIM) | Respect to GND | 1.62 | 1.8 | 1.98 | V |
Power Consumption
Condition | Min. | Typ. | Max | Unit |
---|
Power consumption
| Reader mode (PCD active)| —| 130| —| mA
Reader mode (PCD standby)| —| 50| —| uA
Peer to peer mode (active)| —| 130| —| mA
Peer to peer mode
(standby)
| —| 50| —| uA
Continue TX mode| —| 130| —| mA
Hard Power Down mode| —| 10| —| uA
Host interface characteristics
- I2C-bus Interface
- The I2C-bus Interface implements a slave I2C-bus interface with integrated shift register, shift timing generation and slave address recognition.
- I2C-bus Standard mode (100 KHz SCL), Fast mode (400 KHz SCL) and High-speed mode (3.4 MHz SCL) are supported.
- I2C-bus timings
- Here below are timings and frequency specifications.
High-speed mode I2C-bus timing specification
Symbol | Parameter | Conditions | Min | Max | Unit |
---|---|---|---|---|---|
fCLK(HIF4) | Clock frequency on pin HIF4 | I C-bus SCL; Cb <100pF | 0 | 3.4 | MHz |
tSU;STA | Set-up time for a repeated START condition | Cb<100pF | |||
160 | – | ns | |||
tHD;STA | Hold time(repeated) START condition | Cb<100pF | 160 | – | ns |
tLOW | LOW period of the SCL clock | Cb<100pF | 160 | – | ns |
tHIGH | HIGH period of the SCL clock | Cb<100pF | 60 | – | ns |
tSU;DAT | Date set-up time | Cb<100pF | 10 | – | ns |
tHD;DAT | Data hold time | Cb<100pF | 0 | – | ns |
tr(HIF3) | Rise time on pin HIF3 | I C-bus SDA; C <100pF b | 10 | 80 | ns |
tf(HIF3) | Fall time on pin HIF3 | I C-bus SDA; C <100pF b | 10 | 80 | ns |
Vhys | Hysteresis voltage | Schmitt trigger inputs; Cb<100pF | |||
0.1*VPVDD | – | V |
Fast mode I2C-bus timing specification
Symbol | Parameter | Conditions | Min | Max | Unit |
---|---|---|---|---|---|
fCLK(HIF4) | Clock frequency on pin HIF4 | I C-bus SCL; Cb <400pF | 0 | 400 | KHz |
tSU;STA | Set-up time for a repeated START condition | Cb<400pF | |||
600 | – | ns | |||
tHD;STA | Hold time(repeated) START condition | Cb<400pF | 600 | – | ns |
tLOW | LOW period of the SCL clock | Cb<400pF | 1.3 | – | ns |
tHIGH | HIGH period of the SCL clock | Cb<400pF | 600 | – | ns |
tSU;DAT | Date set-up time | Cb<400pF | 100 | – | ns |
tHD;DAT | Data hold time | Cb<400pF | 0 | 900 | ns |
Vhys | Hysteresis voltage | Schmitt trigger inputs; Cb<400pF | 0.1* | ||
VPVDD | – | V |
Power-up sequence
- There are 2 different supplies for module which allows set up independently, therefore different power-up sequences have to be considered. 1> VBAT is set up before PVDD
- This is at least the case when VBAT pin is directly connected to the battery and when module VBAT is always supplied as soon the system is supplied.
- As VEN pin is referred to VBAT pin, VEN voltage shall go high after VBAT has been set.
- 2> PVDD and VBAT are set up in the same time
- It is at least the case when VBAT pin is connected to a PMU/regulator which also supplies PVDD.
