FOXCONN NXP NPC300 Module NFC Near Field Communication User Manual

June 15, 2024
foxconn

FOXCONN NXP NPC300 Module NFC Near Field Communication

Product Information

Specifications

  • Product Name: NFC (NXP NPC300) Module 5.0
  • Manufacturer: HongFuJin Precision Industry Co., LTD
  • Manufacture Site: ChongQing
  • Supported RF protocols: NFC Forum, NCI, ISO/IEC 14443, ISO/IEC 15693
  • Frequency : 13.56MHz

Product Usage Instructions

Introduction
The T77H747.10 is an NFC module designed for integration in computer or portable equipment and consumer devices compliant with NFC standards (NFC Forum, NCI, ISO/IEC 14443 and ISO/IEC 15693) etc. This module is based on NXP NPC300 solution, which is a highly integrated transmission module for contactless communication at 13.56MHz.

Scope
The NFC module RF protocols supported:

  • NFC Forum
  • NCI
  • ISO/IEC 14443
  • ISO/IEC 15693

Function
(Remark:
Regulatory Certification is not started at this phase)

  • PCB Pattern of NFC Module
    The NFC module has a specific PCB pattern for component placement. Please refer to the user manual for detailed information on PCB component placement and stack up.

  • Bill of Materials (BOM) of NFC Module
    The BOM provides a list of all the materials required for the NFC module. Refer to the user manual for the complete BOM.

  • Marking Information
    The marking information section provides details on labeling and identification of the NFC module. Refer to the user manual for the specific marking information.

  • Packing Information
    The packing information section provides details on how the NFC module is packaged for shipping and storage. Refer to the user manual for the specific packing information.

FAQ (Frequently Asked Questions)

  1. Q: What are the supported RF protocols?
    A: The NFC module supports NFC Forum, NCI, ISO/IEC 14443, and ISO/IEC

  2. Q: What is the frequency of the NFC module?
    A: The NFC module operates at a frequency of 13.56MHz.

NFC
(Near Field Communication)
NXP NPC300 Module

Project Name NFC (NXP NPC300) Module
Document Rev. 5.0
FOXCONN Part No. T77H747.10
Module Rev. 005
FRU Part No. 01AX745
Customer Part No. SW10K97523
FOXCONN Label Rev 00S0
Prepared by Reviewed by
--- ---
Bandy.Jiang Wei.Liao

Revision History

Revision Date Originator Comment
1.0 2016/01/28 Smile. Ming Initial release






2.0

| ****






2016/04/20

| ****






Bandy.Jiang

| 1> Add pin 1 marking for mechanical drawing.

2> Add SM bus support in addition to I2C bus. (in page 4,5)

3> Add description of pin9 (TX_PWR_REQ) signal with active high 1.8V level output. (in page 15)

4> Change the PN of antenna connector from BM05B-ACHSS-A-GAN-ETF(LF)(SN) to BM05B- ACHKS-A-GAN-ETF(HF)

5> Update material in shielding drawing.

6> Following the latest schematic, update the material description into BOM

7> Add Tray ID label, Carton label, Pallet label into label information

8> Update packing information


3.0

| ****

2016/04/26

| ****

Bandy.Jiang

| 1> Update Module picture in page 18

2> Update packing information in page 23~24

3> Update vendor PN of host interface connector in page 15




4.0

| ****



2016/06/24

| ****



Bandy.Jiang

| 1> Remove R5 from BOM.

2> Change Foxconn project name from T77H747.00 to T77H747.10

3> Change FRU part No. from 00JT548 to 01AX745.

4> Based on above change list, update module picture, BOM, label contents and packing

information.

