EBYTE E200-470A17S 470MHz Wireless Audio Module User Manual
- June 10, 2024
- ebyte
Table of Contents
- Disclaimer
- General Introduction
- Specification And Parameter
- Size and Pin Definition
- Recommended connection diagram
- Channel Code Value Table
- Operating mode
- Instructions and factory parameters
- Hardware Design
- FAQ
- Welding operation guidance
- Related models
- Antenna Guide
- Batch packaging
- Revision history
- About us
- References
- Read User Manual Online (PDF format)
- Download This Manual (PDF format)
EBYTE E200-470A17S 470MHz Wireless Audio Module
Disclaimer
EBYTE reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or any part thereof without the express permission of EBYTE is strictly prohibited. The information contained herein is provided “as is” and EBYTE assumes no liability for the use of the information. No warranty, either express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by EBYTE at any time. For most recent documents, visit www.ebyte.com.
General Introduction
Brief Introduction
E200-470A17S is a new wireless audio transmission module, which integrates
transceiver. It has the characteristics of small size and convenient use. It
works in the frequency band (470.033 ～ 512.273MHz) (default 512.273MHz), uses
hardware I/O to select channels, supports MIC input and speaker output, and is
compatible with 3.3V and 5V power supply voltages. The E200-470A17S integrates
a microphone (Microphone) and a speaker (Speaker) PA amplifier. Direct
connection to the microphone does not require an external amplifier. The audio
output can directly drive a 250mW/8ohm speaker. The radio frequency part
provides a sensitivity of -98dBm, which greatly improves the wireless
distance.
Features
- Support one-to-many broadcast transmission;
- Under ideal conditions, the communication distance can reach 300m;
- Control the working channel through the channel pin (restart effective), easy to use;
- The master-slave mode can be switched in real time, which is more flexible;
- Support 3.0～5.5V power supply, power supply greater than 3.3V can guarantee the best performance;
- Industrial standard design, supporting long-term use at -40～+85℃;
- Dual antennas are optional (IPEX/stamp hole), which is convenient for users to develop and integrate.
Application
- Smart home;
- Wireless alarm security system;
- Wireless audio transmission;
- Intelligent voice system;
Specification And Parameter
RF parameter
| RF parameter | Value | Remarks |
|---|---|---|
| Working frequency | 470.033～512.273MHz | Support ISM band |
| Transmit power | 16.5dBm～17.5dBm | The software is adjustable, and users need to |
develop their own settings
Receive sensitivity| -98dBm| Air rate 500kbps
Modulation| FSK| Modulation technology
Blocking power| 15dBm| The probability of burning at close range is small
Audio sampling rate| 60Hz~5KHz| There is a 12-bit ADC inside the chip
Reference distance| 300m| Clear and open, antenna gain 5dBi, antenna height
2.5 meters, air rate 500kbps
Electric parameter
| Main parameter | Performance | Remarks |
|---|---|---|
| Min. | Typ. | Max. |
| Working voltage (V) | 2.3 | 3.3 |
than 5.5V will permanently burn the module
I/O voltage| -0.3| –| 3.6| Exceeding 3.6V may permanently damage the module
I/O
Communication level (V)| -0.3| 3.3| 3.6| Risk of burnout when using 5V level
Working temperature (℃)| -40| –| +85| Industrial grade design
Power consumption| TX current （mA）| 98| 100| Instantaneous power consumption,
average current: 35mA| Instantaneous power consumption, average current: 35mA
RX current （mA）| 44| 45| Output connection 8ohm, 250mW speaker, maximum volume
185mA| Output connection 8ohm, 250mW speaker, maximum volume 185mA
Hardware parameter
| Hardware parameter | Value | Remarks |
|---|---|---|
| Packaging method | SMD | – |
| Interface | Stamp hole | Spacing 1.27mm |
| Communication Interface | UART | TTL level(reserved) |
| Dimensions | 16*26 mm | — |
| Product Weight | 2g | ±0.1g |
| RF interface | IPEX/Stamp hole | Equivalent impedance is about 50Ω |
Size and Pin Definition
| Pin No. | Item | Direction | Description |
|---|---|---|---|
| 2 | ANT | – | Antenna |
| 6 | REST | Input | Module reset pin, low level effective; |
| 11 | TXD | Output | TTL serial port output, currently only supports reading the |
module version, and does not use floating processing;
12| RXD| Input| TTL serial port input, currently only supports reading the
module version, and does not use floating processing;
16| TTCLK| –| Debug clock pin, do not use floating processing;
17| TTDIO| –| Debug data pins, do not use floating processing;
20| VCC| power supply| Module power supply is positive reference, voltage
range: 2.3～5.5V DC, recommended 3.3V or 5V;
23| Mode| Input| The module’s transceiver mode control pin, low-level
transmission mode, high-level reception mode, cannot be left floating;
25| Debug_EN| –| Debug control pin, enter the program burning mode for the
low-level module, do not use floating processing;
26| CH3| Input| Channel selection 3, combined with CH0, CH1, CH2 to select 16
