Insight SiP ISP2053 Dual-core Bluetooth 5.2 BLE Module User Manual
- June 9, 2024
- Insight SiP
Table of Contents
ISP2053 Dual-core Bluetooth 5.2 BLE Module
ISP2053 Dual-core Bluetooth 5.2 BLE Module
This ultra-small LGA module, 8 x 8 x 1 mm, is based on the nRF5340 Chip. Its powerful Dual-core CortexTM M33 CPUs, flash and RAM memory combined with an optimized antenna offers the perfect solution for High-end Bluetooth connectivity. Long range, high temperature and multiple digital and analog interfaces give optimum flexibility for sensor integration, audio and complex IoT processing.
Key Features
Bluetooth Low Energy 5.2 LE Audio, Direction Finding and Long Range Fully
integrated RF Matching and Antenna Integrated 32 MHz & 32 kHz Clocks DC/DC
converter with loading circuit Based on Nordic Semiconductor nRF53 Application
Processor ARM Cortex M33 1 MB Flash + 512 KB RAM and 8 KB Cache Network
Processor ARM Cortex M33 256 KB Flash + 64 KB RAM and 2 KB Cache Security ARM
TrustZone & CryptoCell 312 Configurable 46 GPIOs including 8 ADCs Digital
interfaces USB, QSPI, SPI, UART, I²S, PDM, PWM Power supply 1.7 to 5.5V Very
small size 8.0 x 8.0 x 1.0 mm Extended Temperature -40 to +105 °C
Applications
LE Audio Professional lighting Industrial Advanced wearables Medical Smart
home Asset tracking and RTLS
Pending Certifications
Bluetooth SIG CE FCC, IC TELEC, KCC RoHS and Reach compliant Conflict Mineral
Declaration
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Revision History
Revision R0 R1 R2 R3 R4
Date
Ref
11/02/2021
jf pg
31/05/2021
jf pg
24/09/2021
jf pg
03/11/2021
jf pg
25/01/2022
jf pg
Change Description Preliminary release Change pinout Minor typo error correction Document review Document review Section 2.6 and 2.7 update
: ISP1907 LE MODULE IT, , . : Bluetooth 5.2 : ISP2053 Module : INSIGHT SIP SAS : ( ) : ISP2053 / : INSIGHT SIP SAS / : : R-C-iNs-ISP2053
AS : Insight SIP – the System-in-Package approachhttps://www.insightsip.com :
cedric.requin@insightsip.com Phone : +33 (0) 493 008 880
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BLE MODULE
ISP2053
Contents
1. Block Diagram………………………………………………………………………………………………………………………………………………4
2. Specifications……………………………………………………………………………………………………………………………………………….6
2.1. Important Notice ………………………………………………………………………………………………………………………………. 6 2.2.
Absolute Maximum Ratings………………………………………………………………………………………………………………..6 2.3.
Operating Conditions ………………………………………………………………………………………………………………………… 6 2.4.
Power Consumption …………………………………………………………………………………………………………………………. 7 2.5. Clock
Sources …………………………………………………………………………………………………………………………………. 7 2.6. Radio
Specifications …………………………………………………………………………………………………………………………. 8 2.7. Range
Measurement ………………………………………………………………………………………………………………………… 8 2.8. Antenna
Performance………………………………………………………………………………………………………………………..8 2.9. Electrical
Schematic ………………………………………………………………………………………………………………………..11
3. Pin Description …………………………………………………………………………………………………………………………………………..12
4. Mechanical Outlines……………………………………………………………………………………………………………………………………15
4.1. Mechanical Dimensions……………………………………………………………………………………………………………………15 4.2.
SMT Assembly Guidelines ……………………………………………………………………………………………………………….17 4.3.
Antenna Performance………………………………………………………………………………………………………………………17
5. Product Development Tools……………………………………………………………………………………………………………………….18
5.1. Hardware ……………………………………………………………………………………………………………………………………….18 5.2.
Firmware………………………………………………………………………………………………………………………………………..18 5.3.