5.0| 2016/06/28| Bandy. Jiang| 1> Change Host JST part number from ACHR-05V- A-S to ACHR-05V-A-K(HF) in page 14
| | |

  • T77H747.10 is made in China,
  • Manufactured by HongFuJin Precision Industry Co., LTD Manufacture Site: ChongQing
  • http://www.foxconn.com

Introduction
The T77H747.10 is an NFC module designed for integration in computer or portable equipment and consumer devices compliant with NFC standards (NFC Forum, NCI, ISO/IEC 14443 and ISO/IEC 15693) etc. This module is based on NXP NPC300 solution, which is a highly integrated transmission module for contactless communication at 13.56MHz.
Scope
The NFC module RF protocols supported

  • NFCIP-1, NFCIP-2 protocol
  • NFC Forum device 1.3
  • ISO/IEC 14443A, ISO/IEC 14443B
  • ISO/IEC 15693/ICODE VCD mode
  • FeliCa PCD mode/PICC mode
  • MIFARE PCD encryption mechanism(MIFARE 1K/4K)
  • MIFARE PICC mode
  • NFC Forum tag (type 1/type 2/type 3/type 4/type V)

Function

  • NFC Features
    • Reader & Writer mode
    • Peer-to-Peer Communication mode
    • Card emulation mode
  • • I2C-bus and SM-bus compatible for host Interface
  • • Windows 8 Logo Device Requirement compliant
    • NFC Forum Wave1 Certification
    • LLCP
    • SNEP
  • • Windows 10 Logo system Requirement compliant
    • Peer to Peer Communication over 2cm distance less than 10cm
  • • Modular certification
    • FCC
    • CE
    • UL/CB
    • meet other regulatory requirements (as defined by 108 countries)
    • (Remark: Regulatory Certification is not started at this phase)
  • Support Intel Windows 7/8.x/10 platform
  • RoHS and Green Compliant

Hardware block diagram

  • The T77H747.10 NFC module is based on NXP NPC300 solution with includes ARM microcontroller core, EEPROM, demodulator and decoder, power management unit, host
  • interface. This module is powered from the host (5V) and interfaces to the host with I2C -bus compatible signals, on-board 27.12 MHz XTAL. Also includes on board low profile FPC/FFC 12pin connector for host interface and 5pin WTB antenna connector for antenna interface. Form factor: 20.0mm x13.0mm x 2.1mm (typical) NFC module
    • Host Interface: I C and SM bus compatible interface with 12-pin FPC connector
    • PCB: 4-layers HDI design
  • The functional block diagram is shown as belowFOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-image-1

Electrical Characteristics

  • operating conditions
    • Absolute Maximum Rating
Symbol Condition Min. Typ. Max Unit
VBAT Respect to GND 5.0 6.0 V
PVDD Respect to GND 3.3 4.35 V
ESD Limit Level HBM +/-1.0 KV
CDM +/-500 V
Operating Temperature 0 +25 +70
Storage Temperature -20 +25 +85
Storage Humidity 0 +85 %

Recommended Operating Condition

Symbol Condition Min. Typ. Max Unit
VBAT Respect to GND 4.5 5.0 5.5 V
PVDD Respect to GND 3.0 3.3 3.6 V
PMUVCC Respect to GND 1.62 1.8 1.98 V
VDD Respect to GND 1.65 1.8 1.95 V
VDD(SIM) Respect to GND 1.62 1.8 1.98 V

Power Consumption

Condition Min. Typ. Max Unit

Power consumption

| Reader mode (PCD active)| —| 130| —| mA
Reader mode (PCD standby)| —| 50| —| uA
Peer to peer mode (active)| —| 130| —| mA
Peer to peer mode

(standby)

| —| 50| —| uA
Continue TX mode| —| 130| —| mA
Hard Power Down mode| —| 10| —| uA

Host interface characteristics

  • I2C-bus Interface
  • The I2C-bus Interface implements a slave I2C-bus interface with integrated shift register, shift timing generation and slave address recognition.
  • I2C-bus Standard mode (100 KHz SCL), Fast mode (400 KHz SCL) and High-speed mode (3.4 MHz SCL) are supported.
  • I2C-bus timings
  • Here below are timings and frequency specifications.FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-image-2