channels that can work, see the channel table for details;
27| CH2| Input| Channel selection 2, combined with CH0, CH1, CH3 to select 16
channels that can work, see the channel table for details;
28| CH1| Input| Channel selection 1, combined with CH0, CH2, and CH3 to select
16 channels that can work, see the channel table for details;
29| CH0| Input| Channel selection 0, combined with CH1, CH2, CH3 to select 16
channels that can work, see the channel table for details;
30| VOIN| Input| Audio input is negative, please refer to the recommended
circuit for hardware design;
31| VOIP| Input| The audio input is positive, the hardware design is detailed
in the recommended circuit;
32| VOON| Output| Audio output is negative, please refer to the recommended
circuit for hardware design;
33| VOOP| Output| The audio output is positive, the hardware design is
detailed in the recommended circuit;
1、3 15、 19、34 35、 36| GND| power supply| Module ground
4、5 7、8、 9、10 13、 14、18 21、 22、24| NC| –| Keep it unused and suspend it for
disposal;
Recommended connection diagram
Channel Code Value Table
E200-470A17S switches channels through different combinations of high and low
levels of the four pins CH0~CH3.
Low level is represented by “0”, and high level is represented by “1”. The
frequency correspondence table is as follows:
| CH3 | CH2 | CH1 | CH0 | channel | Frequency（MHZ） | Remark |
|---|---|---|---|---|---|---|
| 0 | 0 | 0 | 0 | channel0 | 470.033 | – |
| 0 | 0 | 0 | 1 | channel1 | 472.849 | – |
| 0 | 0 | 1 | 0 | channel2 | 475.665 | – |
| 0 | 0 | 1 | 1 | channel3 | 478.481 | – |
| 0 | 1 | 0 | 0 | channel4 | 481.297 | – |
| 0 | 1 | 0 | 1 | channel5 | 484.113 | – |
| 0 | 1 | 1 | 0 | channel6 | 486.929 | – |
| 0 | 1 | 1 | 1 | channel7 | 489.745 | – |
| 1 | 0 | 0 | 0 | channel8 | 492.561 | – |
| 1 | 0 | 0 | 1 | channel9 | 495.377 | – |
| 1 | 0 | 1 | 0 | channel10 | 498.193 | – |
| 1 | 0 | 1 | 1 | channel11 | 501.009 | – |
| 1 | 1 | 0 | 0 | channel12 | 503.825 | – |
| 1 | 1 | 0 | 1 | channel13 | 506.641 | – |
| 1 | 1 | 1 | 0 | channel14 | 509.457 | – |
| 1 | 1 | 1 | 1 | channel15 | 512.273 | – |
Note: After switching channels, you need to restart to take effect.
Operating mode
The module has two working modes, which are set by pin Mode; the details are shown in the following table:
| Mode (send/receive ) | Mode | Mode introduction | Remark |
|---|---|---|---|
| Send mode | 0 | The module is in the transmitting state, and the signal input by | |
| the audio input interface is sent out wirelessly; | Transceiver function can be |
switched in real time
Receive mode| 1| The module is in the receiving state, and the signal received
wirelessly is output through the audio output interface;| Transceiver
function can be switched in real time
Instructions and factory parameters
Instruction format
The module supports software version reading, and it can be read through the serial port in the transceiver mode(when reading, only 9600, 8N1 format is supported):
| No. | Instruction format | Detailed description |
|---|---|---|
| 1 | Read software version | instruction：C3 C3 C3 |
response：E200-470A17S(Vx.x) example 1:
Send: C3 C3 C3 (hexadecimal format)
Return: E200-470A17S(V1.0)
Factory default parameters
| model | Factory default information ： E200-470A17S |
|---|---|
| Module model | Frequency |
Transmitting power
E200-470A17S| 512.273MHz| 500kbps| 9600bps| 8N1| 17.5dbm
Hardware Design
- It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and the module needs to be reliably grounded.
- Please pay attention to the correct connection of the positive and negative poles of the power supply, reverse connection may cause permanent damage to the module.
- Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum, the module will be permanently damaged;
- Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;
- When designing the power supply circuit for the module, it is often recommended to reserve more than 30%of the margin, so the whole machine is beneficial for long-term stable operation;
- The module should be as far away as possible from the power supply, transformers, high frequency wiring and other parts with large electromagnetic interference;
- Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of the module and routed in the Bottom Layer;
- Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees;
- It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect the performance. It is recommended to keep them away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;
- Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog, power traces) around the module that will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;
- If the communication line uses 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a risk of damage);
- The antenna installation structure has a great influence on the performance of the module. Make sure that the antenna is exposed and it is best to be vertically upward;
- The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna extension cable to extend the antenna to the outside.