Development Tools………………………………………………………………………………………………………………………….19
6. Packaging & Ordering information
…………………………………………………………………………………………………………….20 6.1. Marking
………………………………………………………………………………………………………………………………………….20 6.2. Prototype
Packaging ……………………………………………………………………………………………………………………….20 6.3. Jedec Trays
……………………………………………………………………………………………………………………………………20 6.4. Tape and Reel
………………………………………………………………………………………………………………………………..21 6.5. Ordering
Information………………………………………………………………………………………………………………………..22
7. Storage & Soldering
information………………………………………………………………………………………………………………..23 7.1. Storage and
Handling………………………………………………………………………………………………………………………23 7.2. Moisture
Sensitivity………………………………………………………………………………………………………………………….23 7.3. Soldering
information……………………………………………………………………………………………………………………….24
8. Quality & User information
…………………………………………………………………………………………………………………………25 8.1. Certifications
…………………………………………………………………………………………………………………………………..25 8.2. EC CE
Certification……………………………………………………………………………………………………………………….25 8.3. USA User
information……………………………………………………………………………………………………………………25 8.4. Canada User
information……………………………………………………………………………………………………………….26 8.5. RF Exposure
Information………………………………………………………………………………………………………………….26 8.6. Informations
concernant l’exposition aux fréquences radio (RF) ……………………………………………………………26
8.7. Discontinuity …………………………………………………………………………………………………………………………………..26 8.8.
Disclaimer ………………………………………………………………………………………………………………………………………27
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1. Block Diagram Confidential File – Not Attached
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Confidential File – Not Attached
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2. Specifications Confidential File – Not Attached
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Confidential File – Not Attached
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Confidential File – Not Attached
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Radiation Pattern in 3 planes
Module mounted on a USB dongle ground plane Gain measurement in dBi @ 2.45
GHz.
BLE MODULE ISP2053
Ground Plane Effect Simulation
USB dongle ground plane (size: 18 x 30 mm²)
Cell phone config 1 ground plane
(size: 40 x 100 mm²)
Cell phone config 1 with side ground plane
(size: 40 x 100 mm²)
Cell phone config 2 with side ground plane
(size: 40 x 100 mm²)
Cell phone config 3 with side ground plane
(size: 40 x 100 mm²)
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2.9. Electrical Schematic Confidential File – Not Attached
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3. Pin Description
The module uses an LGA format with a grid of pads on a 0.65 mm pitch according to QFN Jedec standard. The NC pads are to be connected to isolated metal pads on the application PCB for mechanical stability and reliability (drop test).
Pin
Name
Pin function
A1
VSS
Ground
A2
VBUS
USB Power
A3
P1.03/I2C
Digital I/O
TWI 1 Mbps
A4
D+
USB Data
A5
D-
USB Data
A6
VDDH
Power
A7
DCCH
Power
A8
P0.02/NFC1
Digital I/O
NFC
A9
P0.03/NFC2
Digital I/O
NFC
A10 P0.10/TD1
Digital I/O
Trace Data
A11 VSS
Ground
B2
P1.15
Digital I/O
B3
P0.06/AIN2
Digital I/O
Analog Input
B4
P0.04/AIN0
Digital I/O
Analog Input
B5
P1.01
Digital I/O
B6
P0.07/AIN3
Digital I/O
Analog Input
B7
P1.00
Digital I/O
B8
P0.05/AIN1
Digital I/O
Analog Input
B9
P0.08/TD3
Digital I/O
Trace Data
B10 P1.02/I2C
Digital I/O
TWI 1 Mbps
C1
VDD
Power
C2
P0.13/QSPI0
Digital I/O
Quad SPI
C3
P0.19
Digital I/O
C4
P0.15/QSPI2
Digital I/O
Quad SPI
C5
P0.14/QSPI1
Digital I/O
Quad SPI
C6
P0.16
Digital I/O
C7
P0.09/TD2
Digital I/O
Trace Data
Description
Should be connected to ground plane on application PCB 5V input for USB 3.3V
regulator General purpose I/O pin High Speed TWI USB D+ USB DHigh voltage
power supply (1.7 3.6V) High voltage DC/DC converter output General purpose
I/O pin NFC antenna connection General purpose I/O pin NFC antenna connection
General purpose I/O pin Trace port output Should be connected to ground plane
on application PCB General purpose I/O pin General purpose I/O pin
SAADC/COMP/LPCOMP input General purpose I/O pin SAADC/COMP/LPCOMP input
General purpose I/O pin General purpose I/O pin SAADC/COMP/LPCOMP input