High-speed mode I2C-bus timing specification

Symbol Parameter Conditions Min Max Unit
fCLK(HIF4) Clock frequency on pin HIF4 I C-bus SCL; Cb <100pF 0 3.4 MHz
tSU;STA Set-up    time    for    a    repeated START condition Cb<100pF
160 ns
tHD;STA Hold     time(repeated)     START condition Cb<100pF 160 ns
tLOW LOW period of the SCL clock Cb<100pF 160 ns
tHIGH HIGH period of the SCL clock Cb<100pF 60 ns
tSU;DAT Date set-up time Cb<100pF 10 ns
tHD;DAT Data hold time Cb<100pF 0 ns
tr(HIF3) Rise time on pin HIF3 I C-bus SDA; C <100pF b 10 80 ns
tf(HIF3) Fall time on pin HIF3 I C-bus SDA; C <100pF b 10 80 ns
Vhys Hysteresis voltage Schmitt      trigger      inputs; Cb<100pF
0.1*VPVDD V

Fast mode I2C-bus timing specification

Symbol Parameter Conditions Min Max Unit
fCLK(HIF4) Clock frequency on pin HIF4 I C-bus SCL; Cb <400pF 0 400 KHz
tSU;STA Set-up    time    for    a    repeated START condition Cb<400pF
600 ns
tHD;STA Hold     time(repeated)     START condition Cb<400pF 600 ns
tLOW LOW period of the SCL clock Cb<400pF 1.3 ns
tHIGH HIGH period of the SCL clock Cb<400pF 600 ns
tSU;DAT Date set-up time Cb<400pF 100 ns
tHD;DAT Data hold time Cb<400pF 0 900 ns
Vhys Hysteresis voltage Schmitt      trigger      inputs; Cb<400pF 0.1*
VPVDD V

Power-up sequence

  • There are 2 different supplies for module which allows set up independently, therefore different power-up sequences have to be considered. 1> VBAT is set up before PVDD
  • This is at least the case when VBAT pin is directly connected to the battery and when module VBAT is always supplied as soon the system is supplied.
  • As VEN pin is referred to VBAT pin, VEN voltage shall go high after VBAT has been set. FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-image-3
  • 2> PVDD and VBAT are set up in the same time
  • It is at least the case when VBAT pin is connected to a PMU/regulator which also supplies PVDD.FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-image-4

Power-down sequence

FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-
image-5

Function timing characteristics

Reset timing

Symbol Parameter Conditions Min Typ Max Unit
tW(VEN) VEN pulse width To reset 10 us
tboot Boot time 2.5 ms

Power-up timings

Symbol Parameter Conditions Min Typ Max Unit
tt(VBA T – V E N) Transition time from pin VBAT to pin VEN
  • VBAT,VEN
  • Voltage=HIGH

| 0| 0.5| –| ms
tt(VPV D D – V E N)| Transition time from pin PVDD to pin VEN|

  • PVDD,VEN
  • Voltage=HIGH

| 0| 0.5| –| ms
tt(VBA T – V P V D D )| Transition time from pin VBAT to pin PVDD|

  • VBAT,PVDD
  • Voltage=HIGH

| 0| 0.5| –| ms

Power-down timings

Symbol Parameter Conditions Min Typ Max Unit
tVBAT(L) Time VBAT LOW 20 ms

Download mode timings

Symbol Parameter Conditions Min Typ Max Unit
Tt(DWL_REQ-VEN) Transition       time       from      pin DWL_REQ to pin VEN
  • DWL_REQ,VEN
  • voltage=HIGH

| 0| 0.5| –| ms

NFC contactless standard conformance

Frequency interoperability

  • When in communication, NFC module is generating some RF frequencies. It is also sensitive to some RF signals as it is looking from data in the field.
  • In order to avoid interference with others RF communication, it is required to tune the antenna matching for antenna board.
  • (Remark: The antenna matching tuning is responsible for antenna vendor)
  • It must limit the RF frequency dispersion to 13.56MHz +/-50ppm.