Power-down sequence
Function timing characteristics
Reset timing
Symbol | Parameter | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
tW(VEN) | VEN pulse width | To reset | 10 | – | – | us |
tboot | Boot time | – | – | 2.5 | ms |
Power-up timings
Symbol | Parameter | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
tt(VBA T – V E N) | Transition time from pin VBAT to pin VEN |
- VBAT,VEN
- Voltage=HIGH
| 0| 0.5| –| ms
tt(VPV D D – V E N)| Transition time from pin PVDD to pin VEN|
- PVDD,VEN
- Voltage=HIGH
| 0| 0.5| –| ms
tt(VBA T – V P V D D )| Transition time from pin VBAT to pin PVDD|
- VBAT,PVDD
- Voltage=HIGH
| 0| 0.5| –| ms
Power-down timings
Symbol | Parameter | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
tVBAT(L) | Time VBAT LOW | 20 | – | – | ms |
Download mode timings
Symbol | Parameter | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Tt(DWL_REQ-VEN) | Transition time from pin DWL_REQ to pin VEN |
- DWL_REQ,VEN
- voltage=HIGH
| 0| 0.5| –| ms
NFC contactless standard conformance
Frequency interoperability
- When in communication, NFC module is generating some RF frequencies. It is also sensitive to some RF signals as it is looking from data in the field.
- In order to avoid interference with others RF communication, it is required to tune the antenna matching for antenna board.
- (Remark: The antenna matching tuning is responsible for antenna vendor)
- It must limit the RF frequency dispersion to 13.56MHz +/-50ppm.
Supported smart card types
Card Types| Read CSN
(Card Serial Number)
| Read/Write application data area| Supported baud rates
---|---|---|---
NFC Forum Type1 Tag| Yes| Yes| 106 kbps
NFC Forum Type2 Tag| Yes| Yes| 106 kbps
NFC Forum Type3 Tag| Yes| Yes| 212, 424 kbps
NFC Forum Type4 Tag| Yes| Yes| 106 kbps
NFC Forum TypeV Tag| Yes| Yes| 106 kbps
ISO/IEC 14443 Type A
compliance cards
| Yes| Yes (with application)| 106 kbps
Mifare Classics 1K,4K| Yes| Yes (with application)| 106 kbps
Mifare DESFire| Yes| Yes (with application)| 106 kbps
Mifare Ultralight| Yes| Yes (with application)| 106 kbps
Mifare Plus| Yes| Yes (with application)| 106 kbps
(Mifare) SmartMX| Yes| Yes (with application)| 106 kbps
ISO/IEC 14443 Type B
compliance cards
| Yes| Yes (with application)| 106 kbps
FeliCa general card| Yes| Yes (with application)| 212, 424 kbps
FeliCa Edy card| Yes| Yes (with application)| 212, 424 kbps
FeliCa Suica card| Yes| Yes (with application)| 212, 424 kbps
FeliCa PKI Option card| Yes| Yes (with application)| 212, 424 kbps
HID iCLASS Seos| Yes| Yes (with application)| 106 kbps
Contactless interface unit
- The NFC module supports various communication modes at different transfer speeds and modulation schemes. The following chapters give more detailed overview of selected communication modes.
- 1> Reader/Writer communication modes
Generally 5 reader/writer communication modes are supported:
- 1> Reader/Writer communication modes
- Generally 5 reader/writer communication modes are supported:
- PCD reader/writer for ISO/IEC 14443A/MIFARE
- The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s.
- PCD reader/writer for ISO/IEC 14443B
- The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s.
- PCD reader/writer for Jewel/Topaz tags
- The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s.
- PCD reader/writer for FeliCa cards
- The transfer speed includes 212 kbit/s, 424 kbit/s.
- VCD reader/writer for ISO/IEC 15693/ICODE
- The transfer speed includes 1.65 kbit/s, 26.48 kbit/s.
- 2> Peer to Peer communication modes
- (ISO/IEC 18092, Ecma 340 NFCIP-1 communication modes)
An NFCIP-1 communication takes place between 2 devices
- NFC initiator: generates RF field at 13.56 MHz and starts the NFCIP-1communication.
- NFC Target: responds to NFC initiator command either in a load modulation scheme in Passive communication mode or using a self-generated and self-modulated RF field for
- Active communication mode.
- The NFCIP-1 communication differentiates between Active and Passive communication modes.
- Active communication mode means both the NFC initiator and the NFC target are using their own RF field to transmit data
- Passive communication mode means that the NFC target answers to an NFC initiator command in a load modulation scheme. The NFC initiator is active is terms of generating the RF field.
- The NFC module supports the Active Target, Active Initiator, Passive Target and Passive Initiator communication modes at the transfer speeds 106 kbit/s, 212 kbit/s and 424 kbit/s.