- The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly weakened.
FAQ
Communication range is too short
- The communication distance will be affected when obstacle exists;
- Data lose rate will be affected by temperature, humidity and co-channel interference;
- The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;
- Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;
- The signal will be affected when the antenna is near metal object or put in a metal case;
- Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance);
- The power supply low voltage under room temperature is lower than recommended value, the lower the voltage, the lower the transmitting power;
- Due to antenna quality or poor matching between antenna and module.
Module is easy to damage
- Please check the power supply source, ensure it is between the recommended supply voltage, voltage higher than the maximum will damage the module.
- Please check the stability of power source, the voltage cannot fluctuate too much.
- Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic susceptibility.
- Please ensure the humidity is within limited range, some parts are sensitive to humidity.
- Please avoid using modules under too high or too low temperature.
Sound quality is too bad
- The power supply ripple is too large, so be sure to reduce the power supply ripple, increase the decoupling capacitor, and increase the EMC filter circuit;
- The audio input wiring is unreasonable, and it needs to be differentially designed and as close as possible to the module pins;
- The audio input wiring is unreasonable, and it needs to be differentially designed and as close as possible to the module pins;
- There may be co-channel signal interference nearby, modify the module channel usage;
Welding operation guidance
Reflow soldering temperature
Profile Feature| Curve characteristics| Sn-Pb Assembly| Pb-
Free Assembly
---|---|---|---
Solder Paste| Solder paste| Sn63/Pb37| Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）| Min preheating temp.| 100℃| 150℃
Preheat temperature max (Tsmax)| Max preheating temp.| 150℃| 200℃
Preheat Time (Tsmin to Tsmax)(ts)| Preheating time| 60-120 sec| 60-120 sec
Average ramp-up rate(Tsmax to Tp)| Average ramp-up rate| 3℃/second max|
3℃/second max
Liquidous Temperature (TL)| Liquid phase temp| 183℃| 217℃
Time（tL）Maintained Above（TL）| Time below liquid phase line| 60-90 sec| 30-90
sec
Peak temperature（Tp）| Peak temp| 220-235℃| 230-250℃
Aveage ramp-down rate（Tp to Tsmax）| Average ramp-down rate| 6℃/second max|
6℃/second max
Time 25℃ to peak temperature| Time to peak temperature for 25℃| 6 minutes max|
8 minutes max
Reflow soldering curve
Related models
Product No.| Frequency Hz| Transmit power dBm| **Test
distance km| ****Package| ****Size mm| ****Communication
Interface*
---|---|---|---|---|---|---
E200-470A17S| 470M-512M| 17.5| 0.3| SMD| 1626| Analog/TTL
Antenna Guide
Antenna recommendation
Antenna is an important role in the communication process. Inferior antennas often have a great impact on the communication system. Therefore, we recommend some antennas as antennas that support our wireless modules and have excellent performance and reasonable price.
Product| Type| Frequency Hz| Interference| Gain
dBi| Height| Feeder| Features
---|---|---|---|---|---|---|---
TX490-JZ-5| Rubber antenna| 470/490M| SMA-J| 2.0|
50| –| Ultrashort Straight and Omnidirectional Antenna
TX490-XPL-100| **Sucker antenna| ****470/490M| SMA-J|
****3.5| 120| 100| Small Sucker
antenna, cost-effective**
Batch packaging
Revision history
| Version | Date | Description | Issued by |
|---|---|---|---|
| 1.0 | 2020-06-16 | Original version | |
| 1.1 | 2020-07-21 | Format revision | Ren |
| 1.2 | 2022-10-21 | Content correction | Hao |
About us
Technical support: support@cdebyte.com
Documents and RF Setting download link: https://www.es-ebyte.com
Thank you for using Ebyte products! Please contact us with any questions or
suggestions: info@cdebyte.com
Official hotline:028-61399028
Web: https://www.es-ebyte.com
Address: , Building B5, Mould Industrial Park, 199# Xiqu Ave, High-tech Zone,
Chengdu, 611731, Sichuan, China
References
- 串口服务器_数传电台_4G DTU_遥控开关_LoRa/ZigBee/WiFi/蓝牙模块-成都亿佰特电子科技有限公司官网
- Fabricantes de módem inalámbrico Lora de China, proveedores de terminales IoT industriales
- Китайские производители беспроводных модемов Lora, поставщики промышленных терминалов IoT
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