Supported smart card types

Card Types| Read CSN

(Card Serial Number)

| Read/Write application data area| Supported baud rates
---|---|---|---
NFC Forum Type1 Tag| Yes| Yes| 106 kbps
NFC Forum Type2 Tag| Yes| Yes| 106 kbps
NFC Forum Type3 Tag| Yes| Yes| 212, 424 kbps
NFC Forum Type4 Tag| Yes| Yes| 106 kbps
NFC Forum TypeV Tag| Yes| Yes| 106 kbps
ISO/IEC     14443     Type     A

compliance cards

| Yes| Yes (with application)| 106 kbps
Mifare Classics 1K,4K| Yes| Yes (with application)| 106 kbps
Mifare DESFire| Yes| Yes (with application)| 106 kbps
Mifare Ultralight| Yes| Yes (with application)| 106 kbps
Mifare Plus| Yes| Yes (with application)| 106 kbps
(Mifare) SmartMX| Yes| Yes (with application)| 106 kbps
ISO/IEC     14443     Type     B

compliance cards

| Yes| Yes (with application)| 106 kbps
FeliCa general card| Yes| Yes (with application)| 212, 424 kbps
FeliCa Edy card| Yes| Yes (with application)| 212, 424 kbps
FeliCa Suica card| Yes| Yes (with application)| 212, 424 kbps
FeliCa PKI Option card| Yes| Yes (with application)| 212, 424 kbps
HID iCLASS Seos| Yes| Yes (with application)| 106 kbps

Contactless interface unit

  • The NFC module supports various communication modes at different transfer speeds and modulation schemes. The following chapters give more detailed overview of selected communication modes.
  • 1> Reader/Writer communication modes

Generally 5 reader/writer communication modes are supported:

  • 1> Reader/Writer communication modes
  • Generally 5 reader/writer communication modes are supported:
    • PCD reader/writer for ISO/IEC 14443A/MIFARE
  • The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s.
    • PCD reader/writer for ISO/IEC 14443B
  • The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s.
    • PCD reader/writer for Jewel/Topaz tags
  • The transfer speed includes 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s.
    • PCD reader/writer for FeliCa cards
  • The transfer speed includes 212 kbit/s, 424 kbit/s.
    • VCD reader/writer for ISO/IEC 15693/ICODE
  • The transfer speed includes 1.65 kbit/s, 26.48 kbit/s.
  • 2> Peer to Peer communication modes
    • (ISO/IEC 18092, Ecma 340 NFCIP-1 communication modes)

An NFCIP-1 communication takes place between 2 devices

  • NFC initiator: generates RF field at 13.56 MHz and starts the NFCIP-1communication.
  • NFC Target: responds to NFC initiator command either in a load modulation scheme in Passive communication mode or using a self-generated and self-modulated RF field for
  • Active communication mode.
    • The NFCIP-1 communication differentiates between Active and Passive communication modes.
    • Active communication mode means both the NFC initiator and the NFC target are using their own RF field to transmit data
    • Passive communication mode means that the NFC target answers to an NFC initiator command in a load modulation scheme. The NFC initiator is active is terms of generating the RF field.
  • The NFC module supports the Active Target, Active Initiator, Passive Target and Passive Initiator communication modes at the transfer speeds 106 kbit/s, 212 kbit/s and 424 kbit/s.

3> Card communication modes

  • The NFC module can be addressed as an ISO/IEC 14443A or ISO/IEC 14443B cards. This means that NFC module can generate an answer in a load modulation scheme.
  • The transfer speed includes 106 kbit/s, 212 kbit/s and 424 kbit/s.

Mechanical Architecture

  • Module Mechanical Drawing
    • Dimension (WxL): 20mm x 13mm,
    • Module Max Thickness: 2.2mm

FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-
image-6 FOXCONN-NXP-NPC300-Module-
NFC-Near-Field-Communication-image-7

Antenna interface of NFC module

  • 1> Antenna connector
  • Manufacturer: JST Manufacturer PN: BM05B-ACHKS-A-GAN-ETF(HF)
Connector Type Manufacture PN Size
ACH connector SMT type with 1.2mm pitch JST : BM05B-ACHKS-A-GAN- ETF(HF)

7.8mm x 4.3mm x 1.5mm

Connector 2D drawing

FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-
image-8

Pin definition:

Pin Symbol I/O Refer Note
1 RXP I VDD Positive receiver input
2 TX1 O VDD Antenna output1
3 GND G N/A Ground
4 TX2 O VDD Antenna output2
5 RXN I VDD Negative receiver input
S1 GND G N/A Ground
S2 GND G N/A Ground
  • Remark:
  • P = power supply,
  • G = ground,
  • I = input,
  • O = output, I/O = input/output

2 > Recommend Antenna cable design.

FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-
image-30FOXCONN-NXP-NPC300-Module-
NFC-Near-Field-Communication-image-9

Host interface of NFC module

  • 1> Host interface connector
  • Manufacturer: KYOCERA Manufacturer PN: 046811612000846 +
Connector Manufacture PN Size
FPC/FFC connector SMT type with 0.5mm pitch KYOCERA: 046811612000846+

11.73mm x 4.79mm x 1.28mm

FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-
image-10

Remark: The connector is bottom conduct with golden plating of FPC cable

Pin Symbol Pin Type Refer Description
1 VBAT Input Power N/A Power supply from system (4.5V – 5.5V)
2 PVDD Input Power N/A Power supply to I/O (3.0V – 3.6V)
3 I2C_SDA I/O PVDD I2C data
4 I2C _SCL I PVDD I2C clock
5 GND G N/A Ground
6 IRQ O PVDD Interrupt from NFC module to the host (Host_Wake)
7 NFC_Presence G N/A Connect to ground for NFC module presence bit (Low

active)
8| VEN| I| VBAT| Reset pin. Set the device in Hard Power Down
9| TX_PWR_REQ| O| VDD|

  • (External TX power supply request) (Active high 1.8V level output)
  • Indicates NFC busy state during NFC communication to touchpad.

10| PMUVCC| Input Power| N/A| Power supply to UICC(1.78V~3.3V)
11| SWIO_UICC| I/O| VDD(SIM)| SWP data connection to SIM
12| DWL_REQ| I| PVDD| Firmware download control pin
S1| GND| G| N/A| Ground
S2| GND| G| N/A| Ground

Remark: P = power supply, G = ground, I = input, O = output, I/O = input/output

  • 2> Pin characteristics
  • VEN input pin characteristics
Symbol Parameter Conditions Min Typ Max Unit
VIH HIGH-level input voltage 1.1 VBAT V
VIL LOW-level input voltage 0 0.4 V
IIH HIGH-level input current VEN voltage=VBAT 1 µA
IIL LOW-level input current VEN voltage=0V 1 µA
Ci Input capacitance 5 pF

Remark: P = power supply, G = ground, I = input, O = output, I/O = input/output

2 > Pin characteristics

VEN input pin characteristics

Symbol Parameter Conditions Min Typ Max Unit
VIH HIGH-level input voltage 1.1 VBAT V
VIL LOW-level input voltage 0 0.4 V
IIH HIGH-level input current VEN voltage=VBAT 1 µA
IIL LOW-level input current VEN voltage=0V 1 µA
Ci Input capacitance 5 pF

Pin characteristics for IRQ, and TX_PWR_REQ

Symbol Parameter Conditions Min Typ Max Unit
VOH HIGH-level output voltage IOH<3mA
IRQ and CLK_REQ pin VPVDD -0.4 VPVDD V
TX_PW R_REQ pin VDD-0.4 VDD V
VOL LOW-level output voltage IOL<3mA 0 0.4 V
CL Load capacitance 20 pF
tf Fall time CL=12pF max
High speed 1 3.5 ns
Low speed 2 10 ns
tr Rise time CL=12pF max
High speed 1 3.5 ns
Low speed 2 10 ns
Rpd Pull-down resistance IRQ and CLK_REQ pins            [1] 0.35 0.85

MΩ
TX_PW R_REQ pin [1]| 55| –| 120| kΩ

Activated in HPO and Monitor states.