General purpose I/O pin General purpose I/O pin SAADC/COMP/LPCOMP input
General purpose I/O pin Trace port output General purpose I/O pin High Speed
TWI Power supply (1.7 3.6V) General purpose I/O pin Quad SPI General purpose
I/O pin General purpose I/O pin Quad SPI General purpose I/O pin Quad SPI
General purpose I/O pin General purpose I/O pin Trace port output
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Pin
Name
Pin function
C8
P0.11/TD0
Digital I/O
Trace Data
C9
P0.17/QSPI_CLK Digital I/O
Quad SPI
C10 P1.05
Digital I/O
C11 SWDIO
Digital I/O
D1
P1.13
Digital I/O
D2
P0.12/TC
Digital I/O
Trace Clock
D3
P0.21
Digital I/O
D4
P0.18/QSPI_CS Digital I/O
Quad SPI
D5
P0.22
Digital I/O
D6
P0.20
Digital I/O
D7
P1.08
Digital I/O
D8
P1.09
Digital I/O
D9
P1.04
Digital I/O
D10 P0.24
Digital I/O
D11 SWDCLK
Digital Input
E1
P1.14
Digital I/O
E2
P0.30
Digital I/O
E3
P0.31
Digital I/O
E4
P1.12
Digital I/O
E5
P1.11
Digital I/O
E6
P0.28/AIN7
Digital I/O
Analog Input
E7
VSS
Ground
E8
P0.29
Digital I/O
E9
P0.27/AIN6
Digital I/O
Analog Input
E10 P0.26/AIN5
Digital I/O
Analog Input
E11 nRST
Reset
F1
VSS
Ground
F2
P1.06
Digital I/O
F3
P0.23
Digital I/O
F4
P1.07
Digital I/O
F5
P1.10
Digital I/O
F6
VSS
Ground
F7
OUT_ANT
Antenna I/O
F8
OUT_MOD
Antenna I/O
F9
VSS
F10 P0.25/AIN4
F11 VSS H K L* NC
Ground Digital I/O Analog Input Ground Not Connected
Description
General purpose I/O pin Trace port output General purpose I/O pin Quad SPI
General purpose I/O pin Serial Wire Debug I/O for debug and programming
General purpose I/O pin General purpose I/O pin Trace clock General purpose
I/O pin General purpose I/O pin Quad SPI General purpose I/O pin General
purpose I/O pin General purpose I/O pin General purpose I/O pin General
purpose I/O pin General purpose I/O pin Serial Wire Debug clock input for
debug and programming General purpose I/O pin General purpose I/O pin General
purpose I/O pin General purpose I/O pin General purpose I/O pin General
purpose I/O pin SAADC/COMP/LPCOMP input Should be connected to ground plane on
application PCB General purpose I/O pin General purpose I/O pin
SAADC/COMP/LPCOMP input General purpose I/O pin SAADC/COMP/LPCOMP input Reset
pin Should be connected to ground plane on application PCB General purpose I/O
pin General purpose I/O pin General purpose I/O pin General purpose I/O pin
Should be connected to ground plane on application PCB This pin is connected
to the internal antenna. It should be connected to Pin F8 OUT_MOD for normal
operation This pin is the RF I/O pin of the BLE module. It should be connected
to Pin F7 OUT_ANT for normal operation Should be connected to ground plane on
application PCB General purpose I/O pin SAADC/COMP/LPCOMP input Should be
connected to ground plane on application PCB Isolated pad on application PCB
for mechanical stability
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ISP2053 pad placement and pin assignment for the LGA QFN package TOP VIEW
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4. Mechanical Outlines 4.1. Mechanical Dimensions Package dimensions
BLE MODULE ISP2053
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Dimensional drawing for 74-Pad LGA Package
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4.2. SMT Assembly Guidelines
For PCB Land Patterns and Solder Mask layout, Insight SiP recommends using the
same dimensions as module pads.
For implementations in which most or all of the inner pads are used Insight
SiP recommends the use of capped vias placed in the center of each pad.
For standard PCB types (no micro vias – all vias are top to bottom): we
recommend to use nominal 0.4mm catch pads with 0.2mm vias. The vias should be
plugged and capped to avoid solder wicking.
For HDI PCB types having micro vias on a layer by layer basis: we recommend to
use 0.25mm catch pads and 0.1mm copper filled laser vias. Ideally the via is
centered in the pad.
For reduced pinout implementations we recommend using external pads only. The
use of a small number of internal pads can be accommodated by placing normal
vias in the center of the device. In this case only the required pads should
be Solder Mask opened and the vias tented with solder mask to prevent short
circuits.
In general, we recommend NSMD solder mask with 50µm SM extension.