3> Card communication modes
- The NFC module can be addressed as an ISO/IEC 14443A or ISO/IEC 14443B cards. This means that NFC module can generate an answer in a load modulation scheme.
- The transfer speed includes 106 kbit/s, 212 kbit/s and 424 kbit/s.
Mechanical Architecture
- Module Mechanical Drawing
- Dimension (WxL): 20mm x 13mm,
- Module Max Thickness: 2.2mm
Antenna interface of NFC module
- 1> Antenna connector
- Manufacturer: JST Manufacturer PN: BM05B-ACHKS-A-GAN-ETF(HF)
Connector Type | Manufacture PN | Size |
---|---|---|
ACH connector SMT type with 1.2mm pitch | JST : BM05B-ACHKS-A-GAN- ETF(HF) |
7.8mm x 4.3mm x 1.5mm
Connector 2D drawing
Pin definition:
Pin | Symbol | I/O | Refer | Note |
---|---|---|---|---|
1 | RXP | I | VDD | Positive receiver input |
2 | TX1 | O | VDD | Antenna output1 |
3 | GND | G | N/A | Ground |
4 | TX2 | O | VDD | Antenna output2 |
5 | RXN | I | VDD | Negative receiver input |
S1 | GND | G | N/A | Ground |
S2 | GND | G | N/A | Ground |
- Remark:
- P = power supply,
- G = ground,
- I = input,
- O = output, I/O = input/output
2 > Recommend Antenna cable design.
Host interface of NFC module
- 1> Host interface connector
- Manufacturer: KYOCERA Manufacturer PN: 046811612000846 +
Connector | Manufacture PN | Size |
---|---|---|
FPC/FFC connector SMT type with 0.5mm pitch | KYOCERA: 046811612000846+ |
11.73mm x 4.79mm x 1.28mm
Remark: The connector is bottom conduct with golden plating of FPC cable
Pin | Symbol | Pin Type | Refer | Description |
---|---|---|---|---|
1 | VBAT | Input Power | N/A | Power supply from system (4.5V – 5.5V) |
2 | PVDD | Input Power | N/A | Power supply to I/O (3.0V – 3.6V) |
3 | I2C_SDA | I/O | PVDD | I2C data |
4 | I2C _SCL | I | PVDD | I2C clock |
5 | GND | G | N/A | Ground |
6 | IRQ | O | PVDD | Interrupt from NFC module to the host (Host_Wake) |
7 | NFC_Presence | G | N/A | Connect to ground for NFC module presence bit (Low |
active)
8| VEN| I| VBAT| Reset pin. Set the device in Hard Power Down
9| TX_PWR_REQ| O| VDD|
- (External TX power supply request) (Active high 1.8V level output)
- Indicates NFC busy state during NFC communication to touchpad.
10| PMUVCC| Input Power| N/A| Power supply to UICC(1.78V~3.3V)
11| SWIO_UICC| I/O| VDD(SIM)| SWP data connection to SIM
12| DWL_REQ| I| PVDD| Firmware download control pin
S1| GND| G| N/A| Ground
S2| GND| G| N/A| Ground
Remark: P = power supply, G = ground, I = input, O = output, I/O = input/output
- 2> Pin characteristics
- VEN input pin characteristics
Symbol | Parameter | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
VIH | HIGH-level input voltage | 1.1 | – | VBAT | V | |
VIL | LOW-level input voltage | 0 | – | 0.4 | V | |
IIH | HIGH-level input current | VEN voltage=VBAT | – | – | 1 | µA |
IIL | LOW-level input current | VEN voltage=0V | 1 | – | – | µA |
Ci | Input capacitance | – | 5 | – | pF |
Remark: P = power supply, G = ground, I = input, O = output, I/O = input/output
2 > Pin characteristics
VEN input pin characteristics
Symbol | Parameter | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
VIH | HIGH-level input voltage | 1.1 | – | VBAT | V | |
VIL | LOW-level input voltage | 0 | – | 0.4 | V | |
IIH | HIGH-level input current | VEN voltage=VBAT | – | – | 1 | µA |
IIL | LOW-level input current | VEN voltage=0V | 1 | – | – | µA |
Ci | Input capacitance | – | 5 | – | pF |
Pin characteristics for IRQ, and TX_PWR_REQ
Symbol | Parameter | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
VOH | HIGH-level output voltage | IOH<3mA | – | – | – | – |
IRQ and CLK_REQ pin | VPVDD -0.4 | – | VPVDD | V | ||
TX_PW R_REQ pin | VDD-0.4 | – | VDD | V | ||
VOL | LOW-level output voltage | IOL<3mA | 0 | – | 0.4 | V |
CL | Load capacitance | – | – | 20 | pF | |
tf | Fall time | CL=12pF max | ||||
High speed | 1 | – | 3.5 | ns | ||
Low speed | 2 | – | 10 | ns | ||
tr | Rise time | CL=12pF max | ||||
High speed | 1 | – | 3.5 | ns | ||
Low speed | 2 | – | 10 | ns | ||
Rpd | Pull-down resistance | IRQ and CLK_REQ pins [1] | 0.35 | – | 0.85 |
MΩ
TX_PW R_REQ pin [1]| 55| –| 120| kΩ
Activated in HPO and Monitor states.