Input pin characteristics for DWL_REQ

Symbol Parameter Conditions Min Typ Max Unit
VIH HIGH-level input voltage VPVDD=1.8V 0.65*VPVDD V
VIL LOW-level input voltage V PVDD=1.8V 0.35*VPVDD V
VIH HIGH-level input voltage VPVDD=3V 2 V
VIL LOW-level input voltage VPVDD=3V 0.8 V
IIH HIGH-level input current 1 µA
IIL LOW-level input current 1 µA
Ci Input capacitance 5 pF
Rpd Pull down resistance Extra pull-down 0.35 0.85 MΩ

Pin characteristics for HIF3(used as I2C-bus SDA) and HIF4(used as I2C-bus SCL)

Symbol Parameter Conditions Min Typ Max Unit
VOL LOW-level output voltage IOL<3mA         [1] 0 0.4 V
CL Load capacitance 10 pF
tf Fall time
  • CL=100 pF;      [1]
  • Rpull-up=2kΩ; Standard and Fast mode

| 30| –| 250| ns

  • CL=100 pF;      [1]
  • Rpull-up=1kΩ; High-speed mode

| 80| –| 110| ns
tr| Rise time|

  • CL=100 pF;      [1]
  • Rpull-up=2kΩ; Standard and Fast mode

| 30| –| 250| ns

  • CL=100 pF;      [1]
  • Rpull-up=1kΩ; High-speed mode

| 10| –| 100| ns
VIH| HIGH-level input voltage| | 0.7 VPVDD| –| VPVDD| V
VIL| LOW-level input voltage| | 0| –| 0.3
VPVDD| V
IIH| HIGH-level input current| VI= VPVDD; high impedance| –| –| 1| µA
IIL| LOW-level input current| VI=0V; high impedance| -1| –| –| µA
Ci| Input capacitance| | –| 5| –| pF

Only for pin HIF3(I2C-bus SDA), HIF4(I2C-bus SCL) is only used as input.

SWIO_UICC pin characteristics

Symbol Parameter Conditions Min Typ Max Unit
VOH HIGH-level output voltage
  • IIH=1mA;       [1]
  • IDD(SIM)=50mA;
  • VDD(SIM_PMU)=2.75V;
  • VDD(SIM_PMU) in class B

| 1.4| –| –| V
VOH| HIGH-level output voltage|

  • ISIM_SWIO=1mA;  [1]
  • IDD(SIM)=30mA;
  • VDD(SIM_PMU)=1.67V;
  • VDD(SIM_PMU) in class C

| 0.85 VDD(SIM)| –| –| V
VOH| HIGH-level output voltage|

  • IIH =1mA;       [1]
  • IDD(SIM)=5mA;
  • VDD(SIM_PMU)=0V;
  • VDD(SIM)-VDDD

| 0.85 VDD(SIM)| –| –| V
VOL| LOW-level output voltage| 0µA<IIL<20Μa [1]| –| –| 0.15VDD(SIM)| V
I[I1H] To allow| HIGH-level output voltage| | ––0.3V and V| 300| –| µA

3 > Recommend FPC cable

FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-
image-11 FOXCONN-NXP-NPC300
-Module-NFC-Near-Field-Communication-image-12

Shielding Cover of NFC module

  • Dimension (L x W x H): 11.69mm x 7.88mm x 1.35mm,
  • Thickness: 0.15mm
  • Materials: KU360S

FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-
image-13 FOXCONN-NXP-NPC300
-Module-NFC-Near-Field-Communication-image-14

Picture of NFC module

FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-
image-15

Marking Information

Label information

FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-
image-16 FOXCONN-NXP-NPC300
-Module-NFC-Near-Field-Communication-image-17

Carton label: P/N:503.00098.005

  • A.XXXXXXXX : the Foxconn MO(I. 473)
  • B.Qty : XXX XXX the quantity of product in carton(carton? Magnet at)
  • Barcode content: The quantity of product in carton (carton abraham)
  • C.REV :WSS W:the engineering version(refer to Foxconn label Rev column in the cover of the MFG document) SS:the version of A300/A400 product(refer to Doc Rev.in the cover of MFG document)
  • D.CIPPYWWXXXX C+ production location + production line + production year + production week + Serial Number(Base on 36)
  • C: carton I: production location(refer to attachment of the last page)
  • PP :Production line
  • YWW: Production year & production week
  • XXXX : Serial number(Base on 36, every two week reset to 0001)