4.3. Antenna Performance
The internal antenna performance is optimized for an FR4 PCB of 1 mm
thickness.
The module should be placed 1 mm from the PCB edge. And it is recommended to
respect a metal exclusion zone to the edge of the board: no metal, no traces
and no components on any application PCB layer except mechanical LGA pads.
When the module is placed on a large PCB dimension, 5mm lateral keep out zone
is recommended. But when the PCB size is smaller, it is possible to place the
module in either corner and reduce the lateral keep out zone as described
below.
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BLE MODULE ISP2053
5. Product Development Tools
5.1. Hardware
In order to assist clients in developing their Bluetooth Smart solutions based
on the ISP2053, Insight SIP offers a Development Kit containing: – One
Interface Board with integrated J-Link OB JTAG/SWD Emulator – One Test Board –
Cables
Using this development kit, product developers can start from a working
solution to develop their own products. Time to market is saved by avoiding
commencing from a blank sheet of paper. In addition, there may be some
applications that use the hardware as is.
Please refer to the documentation for more information:
http://www.insightsip.com/fichiers_insightsip/pdf/ble/ISP2053/isp_ble_DS2053_DK.pdf
5.2. Firmware
ISP2053 supports Bluetooth Low Energy protocol stacks. It also provides
extensive software support for All are available as downloads at
www.nordicsemi.com.
nRF Connect SDK is the development environment for nRF53 solutions. The SDK is
running on the Zephyr operating system.
The SDK includes two implementations of the Bluetooth LE Controller:
Softdevice Controller: Developed by Nordic Semiconductor, this controller
supports features from the Bluetooth 5.2 specification. List of supported
features:
https://developer.nordicsemi.com/nRF_Connect_SDK/doc/latest/nrfxlib/softdevice_controller/READM
E.html#softdevice-controller
Zephyr BLE Controller: Open source developed by the Zephyr community, this
controller support most of BLE features. List of supported features:
https://developer.nordicsemi.com/nRF_Connect_SDK/doc/latest/zephyr/guides/bluetooth/overview.ht
ml
More information about the nRF Connect SDK at:
https://developer.nordicsemi.com/nRF_Connect_SDK/doc/latest/nrf/index.html.
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5.3. Development Tools
The following development tools and software are recommended for using and
testing ISP2053 module:
Nordic Semiconductor nRF Connect for Desktop: Collection of application
enabling programming, testing and debugging of Nordic Semi based products.
Downloadable at https://www.nordicsemi.com/Software-and-tools/Development-
Tools/nRF-Connectfor-desktop.
Segger Embedded Studio: IDE for arm processors. Downloadable from
https://www.segger.com/products/development-tools/embedded-studio.
Segger J-Link Lite: Downloadable from https://www.segger.com/downloads/jlink.
nRF Connect SDK: nRF Connect SDK can be downloaded using nRF Connect for
Desktop. It contains example of source code applications (C language).
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BLE MODULE ISP2053
6. Packaging & Ordering information
6.1. Marking
M /N : I S P 2 0 5 3 T T Y Y WW R
ISP2053 TT YY WW R
Part Number 2 letters Module Type (see section 6.5) 2 digits year number
2 digits week number
1 letter Hardware revision
6.2. Prototype Packaging
For engineering samples and prototype quantities up to 99 units, deliveries
are provided in thermoformed trays or cut tapes.
They are delivered in sealed pack with desiccant pack and humidity sensors.
Please see section 7.2 for more information on moisture sensitivity.
Please order with “ST” code packaging suffix.
6.3. Jedec Trays
For pre-production volumes, ISP2053 are available in Jedec trays. They are
delivered in sealed pack with desiccant pack and humidity sensors. These Jedec
trays are also suitable for further baking at 125°C. Please see section 7.2
for more information on moisture sensitivity. Please order with “JT” code
packaging suffix.
Refer to tray sizes below. Complete information on Jedec trays is available on
request.
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Top view position of modules within the tray.
6.4. Tape and Reel ISP2053 are also available in Tape & Reel. They are
delivered in sealed pack with desiccant pack and humidity sensors. Reels are
proposed in standard quantities of 500 units (180mm / 7″ reel) or 2000 units
(330mm / 13″ reel) only. Please order with “RS” code packaging suffix for
500-unit reels and “R2” for 2000-unit reels. This packaging is not suitable
for high temperature baking. Should it be necessary to recover MSL level, low
temperature baking at 40°C as per Jedec-J-STD-033 is recommended. Top view
position of modules within the reel.