Input pin characteristics for DWL_REQ
Symbol | Parameter | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
VIH | HIGH-level input voltage | VPVDD=1.8V | 0.65*VPVDD | – | – | V |
VIL | LOW-level input voltage | V PVDD=1.8V | – | – | 0.35*VPVDD | V |
VIH | HIGH-level input voltage | VPVDD=3V | 2 | – | – | V |
VIL | LOW-level input voltage | VPVDD=3V | – | – | 0.8 | V |
IIH | HIGH-level input current | – | – | 1 | µA | |
IIL | LOW-level input current | 1 | – | – | µA | |
Ci | Input capacitance | – | 5 | – | pF | |
Rpd | Pull down resistance | Extra pull-down | 0.35 | – | 0.85 | MΩ |
Pin characteristics for HIF3(used as I2C-bus SDA) and HIF4(used as I2C-bus SCL)
Symbol | Parameter | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
VOL | LOW-level output voltage | IOL<3mA [1] | 0 | – | 0.4 | V |
CL | Load capacitance | – | – | 10 | pF | |
tf | Fall time |
- CL=100 pF; [1]
- Rpull-up=2kΩ; Standard and Fast mode
| 30| –| 250| ns
- CL=100 pF; [1]
- Rpull-up=1kΩ; High-speed mode
| 80| –| 110| ns
tr| Rise time|
- CL=100 pF; [1]
- Rpull-up=2kΩ; Standard and Fast mode
| 30| –| 250| ns
- CL=100 pF; [1]
- Rpull-up=1kΩ; High-speed mode
| 10| –| 100| ns
VIH| HIGH-level input voltage| | 0.7 VPVDD| –| VPVDD| V
VIL| LOW-level input voltage| | 0| –| 0.3VPVDD| V
IIH| HIGH-level input current| VI= VPVDD; high impedance| –| –| 1| µA
IIL| LOW-level input current| VI=0V; high impedance| -1| –| –| µA
Ci| Input capacitance| | –| 5| –| pF
Only for pin HIF3(I2C-bus SDA), HIF4(I2C-bus SCL) is only used as input.