Pallet label: P/N:503.00089.005

  • Follow Foxconn standard PIPPYWWXXXX: P+ production location + production line + production year + production week + Serial Number(Base on 36)
  • P: Pallet
  • I: Production location (refer to attachment on page 3)
  • PP: production line Y: the last digital of production year
  • WW: production week
  • XXXX: Serial number(Base on 36,every two week reset to 0001)
  • VSS: W : the engineering version (refer to Foxconn label Rev column in the cover of the MFG document)
  • SS: the version of A300/A400 product (refer to Doc Rev.in the cover of MFG document)

Packing information

FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-
image-21 FOXCONN-NXP-NPC300
-Module-NFC-Near-Field-Communication-image-22FOXCONN-NXP-NPC300-Module-NFC-Near-Field-
Communication-image-23 FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-
image-24

Reliability Test plan

FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-
image-25 FOXCONN-NXP-NPC300
-Module-NFC-Near-Field-Communication-image-26 FOXCONN-NXP-NPC300-Module-NFC-Near-Field-
Communication-image-27

Notice

  • Operating Temperature Conditions
    • The product shall be capable of continuous reliable operation when operating in ambient temperature of 0°C to 70°C.
  • Non-Operating Temperature Conditions
    • Neither subassembly shall be damaged nor shall the operational performance be degraded when restored to the operating temperature when exposed to storage temperature in the  range of -20°C to +85°C.
  • Operating Humidity Conditions
    • The product shall be capable of continuous reliable operation when subjected to relative humidity in the range of 0% and 85% non-condensing.
  • Handling Environment
    • Please make sure to avoid mechanical shock and vibration for this module.
    • Please do not drop the module.
    • Please do not clean the module.

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:

  1. This device may not cause harmful interference, and
  2. This device must accept any interference received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

  • If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
    •  Reorient or relocate the receiving antenna.
    •  Increase the separation between the equipment and receiver.
    •  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
    • Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body.

Radiation Exposure Statement

  • The product complies with the FCC portable RF exposure limit set forth for an uncontrolled environment and is safe for intended operation as described in this manual. Further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such a function is available.
  • This device is intended only for OEM integrators under the following conditions
  • The antenna must be installed such that 20 cm is maintained between the antenna and users, and The transmitter module may not be collocated with any other transmitter or antenna.
  • As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed
  • IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

End Product Labeling

  • This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID:MCLT77H747”. The grantee’s FCC ID can be used only when all FCC compliance requirements are met.

Manual Information To the End User

  • The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
    The end user manual shall include all required regulatory information/warning as show in this manual.

Industry Canada statement
This device complies with ISED’s licence-exempt RSSs.

Operation is subject to the following two conditions

  1. This device may not cause harmful interference, and
  2. This device must accept any interference received, including interference that may cause undesired operation.

Radiation Exposure Statement

  • This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment.
  • This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.

Radiation Exposure Statement
The product complies with the Canada portable RF exposure limit set forth for an uncontrolled environment and is safe for intended operation as described in this manual. Further RF exposure reduction can be achieved if the product can be kept as far as possible from the user’s body or by setting the device to lower output power if such a function is available.

  1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and
  2. The transmitter module may not be co-located with any other transmitter or antenna.
  3. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

IMPORTANT NOTE

  • In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.
  • End Product Labeling
    This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains IC: 2878D-T77H747”

Manual Information To the End User

  • The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
  • The end user manual shall include all required regulatory information/warning as show in this manual.
  • This radio transmitter (IC: 2878D-T77H747, Model: T77H747) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

DETACHABLE ANTENNA USAGE

  • This radio transmitter (IC: 2878DT77H747 / Model: T77H747) has been approved by ISED to operate with the antenna type listed below with maximum permissible gain indicated.
  • Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-image-28 FOXCONN-NXP-NPC300-Module-NFC-Near-Field-Communication-image-29

References

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