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6.5. Ordering Information
I SP2 0 5 3 – TT – ZZ
I SP2 0 5 3
– AX
– EB – TB – ST – JT – RS
Part Number
Long range version
Evaluation Board(1) Test board (1) Standard Tray or Cut Tape Jedec Tray
Packaging Reel of 500 units
(1) Please see section 5.1 and refer to the following documentation for more information on development kit and test board: http://www.insightsip.com/fichiers_insightsip/pdf/ble/ISP2053/isp_ble_DS2053_DK.pdf
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7. Storage & Soldering information
7.1. Storage and Handling
Keep this product away from other high frequency devices which may interfere
with operation such as other transmitters and devices generating high
frequencies.
Do not expose the module to the following conditions: – Corrosive gasses such
as Cl2, H2S, NH3, SO2, or NOX – Extreme humidity or salty air – Prolonged
exposure to direct Sunlight – Temperatures beyond those specified for storage
Do not apply mechanical stress
Do not drop or shock the module
Avoid static electricity, ESD and high voltage as these may damage the module
ATTENTION
CONSERVE PRECAUTIONFOR HANDLING ELECTROSTATIC SENSITIVE DEVICES
7.2. Moisture Sensitivity
All plastic packages absorb moisture. During typical solder reflow operations
when SMDs are mounted onto a PCB, the entire PCB and device population are
exposed to a rapid change in ambient temperature. Any absorbed moisture is
quickly turned into superheated steam. This in vapor pressure can cause the
package to swell. If the pressure exerted exceeds the flexural strength of the
plastic mold compound, then it is possible to crack the package. Even if the
package does not crack, interfacial delamination can occur.
ISP2053 has been tested MSL-3 according to standards. The products are
delivered in dry pack with humidity sensor. When removing the trays or reels
from the dry pack, the humidity sensor must be checked. Modules can then be
exposed to ambient room conditions (approximately 30 °C/60%RH) during 168
hours before assembly on the PCB.
After this period of time, it is mandatory to bake the product before assembly
according to Jedec J-STD-033. The baking process is 24 hours at 125°C for
Jedec trays. For all other delivery formats, the baking process is 40°C for 8
days.
CAUTION
MOISTURE SENSITIVE DEVICES
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7.3. Soldering information Recommendation for RoHS reflow process is according
to Jedec JSTD-020 and 033 standard profiles.
Preheat/Soak Temperature Min (Tsmin) Temperature Max (Tsmax) Time (ts) from
(Tsmin to Tsmax)
Ramp-up rate (TL to Tp)
Liquidous temperature (TL) Time (tL) maintained above TL
150 °C 200 °C 60-120 sec
3 °C/sec max
217 °C 60-150 sec
Peak package body temperature (Tp)
Classification Temperature (Tc) Time (tp) maintained above TC-5 °C
260°C (+0/-5°C)
260 °C 30 sec
Ramp-down rate (Tp to TL)
6 °C/sec max
Time 25 °C to peak temperature
8 mn max
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8. Quality & User information
8.1. Certifications
All below certificates can be downloaded on the website:
Bluetooth SIG Declaration : pending CE Certified, DoC Insight SiP pending
TELEC Certified, pending KCC Certification n° R-C-iNs-ISP2053 pending FCC
Certification n° 2AAQS-ISP2053 pending IC Certification n° 11306A-ISP2053
pending RoHS3 and Reach compliant, Ref TR191101 and TR200301 Conflict Mineral
Declaration available, Ref TR180701
To support customers in their application certification, Insight SiP can
provide test reports on request.
8.2. EC CE Certification
This device can be operated in at least one Member State without infringing
applicable requirements on the use of radio spectrum.
8.3. USA User information
This intends to inform how to specify the FCC ID of our module “ISP2053” on
the product. Based on the Public Notice from FCC, the host device should have
a label which indicates that it contains our module. The label should use
below example wording or any similar wording that expresses the same meaning:
“Contains FCC ID: 2AAQS-ISP2053”
The label of the host device should also include the below FCC Statement. When
it is not possible, this information should be included in the User Manual of
the host device:
“This device complies with part 15 of the FCC rules. Operation is subject to
the following two conditions. (1) This device may not cause harmful
interference (2) This device must accept any interference received, including
interference that may cause undesired operation. Caution: Any Changes or
modifications not expressly approved by the party responsible for compliance
could void the user’s authority to operate the equipment.”