SWIO_UICC pin characteristics
Symbol | Parameter | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
VOH | HIGH-level output voltage |
- IIH=1mA; [1]
- IDD(SIM)=50mA;
- VDD(SIM_PMU)=2.75V;
- VDD(SIM_PMU) in class B
| 1.4| –| –| V
VOH| HIGH-level output voltage|
- ISIM_SWIO=1mA; [1]
- IDD(SIM)=30mA;
- VDD(SIM_PMU)=1.67V;
- VDD(SIM_PMU) in class C
| 0.85 VDD(SIM)| –| –| V
VOH| HIGH-level output voltage|
- IIH =1mA; [1]
- IDD(SIM)=5mA;
- VDD(SIM_PMU)=0V;
- VDD(SIM)-VDDD
| 0.85 VDD(SIM)| –| –| V
VOL| LOW-level output voltage| 0µA<IIL<20Μa [1]| –| –| 0.15VDD(SIM)| V
I[I1H] To allow| HIGH-level output voltage| | ––0.3V and V| 300| –| µA
3 > Recommend FPC cable
Shielding Cover of NFC module
- Dimension (L x W x H): 11.69mm x 7.88mm x 1.35mm,
- Thickness: 0.15mm
- Materials: KU360S
Picture of NFC module
Marking Information
Label information
Carton label: P/N:503.00098.005
- A.XXXXXXXX : the Foxconn MO(I. 473)
- B.Qty : XXX XXX the quantity of product in carton(carton? Magnet at)
- Barcode content: The quantity of product in carton (carton abraham)
- C.REV :WSS W:the engineering version(refer to Foxconn label Rev column in the cover of the MFG document) SS:the version of A300/A400 product(refer to Doc Rev.in the cover of MFG document)
- D.CIPPYWWXXXX C+ production location + production line + production year + production week + Serial Number(Base on 36)
- C: carton I: production location(refer to attachment of the last page)
- PP :Production line
- YWW: Production year & production week
- XXXX : Serial number(Base on 36, every two week reset to 0001)
Pallet label: P/N:503.00089.005
- Follow Foxconn standard PIPPYWWXXXX: P+ production location + production line + production year + production week + Serial Number(Base on 36)
- P: Pallet
- I: Production location (refer to attachment on page 3)
- PP: production line Y: the last digital of production year
- WW: production week
- XXXX: Serial number(Base on 36,every two week reset to 0001)
- VSS: W : the engineering version (refer to Foxconn label Rev column in the cover of the MFG document)
- SS: the version of A300/A400 product (refer to Doc Rev.in the cover of MFG document)
Packing information
Reliability Test plan
Notice
- Operating Temperature Conditions
- The product shall be capable of continuous reliable operation when operating in ambient temperature of 0°C to 70°C.
- Non-Operating Temperature Conditions
- Neither subassembly shall be damaged nor shall the operational performance be degraded when restored to the operating temperature when exposed to storage temperature in the range of -20°C to +85°C.
- Operating Humidity Conditions
- The product shall be capable of continuous reliable operation when subjected to relative humidity in the range of 0% and 85% non-condensing.
- Handling Environment
- Please make sure to avoid mechanical shock and vibration for this module.
- Please do not drop the module.
- Please do not clean the module.
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
- This device may not cause harmful interference, and
- This device must accept any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
- If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the
party responsible for compliance could void the user’s authority to operate
this equipment.
This transmitter must not be co-located or operating in conjunction with any
other antenna or transmitter.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. This equipment should be installed and operated with
a minimum distance of 20cm between the radiator & your body.
Radiation Exposure Statement
- The product complies with the FCC portable RF exposure limit set forth for an uncontrolled environment and is safe for intended operation as described in this manual. Further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such a function is available.
- This device is intended only for OEM integrators under the following conditions
- The antenna must be installed such that 20 cm is maintained between the antenna and users, and The transmitter module may not be collocated with any other transmitter or antenna.
- As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed
- IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
- This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID:MCLT77H747”. The grantee’s FCC ID can be used only when all FCC compliance requirements are met.
Manual Information To the End User
- The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
Industry Canada statement
This device complies with ISED’s licence-exempt RSSs.
Operation is subject to the following two conditions
- This device may not cause harmful interference, and
- This device must accept any interference received, including interference that may cause undesired operation.
Radiation Exposure Statement
- This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment.
- This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
Radiation Exposure Statement
The product complies with the Canada portable RF exposure limit set forth for
an uncontrolled environment and is safe for intended operation as described in
this manual. Further RF exposure reduction can be achieved if the product can
be kept as far as possible from the user’s body or by setting the device to
lower output power if such a function is available.
- The antenna must be installed such that 20 cm is maintained between the antenna and users, and
- The transmitter module may not be co-located with any other transmitter or antenna.
- As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
IMPORTANT NOTE
- In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.
- End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains IC: 2878D-T77H747”
Manual Information To the End User
- The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
- The end user manual shall include all required regulatory information/warning as show in this manual.
- This radio transmitter (IC: 2878D-T77H747, Model: T77H747) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
DETACHABLE ANTENNA USAGE
- This radio transmitter (IC: 2878DT77H747 / Model: T77H747) has been approved by ISED to operate with the antenna type listed below with maximum permissible gain indicated.
- Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
References
Read User Manual Online (PDF format)
Read User Manual Online (PDF format) >>