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8.4. Canada User information
This intends to inform how to specify the IC of our module “ISP2053” on the
product. According to Canadian standards “RSS-Gen” the host device should have
a label which indicates that it contains our module. The label should use
below example wording or any similar wording that expresses the same meaning:
“Contains IC: 11306A-ISP2053”
The label of the host device should also include the below IC Statement. When
it is not possible, this information should be included in the User Manual of
the host device:
“This device complies with Industry Canada license-exempt RSS standard(s).
Operation is subject to the following two conditions: (1) this device may not
cause interference, and (2) this device must accept any interference,
including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux
appareils radio exempts de licence. L’exploitation est autorisée aux deux
conditions suivantes : (1) l’appareil ne doit pas produire de brouillage, et
(2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique
subi, même si le brouillage est susceptible d’en compromettre le
fonctionnement.”
8.5. RF Exposure Information
This equipment complies with FCC/IC radiation exposure limits set forth for an
uncontrolled environment and meets the FCC radio frequency (RF) Exposure
Guidelines in Supplement C to OET65 and RSS-102 of the IC radio frequency (RF)
Exposure rules. This equipment has very low levels of RF energy that it deemed
to comply without maximum permissive exposure evaluation (MPE).
8.6. Informations concernant l’exposition aux fréquences radio (RF)
La puissance de sortie émise par l’appareil de sans-fil est inférieure à la
limite d’exposition aux fréquences radio d’Industry Canada (IC). Ce module a
également été évalué et démontré conforme aux limites d’exposition aux RF d’IC
dans des conditions d’exposition à des appareils mobiles et/ou portables.
8.7. Discontinuity
Normally a product will continue to be manufactured as long as all of the
following are true: – The manufacturing method is still available. – There are
no replacement products. – There is demand for it in the market.
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In case of obsolescence, Insight SiP will follow Jedec Standard JSD-48. A
Product Discontinuation Notice (PDN) will be sent to all distributors and made
available on our website. After this, the procedure goes as follows: – Last
Order Date will be 6 months after the PDN was published. – Last Shipment Date
will be 6 months after Last Order Date, i.e. 12 months after PDN.
8.8. Disclaimer
Insight SiP’s products are designed and manufactured for general consumer
applications, so testing and use of the product shall be conducted at
customer’s own risk and responsibility. Please conduct validation and
verification and sufficient reliability evaluation of the products in actual
condition of mounting and operating environment before commercial shipment of
the equipment. Please also pay attention (i) to apply soldering method that
don’t deteriorate reliability, (ii) to minimize any mechanical vibration,
shock, exposure to any static electricity, (iii) not to overstress the product
during and after the soldering process.
The products are not designed for use in any application which requires
especially high reliability where malfunction of these products can reasonably
be expected to result in personal injury or damage to the third party’s life,
body or property, including and not limited to (i) aircraft equipment, (ii)
aerospace equipment, (iii) undersea equipment, (iv) power plant control
equipment, (v) medical equipment, (vi) transportation equipment, (vii) traffic
signal equipment, (viii) disaster prevention / crime prevention equipment.
The only warranty that Insight SiP provides regarding the products is its
conformance to specifications provided in datasheets. Insight SiP hereby
disclaims all other warranties regarding the products, express or implied,
including without limitation any warranty of fitness for a particular purpose,
that they are defectfree, or against infringement of intellectual property
rights. Insight SiP customers agree to indemnify and defend Insight SiP
against all claims, damages, costs and expenses that may be incurred,
including without any limitation, attorney fees and costs, due to the use of
products.
Note- Additional testing, FCC Part 15 Subpart B disclaimer
The modular transmitter is only FCC authorized for the specific rule parts
(i.e., FCC transmitter rules) listed on the grant, and that the host product
manufacturer is responsible for compliance to any other FCC rules that apply
to the host not covered by the modular transmitter grant of certification. The
host product may need to be evaluated against the FCC Part 15B criteria for
unintentional radiators in order to be properly authorized for operation as a
Part 15 digital device. 8.8 Limited module procedures -Not applicable
January 25, 2022
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Document Ref: isp_ble_DS2053_R4.docx
References
- Nordic Semiconductor | Empowering Wireless Innovation - nordicsemi.com
- Welcome to the nRF Connect SDK! — nRF Connect SDK 2.4.99 documentation
- Embedded Studio: The Multi-Platform IDE